JP2019091916A - ボンディング用途のための厚い銅ワイヤを製造するための方法 - Google Patents
ボンディング用途のための厚い銅ワイヤを製造するための方法 Download PDFInfo
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- JP2019091916A JP2019091916A JP2019015289A JP2019015289A JP2019091916A JP 2019091916 A JP2019091916 A JP 2019091916A JP 2019015289 A JP2019015289 A JP 2019015289A JP 2019015289 A JP2019015289 A JP 2019015289A JP 2019091916 A JP2019091916 A JP 2019091916A
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- wire
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- 238000000034 method Methods 0.000 title claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title abstract description 22
- 238000000137 annealing Methods 0.000 claims abstract description 90
- 239000010949 copper Substances 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000002243 precursor Substances 0.000 claims abstract description 9
- 239000011247 coating layer Substances 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 7
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000011162 core material Substances 0.000 description 31
- 238000005259 measurement Methods 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000013590 bulk material Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000002050 diffraction method Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0006—Apparatus or processes specially adapted for manufacturing conductors or cables for reducing the size of conductors or cables
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/02—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/008—Using a protective surface layer
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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- H—ELECTRICITY
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- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
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- H01B13/0036—Details
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Abstract
Description
(a)銅コア前駆体を準備する工程と、
(b)ワイヤコアの最終直径に到達するまで前駆体を延伸する工程と、
(c)延伸したワイヤを、4秒から2時間、好ましくは4秒から1時間の範囲の最小のアニーリング時間の間、断面全体にわたって650から1000℃の範囲の最小のアニーリング温度でアニーリングする工程と
を含む、方法に関する。
分布は、均質な分布またはワイヤの中心からの距離が増加するにつれて平均粒径の増加のいずれかを示す。
全ての試験および測定は、T=20℃および相対湿度50%にて行った。
99.99%以上の純度のある量の銅材料(「4N銅」)をるつぼ中で溶融した。さらなる物質は溶融物に添加しなかった。次いでワイヤコア前駆体を溶融物から鋳造した。
TS1:アニーリングオーブン直後のワイヤの引張強度;
EL1:アニーリングオーブン直後のワイヤの伸び;
YS1:アニーリングオーブン直後のワイヤの降伏強度;
TS2:パッケージングリール上に巻いた後のワイヤの引張強度;
EL2:パッケージングリール上に巻いた後のワイヤの伸び;
YS2:パッケージングリール上に巻いた後のワイヤの降伏強度。
Drは、曲率半径の方向において測定されたワイヤの直径と定義され、
Eは、曲げに起因するワイヤの外側繊維の相対伸びであり、
Eは、0.006以下である。
5cm=0.25*0.03cm/0.0015
本発明の第2の実施例として、リボンの形態のボンディングワイヤが製造される。全ての製造工程は、アニーリング工程の前にワイヤコアを平らにする追加の工程を除いて、上記の第1の実施例に従って実施される。ワイヤを平らにする工程はワイヤを圧延することによって達成される。得られたリボンは、その最長直径に対する最短直径の比率が0.1である。その最短直径は100μmであり、その最長直径は1000μmであり、断面積はおおよそ100,000μm2である。
Claims (15)
- 表面を有するコアを含むボンディングワイヤを製造する方法であって、前記コアは98.0%以上の銅を含み、7500から600000μm2の範囲の断面積および40から95N/mm2の範囲の弾性限界RP0.2(降伏強度)を有し、前記方法は、
(a)銅コア前駆体を準備する工程と、
(b)ワイヤのコアの最終直径に到達するまで前記前駆体を延伸する工程と、
(c)前記延伸したワイヤを、4秒から2時間の範囲の最小のアニーリング時間の間、断面全体にわたって650から1000℃の範囲の最小のアニーリング温度でアニーリングする工程と
を含む、方法。 - 前記アニーリングはストランドアニーリングである、請求項1に記載の方法。
- 前記ワイヤは、最大伸びの温度より10から150℃高い温度でアニーリングされる、請求項1または2に記載の方法。
- (d)工程(c)の後、ワイヤを移送し、パッケージする工程をさらに含み、
前記ワイヤは曲率半径Rcで曲げられ、Rcは0.25・Dr/Eに等しく、
式中、Drは曲率半径の方向において測定されたワイヤの直径と定義され、
Eは曲げに起因するワイヤの外側繊維の相対伸びであり、
Eは0.0002から0.006の範囲である、
請求項1〜3のいずれか一項に記載の方法。 - (e)前記コアの表面上にコーティング層を重ね合わせるように、工程(b)の前または後のいずれかにコーティング層の材料で前記銅コアをコーティングする工程をさらに含む、請求項1〜4のいずれか一項に記載の方法。
- 前記コーティング層は20nmから0.5μmの厚さを有する、請求項5に記載の方法。
- 前記コーティング層は、主成分として貴金属、Ti、NiまたはCrからなる群の1つを含む、請求項5または6に記載の方法。
- 前記コーティング層は中間層として提供され、少なくとも1つの外層が前記中間層の上に重ね合わされる、請求項5〜7のいずれか一項に記載の方法。
- 前記外層は主成分として貴金属を含む、請求項8に記載の方法。
- 前記中間層は5nmから100nmの範囲の厚さを有する、請求項8または9に記載の方法。
- (f)工程(c)の前に前記ワイヤをリボンの形状に圧延する工程をさらに含む、請求項1〜10のいずれか一項に記載の方法。
- 前記ワイヤは円形断面形状を有し、断面積を通る最短経路と最長経路の比率は0.8から1.0である、請求項1〜10のいずれか一項に記載の方法。
- 前記断面積を通る最短経路と最長経路の比率は0.02から0.5である、請求項11に記載の方法。
- 前記ワイヤの第2の領域(R2)の平均粒径と前記ワイヤの第1の領域(R1)の平均粒径の比率は0.05から0.8であり、
前記ワイヤの第1の領域(R1)は、前記ワイヤの幾何学的中心線から前記ワイヤの最小直径の10%以下の距離を有する全ての点によって画定され、
前記ワイヤの第2の領域(R2)は、前記コアの表面から前記ワイヤの最小直径の10%以下の距離を有する全ての点によって画定される、
請求項1〜13のいずれか一項に記載の方法。 - 前記ワイヤは、アニーリング後に最大伸び値の40から92%の伸び値を有する、請求項1〜14のいずれか一項に記載の方法。
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- 2015-04-28 US US15/325,338 patent/US20170200534A1/en not_active Abandoned
- 2015-04-28 EP EP15721617.7A patent/EP3167482B1/en active Active
- 2015-04-28 JP JP2016574220A patent/JP2017520121A/ja active Pending
- 2015-04-28 HU HUE15721617A patent/HUE055485T2/hu unknown
- 2015-05-12 TW TW104115090A patent/TWI579392B/zh not_active IP Right Cessation
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2019
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Also Published As
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WO2016005068A1 (en) | 2016-01-14 |
HUE055485T2 (hu) | 2021-11-29 |
TW201602371A (zh) | 2016-01-16 |
EP3167482A1 (en) | 2017-05-17 |
CN106471143A (zh) | 2017-03-01 |
TWI579392B (zh) | 2017-04-21 |
JP6762386B2 (ja) | 2020-09-30 |
JP2017520121A (ja) | 2017-07-20 |
EP3167482B1 (en) | 2021-07-14 |
US20170200534A1 (en) | 2017-07-13 |
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