JP2019079937A - Light emitting device, package, and method for manufacturing them - Google Patents

Abstract

To provide a light emitting device excellent in package strength while realizing a reduction in thickness.SOLUTION: A light emitting device 100 includes: a package 10 having a resin portion 20 having a recess 29, a pair of lead electrodes 30 supported by the resin portion and disposed with a gap D in a bottom surface 25 of the recess, and a metal plate 40 provided on a side wall of a recess separated from the pair of lead electrodes so as to bridge the gap; and a light emitting element 50 mounted on the pair of lead electrodes of the package.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to light emitting devices, packages, and methods of manufacturing them.

  In recent years, light emitting elements and small light emitting devices with high brightness and high output have been developed and used in various fields. For example, a light source used for a backlight of a liquid crystal display device is required to be thin in order to miniaturize and lighten a device using the light source. Therefore, as a light emitting device used as a light source, for example, various light emitting devices in a form called side view type have been developed.

  In general, the light emitting device is mounted on a package having a concave portion opened in the front, and two lead electrodes are drawn out from the inside of the package as external terminals (for example, a side view type light emitting device). , Patent Document 1). In the light emitting device, the ends of the two lead electrodes are spaced apart from each other on the bottom of the recess of the package with a gap. Each of the two lead electrodes is formed with a first wing or a second wing extending along both sides of the gap.

  Also, the two lead electrodes are disposed on the bottom side of the package, and the first wing and the second wing are bent along the inner side wall of the package, and the molding resin of the package housing is used to form the first wing and the second wing. 2 The outer surface of the wing is supported. Therefore, in the light emitting device, the two lead electrodes increase the area of the light reflection surface from the light emitting diode by the first wing and the second wing.

Unexamined-Japanese-Patent No. 2010-135277

  In order to make the light emitting device as described above thin, it is necessary to make the side wall of the package thin. However, if the side wall of the package is thinned, the package may be broken due to the lack of strength.

  Therefore, an embodiment according to the present disclosure has an object to provide a package excellent in strength, a light emitting device using the same, and a method of manufacturing the same while realizing a reduction in thickness.

The light emitting device according to the present embodiment includes a resin portion having a recess, a pair of lead electrodes supported by the resin portion and disposed at a bottom surface of the recess with a gap, and a sidewall of the recess so as to bridge the gap. And a light emitting device mounted on the pair of lead electrodes of the package.
In the light emitting device according to the present embodiment, the resin portion having a recess, the pair of lead electrodes supported by the resin portion and disposed at a bottom surface of the recess with a gap, and the recess so as to straddle the gap And a light emitting element mounted on a pair of lead electrodes of the package.
The package according to the present embodiment includes a resin portion having a recess, a pair of lead electrodes supported by the resin portion and disposed at a bottom surface of the recess with a gap, and the recess so as to straddle the gap. And a metal plate or an insulating plate provided on the side wall so as to be separated from the pair of lead electrodes.
Further, in the method of manufacturing the package according to the present embodiment, the pair of lead electrodes are formed to face each other with a gap, and the side end surface of the pair of lead electrodes has a length across the gap via the temporary connection portion. A step of preparing a lead frame having a metal plate formed thereon, a bending step of bending the metal plate at a predetermined angle with the connecting portion of the pair of lead electrodes as a boundary, and a die on the lead frame Providing a resin portion, exposing the pair of lead electrodes to the bottom surface of the recess of the resin portion, and disposing the metal plate along the inner side surface of the recess and holding the resin portion by the resin portion; And a separation step of separating the metal plate from the pair of lead electrodes by cutting the connection portion through a cutting device.
Furthermore, in the method of manufacturing a light emitting device according to the present embodiment, a step of preparing a package obtained by the method of manufacturing the package, and a step of mounting a light emitting element on the pair of lead electrodes exposed on the bottom of the recess; And D. separating each package having the light emitting element mounted thereon.

  The package, the light emitting device, and the manufacturing method thereof according to the present embodiment can provide a structure excellent in strength while realizing thinning.

It is a front view which shows the package and light-emitting device concerning a 1st embodiment typically. It is a perspective view which shows typically the cross section in the II-II line of FIG. It is a perspective view which takes out the lead electrode and metal plate which are used for the light-emitting device which concerns on 1st Embodiment, and shows a positional relationship typically. It is a schematic diagram which shows typically the installation angle with respect to the bottom face of a recessed part about the metal plate of the light-emitting device which concerns on 1st Embodiment. It is a flowchart which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment. It is a top view which shows typically a part of state in which a lead electrode and a metal plate are connected via a temporary connection part in the light-emitting device which concerns on 1st Embodiment. It is a top view which shows typically the state which bent the metal plate connected with the lead electrode in the light-emitting device concerning 1st Embodiment bordering on a temporary connection part. It is a top view which shows typically the state which disconnected the temporary connection part of the metal plate connected with the lead electrode in the light-emitting device which concerns on 1st Embodiment. It is a perspective view which makes a partial cross section the modification in the metal plate of the light-emitting device concerning a 1st embodiment, and is shown typically. It is a perspective view which makes a part of light emitting device concerning a 2nd embodiment a section, and is shown typically. It is a top view which shows typically the modification about the shape of the metal plate used for a light-emitting device, and the position of a temporary connection part. It is a top view which shows typically the modification about the arrangement | positioning and shape of the metal plate used for a light-emitting device, and the position of a temporary connection part. It is a top view which shows typically the modification about the shape of the metal plate used for a light-emitting device, and the shape of a temporary connection part, and a position.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical concept of the present invention, and the present invention is not limited to the following ones unless there is a specific description. Further, the sizes and positional relationships of members shown in the drawings may be exaggerated in order to clarify the description. Furthermore, in the drawings, the XYZ directions are illustrated and described, but the directions described in the drawings are arbitrary.

