JP2008166332A - Lead frame for light-emitting element mounting package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame for a light-emitting element mounting package that can entirely make the light-emitting element mounting package thin without failing durability or optical utilization efficiency of a lamp house, and to provide its manufacturing method. <P>SOLUTION: The lead frame is provided with a die pad 6, leads 7 that are arranged on almost the same plane as the die pad 6 in a condition where they have specified spacing to the die pad 6 and are electrically insulated, and a side wall 10 that is made of one metal sheet connected to the lead 7 and is erected from the bottom when using the lead 7 and the die pads 6 as a bottom, and that is bent at a connection portion with the lead 7 so that it may be electrically insulated from the die pad 6 at specified spacing and has a thickness less than those of the leads 7. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a lead frame for a light-emitting element mounting package on which a light-emitting element such as an LED (Light Emitting Diode) is mounted and used as a backlight for a liquid crystal display panel, for example, and a manufacturing method thereof.

In a flat panel display device configured using a non-light emitting element such as a liquid crystal display panel, a back light projector called a backlight is used.
The main part of the backlight is composed of a light emitting device serving as a light source and a light guide plate that optically guides light supplied from the light source to a liquid crystal display panel.
Conventionally, cathode fluorescent tubes have been used as light-emitting devices for light sources, but in recent years, the mainstream has shifted to LED (light-emitting diode) elements for the purpose of further reducing power consumption and reducing the thickness and weight. is doing.

In general, backlights are strongly required to be thin so that the characteristics of flat panel display devices can be utilized. To meet this demand, a so-called sidelight type called a lamp house made of resin and a metal A structure combined with a lead frame has become common.
FIG. 11 is a diagram illustrating a structure of a conventional general light emitting device. As shown in FIG. 11 as an example, the entire light emitting device is an LED mounting package 100, and a metal outer lead frame 200 and a lead portion 700 formed by pressing a thin plate material made of copper alloy or iron. The lamp house 300 formed by molding a synthetic resin and the LED chip 500 are provided as main parts.

More specifically, the lamp house 300 is provided with an opening 400. The opening 400 is an important part in that it functions as a light guide plate and a reflection plate for radiating light emitted from the LED chip 500 to the outside.
When the inner side is viewed from the outer side of the opening part 400, the die pad part 600 connected to the outer lead frame 200 is exposed on the bottom surface of the opening part 400, and the LED chip 500 is mounted on the surface of the die pad part 600. It is fixed with a conductive adhesive or the like. The lead portion 700 is disposed with a predetermined gap from the die pad portion 600. The die pad part 600 and the lead part 700 are electrically insulated by the gap. The lead part 700 is electrically connected to the LED chip 500 by a bonding wire 800. Then, a phosphor (not shown) is injected into the inside of the opening 400, and the space surrounded by the die pad 600 as the bottom surface and the side wall 900 and the slope 910 of the lamp house 300 as the side surface is sealed with a sealing material. The main part of the LED mounting package which is substantially the backlight is constituted.

In the backlight having such a structure, a predetermined operating current is supplied to the LED chip 500 through the outer lead frame 200 and the lead portion 700, and the LED chip 500 emits light. And the light supplied from the LED chip 500 is radiated | emitted from the opening part 400 outside.
In the conventional backlight as described above (hereinafter also referred to as an LED mounting package), the effective radiation of light to the outside remarkably depends on the light guide performance and reflection performance of the resin lamp house 300. It has a structure.

Here, the house width W of the lamp house 300 is generally set to about 0.8 mm. Further, the thickness t of the side wall 900 of the lamp house 300 is set to be about 0.1 mm or more in consideration of durability as a part made of a resin material, manufacturing limitations, and the like. It is common (refer patent document 1).
JP 2004-363533 A

As described above, in order to meet the strong demand for thinning of the entire flat panel display device including the backlight, there is a strong demand for further thinning of the LED mounting package which is substantially the backlight itself.
However, the conventional LED mounting package having the above structure has the following problems in order to achieve further thinning.

  First, it is extremely difficult to further reduce the thickness of the side wall 900 of the lamp house 300 due to the limit of the fluidity of the mold resin in the manufacturing process. Alternatively, for example, when the ultra-thin side wall 900 is molded by devising a mold or the like, the yield is remarkably deteriorated, which in turn causes a disadvantage that the manufacturing cost is significantly reduced.

