JP6277860B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

Conventionally, a light emitting device of a chip scale package (CSP) approximately the same size as a chip has been proposed (for example, Patent Document 1). This light-emitting device is a light-emitting device in a top-view type mounting form. Depending on the application, the light-emitting device itself is thin and can be used very effectively. In addition, the light emitting device is formed with a protrusion on a lead electrode used for a package, thereby improving mass production efficiency and realizing further reduction in thickness.
On the other hand, a side view type light emitting device is used as a backlight light source of a display panel of an electronic device.
Since the mounting form of the side view type light emitting device is different from the above-described top view type, there are various restrictions that the top view type cannot be applied as it is in terms of mounting stability, light distribution state, and the like. .

JP 2001-223391 A

In particular, in recent years, in light-emitting devices that are required to be smaller and thinner, flattening and downsizing of the substrate have been promoted in order to minimize the space occupied by the chip scale package itself. For this reason, the metal member used as a terminal has shifted from a plate-like lead electrode to a metal film formed directly on the substrate itself in the form of an ultrathin film. Even when such a metal film is used for a package, in particular, in a side-view type light-emitting device, when a light-emitting element is mounted on a package and a light-emitting device is mounted on a mounting substrate, it is stable without causing element failure. What can be mounted or mounted with high accuracy and accuracy is demanded.
Further, it is necessary to further improve the light extraction efficiency in a situation where a higher power or higher luminance is required by a smaller chip.

  The present invention has been made in view of the above problems, and even in a small and thin light-emitting device, an element defect occurs when the light-emitting element is mounted on a package and the light-emitting device is mounted on a mounting substrate. An object of the present invention is to provide a light emitting device that can be mounted or mounted stably and with high accuracy.

The present invention
A base body provided with a pair of connection terminals on at least the first main surface;
A light emitting device connected to the connection terminal by a meltable member;
A light reflecting device that covers the light emitting element, and a light emitting device comprising:
The connection terminal includes a convex portion projecting from the connection terminal on the first main surface, the portion connected to the light emitting element.
The convex portion and the meltable member are light emitting devices embedded in the light reflective member.
The present invention also provides:
Preparing a base including a pair of connection terminals having a convex portion on at least the first main surface;
A light emitting element having a semiconductor laminate on a substrate and having a pair of electrodes on the same surface side of the semiconductor laminate is placed on a convex portion on the first main surface of the base, and the light emission is performed by a meltable member. A pair of electrodes of the element and a pair of connection terminals, respectively,
It is a method for manufacturing a light emitting device including a step of embedding a convex portion of the connection terminal, a surface of the meltable member, and a space between the base and the light emitting element with a light reflective member.

According to the light-emitting device of the present invention, even if the light-emitting device is small and thin, it is stable and high without causing any element defect in mounting the light-emitting element on the package and mounting the light-emitting device on the mounting substrate. Mounting or mounting is realized with high accuracy.
According to the method for manufacturing a light-emitting device of the present invention, the above-described light-emitting device can be easily and reliably manufactured.

1 is a schematic perspective view of a light emitting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line A-A ′ of the light emitting device of FIG. 1. It is a plane perspective view of the light-emitting device of FIG. It is a schematic perspective view which shows the state in which the light-emitting device of FIG. 1 was mounted in the mounting member. It is a schematic plan view for demonstrating the manufacturing method of the light-emitting device of FIG. It is a B-B 'line sectional view of Drawing 5A. It is a schematic sectional drawing of the light-emitting device of another embodiment of this invention. It is a schematic cross section of the light-emitting device of further another embodiment of this invention. It is a schematic plan view of the light-emitting device of further another embodiment of this invention. It is the side view seen from the arrow E side of FIG. 8A. It is the F-F 'sectional view taken on the line of FIG. 8A. It is the G-G 'sectional view taken on the line of FIG. 8A. It is a top view of the base | substrate in the light-emitting device of FIG. 8A. It is the perspective view seen from the arrow E side of the base | substrate of FIG. 8E. It is a back surface perspective view of the base | substrate of FIG. 8E. It is a schematic plan view of the light-emitting device of further another embodiment of this invention. It is the side view seen from the arrow E side of FIG. 9A. It is the F-F 'sectional view taken on the line of FIG. 9A. FIG. 9B is a sectional view taken along line G-G ′ of FIG. 9A. It is a top view of the base | substrate in the light-emitting device of FIG. 9A. It is a schematic plan view which shows the shape of the convex part of the connecting terminal in the light-emitting device of further another embodiment of this invention. It is a schematic sectional drawing of the light-emitting device of another embodiment of this invention. It is a general | schematic partial plane perspective view of the light-emitting device of another embodiment of this invention. FIG. 12B is a side view of FIG. 12A. It is sectional drawing of FIG. 12A. It is a top view of the base | substrate in the light-emitting device of FIG. 12A. It is sectional drawing of the base | substrate in the light-emitting device of FIG. 12A. FIG. 12B is a rear view of the base in the light emitting device of FIG. 12A. It is a general | schematic fragmentary top view of the base | substrate for demonstrating the manufacturing method of the light-emitting device of FIG. 12A. It is a schematic plane perspective view of the light-emitting device of further another embodiment of this invention. FIG. 13B is a side view of FIG. 13A. It is sectional drawing of FIG. 13A. It is a top view of the base | substrate in the light-emitting device of FIG. 13A. It is sectional drawing of the base | substrate in the light-emitting device of FIG. 13A. It is a back view of the base | substrate in the light-emitting device of FIG. 13A. It is a general | schematic fragmentary top view of the base | substrate for demonstrating the manufacturing method of the light-emitting device of FIG. 13A.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples.
The size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation.

  The light emitting device of the present invention includes a base body including a pair of connection terminals, a light emitting element, and a light reflecting member. This light emitting device may be used in any mounting form, but a light emitting device mounted in a mounting form called a side view type, so-called side light emitting type, that is, a surface adjacent to the light extraction surface. A mounting surface is preferable.

  In this specification, the light extraction surface of the light emitting device is referred to as an upper surface, the surface adjacent to or intersecting with the light extraction surface is referred to as a side surface, and one of the side surfaces is referred to as a mounting surface of the light emitting device. Accordingly, the surface corresponding to the light extraction surface of the light emitting device among the surfaces of each element or each member constituting the light emitting device is the first main surface (that is, the upper surface) and the opposite side of the first main surface. The surface may be referred to as a second main surface (that is, the lower surface), and a surface that is adjacent to or intersects with the first main surface and the second main surface (that is, a surface corresponding to the side surface of the light emitting device).

[Substrate]
The base body includes a pair of connection terminals corresponding to positive and negative at least on the first main surface. These connection terminals are usually formed on at least the first main surface of the base material. The 1st main surface here refers to one surface of a base or a base material.
The shape of the substrate is not particularly limited, but is usually a shape corresponding to the shape of a base material described later. For example, it is preferable that at least the first main surface is long in the longitudinal direction, and it is more preferable that a short direction perpendicular to the longitudinal direction is provided.

(Base material)
The base material may be formed of any material. For example, a metal, ceramic, resin, dielectric, pulp, glass, paper, or a composite material thereof, or a composite material of these materials and a conductive material (for example, metal, carbon, etc.) can be used. Examples of the metal include those containing copper, iron, nickel, chromium, aluminum, silver, gold, titanium, or alloys thereof. Examples of the resin include an epoxy resin, a bismaleimide triazine (BT) resin, and a polyimide resin. The resin may contain a white pigment such as titanium oxide. Of these, ceramics and composite resins are preferable.
When the base material is formed of such a material, it can be procured at low cost by applying a known manufacturing technique.

  Examples of the ceramic include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or a mixture thereof, and it is preferable to use aluminum nitride having high heat dissipation. The composite resin is preferably a glass epoxy resin. Note that the base material may have a moderate strength or may have so-called flexibility.