First Embodiment
FIG. 1 is a front view schematically showing a package and a light emitting device according to the first embodiment, FIG. 2 is a perspective view schematically showing a cross section taken along line II-II in FIG. 1, and FIG. FIG. 4 is a perspective view schematically showing the positional relationship by taking out the lead electrode and the metal plate used for the light emitting device according to the embodiment, and FIG. 4 is an installation angle of the metal plate of the light emitting device according to the first embodiment Is a schematic view schematically showing.

The light emitting device 100 includes a resin portion 20 having a recess 29 and a pair of lead electrodes (first lead 31 and second lead 32) 30 supported by the resin portion 20 and disposed with a gap D in the bottom surface 25 of the recess 29. And a metal plate 40 (first metal plate 41, second metal plate 42) provided on the side walls (first side wall 21 and second side wall 22) of the recess 29 so as to cross the gap D apart from the pair of lead electrodes 30. And a light emitting element 50 mounted on the pair of lead electrodes 30 of the package 10. Here, "to straddle the gap D" means that the side wall of the recess 29 is continuous (from the metal plate 40) from a part of the first lead to a part of the gap D and the second lead. That is, the metal plate 40 is installed on the side wall so as to cover the position of the side wall opposed to the gap D.
In the resin portion 20 of the light emitting device 100, the side to be the light extraction surface which is the light emitting surface is referred to as the front, and the surface on the opposite side is referred to as the back. Further, in the light emitting device 100, the surface on the side to which the first outer lead 31b and the second outer lead 32b which are drawn out from the side wall of the first lead 31 and the second lead 32 are electrically connected is the lower surface. The opposite surface is called the upper surface. The lower surface side of the light emitting device 100 is taken as a mounting surface of the light emitting device 100. Each component will be described below.

(package)
The package 10 is a container that accommodates the light emitting element 50 and has terminals (a pair of lead electrodes 30) for supplying power to the light emitting element 50 from the outside. The package 10 includes at least a resin portion 20 and a first lead 31 and a second lead 32 which are a pair of lead electrodes 30. In addition, the package 10 demonstrates as an example what is used for the side light emission type light-emitting device.

(Resin part)
The resin portion 20 is a resin molded body which is a base of the container in the package 10. The resin portion 20 is formed so as to support the pair of lead electrodes 30 having the recess 29 and having the first lead 31 and the second lead 32.
The resin portion 20 is formed with a recess 29 at its center and has an opening 28 at the front. The opening 28 of the resin portion 20 has a horizontally long shape in front view. The side walls constituting the recess 29 are formed by the first side wall 21 and the second side wall 22 opposed in the short direction (Z direction) and the third side wall 23 and the fourth side wall 24 opposed in the longitudinal direction (X direction) It is done. The first side wall 21 and the second side wall 22 are formed thinner than the third side wall 23 and the fourth side wall 24, and the first metal plate 41 and the second metal plate 42 are provided therein. The first leads 31 and the second leads 32 aligned in the longitudinal direction of the resin portion 20 are exposed on the bottom surface 25 of the recess 29 with a gap D therebetween. The light emitting element 50 described later is placed on the first lead 31 exposed on the bottom surface 25 of the recess 29.

The recess 29 is formed by being surrounded by the side wall. That is, the recess 29 is provided on the front side with the first side wall 21 and the second side wall 22 formed to face each other in the Z-axis direction, and the third side wall 23 and the fourth side wall provided on the front side with the X-axis direction. It is formed by being surrounded by the side wall 24. The concave portion 29 may have an inclined surface on the side wall such that the opening 28 expands toward the outside. Here, the inclined surface is formed on the third side wall 23 and the fourth side wall 24.
In addition, the resin portion 20 is preferably formed of a material having a light reflectance of 70% or more at the light emission peak wavelength of the light emitting element 50 from the viewpoint of light extraction efficiency to the front, and is 80% or more Is more preferably 90% or more. Moreover, it is preferable that the resin part 20 is white. The resin portion 20 is made of a material having fluidity, that is, liquid (including sol or slurry) prior to curing or solidification. The resin portion 20 can be molded by an injection molding method, a transfer molding method, or the like.

  A thermosetting resin or a thermoplastic resin can be used as a base material of the resin portion 20. In addition, resin shown below shall also contain the modified resin (a hybrid resin is included). As a base material of the resin part 20, a thermoplastic resin is preferable from the viewpoint of being easy to shape | mold by the injection molding method, and being cheap compared with a thermosetting resin. As the thermoplastic resin, any one of an aliphatic polyamide resin, polycyclohexane terephthalate, and polycyclohexylene dimethylene terephthalate is preferable. Moreover, a thermosetting resin is preferable in the viewpoint of being excellent in heat resistance and light resistance compared with a thermoplastic resin, long life, and having high reliability. As a thermosetting resin, any one of an epoxy resin, a silicone resin, and an unsaturated polyester resin is preferable. In particular, unsaturated polyester resins and modified resins thereof are preferable because they can be molded by an injection molding method while having the excellent heat resistance and light resistance of a thermosetting resin. The resin portion 20 preferably contains a white pigment such as titanium oxide and a filler in the base material from the viewpoint of light reflectivity, mechanical strength, heat stretchability and the like, but is not limited thereto.