Secondly, even if the side wall 900 can be thinned to less than 0.1 mm, the side wall 900 made of such a too thin resin has a problem that durability is insufficient.
In other words, in order to improve the luminance, the output of the LED chip 500 for backlight tends to be further increased, but the amount of energy of light and heat emitted from the LED chip 500 increases accordingly. Tend to. For this reason, the side wall 900 of the lamp house 300 which is disposed in the vicinity of the LED chip 500 and directly receives the energy of light and heat emitted from the LED chip 500 for a long period of time is further deteriorated by ultraviolet degradation and thermal degradation. It will end up.
Moreover, in addition to the general tendency, when the LED mounting package is further reduced in thickness, the side wall 900 becomes closer to the LED chip 500, and the side wall 900 is deteriorated by ultraviolet or thermal deterioration. Will be further encouraged.
Further, when the side wall 900 is further thinned, the heat resistance and durability against ultraviolet rays of the side wall 900 itself are further reduced, so that the resin deterioration of the side wall 900 becomes more remarkable.
Further, when the side wall 900 is made extremely thin, such as less than 0.1 mm, the light from the LED chip 500 is transmitted through the side wall 900 made of the extremely thin resin, resulting in a large light loss. is there.

Third, in addition to reducing the thickness of the side wall 900, in order to achieve a reduction in the thickness of the entire LED mounting package, the width of the die pad portion 600 must be further reduced. However, when the width of the die pad portion 600 is remarkably reduced as described above, the LED chip 500 and the side wall 900 become extremely close to each other. If it does so, the utilization efficiency of the light radiated | emitted from LED chip 500 falls, or the problem that it becomes difficult to obtain sufficient brightness | luminance arises.
That is, the LED chip 500 also emits light from its side surface, and the light is reflected by the surface of the side wall 900 and guided to the outside of the opening 400 to be effectively used as light source light. Has been. However, if the LED chip 500 and the side wall 900 are too close as described above, it becomes difficult to effectively guide the light from the side surface of the LED chip 500 to the outside by the side wall 900, and the use of light. The efficiency is reduced, or obtaining sufficient luminance is hindered.

The present invention has been made in view of such problems, and an object of the present invention is to make it possible to reduce the overall thickness of the light emitting element mounting package without impairing the durability and light utilization efficiency of the lamp house. Another object of the present invention is to provide a lead frame for a light emitting device mounting package and a manufacturing method thereof.

  A first lead frame for a light emitting element mounting package according to the present invention includes a die pad portion on which the light emitting element is mounted and connected to one of the positive and negative electrodes of the light emitting element, and a predetermined gap with respect to the die pad portion. A lead part connected to the other electrode of the light emitting element, and a single metal plate connected to the lead part. The lead portion and the die pad portion as a bottom surface, and the lead portion so as to stand upright with respect to the bottom surface and to be electrically insulated with a predetermined gap with respect to the die pad portion. And a side wall portion formed by bending at a portion connected to the portion, the side wall portion having a thickness less than the thickness of the lead portion.

  According to the second light emitting element mounting package lead frame of the present invention, in the first light emitting element mounting package lead frame, the thickness of the side wall portion is 80% or less of the thickness of the lead portion. It is a feature.

  A lead frame for a light emitting element mounting package according to a third aspect of the present invention is the first or second lead frame for a light emitting element mounting package, wherein a bending V groove is provided at a bending position of the side wall portion. It is characterized by.

  A fourth light emitting element mounting package lead frame of the present invention is the light emitting element mounting package lead frame according to any one of the first to third aspects, wherein the light from the light emitting element on both the front and back surfaces of the side wall portion. An unevenness for diffusing the light emitted from the light emitting element is provided on the surface on the receiving side.

  According to the first method for manufacturing a lead frame for a light-emitting element mounting package of the present invention, a die pad portion is formed in which the light-emitting element is mounted and one of the positive and negative electrodes of the light-emitting element is connected. Providing a lead part connected to the other electrode of the light emitting element via a connecting member, and a side wall part made of the same metal plate as the lead part so as to be continuous with the lead part; A step of making the thickness of the side wall portion less than the thickness of the lead portion; and a portion connecting the side wall portion to the lead portion at a predetermined angle with respect to the bottom surface with the lead portion as a bottom surface A step of bending so as to stand upright, and a step of disposing the lead portion in a state of being electrically insulated with a predetermined gap with respect to the die pad portion on substantially the same plane as the die pad portion. Including It is characterized.