  The shape, size, thickness, and the like of the base material in one light emitting device are not particularly limited, and can be set as appropriate. Examples of the (planar) shape of the first main surface include a circular shape, a polygonal shape such as a quadrangle, or a shape close to these, and a rectangular shape is preferable among them. The size is preferably a larger area than the light emitting element described later, and in particular, a size having a length of about 2 to 5 times one side of the light emitting element is preferable. As for thickness, about 50-300 micrometers is mentioned.

(Connecting terminal)
The pair of connection terminals may be formed on at least the first main surface of the base.
For example, the connection terminal is provided extending from the first main surface on the surface (that is, the end surface) existing between the first main surface and the second main surface, or from the first main surface, It passes over the end surface existing between the first main surface and the second main surface, and further extends on the second main surface (for example, in a cross-sectional view, in a U shape). Preferred (see connection terminal 3 in FIG. 2, connection terminal 43 in FIG. 8C, etc.). Here, the end surface means a part or all of one end surface existing between the first main surface and the second main surface, but the specific existing between the first main surface and the second main surface. In addition to a part or all of the end face, a part of one or two end faces adjacent to the specific end face may be included.

In the connection terminal, a portion connected to the light emitting element on the first main surface of the base includes a protrusion protruding from the surface of the connection terminal. Hereinafter, this part may be referred to as an “element connection part”.
The shape, height, size, and the like of the convex portion are not particularly limited, and can be appropriately adjusted depending on the size of the base, the thickness of the connection terminal, the size of the light emitting element, and the like.
For example, it is preferable that the convex portions are arranged in shapes, sizes, and positions corresponding to each of a pair of electrodes formed in the light emitting element described later. Further, the planar shape of the convex portion is a polygon such as a circle, an ellipse or a ring, a triangle or a quadrangle, a shape obtained by rounding these corners, a polygon such as an X, L, E, or V shape, or these corners. Examples include rounded shapes. Especially, it is preferable that at least a part of the outer shape of the convex portion in plan view is a shape that matches the outer shape of the electrode of the light emitting element. Thereby, as will be described later, the mountability can be improved by the self-alignment effect. Moreover, the shape where a part (for example, center part) of a polygon side was dented inside is preferable like X shape. It is easy to store the meltable member in the recessed portion, and the mounting of the light emitting element can be stabilized.
The inclination on the side surface of the convex portion is preferably close to vertical. Thereby, it becomes difficult for the light emitting element mounted on it to move, and the mounting of the light emitting element can be stabilized.

  In the pair of connection terminals, the portions connected to the light emitting element are usually separated from each other on the first main surface of the base. Therefore, the convex portion can be arranged adjacent to or apart from the edge of the connection terminal and partially adjacent or partially separated. Especially, it is preferable that the whole edge part of a convex part is spaced apart from the edge part of a connection terminal, and is arrange | positioned inside it (for example, the convex part 3a of FIG. 3, the convex part 13a of FIG. 5A, FIG. (Refer to the convex part 43a of FIG. 9E). Due to the arrangement of the projections, even when a meltable member to be described later flows from the projection when the light emitting element is mounted, it is easy to collect around the projection, and the short circuit between the pair of connection terminals, the intention It is possible to prevent the meltable member from entering the area that is not. Therefore, the light emitting element can be accurately fixed to the intended site. Further, it is possible to prevent a meltable member or the like for mounting the light emitting element or a flux contained therein from penetrating under the light reflecting member (to be described later) and further below the light emitting element along the connection terminal surface. Can do.

  For example, the height of the convex portion only needs to protrude from the thinnest part of the connection terminal on the first main surface of the base, and is 10% or more, 20% or more, 30% or more of the thickness of the thinnest part. , 40% or more, 50% or more, preferably 100% or more. In other words, when the thickness of the thinnest portion of the first main surface is about 10 to 40 μm, the connection terminal has a thickness of about 1 to 40 μm.

The connection terminal may be formed of, for example, a single layer film or a multilayer film of a metal such as Au, Pt, Pd, Rh, Ni, W, Mo, Cr, Ti, Fe, Cu, Al, Ag, or an alloy thereof. it can. Among these, materials excellent in conductivity and mountability are preferable, and materials having good bondability and wettability with solder used for mounting the light emitting device are more preferable. In particular, copper or a copper alloy is preferable from the viewpoint of heat dissipation. A film having high light reflectivity such as silver, platinum, tin, gold, copper, rhodium, or an alloy thereof may be formed on the surface of the connection terminal. Specific examples of the connection terminal include a laminated structure of W / Ni / Au, W / Ni / Pd / Au, W / NiCo / Pd / Au, and the like.
The connection terminals may partially differ in thickness or number of layers (see the connection terminals 43 in FIGS. 8B and 9B, and the protrusions 43a in FIGS. 8C and 9C).

  The connection terminal may use wiring, a lead frame, or the like, or can be formed by vapor deposition on the surface of a base material, sputtering, plating, or the like. Among these, it is preferable to use plating. In particular, the protrusion is formed on the single-layer film or the laminated film by using a mask after forming the above-described single-layer film or laminated film of the metal or alloy on at least the first main surface. It can be formed by further laminating a single layer film or a laminated film. The convex portion can be formed by forming a thick film by substrate surface plating or the like and then removing portions other than the convex portion by etching. According to this method, it is easy to make the inclination of the side surface of the convex portion close to vertical. Further, even when a composite substrate is used, variation in plating thickness (height of convex portions) can be reduced, so that mass productivity can be improved. The thickness of the connection terminal is from several μm to several hundred μm.

  It is preferable that a part of the edge of the connection terminal is formed so as to coincide with a part of the edge of the first main surface of the base. In other words, it is preferable that a part of the end face of the connection terminal and a part of the end face of the base are formed so as to form the same plane. Thereby, the mountability of the light emitting device can be improved. Here, the same surface means that there is no or almost no step, and irregularities of about several μm to several tens of μm are allowed. The same applies hereinafter in this specification.

  The connection terminal preferably has, on the first main surface, an element connection portion connected to the above-described electrode of the light emitting element and an external connection portion connected to the outside of the light emitting device. In particular, it is more preferable that the external connection portion further extends on the second main surface of the base in addition to the first main surface of the base. Usually, the element connection portion is arranged on the first main surface, and the external connection portion is arranged on the first main surface, the first main surface and the end surface, or on the first main surface, the end surface and the second main surface. .

  The connection terminals do not necessarily have the same width (for example, the length in the short direction of the substrate) over the first main surface, the end surface, and / or the second main surface, and only a part thereof is narrow or wide. It may be formed. Alternatively, a part of the connection terminal may be covered with an insulating material (for example, a base material) so as to be narrow on the first main surface and / or the second main surface of the base. Such a narrow portion is preferably disposed on at least the first main surface of the base (see connection terminal 3 in FIG. 3), and is disposed on both the first main surface and the second main surface. (Refer to the connection terminal 43 in FIGS. 8D and 8F). In particular, it is more preferable that the narrow portion is disposed in the vicinity of the light reflecting member described later on the first main surface of the base. By arranging the narrow portion, the solder or the like as will be described later, or the flux contained therein, which is connected to the connection terminal, along the surface of the terminal, below the light reflecting member to be described later, and further below the light emitting element. It is possible to suppress the intrusion.

  The narrow portion is preferably narrower than the element connection portion. Further, it is preferable that the narrow portion is gradually narrowed (see, for example, the connection terminal 43 in FIG. 8E).

  When the connection terminal extends from the first main surface to the second main surface, the connection terminal does not necessarily pass through the end surface and may extend through a through hole provided in the base material.