  Further, the first side wall 21 and the second side wall 22 of the resin portion 20 are formed to be thinner. Specifically, it is desired that the thickness of a part of the first side wall 21 and the second side wall be, for example, 100 μm or less, and further 50 μm or less. The resin portion 20 is reinforced here by the metal plate 40 in order to increase the strength of the portion formed only of the resin. Although the second side wall 22 of the resin portion 20 is formed such that the center is parallel to the first side wall 21 and the step portion is formed through the left and right inclined surfaces 22 a in front view, Like the side wall 21, it may be formed linearly. Here, the central outer wall surface of the second side wall 22 parallel to the first side wall 21 has a level difference up to the outer wall surfaces of the third side wall 23 and the fourth side wall 24 by the left and right inclined surfaces 22a. Therefore, the central outer wall surface of the second side wall 22 is accommodated in the step portion even when the first outer lead 31 b and the second outer lead 32 b protrude from the wall surface, and the central outer wall surface of the second side wall 22 The difference in height between the first outer lead 31 b and the lower surface of the second outer lead 32 b is reduced.

(Lead electrode)
The pair of lead electrodes 30 supported by the resin portion 20 has a first lead 31 and a second lead 32. The first lead 31 penetrates the side wall of the resin portion 20 continuously with the first inner lead 31 a disposed in the recess 29 of the resin portion 20 and the first inner lead, and then bends along the outer wall surface And a first outer lead 31 b formed by Similarly, the second lead 32 extends along the outer wall surface after penetrating the side wall of the resin portion 20 continuously with the second inner lead 32a disposed in the recess 29 of the resin portion 20 and the second inner lead 32a. And a second outer lead 32b formed by bending. The first outer lead 31 b of the first lead 31 and the second outer lead 32 b of the second lead 32 are disposed on the lower surface side which is the mounting surface of the package 10 and joined to an external circuit board or the like. The first inner leads 31 a and the second inner leads 32 a are provided on the bottom surface 25 of the recess 29 until the first side wall 21 and the second side wall 22 rise. The first inner lead 31 a and the second inner lead 32 a may be separated from the first side wall 21 and the second side wall 22, and if they are not electrically connected to the metal plate 40. The size may be up to a position in contact with the first side wall 21 and the second side wall 22.

  The lead electrode 30 may have any shape depending on the shape of the resin portion 20. For example, the lead electrode 30 may have a plate shape, a block shape, or a film shape, and has a wave shape or unevenness. May be The thickness of the lead electrode 30 may be constant, or may be partially thick or partially thin. The width of the lead electrode 30 is not particularly limited, but a wider one is preferable because the heat dissipation property is improved. The material of the lead electrode 30 is not particularly limited, and it is preferable to be formed of a material having a relatively large electric conductivity and thermal conductivity. With such a material, the heat generated from the light emitting element 50 can be efficiently dissipated to the outside. For example, the material of the lead electrode 30 has a thermal conductivity of about 200 W / (m · K) or more, a relatively large mechanical strength, or a material that is easy to be punched, pressed or etched. Is preferred. Specific examples of the material of the lead electrode 30 include metals such as copper, aluminum, gold, silver, tungsten, iron and nickel, and alloys such as iron-nickel alloy and phosphor bronze. Further, it is preferable that the surface of the lead electrode 30 be plated with a light-reflective metal such as silver or aluminum in order to efficiently extract the light from the mounted light-emitting element 50.

(Metal plate)
The metal plate 40 is provided on the first side wall 21 and the second side wall 22 so as to be separated from the first lead 31 and the second lead 32 so as to bridge the gap D between the first lead 31 and the second lead 32. There is. Here, the metal plate 40 includes a first metal plate 41 and a second metal plate 42, and is provided at a position facing each other with the first lead 31 and the second lead 32 interposed therebetween. The first metal plate 41 and the second metal plate 42 are formed of the same metal as the lead electrode 30. The first metal plate 41 and the second metal plate 42 are connected to the first lead 31 via the temporary connection portion 3a (see FIG. 3), and are separated from the first lead 31 after the resin portion 20 is formed. Installed by The first metal plate 41 and the second metal plate 42 span the gap D between the first lead 31 and the second lead 32, and are formed to have a length ranging from the first lead 31 to the second lead 32. As an example, it is formed in a rectangle. The first metal plate 41 and the second metal plate 42 have the same shape and the same thickness, and are formed at an angle along the side wall that can be embedded inside the first side wall 21 and the second side wall 22. Since the first metal plate 41 and the second metal plate 42 are provided to increase the strength of the resin portion 20, the first metal plate 41 and the second metal plate 42 cover the position across the gap D between the first lead 31 and the second lead 32 and The shape, thickness, and the like of the first lead 31 are not limited as long as they face both the first lead 31 and the second lead 32.

  Although the first metal plate 41 and the second metal plate 42 are illustrated as being covered and embedded in the first side wall 21 and the second side wall 22 in the drawing, the first lead 31 and the second lead are shown. Since there is no electrical connection with 32, the plate surface may be exposed from the inner wall surfaces of the first side wall 21 and the second side wall 22. The first metal plate 41 and the second metal plate 42 in the first side wall 21 and the second side wall 22 are positioned in the wall or are positioned so as to expose the plate surface from the wall surface in the temporary connection portion 3a. It is formed to be set by the conditions of the bending position and the bending angle (see FIG. 4). That is, the first metal plate 41 and the second metal plate 42 are 90 degrees to 110 degrees at the position of the temporary connection portion 3a preset in the manufacturing process, for example, the end of the temporary connection portion 3a on the metal plate 40 side. By being bent at the temporary connection portion 3 a in the range, the angle is also adjusted by being positioned inside the first side wall 21 and the second side wall 22.