  According to the second method for manufacturing a lead frame for a light emitting element mounting package of the present invention, in the first method for manufacturing a lead frame for a light emitting element mounting package, the thickness of the side wall portion is set to 80% of the thickness of the lead portion. % Or less.

  According to the third method for manufacturing a lead frame for a light emitting element mounting package of the present invention, in the first or second method for manufacturing a lead frame for a light emitting element mounting package, a V groove is provided at a bending position of the side wall portion. The V-groove is used as a guide groove in bending, and the side wall portion is bent so as to stand up against the lead portion.

A fourth light emitting element mounting package lead frame manufacturing method of the present invention is the light emitting element mounting package lead frame manufacturing method according to any one of the first to third aspects.
The method further includes the step of providing irregularities for diffusing the light emitted from the light emitting element on the surface receiving the light from the light emitting element, of both the front and back surfaces of the side wall.

  A fifth light emitting element mounting package lead frame manufacturing method of the present invention is the light emitting element mounting package lead frame manufacturing method according to any one of the first to fourth aspects, wherein the side wall portion is crushed. And a step of making the thickness of the side wall portion less than the thickness of the lead portion, and a step of correcting the dimension of the side wall portion enlarged by the extension accompanying the crushing process to a predetermined set size. Yes.

  A sixth light emitting element mounting package lead frame manufacturing method according to the present invention is the light emitting element mounting package lead frame manufacturing method of any one of the first to fifth aspects, wherein the top side of the side wall is tapered in cross section. The method further includes a step of edge processing into a shape.

  A seventh light emitting element mounting package lead frame manufacturing method of the present invention is the light emitting element mounting package lead frame manufacturing method according to any one of the first to sixth aspects, wherein the side wall portion has the lead portion. It is characterized in that the angle of standing up is an obtuse angle.

  An eighth light emitting element mounting package lead frame manufacturing method according to the present invention is the light emitting element mounting package lead frame manufacturing method according to any one of the first to seventh aspects, wherein at least the side wall portion is formed by pressing. It is characterized in that it is formed by punching, and a notch shape for preventing press wrinkling is provided in the peripheral edge of the side wall portion in the press working step.

  A ninth light emitting element mounting package lead frame manufacturing method of the present invention is the light emitting element mounting package lead frame manufacturing method according to any one of the first to eighth aspects, wherein the light emitting element lead frame is continuously formed. A plurality of deformation prevention fins having a height greater than the height of the side wall portion from the bottom surface in a state where the side wall portion is upright with the lead portion as a bottom surface. Is further included in the surface of the metal plate material.

  According to the present invention, the side wall portion is formed from a single metal plate connected to the lead portion, the lead portion and the die pad portion are used as the bottom surfaces, and are erected from the bottom surface, and with a predetermined gap with respect to the die pad portions. The side wall portion is made of the same metal plate as the lead portion because it is formed by bending at the portion connected to the lead portion so as to be electrically insulated. Can do. Therefore, it is possible to reduce the thickness of the side wall portion to less than 0.1 mm while ensuring high durability and light blocking properties of the side wall portion. As a result, it is possible to achieve a further reduction in the thickness of the entire light emitting element mounting package, which is substantially the backlight itself, without impairing durability and light blocking properties.

  Further, since the thickness of the side wall portion is made thinner than the thickness of the lead portion, the level difference caused by the difference in thickness at the connecting portion between the side wall portion and the lead portion thicker than that is caused by the above bending process. Therefore, it is possible to easily achieve the bending process at the accurate position of the side wall portion.

In addition, the side wall portion is not connected to the die pad portion on which the light emitting element is mounted, but is connected to a lead portion formed separately from the die pad portion, and the lead portion is raised with the lead portion as a bottom surface by bending. As a result, the step of mounting the light emitting element on the die pad can be performed completely independently of the side wall bending process. Accordingly, the degree of freedom in designing the manufacturing process is dramatically improved as compared with the configuration in which the side wall portion is connected to the die pad portion. Further, it is possible to achieve further narrowing of the width of the die pad portion and the lead portion without being hindered by restrictions such as a dimensional margin required when the side wall portion is bent.