Further, in addition to the connection terminal electrically connected to the light emitting element, a heat radiating terminal, a heat sink, a reinforcing member, and the like may be included (see, for example, the reinforcing terminal 43c in FIGS. 8B and 9B). . These may be disposed on any of the first main surface, the second main surface, and the end surface, and particularly preferably disposed below the light emitting element and / or the light reflecting member. Thereby, the intensity | strength of a light-emitting device can be raised and reliability can be improved. Further, when the light reflective member is molded using a mold, the distortion of the substrate is reduced, and the moldability of the light reflective member can be improved.
When the heat radiating terminal or the reinforcing terminal is provided between the connection terminals, it is preferable that the terminal is covered with an insulating film such as a solder resist or an insulating film is provided between the terminals. . Thereby, the bridge | crosslinking of the meltable member between the connection terminals and the terminal for thermal radiation or the reinforcement terminal can be prevented.

  Further, in the case where a plurality of light emitting elements are arranged in one light emitting device, one or more additional connection terminals for electrically connecting the plurality of light emitting elements may be provided. In this case, the shape and position of the connection terminal can be appropriately set depending on the number of light-emitting elements mounted on one substrate, the arrangement thereof, the connection form (parallel and series), and the like (see the terminal 25 in FIG. 6). . This connection terminal is provided with the above-described convex portion at a portion connected to the light emitting element.

  As for a connection terminal, it is preferable that the 1st main surface other than a convex part is flat. Further, the first main surface of the connection terminal and the surface of the convex portion are horizontal to the first main surface of the base so that the light emitting surface can be arranged horizontally when the light emitting element is mounted on the base. It is preferable.

  The substrate itself may constitute a protective element such as a capacitor, a varistor, a Zener diode, or a bridge diode, or may include a part of the structure that functions as these elements. By using a device that performs such an element function, it is possible to function as a light emitting device without separately mounting components. As a result, it is possible to further reduce the size of a high-performance light-emitting device with improved electrostatic withstand voltage and the like.

[Light emitting element]
The light emitting element is mounted on the base, and is connected to the connection terminal on the first main surface on the first main surface of the base.
There may be one light emitting element or a plurality of light emitting elements mounted on one light emitting device. The size, shape, and emission wavelength of the light-emitting element can be selected as appropriate. When a plurality of light emitting elements are mounted, the arrangement may be irregular, and may be arranged regularly or periodically such as a matrix. In addition, the plurality of light emitting elements may be connected in any of series, parallel, series parallel, or parallel series.

  The light-emitting element in the light-emitting device of the present invention includes a semiconductor stacked body in which a first semiconductor layer (for example, an n-type semiconductor layer), a light-emitting layer, and a second semiconductor layer (for example, a p-type semiconductor layer) are stacked in this order. On the surface side (for example, the surface on the second semiconductor layer side), both the first electrode electrically connected to the first semiconductor layer and the second electrode electrically connected to the second semiconductor layer are provided. . The semiconductor stacked body is usually stacked on a substrate for growth of a semiconductor layer. However, the light emitting element may be accompanied by a growth substrate or may be a substrate from which the substrate has been removed.

The types and materials of the first semiconductor layer, the light emitting layer, and the second semiconductor layer are not particularly limited, and examples thereof include various semiconductors such as III-V group compound semiconductors and II-VI group compound semiconductors. Specific examples thereof include nitride-based semiconductor materials such as In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1), and include InN, AlN, GaN, InGaN, and AlGaN. InGaAlN or the like can be used. As the film thickness and layer structure of each layer, those known in the art can be used.

Examples of the substrate for growing the semiconductor layer include a substrate capable of epitaxially growing the semiconductor layer. Examples of such a substrate material include an insulating substrate such as sapphire (Al ₂ O ₃ ) and spinel (MgA1 ₂ O ₄ ), the above-described nitride-based semiconductor substrate, and the like. By using a light-transmitting substrate such as a sapphire substrate as a substrate for growing a semiconductor layer, the substrate can be used for a light-emitting device without being removed from the semiconductor stacked body.
The substrate may have a plurality of convex portions or irregularities on the surface. Moreover, you may have an off angle of about 0-10 degree with respect to predetermined crystal planes, such as C surface and A surface.
The substrate may have a semiconductor layer such as an intermediate layer, a buffer layer, or a base layer, an insulating layer, or the like between the first semiconductor layer.

  The semiconductor layer growth substrate irradiates the semiconductor layer from the growth substrate side with laser light (for example, KrF excimer laser) that passes through the substrate to cause a decomposition reaction at the interface between the semiconductor layer and the substrate. The substrate can be removed from the semiconductor layer by using a laser lift-off method or the like. However, the growth substrate may be a substrate in which some of the substrate remains in the end portion or corner portion of the semiconductor layer in addition to the substrate completely removed from the semiconductor layer. The substrate for growth may be removed before or after the light emitting element is mounted on the substrate.

  When the semiconductor stacked body is obtained by removing the substrate for growing the semiconductor layer, a light emitting device that can be made thinner and smaller can be obtained. Further, by removing a layer that does not directly contribute to light emission, absorption of light emitted from the light emitting layer due to this can be prevented. Therefore, the light emission efficiency can be further improved. As a result, it is possible to increase the light emission luminance.

  The shape of the semiconductor laminate in plan view is not particularly limited, and a quadrangle or a shape approximate to this is preferable. The upper limit of the size of the semiconductor stacked body can be adjusted as appropriate depending on the size of the light emitting device. Specifically, the length of one side of the semiconductor stacked body is about several hundred μm to 10 mm.

(First electrode and second electrode)
The first electrode and the second electrode are preferably formed on the same side of the semiconductor stacked body (on the opposite side when a substrate is present). Thereby, flip chip mounting can be performed in which the positive and negative connection terminals of the substrate and the first electrode and the second electrode of the light emitting element are opposed to each other.

  The first electrode and the second electrode can be formed of, for example, a single layer film or a laminated film of a metal such as Au, Pt, Pd, Rh, Ni, W, Mo, Cr, Ti, or an alloy thereof. Specifically, the laminated layers are Ti / Rh / Au, W / Pt / Au, Rh / Pt / Au, W / Pt / Au, Ni / Pt / Au, Ti / Rh, etc. from the semiconductor layer side. A membrane is mentioned. The film thickness may be any film thickness used in this field.

In addition, the first electrode and the second electrode have a material layer having a higher reflectivity with respect to light emitted from the light emitting layer than other materials of the electrode on the side close to the first semiconductor layer and the second semiconductor layer, respectively. It is preferable to be arranged as a part of
Examples of the material having high reflectance include a layer containing silver, a silver alloy, or aluminum. As the silver alloy, any material known in the art may be used. The thickness of the material layer is not particularly limited, and may be a thickness that can effectively reflect light emitted from the light emitting element, for example, about 20 nm to 1 μm. The larger the contact area of the material layer with the first semiconductor layer or the second semiconductor layer, the better.

In addition, when using silver or a silver alloy, in order to prevent silver migration, it is preferable to form a coating layer that covers the surface (preferably, the upper surface and the end surface).
As such a coating layer, what is necessary is just to be formed with the metal and alloy which are normally used as a conductive material, for example, the single layer or laminated layer containing metals, such as aluminum, copper, and nickel, is mentioned. It is done. Of these, AlCu is preferably used. The thickness of the coating layer is about several hundred nm to several μm in order to effectively prevent silver migration.

  As long as the first electrode and the second electrode are electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, the entire surface of the electrode may not be in contact with the semiconductor layer. The part may not be located on the first semiconductor layer and / or part of the second electrode may be located on the second semiconductor layer. That is, for example, the first electrode may be disposed on the second semiconductor layer via an insulating film or the like, or the second electrode may be disposed on the first semiconductor layer. Thereby, since the shape of a 1st electrode or a 2nd electrode can be changed easily, it can mount in a pair of connecting terminal easily.

  The insulating film here is not particularly limited, and may be either a single layer film or a laminated film used in this field. By using an insulating film or the like, the first electrode and the second electrode can be set to an arbitrary size and position regardless of the plane area of the first semiconductor layer and / or the second semiconductor layer.