  Also, as an example, the first metal plate 41 and the second metal plate 42 can be bent at the same angle as the side wall at the end portion of the temporary connection portion 3a on the first lead 31 side by the temporary connection portion 3a. Can be exposed. Therefore, even if the first metal plate 41 and the second metal plate 42 are at an angle of 90 degrees with respect to the bottom surface 25, the first metal plate 41 and the second metal plate 42 are exposed from the side wall surfaces of the first side wall 21 and the second side wall 22. It can also be buried inside the first side wall 21 and the second side wall 22. Furthermore, the first metal plate 41 and the second metal plate 42 can be made the same angle or different angles in accordance with the angles of the side wall surfaces of the first side wall 21 and the second side wall 22.

  The first metal plate 41 and the second metal plate 42 may be formed to have a thermal conductivity higher than that of the lead electrode 30. As shown in FIG. 7, the first metal plate 41 and the second metal plate 42 are mainly made of copper when the lead electrode 30 is made of a material mainly composed of copper which is copper or copper alloy. The thermal conductivity can be increased by providing the plate surface with a high thermal conductivity member 43 such as a material having a conductivity higher than that of the material to be used, for example, Ag. By making the thermal conductivity of the first metal plate 41 and the second metal plate 42 higher than that of the lead electrode 30, the influence of heat on the light emitting element 50 can be reduced. The high thermal conductivity member 43 does not have to completely cover the entire surface of the metal plate 40, and may be partial if the thermal conductivity is high. Further, the high thermal conductivity member 43 is formed by being provided on the metal plate 40 in the step of preparing the lead frame.

(Temporary connection part)
The temporary connection portion 3 a is for temporarily connecting the metal plate 40 to the lead electrode 30. The temporary connection portion 3a is formed, for example, in a state where the first metal plate 41 and the second metal plate 42 are connected to the left and right side end surfaces of the first lead 31, and can be maintained until the resin portion 20 is provided. It is done. The temporary connection portion 3 a is formed of the same material as the metal plate 40 and the lead electrode 30.
The temporary connection portion 3a is bent by a bending device, for example, to form the resin portion 20, and then cut or divided by irradiation of a laser from the laser processing device to cut the metal plate 40 and the lead electrode 30. Let go. Therefore, the temporary connection part 3a is formed in the length and width which can provide the 1st metal plate 41 and the 2nd metal plate 42 along a side wall, after being bent by predetermined angle. As an example, the temporary connection portion 3a is formed only on the first lead 31 side. By providing the temporary connection portion 3 a only on the first lead 31 side, the cause of the short circuit of the lead electrode 30 can be reduced. The number, shape, or size of the temporary connection portions 3a are not particularly limited. In addition, it is preferable that the temporary connection portions 3a be formed in left-right symmetry so as to be the same distance with respect to the center in the plate longitudinal direction. The temporary connection portion 3a is formed symmetrically in the left-right direction from the center in the longitudinal direction of the first metal plate 41 or the second metal plate 42, so that the force in the bending direction from the bending device is applied in the manufacturing process. The metal plate 41 and the second metal plate 42 can be easily arranged at equal positions with respect to the first lead 31.

(Light emitting element)
The light emitting element 50 is formed by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, AlInGaN or the like on a substrate such as sapphire as a light emitting layer. Among these, a nitride-based compound semiconductor device having an emission peak wavelength in the short wavelength range (360 nm to 550 nm) of visible light from the ultraviolet range can be used. Note that a light emitting element having a light emission peak wavelength in a long wavelength range (551 nm to 780 nm) of visible light can also be used.
A plurality of light emitting elements 50 may be used, and the light emitting device 100 having a wide color reproduction range can be provided by using the light emitting elements 50 having different emission colors. For example, two light emitting elements 50 capable of emitting green light and one light emitting element 50 capable of emitting blue light and red can be provided.
Note that in order to use the light emitting device 100 for a pixel of a full color display device, the emission wavelength of the red light emitting element 50 is 610 nm to 700 nm, the emission wavelength of the green light emitting element 50 is 495 nm to 565 nm, and the blue light is It is preferable that the light emission wavelength of the light emitting element 50 is 430 nm to 490 nm. In the case where the mixed light of white color is emitted in the light emitting device 100, the complementary color relationship in the light emission wavelength between the light emitting element 50 and the fluorescent substance contained in the sealing member 60 or the sealing member 60 by the light output of the light emitting element 50. In light of deterioration and the like, the emission wavelength of the light emitting element 50 is preferably 400 nm or more and 530 nm or less, and more preferably 420 nm or more and 490 nm or less.

(Sealing member)
The sealing member 60 is provided in the recess 29 of the package 10, and the light emitting element 50 disposed in the recess 29, the lead electrode 30, and a wire for electrically connecting the light emitting element 50 and the lead electrode 30. It is a member which covers Wa etc. The sealing member 60 may not be provided, but by providing it, the sealed member can be protected from deterioration due to moisture or gas or damage due to mechanical contact. In addition, since the sealing member 60 fills the space between the end of the temporary connection portion 3a and the first lead 31, the possibility of an electrical short between the metal plate 40 and the first lead 31 can be obtained. It can suppress more. In addition, the bonding strength between the sealing member 60 and the package 10 and between the sealing member 60 and the lead electrode 30 can be improved by the anchor effect.
Although the material which can be used as the sealing member 60 is not particularly limited, it is preferable to have good translucency. Examples of such a material include resin materials such as silicone resin and epoxy resin, and inorganic materials such as glass.
In addition, the sealing member 60 may contain a fluorescent material for converting the wavelength of the light from the light emitting element 50 or a light reflecting material for scattering the light from the light emitting element 50.

The light reflective material preferably has insulating properties, and for example, particles of titanium oxide (TiO ₂ ), aluminum oxide (Al ₂ O ₃ ) and the like can be used.
Moreover, as a fluorescent substance, what is necessary is to be what absorbs the light from the light emitting element 50, and carries out wavelength conversion to the light of a different wavelength. For example, what is generally used as a fluorescent material, such as aluminum garnet fluorescent substance, may be used.