Hereinafter, a lead frame for a light emitting element mounting package and a method for manufacturing the same according to the present embodiment will be described with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a main part of the entire light emitting element mounting package in which the lead frame according to the present embodiment is incorporated, and FIG. 2 is a state before the lead frame according to the embodiment of the present invention is bent. FIG. 3 is a diagram showing a state after the lead frame bending process and before the resin molding process.

  As shown in FIG. 1, the entire light emitting element mounting package includes a lead frame 1, a lamp house resin portion 3, and an LED chip 5 as its main parts. What is characteristic of the entire light emitting element mounting package is that the lamp house resin part 3 is insert-molded so that the side wall part 10 of the lead frame 1 is included as a part of the side wall of the lamp house 11, and the whole lamp house 11 is formed. That is, it is composed. In other words, in this light emitting element mounting package, the side wall portion of the lamp house 11 which is a main part for effectively radiating light emitted from the LED chip 5 to the outside is used instead of the conventional resin. It replaces with the side wall part 10 which is a part of the lead frame 1, and is made of metal.

  The lead frame 1 according to the present embodiment incorporated in the light emitting element mounting package includes a developed plan view (a) in FIG. 2 and a sectional view taken along the line AA in FIG. 2 and a plan view (a) in FIG. As shown in the figure (b) and the front view (c), the outer lead part 2, the die pad part 6, the lead part 7, and the side wall part 10 constitute the main part.

  The outer lead portion 2 is set to be used as a so-called external connection terminal for connection to an external electronic device main body side printed wiring board or the like (not shown). The outer lead portion 2 is formed by punching the same metal material as the die pad portion 6 using a press die or the like, and is continuous with the die pad portion 6 in the longitudinal direction.

  The die pad portion 6 is formed in an elongated shape, and an LED chip 5 is mounted as a light emitting element at a substantially central portion thereof so as to be electrically connected to one of the positive and negative electrodes of the LED chip 5. Is set to The die pad portion 6 is separate from the lead portion 7 and the side wall portion 10 and is disposed in a non-contact (and thus electrically insulated) state with a predetermined gap therebetween. . In the gap, the lamp house resin portion 3 is insert-molded so as to bite in, the arrangement relationship between the two is fixed, and the electrical insulation between them is further ensured. .

  The lead portion 7 is made of a single metal material continuous with the side wall portion 10 and is electrically insulated with a predetermined gap with respect to the die pad portion 6 and is substantially flush with the die pad portion 6. Be placed. The other electrode of the LED chip 5 is connected to the die pad portion 6 via a connection member 8.

The side wall portion 10 is made of a single metal plate connected to the lead portion 7, and has an obtuse angle such as 90 degrees (right angle) or 100 degrees with respect to the bottom surface of the lead portion 7 and the die pad portion 6. Then, it is formed by bending at a portion connected to the lead portion 7 so as to stand up.
More specifically, the side wall portion 10 is connected to the lead portion 7 at a position offset toward one end side in the longitudinal direction (continuous). In the example shown in FIG. 2, the side wall portion 10 is located at a position that is offset from one end on the lower side in the longitudinal direction of the side wall portion 10 and has a length that is about ¼ of the longitudinal direction (full length) of the side wall portion 10. It is connected with. In the remaining length of about 3/4, the die pad portion 6 is arranged in a non-contact state with the side wall portions 10 in a region sandwiched between the left and right side wall portions 10.

The thickness of the side wall portion 10 is thinner than the thickness of the lead portion 7. The thickness is preferably 80% or less, more preferably 50% or less of the thickness of the lead portion 7.
In general, the thickness of the lead frame is 0.1 to 0.2 mm. Therefore, the thickness of the lead portion 7 is also about that. For example, when the thickness of the lead portion 7 is about 0.1 mm, 80% thereof. By setting it to ˜50%, the thickness of the side wall portion 10 can be set to 0.08 mm to 0.05 mm, and ultrathinning of the side wall, which is impossible with a conventional resin lamp house, is achieved. Or when the thickness of the lead part 7 is 0.2 mm, the thickness of the side wall part 10 can be 0.1 mm or less by setting it to 50% or less.
In addition, the thickness of the side wall 10 is 80% or less of the thickness of the lead 7, and the difference (step) between the thickness of the side wall 10 and the lead 7 is the thickness of the lead 7. It means that it will be clear as 20% or more of. Therefore, by providing such a clear step, the side wall 10 can be bent easily and reliably at an accurate position using the step as a bending guide line.