  The shapes of the first electrode and the second electrode can be set according to the shape of the semiconductor laminate, the shape of the connection terminal (particularly, the convex portion) of the base body, and the like. It is preferable that each of the first electrode, the second electrode, and the connection terminal (particularly the convex portion) has a square shape in plan view or a shape close thereto. Thereby, joining and position alignment of a semiconductor laminated body and a base | substrate can be easily performed by the self-alignment effect. In this case, it is preferable that the planar shapes of the first electrode and the second electrode are substantially the same at least on the outermost surface of the semiconductor stacked body connected to the substrate. Moreover, it is preferable that the first electrode and the second electrode are arranged so as to face each other across the central portion of the semiconductor stacked body.

  The first main surface (surface opposite to the semiconductor layer) of the first electrode and the second electrode may have a step, but is preferably substantially flat. Here, the term “flat” refers to the height from the second main surface (the surface opposite to the first main surface) of the semiconductor stacked body to the first main surface of the first electrode, and the second main surface of the semiconductor stacked body to the second main surface. It means that the height to the 1st main surface of 2 electrodes is substantially the same. Here, “substantially the same” allows a variation of about ± 10% of the height of the semiconductor stacked body.

  As described above, the first main surfaces of the first electrode and the second electrode are substantially flat, that is, by substantially disposing them on the same surface, it becomes easy to mount the light emitting element horizontally on the substrate. In order to form such a 1st electrode and a 2nd electrode, it can implement | achieve by providing a metal film by plating etc. on an electrode, for example, and polishing or cutting so that it may become flat after that.

A DBR (distributed Bragg reflector) layer or the like may be disposed between the first electrode and the second electrode and the first semiconductor layer and the second semiconductor layer in a range that does not hinder the electrical connection therebetween. Good.
The DBR has a multilayer structure in which a low refractive index layer and a high refractive index layer are laminated on an underlayer arbitrarily formed of an oxide film, for example, and selectively reflects light having a predetermined wavelength. Specifically, a predetermined wavelength can be reflected with high efficiency by alternately laminating films having different refractive indexes with a thickness of ¼ wavelength. As a material, it can be formed including at least one oxide or nitride selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al.

(Melting member)
In the light-emitting element, the first electrode and the second electrode are usually joined to the connection terminal of the substrate described above by the meltable member, in particular, on the convex portion, and in some cases, further on the side surface of the convex portion. For such a meltable member, any material known in the art can be used. Examples of the meltable member include materials that can be melted by heating, for example, solders such as tin-bismuth, tin-copper, tin-silver, and gold-tin, and brazing materials such as low melting point metals. In particular, by using solder, the light-emitting element can be easily mounted in place by the self-alignment effect, the mass productivity can be improved, and a smaller light-emitting device can be manufactured.
The meltable member covers at least the upper surface of the convex portion. The meltable member may cover a part or all of the side surface of the convex portion and further the first main surface of the connection terminal around the convex portion.

(Light reflective member)
The light reflective member is a member having light reflectivity and a function of covering, fixing, or sealing at least the light emitting element. Moreover, it is a member which embeds the convex part of a connection terminal mentioned above, and a meltable member. Further, of the convex portion of the connection terminal, the part not covered with the meltable member, the part of the meltable member that is not in contact with the electrode of the light emitting element, and the part of the light emitting element that faces the substrate, It is preferable that all of the portions that are not in contact with the meltable member and the end surfaces thereof are in contact with and covered with the light reflective member. With such an arrangement, light emitted from the light emitting element can be efficiently extracted to the light extraction surface side without being absorbed by the substrate, the connection terminal, the meltable member, and the like.

  The material of the light reflecting member is not particularly limited, and examples thereof include ceramic, resin, dielectric, pulp, glass, or a composite material thereof. Among these, a resin is preferable from the viewpoint that it can be easily formed into an arbitrary shape.

  Examples of the resin include a thermosetting resin and a thermoplastic resin. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; polyimide resin compositions, modified polyimide resin compositions; Polyphthalamide (PPA); polycarbonate resin; polyphenylene sulfide (PPS); liquid crystal polymer (LCP); ABS resin; phenol resin; acrylic resin;

The light reflective member is preferably made of a material having a reflectance of 60% or more with respect to light from the light emitting element, more preferably 70%, 80%, or 90% or more.
Therefore, the above-mentioned materials, for example, resin, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, various rare earth oxides (for example, yttrium oxide) , Gadolinium oxide) or the like, a light scattering material, or a colorant such as carbon black is preferably contained.
The light reflective member may contain a fibrous filler such as glass fiber or wollastonite, or an inorganic filler such as carbon. Further, a material with high heat dissipation (eg, aluminum nitride) may be included. Furthermore, you may make the light-reflective member contain the fluorescent substance mentioned later.
These additives are preferably contained, for example, in an amount of about 10 to 40% by weight based on the total weight of the light reflective member.

  Thereby, the light from a light emitting element can be reflected efficiently. In particular, a material having a higher light reflectivity than that of the base is used (for example, when aluminum nitride is used for the base, a silicone resin containing titanium dioxide is used as the light reflective member), while maintaining handling properties. By reducing the size of the substrate, the light extraction efficiency of the light emitting device can be further increased.

Further, the strength of the light-reflecting member during the process can be improved, for example, by removing and peeling the growth substrate of the semiconductor layer, and as a result, the strength of the light-emitting device can be ensured.
Furthermore, heat dissipation can be improved with a material having high heat dissipation while maintaining downsizing of the light emitting device.

The shape of the light reflecting member is not particularly limited, and examples thereof include a polygonal column such as a cylinder and a quadrangular column or a shape close to these, a polygonal frustum such as a truncated cone and a quadrangular pyramid. In particular, it is preferable to have an elongated shape in the longitudinal direction of the substrate. Moreover, it is preferable to have the surface along the transversal direction of a base | substrate.
The light reflective member is preferably provided so as to surround the entire periphery of the light emitting element. Further, it is preferably provided so as to fill a space between the light-emitting element mounted on the flip chip and the substrate. Thereby, the intensity | strength of a light-emitting device can be raised. In the case where the light reflecting member is provided so as to surround the entire periphery of the light emitting element, the light reflecting member is preferably provided thick on the long side of the light emitting device and thin on the short side. Thereby, the light emitting device can be thinned.

The edge of the light reflective member in plan view may be disposed inside or outside of the edge of the substrate. When the light reflecting member has a shape elongated in the longitudinal direction, one edge portion along the longitudinal direction preferably coincides with the edge portion along the longitudinal direction of the base body. That is, at least one of the end surfaces along the longitudinal direction of the light reflecting member preferably forms the same surface as one of the end surfaces along the longitudinal direction of the substrate, and both of the end surfaces along the longitudinal direction have the same surface. More preferably, it is formed. Accordingly, the area of the light extraction surface can be increased without increasing the thickness of the light emitting device, and the light extraction efficiency can be increased. The edge in the short direction may be arranged outside the edge along the short direction of the substrate, but is usually arranged inside.
When the light emitting device is mounted as a side view type, the width in the short direction of the base body and the light reflecting member is preferably 0.2 mm to 0.4 mm.

The size of the light-reflecting member is preferably larger than that of the light-emitting element, and particularly preferably has a side length of about 2 to 5 times one side of the light-emitting element. As for thickness, about 50-300 micrometers is mentioned, for example.
The light reflective member can be formed by screen printing, potting, transfer molding, compression molding, or the like.

  The light reflecting member may be provided so as to cover the upper surface or the side surface of the light emitting element before the light emitting element is mounted on the substrate. Usually, the entire surface of the side surface of the light emitting element faces the substrate of the light emitting element. In order to seal or cover the surface or the like, it is preferable to form the light emitting element after it is mounted on the substrate.