  The light emitting device 100 having the configuration as described above has the first metal plate 41 and the second metal plate along the first side wall 21 and the second side wall 22 at a position straddling the gap D between the first lead 31 and the second lead 32. 42 are provided. Therefore, the light emitting device 100 can improve the strength of the resin portion 20 of the package 10 and prevent the occurrence of cracking even if the size is reduced.

  Next, a method of manufacturing the light emitting device 100 will be described below with reference to FIGS. 5 and 6A to 6C. FIG. 5 is a flowchart showing a method of manufacturing the light emitting device according to the first embodiment, and FIG. 6A is a state in which lead electrodes and a metal plate are connected via a temporary connection portion in the light emitting device according to the first embodiment. FIG. 6B is a plan view schematically showing a state in which the metal plate connected to the lead electrode in the light emitting device according to the first embodiment is bent at a temporary connection portion. FIG. 6C is a plan view schematically showing a state in which the temporary connection portion of the metal plate connected to the lead electrode in the light emitting device according to the first embodiment is separated.

  Here, the method of manufacturing the light emitting device includes a preparation step S1 of preparing a lead frame, a bending step S2 of bending a part of the lead frame, a package forming step S3 of providing a resin portion on the lead frame, and a package The step of preparing the package including the step S4 of disconnecting the separated temporary connection portion and separating it from the lead electrode is performed first. Then, the method of manufacturing the light emitting device includes a mounting step S5 of mounting the light emitting element on the pair of lead electrodes after the package is prepared, and a singulation step S7 of cutting the lead frame into pieces for each package. Is going to include. In addition, the manufacturing method of a light-emitting device is demonstrated as performing sealing member formation process S6 which forms a sealing member in the recessed part of a resin part after individualization process S7 after mounting process S5.

(Preparation process)
In the preparation step S1, a pair of lead electrodes 30 are formed facing each other with a gap D therebetween, and the side end surfaces of the pair of lead electrodes 30 are formed to have a length straddling the gap D via the temporary connection portion 3a. This is a step of preparing a lead frame having a metal plate 40. In the lead frame, a plurality of portions of the lead electrode 30 and the portions of the metal plate 40 associated therewith are formed in the matrix direction.
In the preparation step S1, in the lead frame, a metal flat plate is subjected to punching processing, etching processing and the like, and a plurality of portions in which the pair of lead electrodes 30 and the metal plate 40 are formed are provided in alignment. That is, in the lead frame, through holes are formed in a predetermined pattern, and when it is singulated, a portion divided into two lead regions so as to become a pair of lead electrodes 30, and a temporary connection portion 3a to the lead electrodes 30 And a portion in which the metal plate 40 temporarily connected is formed. In the preparation step, a flat metal plate can be used as the lead frame, but a metal plate provided with steps and irregularities can also be used.
The metal plate 40 formed in the lead frame is formed to have a length across the gap D between the pair of lead electrodes 30. Then, in the lead frame, the first metal plate 41 and the second metal plate 42 which are metal plates 40 are temporarily connected to the side end surface of the first lead 31 by the temporary connection portion 3a.

The lead frame is a flat plate of copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, or alloys of these, subjected to various processes such as pressing (including punching), etching, and rolling. Is the mother. Also, the lead frame may be composed of a laminate of these metals or alloys, but it may be simple to be composed of a single layer. In particular, copper alloys (phosphor bronze, iron-containing copper, etc.) mainly composed of copper are preferable. Furthermore, a light reflecting film such as silver, aluminum, rhodium, or an alloy thereof may be provided on the surface of at least a portion of the lead frame to be the lead electrode 30, and silver or a silver alloy having excellent light reflectivity is particularly preferable. preferable.
The lead frame may be prepared by providing the metal plate 40 with the high thermal conductivity member 43 having high thermal conductivity. When the high thermal conductivity member 43 is provided, spray application or the like is performed using a mask or the like.

(Bending process)
Once the lead frame is prepared, a bending process is then performed. The bending step S2 is a step of bending the first metal plate 41 and the second metal plate 42 at a predetermined angle with the temporary connection portion 3a as a boundary. The bending position and angle of the first metal plate 41 and the second metal plate 42 are set in advance by the bending apparatus used, and are set by one bending process or two or more bending processes. Bendable in position and angle. The first metal plate 41 and the second metal plate 42 are bent, for example, in a range of 90 degrees to 110 degrees with respect to the bottom surface 25 of the recess 29, and are provided along the inner side wall of the recess 29. When the angle with respect to the bottom surface 25 of the first metal plate 41 and the second metal plate 42 is smaller than 90 degrees, the effective amount of light extracted from the light emitting element 50 is reduced. In addition, when the angle of the first metal plate 41 and the second metal plate 42 with respect to the bottom surface 25 is larger than 110 degrees, a difference with the formation angle of the side wall of the resin portion 20 occurs. It may protrude from the wall.

(Package formation process)
When the bending step S2 ends, next, a package forming step S3 is performed.
In the package forming step S3, using the upper and lower molds, the resin portion 20 is provided in a region including the portions of the pair of lead electrodes 30 of the lead frame and the portions of the first metal plate 41 and the second metal plate 42. Forming the package 10. In the package formation step S3, the package 10 is provided with the resin portion 20 having the concave portion 29 on the lead frame which becomes the lead electrode 30, and a predetermined number is formed at one time. More specifically, the resin portion 20 can be formed by sandwiching the region of the lead electrode 30 and the metal plate 40 in a mold which is divided up and down, and injecting the melted resin composition into the mold. . In the package forming step S3, the resin portion is in a state in which the portion of the first outer lead 31b of the first lead 31 and the portion of the second outer lead 32b of the second lead 32 project from the outer surface of the resin portion 20 A portion of the first inner lead 31a of the first lead 31 and a portion of the second inner lead 32a of the second lead 32 are exposed and disposed on the bottom surface 25 of the recessed portion 29 through the gap D. Thus, the resin portion 20 is formed. In the package forming step S3, the first metal plate 41 is provided inside the first side wall 21 of the resin portion 20, and the second metal plate 42 is provided inside the second side wall 22, so that the resin portion is formed. 20 are formed.