  At the position where the side wall portion 10 is bent, a V-groove 26 for the bending is provided. By providing the V groove 26, the side wall 10 can be bent more accurately and easily. The depth of the V-groove 26 is preferably about 1/3 to 1/2 of the thickness of the side wall 10.

  The side wall portion 10 is disposed with a predetermined gap with respect to the die pad portion 6, thereby being electrically insulated from the die pad portion 6. In the gap, the lamp house resin portion 3 is insert-molded so as to bite in, the arrangement relationship between the two is fixed, and the electrical insulation between the two is further ensured. .

And in this side wall part 10, the unevenness | corrugation 20 for diffusing light is shown in the inner surface (surface which comprises the side wall of the opening part 4) which receives the light from LED chip 5, as shown in FIG. Is provided. In the example shown in FIG. 8A, the planar shape (pattern) of the unevenness 20 is formed by arranging a plurality of parallel straight lines. Further, in the example shown in FIG. 8B, a plurality of dimples, each of which has a semispherical cross section, are arranged in a staggered pattern. In the example shown in FIG. 8C, a lattice pattern is used.
By providing such irregularities 20 on the side wall portion 10, the light emitted from the LED chip 5 is effectively radiated to the outside while being appropriately diffused, and the in-plane uniformity is further improved. It becomes possible to realize supply of light.

Next, a method for manufacturing the lead frame for a light emitting element mounting package according to the present embodiment will be described.
For example, the outer lead frame 2 and the die pad portion 6 are formed from a metal plate material such as a copper thin plate by press (punching) processing using a mold or the like.
On the other hand, the lead part 7 and the side wall part 10 are formed in the continuous (connected) state without a cut | disconnection by the press (punching) process using a metal mold | die etc. from the same continuous metal plate material. .

And as shown in FIG. 4, the lead | read | reed part 7 and the side wall part 1 which were formed by punching
In the state before bending at 0 (FIG. 4A), the side wall portion 10 is crushed so that the thickness of the side wall portion 10 is less than the thickness of the lead portion 7. (FIG. 4B).
The outer shape of the side wall 10 is enlarged by the extension accompanying the plastic deformation during the crushing process. Therefore, the enlarged portion 12 of the side wall portion 10 is cut again by pressing or the like (FIG. 4C) and corrected so that the size (outer dimension) of the side wall portion 10 becomes a predetermined set size. . And the V-groove 26 used as the bending guide line in the case of a bending process is provided in the bending position of the side wall part 10 (FIG.4 (d)).
Due to the fact that the side wall 10 is thin and the size and shape accuracy of the side wall 10 must be extremely high when punching is performed by a press for removing the enlarged portion 12 of the side wall 10. There is a tendency that so-called press hoisting is likely to occur.

That is, so-called redrawing is performed at the periphery of the side wall portion 10 as shown by hatching in FIG. 9A in order to remove the enlarged portion 12, but at this time, FIG. ), A large shearing force is applied to the side wall 10 and the enlarged portion 12 by the punch 21 and the die 22 of the press die, and the portion 12 is cut from the main body of the side wall 10. At this time, the portion 12 becomes a press rod, but this press rod is likely to cause a rising phenomenon of the die 21 and may cause a significant decrease in work efficiency in the re-pressing press process.
Therefore, as shown in FIG. 9 (c), notches such as an arc-shaped notch 24-1 and a lightning-like (saw-shaped) notch 24-2 are formed on the peripheral edge of the side wall portion 10 when redrawing. By providing 24, it is possible to increase the biting force of the press rod on the mold and to suppress the occurrence of the rising.

  Here, in the step of crushing the side wall portion 10, the side wall portion 10 is crushed and the concavo-convex portion 20 is formed by incorporating a portion for pressing the concavo-convex portion 20 into a mold used for the crushing processing. It may be provided. Or you may make it form the unevenness | corrugation 20 as another process, after performing a crushing process and a redrawing process.