(Translucent member)
It is preferable that a translucent member is provided on the light extraction surface of the light emitting device.
The end surface of the translucent member may coincide with the end surface of the light reflective member, or the end surface of the translucent member may be covered with the light reflective member. With such an arrangement of the translucent member, light extracted from the light emitting element can be efficiently guided to the light emitting surface.

  The light transmissive member preferably transmits 60% or more of light emitted from the light emitting layer, and further transmits 70%, 80%, or 90% or more. Examples of such members include silicone resins, silicone-modified resins, silicone-modified resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, TPX resins, polynorbornene resins, or hybrid resins containing one or more of these resins. Such as resin, glass and the like. Among these, a silicone resin or an epoxy resin is preferable, and a silicone resin excellent in light resistance and heat resistance is more preferable.

The translucent member preferably contains a phosphor.
As the phosphor, those known in the art can be used. For example, yttrium aluminum garnet (YAG) phosphor activated with cerium, lutetium aluminum garnet (LAG) phosphor activated with cerium, nitrogen-containing calcium aluminosilicate activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ) -based phosphor, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) -based phosphor, β sialon phosphor, KSF-based phosphor (K ₂ SiF ₆ : Mn), semiconductor fine particles called quantum dot phosphors, and the like. Accordingly, a light emitting device that emits mixed light (for example, white light) of primary light and secondary light having a visible wavelength, and a light emitting device that emits secondary light having a visible wavelength when excited by the primary light of ultraviolet light. it can. When the light emitting device is used for a backlight of a liquid crystal display, etc., a phosphor that emits red light (for example, KSF phosphor) that is excited by blue light emitted from the light emitting element and a phosphor that emits green light (for example, β sialon fluorescence). Body). Thereby, the color reproduction range of the display using a light-emitting device can be expanded.
Note that the phosphor is not limited to being contained in the above-described member, and can be provided in various positions and members of the light-emitting device. For example, the phosphor layer may be formed so as to cover the light emitting element, or may be provided as a phosphor layer that is coated, bonded, or the like on a light-transmitting member that does not contain a phosphor.

  The translucent member may further contain a filler (for example, a diffusing agent, a colorant, etc.). For example, silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass , Carbon black, phosphor crystals or sintered bodies, and sintered bodies of phosphors and inorganic binders. Optionally, the refractive index of the filler may be adjusted. For example, 1.8 or more is mentioned, and in order to efficiently scatter light and obtain high light extraction efficiency, it is preferably 2 or more, and more preferably 2.5 or more. Of these, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index and excellent thermal conductivity.

The shape of the filler particles may be any of crushed, spherical, hollow and porous. The average particle diameter (median diameter) of the particles is preferably about 0.08 to 10 μm, which can obtain a light scattering effect with high efficiency.
For example, the filler is preferably about 10 to 60% by weight with respect to the weight of the translucent member.

  The method of forming the translucent member is a method in which the translucent member is formed into a sheet shape and adhered by a hot melt method or an adhesive, electrophoretic deposition method, potting, compression molding, spraying, electrostatic coating method, The printing method etc. are mentioned. At this time, silica (aerosil) or the like may be added in order to adjust the viscosity or fluidity.

The thickness of a translucent member is not specifically limited, For example, about 10-300 micrometers is mentioned. By setting the thickness as described above, the light extracted from the light emitting element can be efficiently used regardless of whether the end face of the translucent member coincides with the end face of the light reflective member or is covered with the light reflective member. Can be guided to the light emitting surface.
In order to control light distribution, the translucent member may have a first main surface and / or a second main surface that are convex and concave surfaces such as a concave surface.
The translucent member may be attached to the upper surface of the light emitting element before the light emitting element is mounted on the substrate, and may be provided in the light emitting device. In particular, in the case where the light-emitting element is constituted by a semiconductor stacked body from which a substrate for growing a semiconductor layer is removed, for example, light is emitted by being bonded or fixed to a hard translucent member such as glass or ceramic. The strength of the element is increased, and handling properties, reliability of mounting the light emitting element, and the like can be improved.

[Insulating material]
In the light emitting device of the present invention, the insulating member may be disposed so as to cover a part of the connection terminal.
The insulating member is preferably disposed between the element connection portion of the connection terminal and the external connection portion. The insulating member may be disposed so as to completely separate the surface region between the element connection portion and the external connection portion so as not to dispose a region connected between the element connection portion and the external connection portion. preferable. Furthermore, it is preferable that the edge part of a light reflective member is arrange | positioned on a connection terminal so that it may be arrange | positioned on an insulating member.
Accordingly, as described later, when the light emitting device is mounted on the mounting substrate in a side view type, it is avoided that the meltable member enters along the surface of the connection terminal and decreases the reliability of the light emitting device. be able to. When the light emitting element is connected to the connection terminal by the meltable member, leakage from the convex portion and the vicinity thereof to the external connection portion of the meltable member can be prevented. The adhesion between the light reflecting member and the substrate can be improved, and the possibility that the light reflecting member is peeled off can be reduced.
In particular, as described above, when the light reflective member has a shape that is long in the longitudinal direction, the edge in the longitudinal direction of the light reflective member is disposed on the connection terminal so as to be disposed on the insulating member. More preferably. Thereby, also when a base | substrate warps or twists, a possibility that a light reflective member may peel can be reduced. When the light reflecting member is molded using a mold, it is possible to prevent the connection terminal from being damaged due to contact between the mold and the connection terminal.
As described above, since the connection terminal may not necessarily have the same width on the first main surface, a part of the insulating member is disposed not only on the connection terminal but also on the base body. Sometimes it is done.
A pair of insulating members may be provided so as to cover each of the pair of connection terminals, or the pair of connection terminals may be continuously covered.

  The insulating member is preferably disposed on the connection terminal so that the edge of the light reflecting member is disposed on the insulating member. In particular, as described above, when the light reflective member has a shape that is long in the longitudinal direction, the edge in the longitudinal direction of the light reflective member is disposed on the connection terminal so as to be disposed on the insulating member. More preferably. As described above, since the connection terminal may not necessarily have the same width on the first main surface, a part of the insulating member is disposed not only on the connection terminal but also on the base body. Sometimes it is done.

  The insulating member may be formed of any material as long as it has insulating properties. For example, the materials exemplified above for the light reflective member and the light transmissive member described later can be used. Of these, a white silicone resin having high heat resistance is preferable.

The shape of the insulating member is not particularly limited, and it is preferable that the insulating member is formed in a continuous belt shape from the adjacent portion of the element connecting portion to the outside of the light reflective member, that is, the external connecting portion.
Specifically, the length of the insulating member in the longitudinal direction is about 1/10 to 1/5 that of the light reflective member.
The width of the connecting member is preferably the same as or smaller than the width of the base body and / or the light reflecting member.
By setting it as such a width | variety, the same surface as the end surface of a base | substrate and / or a light reflection member can be formed, and also the same surface can be formed as both the end surface which a base | substrate and a light reflection member oppose. .
In particular, when there is a narrow portion in the connection terminal, it is preferable to completely cover the narrow portion. Accordingly, as described later, when mounting on the mounting substrate in a side-view type, it is possible to prevent the solder from entering along the surface of the connection terminal and reducing the reliability of the light emitting device.

The insulating member can be formed by a method in which the above-described material is formed and pasted into a sheet, a printing method, an electrophoretic deposition method, potting, compression molding, spraying, an electrostatic coating method, or the like. The thickness of an insulating member is not specifically limited, For example, about 10-300 micrometers is mentioned.
Embodiments of a light-emitting device according to the present invention will be specifically described below with reference to the drawings.

Embodiment 1
The light-emitting device 1 of this embodiment is comprised including the base | substrate 4 which has the connection terminal 3, the light emitting element 5, and the light reflection member 7, as shown in FIGS.
The base 4 is formed on the surface of the cuboid base material 2 made of glass epoxy resin (the upper surface 2a as the first main surface, the end surface 2b extending in the short direction and the lower surface 2c as the second main surface) from the base material 2 side. A pair of connection terminals 3 formed by stacking Cu / Ni / Au are formed. The base body 4 functions as a wiring board having a longitudinal length of 2.2 mm, a lateral width of 0.4 mm, and a thickness of 0.3 mm.