Here, a mold is selected in advance so that the resin portion 20 is formed in a shape suitable for the side view type. Moreover, as a resin molding method which forms the resin part 20, well-known resin molding methods, such as a transfer molding method, an injection molding method, a compression molding method, an extrusion molding method, can be used. Depending on whether the type of resin used for the resin portion 20 is a thermosetting resin or a thermoplastic resin, or the form of the package 10, a resin molding method can be appropriately selected.
For example, when the resin is a thermoplastic resin and the package 10 has a form in which the lead electrode 30 is held by the resin portion 20, an injection molding method can be used.

(Separating process)
After the resin portion 20 is formed on the lead frame, the separation step S4 is performed.
The separating step S4 is a step of separating the portion of the metal plate 40 from the portion of the lead electrode 30 of the lead frame supported by the resin portion 20 by cutting the temporary connection portion 3a. In the separation step S4, for example, a laser is applied to the temporary connection portion 3a with a laser by a laser processing apparatus or the like to cut the portion of the temporary connection portion 3a, and the metal plate 40 is separated from the lead electrode 30. Here, since four temporary connection parts 3a are formed on the first lead 31, a laser is applied to each temporary connection part 3a to cut off the temporary connection part 3a and the first lead 31 to the first metal plate 41 and The second metal plate 42 is separated. The temporary connection portion 3a is in a state in which the portion of the cut edge is exposed from the side wall of the recess 29, but the sealing member 60 is filled into the recess 29 later to form the first lead. 31 electrically isolated.
The package is manufactured by the above steps.

(Mounting process)
After the separation step S4, a mounting step S5 is performed. The mounting step S5 is a step of arranging and mounting the light emitting element 50 on the lead electrode 30 from which the metal plate 40 is separated in the separation step S4. The light emitting element 50 is bonded to the bottom surface 25 of the recess 29 of the package 10 using a die bonding member such as resin or solder, and the pad electrode and the lead electrode 30 of the light emitting element 50 are electrically Connected. In the mounting step S5, a plurality of light emitting elements 50 may be arranged.

(Sealing member formation process)
The sealing member forming step S6 is a step of sealing the light emitting element 50 and the lead electrode 30 disposed in the recess 29 by forming the sealing member 60 in the recess 29 of the package 10. In the sealing member forming step S6, the sealing member 60 in a molten state is filled in the recess 29 by, for example, potting. In addition, the sealing member 60 enters the gap between the end of the temporary connection portion 3a exposed from the first side wall 21 and the second side wall 22 in the separation step S4 and the side end face of the first lead 31 to provide insulation. It can be secured securely.

(Dividing process)
A singulation step S7 is performed after the sealing member formation step S6.
The singulation step S7 is a step of forming the individual light emitting devices 100 by cutting predetermined positions of the lead frame for each package 10. In the singulation step S7, the light emission device 100 is singulated by cutting a preset cut portion using a cutting device.
As described above, the package 10 can be manufactured by performing the process including the preparation process S1 to the separation process S4. Further, the light emitting device 100 can be manufactured by performing the steps including the preparation step S1 to the singulation step S7.

Next, a second embodiment will be described with reference to FIG. The same reference numerals are given to the configurations already described, and the description will be omitted. FIG. 8 is a perspective view schematically showing a cross section of a part of the light emitting device according to the second embodiment.
The light emitting device 200 includes a package 10A and a light emitting element 50. Then, the package 10A is separated from the resin portion 20 having the recess 29, the pair of lead electrodes 30 supported by the resin portion 20 and disposed on the bottom surface 25 of the recess 29 with a gap D, and the recess And an insulating plate 140 provided on the side wall of the housing 29.

(Insulation plate)
The insulating plate 140 is provided apart from the first lead 31 and the second lead 32 on the first side wall 21 and the second side wall 22 so as to bridge the gap D between the first lead 31 and the second lead 32. There is. The insulating plate 140 includes the first insulating plate 141 and the second insulating plate 142, and the surface of the plate is exposed from the first side wall 21 and the second side wall 22 at positions facing each other across the first lead 31 and the second lead. It is provided as. The first insulating plate 141 and the second insulating plate 142 are formed of the first metal plate 41 and the second metal plate 42 of the same metal as the lead electrode 30, and the surfaces of the first metal plate 41 and the second metal plate 42 The insulating film 44 is provided on the

  The first insulating plate 141 and the second insulating plate 142 are temporarily connected to the first lead 31 via the temporary connection portion 3a (see FIG. 3), and are cut off from the first lead 31 after the resin portion 20 is formed. It is installed by being released. The first insulating plate 141 and the second insulating plate 142 cross the gap D between the first lead 31 and the second lead 32, and are formed to have a length ranging from a portion of the first lead 31 to a portion of the second lead 32. ing. The first insulating plate 141 and the second insulating plate 142 have the same shape and the same thickness as the first metal plate 41 and the second metal plate 42, and the plate surface is made of the first side wall 21 and the second side wall 22. It is provided at the exposure angle. Since the first insulating plate 141 and the second insulating plate 142 are provided to increase the strength of the resin portion 20, the first lead is provided at a position straddling the gap D between the first lead 31 and the second lead 32. The shape, the thickness, and the like are not limited as long as they have a size that faces both the portion 31 and the portion of the second lead 32.

As an example, the first insulating plate 141 and the second insulating plate 142 are formed by providing the insulating film 44 on the first metal plate 41 and the second metal plate 42 before being bent at the temporary connection portion 3a. May be It is preferable that the insulating material of the insulating film 44 used here is a material which can reflect light in white as the resin portion 20 does. In the insulating member used in the insulating film 44, the resin material is difficult to absorb the light emitted from the light emitting element 50 and has a difference in refractive index with respect to the resin as the base material in order to further increase the reflectance. A powder of a reflective material (for example, TiO ₂ , SiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, etc.) may be dispersed in advance and formed. In addition, the insulating film 44 is preferably formed of a material having a low light transmittance which hardly transmits the light emitted from the light emitting element 50 and the external light. The insulating film 44 can be formed by solidifying a liquid material, and a material having chemical resistance is more preferable. Such materials include thermosetting resins and thermoplastic resins, and specific examples include phenol resins, epoxy resins, BT resins, PPA, silicone resins and the like.

In the light emitting device 200, the first insulating plate 141 and the second insulating plate 142 are provided on the first side wall 21 and the second side wall 22 so as to bridge the gap D between the first lead 31 and the second lead 32 (plate surface Is exposed or embedded) to improve the strength of the resin portion 20 and hardly cause a short circuit. In addition, since the insulating film 44 is formed of a resin material when the resin portion 20 is provided, the bonding strength between the resin portion 20 and the insulating plate 140 can be improved.
In the method of manufacturing the light emitting device, in the lead frame prepared in the preparation step S1, the insulating film 44 is provided on the surfaces of the first metal plate 41 and the second metal plate 42 to be the metal plate 40 to form the first insulating plate 141 and the second insulating plate. The insulating plate 142 is prepared as it is formed. Thereafter, the light emitting device 200 can be formed by performing the bending step S2 similar to the first embodiment to the singulation step S7.

(Modification)
In addition, about the metal plate 40 and the temporary connection part 3a, the modification examples 1-3 are demonstrated using drawing. As a first modification, FIG. 9A is used. FIG. 9A is a plan view schematically showing a modification of the shape of the metal plate used for the light emitting device and the position of the temporary connection portion.
As shown in FIG. 9A, the metal plate 240 is positioned on the side wall (the first side wall 21 and the second side wall 22) of the recess 29 at a position crossing the gap D between the first lead 31 and the second lead 32. The first and second leads 32 and 32 are spaced apart from each other. The 1st metal plate 241 and the 2nd metal plate 242 which are metal plates 240 are formed in the shape which two corners have roundness. Further, the temporary connection portion 3 b is formed on the side end surface of the first lead 31 so as to be at a position separated from the second lead 32. When the metal plate 240 has a rounded corner, the corner of the first metal plate 241 or the second metal plate 242 does not easily protrude from the side wall surface when it is bent at a predetermined angle when embedded in the side wall. Furthermore, the temporary connection portion 3 b is located at a distance from the second lead 32, so that the short circuit is difficult. In addition, the space | interval in which the temporary connection part 3b is installed will not be specifically limited if the metal plate 240 can be supported.

  As a second modification, FIG. 9B is used. FIG. 9B is a plan view schematically showing a modification of the arrangement and shape of the metal plate used for the light emitting device and the position of the temporary connection portion. The metal plate 340 is formed so as to bridge the gap D between the first lead 31 and the second lead 32, and to have a size that faces a part of the first lead 31 and a part of the second lead 32. Good. The temporary connection portion 3 c is provided on the side end surface of the first lead 31 and the side end surface of the second lead 32, and is formed at a position symmetrical with respect to the center of the metal plate 340 in the longitudinal direction. . The first metal plate 341 and the second metal plate 342, which are metal plates 340, are formed to have the same size and the same thickness. Furthermore, the first metal plate 341 and the second metal plate 342 are formed to have a minimum length that faces a portion of the first lead 31 and a portion of the second lead 32 so as to bridge the gap D. Thus, in the metal plate 340, the strength of the resin portion 20 can be improved by minimizing the material of the metal plate 340.

  As a third modification, FIG. 9C is used. FIG. 9C is a plan view schematically showing a modification of the shape of the metal plate used for the light emitting device, and the shape and position of the temporary connection portion. The metal plate 440 is formed to have different lengths in the longitudinal direction of the first metal plate 441 and the second metal plate 442. Since the second metal plate 442 is formed shorter than the first metal plate 441, even if the shape of the entire device is different between the first metal plate 441 side and the second metal plate 442 side, it becomes possible to correspond. . In addition, the temporary connection portion 3 d is temporarily connected at one place to the first metal plate 441 and the side end face of the first lead 31, and at one place at the second end face of the second metal plate 442 and the first lead 31. It is formed to be temporarily connected. The temporary connection portion 3d is formed wider than the temporary connection portions 3a, 3b, 3c so that the first metal plate 441 or the second metal plate 442 can be temporarily connected at one place. Since the temporary connection portion 3d temporarily connects the first metal plate 441 or the second metal plate 442 at one place, the operation on the cutting and processing apparatus side at the time of cutting can be reduced.

The configurations of the first to third modifications may be used in combination as appropriate. For example, the formation position of the temporary connection portion 3c of the second modification may be made only on the first lead 31 side as in the first modification, or may be set at one position as in the third modification. Also, the metal plates 340 and 440 may be formed so as to be rounded like the metal plate 240. Furthermore, as in the third modification, the metal plates 240 and 340 may be formed to have different lengths.
Furthermore, as shown in FIG. 7, the high thermal conductivity member 43 may be provided on the surface of the metal plates 240, 340, and 440, or the insulating film 44 may be provided.
The metal plates 40, 240, 340, and 440 and the insulating plate 140 can have various shapes such as polygonal, semicircular, semielliptical, and fan-shaped.