The pair of connection terminals 3 are close to each other at the central portion on the upper surface 2a side of the base material 2 and have convex portions 3a as element connection portions. The convex portion 3a is formed by stacking Cu / Ni / Au from the base material 2 side. Each of the pair of connection terminals 3 extends in the longitudinal direction from the convex portion 3a which is an element connection portion, and is formed continuously from the upper surface 2a of the base material 2 to the lower surface 2c through the end surface 2b. In the connection terminal 3, a portion (a portion having a U shape in cross section) extending from the convex portion 3 a that is an element connection portion and continuing to the lower surface 2 c of the base material 2 becomes the external connection portion 3 b (see FIG. 2).
The edge along the longitudinal direction of the connection terminal 3 coincides with the edge along the longitudinal direction of the base 4, and the end face along the longitudinal direction of the connection terminal 3 is an end face along the longitudinal direction of the base 4. And form the same plane.

  In addition, the connection terminal 3 has a site | part which becomes narrow between the convex part 3a which is an element connection part, and the external connection part 3b (refer FIG. 3). Although not shown, a part of the external connection portion 3b on the second main surface of the base 4 has a narrowed portion.

One light emitting element 5 is flip-chip mounted on the convex portion 3 a of the base 4.
The light-emitting element 5 includes a nitride semiconductor laminate formed on a sapphire substrate, and has a pair of positive and negative electrodes on the surface of the laminate opposite to the sapphire substrate. In the light emitting element 5, a pair of positive and negative electrodes is connected to the convex portions 3 a of the pair of connection terminals 3 of the base 4 by a meltable member 6 made of Au—Sn eutectic solder.
By utilizing the convex portion 3a of such a connection terminal, even when a meltable meltable member flows from above the convex portion at the time of mounting the light emitting element, it is easy to accumulate around the convex portion, and a pair of connection terminals Therefore, the light-emitting element can be accurately fixed only to the intended portion by preventing the short circuit of the meltable member and the intrusion of the meltable member into the unintended region.
The light emitting element 5 is a rectangular parallelepiped blue light emitting (emission center wavelength of 455 nm) LED having a longitudinal length of 0.8 mm, a lateral width of 0.3 mm, and a thickness of 0.1 mm.

The light reflecting member 7 is formed in a substantially rectangular parallelepiped shape having a length in the longitudinal direction of 1.2 mm, a width in the lateral direction of 0.4 mm, and a thickness of 0.3 mm. That is, the edge portions along the longitudinal direction of the light reflective member 7 respectively coincide with the edge portions along the longitudinal direction of the base body 4.
The light reflective member 7 is provided on the first main surface of the base 4 so as to be in contact with the light emitting element 5 and to cover the entire circumference of the end surface thereof. The light reflective member 7 is also provided on the surface of the light emitting element 5 facing the base 4. That is, it is arranged between the meltable member 6 that covers the convex portion 3a almost completely and covers the surface of the meltable member 6 almost completely.
Thereby, light can be efficiently extracted from the light emitting element 5 to the upper surface.

The light reflective member 7 is composed of silica having an average particle diameter of 14 μm and titanium oxide having an average particle diameter of 0.25 to 0.3 μm as inorganic particles with respect to the total weight of the light reflective member 7. It is formed with a silicone resin contained at ˜2.5 wt% and 40-50 wt%.
On both sides of the light reflective member 7 on the substrate 4, a part of the narrow portion of the connection terminal 3 and the external connection portion are exposed from the light reflective member 7.
The edge along the longitudinal direction of the light reflecting member 7 coincides with the edge along the longitudinal direction of the substrate 4, and the end surface along the longitudinal direction of the light reflecting member 7 is the longitudinal direction of the substrate 4. Is formed on the same plane as the end face extending along the line.

On the light emitting element 5, that is, on the surface opposite to the pair of positive and negative electrodes, a translucent member 10 made of a silicone resin sheet (thickness 0.1 mm) containing a YAG: Ce phosphor is disposed. .
The end surface of the translucent member 10 is covered with the light reflective member 7. The upper surface of the translucent member 10 and the upper surface of the light reflective member 7 form the same surface.

In such a light emitting device 1, as shown in FIG. 4, the pair of end surfaces along the longitudinal direction of the base body 4 and the pair of end surfaces along the longitudinal direction of the light reflecting member 7 form the same surface. Are arranged to be. One end face that forms the same surface is used as a mounting surface of the light emitting device 1, and is mounted in a side view type on a mounting substrate 51 having a wiring pattern 52 on the surface.
For mounting, the pair of external connection portions 3 b of the light emitting device 1 are placed on the wiring patterns 52 corresponding to the positive electrode and the negative electrode of the mounting substrate 51, respectively, and connected by solder 54. The solder 54 is connected to the external connection portion 3b bent in a U-shape by expanding the contact area with the small connection terminal 3 not only on the first main surface of the base 4 but also on the end surface and the second main surface. ing. Accordingly, a fillet can be formed on the side surface of the light emitting device, and heat dissipation and mounting stability of the light emitting device can be improved.

  Further, in the connection terminal 3, by arranging a narrowed portion between the convex portion 3a and the external connection portion 3b, the solder is connected to the external connection portion 3b as described later or included in this. The flux or the like can be prevented from entering under the light reflective member 7.

  Furthermore, both the end surface along the longitudinal direction of the light reflective member and the end surface along the longitudinal direction of the substrate 4 are in contact with the surface of the mounting substrate 11.

  The light reflecting member 7 itself is provided with an extremely thin wall shape around the light emitting element 5, so that the light emitting device can be sufficiently downsized. Further, by arranging the light reflecting member in contact with the periphery of the light emitting element, the light emitted from the light emitting element in the lateral direction is reflected upward by the light reflecting member and taken out. It is possible to improve the light use efficiency.

Such a light emitting device 1 can be manufactured using a composite substrate 14 in which a composite connection terminal 13 is formed on a base material 12, as shown in FIGS. 5A and 5B. The composite substrate 14 is formed by connecting a plurality of substrates to be the substrates of the respective light emitting devices after the singulation process.
This composite substrate 14 has a slit 15 extending from the top surface to the back surface of the base material 12. The composite connection terminal 13 is provided continuously from the upper surface to the lower surface of the base material 12 of the composite base 14 through the inner wall of the slit 15.
In FIG. 5, the composite substrate 14 for obtaining 18 light emitting devices is shown. However, in consideration of production efficiency, the composite substrate 14 for obtaining a larger number (several hundred to several thousand) of light emitting devices can be obtained. .

The light emitting element 5 is connected to such a composite substrate 14, and the light transmitting element 10 having substantially the same shape as the light emitting element 5 in a plan view is bonded onto the light emitting element 5. The plurality of light reflecting members 17 are collectively formed by compression molding so as to cover the end surfaces of the two, and the composite base 14 and the light reflecting member 17 are cut in one direction along the planned dividing line L. Accordingly, the light emitting device which is separated in the extending direction of the slit due to the arrangement of the slits 15 and is singulated with a relatively small number of steps can be obtained.
For the cutting, a dicer, a laser, or the like can be used.

Embodiment 2
As shown in FIG. 6, the light emitting device 20 of the present embodiment includes a base 24 having connection terminals 23, a plurality of light emitting elements 5, and a light reflecting member 27.
The connection terminals 23 are disposed so as to extend to the upper surface, the end surface, and the lower surface on both sides in the longitudinal direction of the base material 22. Further, on the upper surface of the base material 22, for example, a terminal 25 that can connect the plurality of light emitting elements 5 in series is further arranged.
On one surface of the base 24, the connection terminal 23 and the terminal 25 each have a convex portion 23 a as an element connection portion, and the light emitting element 5 is connected to the convex portion 23 a by the meltable member 6.