  In the light emitting device described above, the first metal plate 41, 241, 341, 441 and the second metal plate 42, 242, 342, 442 or the first insulating plate is placed at a position across the gap D where the mechanical strength is relatively low. By providing the 141 and the second insulating plate 142, the strength of the package 10 can be secured even if the thicknesses of the first side wall 21 and the second side wall 22 of the packages 10 and 10A are made thinner, so a thinner structure is realized. Thus, the light emitting device can have excellent package strength.

Further, in the package 10, 10A, only one of the first metal plate 41, 241, 341, 441 and the second metal plate 42, 242, 342, 442, or the first insulating plate 141 and the second insulating plate 142. Only one of them may be provided.
Further, although the metal plate 40, 240, 340, 440 or the insulating plate 140 is described as being cut later in a state of being temporarily connected to the lead frame by any of the temporary connection portions 3a, 3b, 3c, 3d, When preparing the resin portion 20 as a separate member, it may be provided from the surface of the side wall.
The second metal plate 42, 242, 342, 442 or the second insulating plate 142 may have a shape that is bent along the inclined surface 22 a of the second side wall 22 from the portion of the straight plane. That is, the shape of the second metal plate 42, 242, 342, 442 or the second insulating plate 142 is not limited as long as it is formed along the second side wall 22 at a position straddling the gap D.
Further, the metal plates 40, 240, 340, and 440 may be configured to be thinner than the lead electrode 30 so that the thermal conductivity is higher than that of the lead electrode 30.

3a, 3b, 3c, 3d temporary connection portion 10, 10A package 20 resin portion 21 first side wall 22 second side wall 23 third side wall 24 fourth side wall 25 bottom 28 opening 29 recessed portion 30 lead electrode 31 first lead 32 second Reed 40, 240, 340, 440 Metal plate 41, 241, 341, 441 First metal plate 42, 242, 342, 442 Second metal plate 43 High thermal conductivity member 44 Insulating film 50 Light emitting element 60 Sealing member 100, 200 Light emission Device 140 Insulating plate 141 First insulating plate 142 Second insulating plate

Claims (14)

A resin portion having a recess, a pair of lead electrodes supported by the resin portion and disposed with a gap in a bottom surface of the recess, and a gap between the pair of lead electrodes on a side wall of the recess so as to straddle the gap A package having a metal plate provided thereon;
A light emitting device mounted on a pair of lead electrodes of the package.   The metal plate according to claim 1, wherein the metal plate has a first metal plate provided on one inner wall surface of the side wall of the facing recess and a second metal plate provided on the other inner wall surface of the side wall of the facing recess. Light emitting device.   The light emitting device according to claim 1, wherein the metal plate is formed of the same material as the pair of lead electrodes.   The light emitting device according to any one of claims 1 to 3, wherein the metal plate is provided along the side wall at a range of 90 degrees to 110 degrees with respect to the bottom surface of the recess.   The light emitting device according to any one of claims 1 to 4, wherein the metal plate has a thermal conductivity higher than that of the pair of lead electrodes.   The light emitting device according to any one of claims 1 to 5, wherein a surface of the metal plate on the inner wall surface side of the concave portion is exposed from the resin portion.   The light emitting device according to any one of claims 1 to 5, wherein the metal plate is embedded in the resin portion and provided in the side wall. A resin portion having a recess, a pair of lead electrodes supported by the resin portion and disposed with a gap in a bottom surface of the recess, and a gap between the pair of lead electrodes on a side wall of the recess so as to straddle the gap A package having an insulating plate provided thereon;
A light emitting device mounted on a pair of lead electrodes of the package.   The light emitting device according to claim 8, wherein the insulating plate covers a metal plate with an insulating film.   A resin portion having a recess, a pair of lead electrodes supported by the resin portion and disposed with a gap in a bottom surface of the recess, and a gap between the pair of lead electrodes on a side wall of the recess so as to straddle the gap And a metal plate or an insulating plate provided. A pair of lead electrodes are formed facing each other with a gap, and a lead frame having a metal plate formed to have a length straddling the gap on the side end surface of the pair of lead electrodes via a temporary connection portion is prepared. Preparation process,
A bending step of bending the metal plate at a predetermined angle with the temporary connection portion of the pair of lead electrodes as a boundary;
A resin portion is provided on the lead frame via a mold, and the pair of lead electrodes is exposed on the bottom of the recess of the resin portion, and the metal plate is disposed along the inner side surface of the recess. A package forming step to hold;
And a separation step of separating the metal plate from the pair of lead electrodes by cutting the temporary connection portion through a cutting device. The metal plate is a first metal plate connected to the side end surface, which is one side of the pair of lead electrodes, through a temporary connection portion, and the side that is the other side of the pair of lead electrodes. And a second metal plate connected to the end face via the temporary connection portion,
The method for manufacturing a package according to claim 11, wherein in the disconnecting step, the temporary connection portions of the first metal plate and the second metal plate are disconnected from the pair of lead electrodes by the cutting device.   The method of manufacturing a package according to claim 11, wherein the metal plate is coated with an insulating film. Preparing a package obtained by the method of manufacturing a package according to any one of claims 11 to 13.
Mounting the light emitting element on the pair of lead electrodes exposed on the bottom surface of the recess;
A method of manufacturing a light emitting device, comprising: a singulation step of singulating the respective packages in which the light emitting element is mounted.

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