  A plurality of the light emitting elements 5 are arranged in a line. It may be arranged not only in one column but also in the matrix direction.

  The light reflecting member 27 integrally seals the plurality of light emitting elements 5. The end surface along the longitudinal direction of the light reflecting member 27 forms the same surface as the end surface along the longitudinal direction of the substrate 24. An edge portion of the light reflective member 27 facing the short direction is disposed inside the base body 24.

  Although not shown, a recess or a through hole is formed in the base 24 between the light emitting elements 5, and a part of the light reflective member 27 is filled in the recess or the through hole, so that the light reflective member 27 is the base. It is preferable to be locked to 24. Thereby, the adhesiveness of the light reflective member 27 and the base | substrate 24 can be improved, and peeling from the base | substrate 24 of the light reflective member 27 can be prevented.

Except for the configuration described above, the configuration is substantially the same as that of the first embodiment. Therefore, the same effect as in the first embodiment is shown.
Furthermore, this light-emitting device can be used as a linear or matrix side-view type light-emitting device. Therefore, this light-emitting device can improve mounting accuracy as compared with mounting each side-view type light-emitting device on a mounting substrate. Moreover, for example, the alignment property with the light guide plate can be improved as a backlight light source.

Embodiment 3
As shown in FIG. 7, the light emitting device 30 of this embodiment includes a light emitting device according to the first embodiment, that is, a light emitting device provided with a protruding portion 33 a as an element connecting portion in the connection terminal 33. The terminals 33, in particular, the external connection portions 33b are arranged in a shared manner, and are arranged in a plurality of column directions or matrix directions. That is, a through hole is provided in the base material 32 between the adjacent light emitting elements 5, and the connection terminal 33 of the base body 34 is drawn out to the lower surface side of the base body 34 through the through hole.
Except for such a configuration, the configuration is substantially the same as that of the light-emitting device of the first embodiment. Therefore, it has the same effect as the first embodiment. Furthermore, it has the same effect as the second embodiment.

Embodiment 4
In the light emitting device 40 of this embodiment, as shown in FIGS. 8A to 8G, the connection terminal 43 formed continuously from the first main surface of the base material 42 through the end surface to the second main surface is formed of Cu / It is formed of Ni / Au (thickness 20 μm), and the first main surface and the second main surface further have a layer of Cu (thickness 20 μm). 40 μm in thickness).
First, the connection terminal 43 is formed by depositing Cu in a predetermined shape by plating on a portion corresponding to the convex portion 43a of the base material 42, and then masking the end surface and including the convex portion by Cu. And Cu is formed on the second main surface by plating. Furthermore, the connection terminal 43 can be formed by removing the mask on the end face and forming Ni / Au on the first main face, the end face and the second main face by plating.

The base includes a reinforcing terminal 43c on the second main surface corresponding to the mounting region of the light emitting element 5a.
The second main surface of the base is covered with the insulating film 8 from the portion near the center of the base of the pair of connection terminals 43 to the base material 42 and the reinforcing terminal 43c.

  As shown in FIG. 8E, the connection terminal 43 is partially narrowed on the first main surface of the base. Further, as shown in FIG. 8G, a part of the connection terminal 43 is also formed narrow on the second main surface.

As shown in FIG. 8C, the light emitting element 5a is formed of a semiconductor stacked body and a pair of electrodes, and a substrate for growing a semiconductor layer is removed.
For removing the growth substrate, for example, the light emitting element 5 having the growth substrate is mounted on the pair of connection terminals, the light reflecting member 7 is disposed, and then the sapphire substrate as the growth substrate is replaced with this sapphire. Laser irradiation (for example, KrF excimer laser) is applied to the semiconductor layer from the substrate side, a decomposition reaction is caused at the interface between the semiconductor layer and the substrate, and the substrate is separated from the semiconductor layer. Is called.
At this time, the light-emitting element can be securely fixed by covering the semiconductor layer of the light-emitting element with the light-reflecting member 7 and further covering both the convex portion 43 a of the connection terminal 43 and the meltable member 6. The stress due to the laser light irradiation can be absorbed, and the sapphire substrate can be efficiently removed from the semiconductor layer.

The pair of electrodes of the light emitting element 5a are joined to the convex portion 43a of the connection terminal 43 by the meltable member 6 made of eutectic solder of Au—Sn.
On the first main surface of the light emitting element 5a, a ceramic plate containing a phosphor is fixed as a translucent member 10a by a translucent silicone resin adhesive. The end face of the translucent member 10 a is covered with the light reflecting member 7.

Further, the insulating member 9 is disposed on the connection terminal 43 between the convex portion 43a and the external connection portion. The insulating member 9 is formed in a substantially rectangular parallelepiped shape having a length in the longitudinal direction of 0.5 mm, a width in the lateral direction of 0.4 mm, and a thickness of 0.02 mm. The insulating member 9 is exposed 0.3 mm in the longitudinal direction from the end face of the light reflective member 7. The insulating member 9 covers the portion of the connection terminal 3 that is narrow and the periphery thereof.
The edge part which opposes the longitudinal direction of the light reflective member 7 is arrange | positioned on the insulating member 9, and the edge part along the longitudinal direction of the light reflective member 7 followed the longitudinal direction of the insulating member 9. Coincides with the edge. Moreover, the edge part along the longitudinal direction of the insulating member 9 corresponds to the edge part along the longitudinal direction of the base body, and the end surface along the longitudinal direction of the insulating member 9 is the end face along the longitudinal direction of the base body. And form the same plane.
The insulating member 9 is formed of a white silicone resin containing titanium dioxide.
By disposing the insulating member in this way, as described later, when the light emitting device is mounted on the mounting substrate in a side view type, solder penetrates along the surface of the connection terminal, thereby improving the reliability of the light emitting device. Decreasing can be avoided. Further, when the light emitting element is connected to the connection terminal by the meltable member, leakage from the convex portion and the vicinity thereof to the external connection portion of the meltable member can be prevented.

  Except for such a configuration, the configuration is substantially the same as that of the light-emitting device of the first embodiment. Therefore, it has the same effect as the first embodiment.

Embodiment 5
As shown in FIGS. 9A to 9E, the light emitting device 50 of this embodiment includes a transparent glass plate on the light emitting element 5 as a translucent member 10b and a phosphor coated on the surface thereof by spraying. Layer 10c is disposed.
Except for these configurations, the configuration is substantially the same as that of the light-emitting device of Embodiment 4. Therefore, it has the same effect as Embodiments 1 and 4.

Embodiment 6
As shown in FIG. 10, the light emitting device of this embodiment is substantially the same as the light emitting device of Embodiments 4 and 5, except that the planar shape of the convex portion 53a in the connection terminal 53 is formed in an X shape. It has the same configuration. Therefore, the same effects as those of the first, fourth, and fifth embodiments are obtained.
In addition, by making the convex shape into an X shape, the meltable member can be easily stored in the concave portion in plan view, and the connection of the light emitting element can be made more reliable and strong.

Embodiment 7
As shown in FIG. 11, the light emitting device 60 of this embodiment has through holes 62a in the vicinity of both ends in the longitudinal direction of the base material 62, and the connection member 63 extends from the upper surface to the lower surface through the through holes 62a. The light emitting device has substantially the same configuration as that of the light emitting devices of Embodiments 1 and 4 except that the end surface is not covered. Therefore, it has the same effect as Embodiments 1 and 4.

Embodiment 8
As shown in FIGS. 12A to 12G, the light-emitting device 70 of the present embodiment includes a base body having a base material 72, a connection terminal 73 provided on the surface of the base material 72, one light-emitting element 5, and light. The reflective member 7 is included. The light emitting element 5 is connected to two convex portions 73 a provided on the connection terminal 73 by the meltable member 6. Further, as shown in FIG. 12C, an insulating film 78 is provided between the pair of connection terminals 73 on the back surface of the base. Furthermore, a translucent member 10d containing a phosphor that continuously covers the light emitting element 5 and the upper surface of the sealing member 7 is provided.
The shape of the pattern of the connection terminal 73 arranged on the base material 72 and the size of the convex portion 73a formed on the surface of the connection terminal 73 are different, and the four end surfaces of the translucent member 10d are 4 of the light reflective member 7. The configuration is substantially the same as that of the light emitting device of Embodiment 1 except that the two end surfaces coincide with each other. Therefore, it has the same effect as the first embodiment.
The light emitting element 5 used here is a rectangular parallelepiped blue light emitting (emission central wavelength of 455 nm) LED having a length in the longitudinal direction of 1.1 mm, a width in the short direction of 0.2 mm, and a thickness of 0.2 mm. It is.
The base has a substantially rectangular parallelepiped shape with a length in the longitudinal direction of 3.5 mm, a width in the lateral direction of 0.4 mm, and a thickness of 0.2 mm. The light reflecting member 7 is formed in a substantially rectangular parallelepiped shape having a length in the longitudinal direction of 1.2 mm, a width in the lateral direction of 0.4 mm, and a thickness of 0.3 mm.

  As shown in FIG. 12G, the light emitting device 70 can be manufactured in the same manner as in the first embodiment by using a composite substrate in which a composite connection terminal 73c is formed on a base material 72c. The composite substrate is constituted by a plurality of continuous substrates which are the substrates of the light emitting devices as shown in FIGS. 12D and 12E after the individualization step. The two light emitting elements 5 are joined to the four convex portions 83a provided on the connection terminal 83 and the second connection terminal 83e by the meltable member 6.

Embodiment 9
As shown in FIGS. 13A to 13G, the light emitting device 80 according to the present embodiment includes a base body having a base material 82, a connection terminal 83 provided on the surface of the base material 82, and a second connection terminal 83 e, 2 Two light emitting elements 5 and a light reflecting member 7 are included.
The number of the light emitting elements 5, the shape of the pattern of the connection terminal 83 arranged on the base material 82, and the size of the convex portion 83a formed on the surface of the connection terminal 83 are different, and the four end surfaces of the translucent member 10d are different. The configuration is substantially the same as that of the light-emitting device of Embodiment 1 except that it matches the four end faces of the light-reflecting member 7. Therefore, it has the same effect as the first embodiment.
The two light emitting elements 5 are substantially rectangular parallelepipeds having a longitudinal width of 1.1 mm, a lateral width of 0.2 mm, and a thickness of 0.2 mm, and are arranged in the longitudinal direction of the substrate at intervals of 0.4 mm. Has been implemented. The base body is formed in a substantially rectangular parallelepiped shape having a length in the longitudinal direction of 3.5 mm, a width in the lateral direction of 0.4 mm, and a thickness of 0.15 mm. The light reflective member 7 is formed in the center of the first main surface of the base body into a substantially rectangular parallelepiped shape having a length in the longitudinal direction of 3.0 mm, a width in the short direction of 0.4 mm, and a thickness of 0.2 mm. ing.
The base material 82 has a through hole 82d between the two light emitting elements 5, and the second connection terminal 83e extends to the back surface by filling the through hole 82d. That is, the second connection terminal 83e is provided between the two light emitting elements 5 on the back side of the base. More specifically, it is provided between two insulating films 88b provided immediately below the two light emitting elements. Note that the two insulating films 84 are in contact with the base material 82 and are provided apart from the connection terminal 83 and the second connection terminal 83e, respectively. The second connection terminal 83e is exposed without being covered with an insulating film on the back surface side of the base, and when a light emitting device is mounted, a joining member such as solder is connected, Also functions as a terminal for heat dissipation.
And the translucent member 10d containing the fluorescent substance which coat | covers continuously the two light emitting elements 5 and the upper surface of the sealing member 7 is provided.

  The light emitting device 80 can be manufactured in the same manner as in the first embodiment, using a composite substrate shown in FIG. 13G in which a composite connection terminal 83c is formed on a base material 82c. The composite substrate is formed by connecting a plurality of substrates that are the substrates of the light emitting devices as shown in FIGS. 13D and 13E after the singulation process.

  The light-emitting device of the present invention includes a backlight source of a liquid crystal display, various lighting devices, a large display, various displays such as advertisements, destination guidance, and an image reading device in a digital video camera, a facsimile, a copier, a scanner, etc. It can be used for projector devices.

1, 20, 30, 40, 50, 60, 70, 80 Light-emitting device 2, 12, 22, 32, 42, 62, 72, 82 Base material 2a Upper surface 2b End surface 2c Lower surface 3, 23, 33, 43, 53, 63, 73, 83 Connection terminal 3a, 13a, 23a, 43a, 53a, 63a, 73a, 83a Convex part 3b, 33b External connection part 4, 24 Base body 5, 5a Light emitting element 6 Melting member 7, 17, 27 Light reflection Conductive member 8, 78, 84 Insulating film 9 Insulating member 10, 10a, 10b, 10d Translucent member 10c Phosphor layer 13, 73c, 83c Composite connection terminal 14, 72c, 82c Composite substrate 15, 75, 85 Slit 25 terminal 43c, 63b reinforcement terminal 51 mounting board 52 wiring pattern 54 solder 62a, 82d through hole 83e second connection terminal

Claims (11)

A base body provided with a pair of connection terminals on at least the first main surface;
A light emitting device connected to the connection terminal by a meltable member;
A light reflecting device that covers the light emitting element, and a light emitting device comprising:
The connection terminal includes a convex portion projecting from the connection terminal on the first main surface, the portion connected to the light emitting element.
The convex portion is spaced from the edge of the connection terminal on the first main surface,
The light emitting device, wherein the convex portion and the meltable member are embedded in the light reflective member.   The light emitting device according to claim 1, wherein the light emitting device is a side view type light emitting device.   The light-emitting device according to claim 1, wherein the light-reflecting member is embedded between the base and the light-emitting element. The 1st main surface of the said light emitting element forms the same surface as the 1st main surface of the said light reflective member, or exists in a position lower than the 1st main surface of the said light reflective member. The light emitting device according to any one of the above.   The light-emitting device according to any one of claims 1 to 4, wherein a translucent member containing a phosphor excited by light from the light-emitting element is disposed on the first main surface of the light-emitting element. .   The light-emitting device according to claim 5, wherein an end face of the translucent member and an end face of the light-emitting element are covered with the light-reflecting member.   7. The connection terminal according to claim 1, wherein the connection terminal extends from the first main surface of the base to a second main surface that is a surface opposite to the first main surface. The light-emitting device of description. The connection terminal has the convex part and an external connection part connected to the outside of the light emitting device on the first main surface,
The light emitting device according to claim 1, further comprising an insulating member that covers a part of the connection terminal between the convex portion and the external connection portion. A pair of connection terminals to at least the first main surface, the connection terminal prepares a group member that having a protrusion spaced from the edge,
A light emitting element having a semiconductor laminate on a substrate and having a pair of electrodes on the same surface side of the semiconductor laminate is placed on a convex portion on the first main surface of the base, and the light emission is performed by a meltable member. A pair of electrodes of the element and a pair of connection terminals, respectively,
A method of manufacturing a light emitting device, comprising: a step of embedding a convex portion of the connection terminal, a surface of the meltable member, and a space between the base and the light emitting element with a light reflective member.   Furthermore, the manufacturing method of the light-emitting device of Claim 9 including the process of peeling the said board | substrate from the said light emitting element.   Furthermore, the manufacturing method of the light-emitting device of Claim 10 which arrange | positions a translucent member in one surface of the said semiconductor laminated body from which the said board | substrate peeled.