After the side wall 10 is crushed to a desired thickness and a V-groove is formed, the side wall 10 is bent to a predetermined angle by a press die or the like using the V-groove 26 as a guide groove for bending. By processing, the side wall part 10 is made to stand at a predetermined angle with the lead part 7 as a bottom surface (FIG. 4E).
At this time, the step caused by the difference in thickness between the side wall portion 10 and the lead portion 7 also functions as a guide line at the time of bending processing. The folding at a predetermined position is achieved.
In addition, the action of the V-groove 26 and the like can suppress the occurrence of non-negligible bending deformation and residual distortion in the width direction of the entire lead portion 7 due to bending deformation, and as a result It is possible to improve the bonding characteristics of the connecting member 8 in the flat area of the lead portion 7.

  Here, in the example shown in FIG. 5 and FIG. 7A, the side wall portion 10 is set to stand upright at a substantially right angle with respect to the lead portion 7, but this angle is only a right angle (90 degrees). Of course, it is not limited to. In addition to this, for example, as shown in FIG. 7B, an obtuse angle exceeding 90 degrees may be set by the angle setting R. By doing in this way, it becomes possible to set the reflected optical axis in the side wall part 10 as a reflecting plate of the light radiated | emitted from LED chip 5 to a desired angle.

In this way, after the side wall portion 10 is erected so as to form a predetermined angle with respect to the lead portion 7, the lead portion 7 is substantially flush with the die pad portion 6 and is predetermined with respect to the die pad portion 6. There is a non-contact (electrically insulated) state with a gap, and the side wall portion 10 also has a predetermined gap with respect to the die pad portion 6 and a non-contact (electrically insulated) state. Arrange so that
Then, the lamp house resin part 3 is insert-molded, and the lamp house resin part 3 and the side wall part 10 constitute a side wall of the lamp house 11. In the process of insert molding the lamp house resin portion 3, as shown in FIG. 5, the lead frame 1 is inserted and set in the lower mold 15 (FIG. 5A), and the upper mold 14 and the lower mold 15 are closed and a resin is injected (FIG. 5B). After the resin is cured, the molds 14 and 15 are opened and released (FIG. 5C). Thus, the main part of the light emitting element mounting package obtained by insert molding the lamp house resin part 3 to the lead frame 1 is obtained.

  Here, in the process of inserting the lead frame 1 into the lower mold 15, the clearance (S) between the two is extremely small, and as shown schematically in FIG. Due to errors in bending accuracy of the frame 1 and dimensional errors in the lower mold 15, it may be difficult to correctly insert the lead frame 1 into the lower mold 15. In order to avoid the occurrence of such an inconvenient situation, as shown in FIGS. 6B and 6C, it is desirable to edge process the top side 27 of the side wall portion 10 into a tapered cross section. Alternatively, as shown in FIG. 6D, the opening portion 28 of the lower mold 14 is chamfered to make the opening portion 28 wide, and the top side 27 of the lead frame 1 is set to the lower mold die. However, in this case, as shown in FIG. 6 (e), some protrusions remain as burrs 19 in the lamp house resin portion 3 which is the finished product. It will be. In view of not leaving such burrs 19, it is more desirable to edge-process the top side 27 of the side wall portion 10 in a tapered shape as described above.

  Note that a plurality of lead frames 1 may be manufactured from a continuous metal material plate such as a hoop material by a manufacturing facility such as a continuous press line. In such a case, there is a situation where the hoop material is moved (transported) in a state where the side wall portion 10 is upright with the lead portion 7 as a bottom surface. In such a case, the side wall portion 10 in the upright state is deformed. There is a risk of damage or damage. Therefore, in such a case, as shown in an example in FIG. 10, the deformation preventing fin 25 having a height larger than the height from the bottom surface (flat surface of the metal plate material) of the side wall portion 10 is provided. The side wall 10 may be prevented from colliding with an external obstacle by the deformation preventing fin 25 provided on the metal plate material.

  As described above, according to the lead frame and the manufacturing method thereof according to the present embodiment, the side wall portion 10 is formed from one metal plate connected to the lead portion 7, and the lead portion 7 and the die pad portion are formed by bending. 6 is used as a bottom surface, and is made to stand up against the bottom surface and is electrically insulated with a predetermined gap with respect to the die pad portion 6, so that the side wall portion 10 has high durability and light shielding. It is possible to reduce the thickness of the side wall 10 so as to be less than 0.1 mm while maintaining the property. As a result, it is possible to achieve a further reduction in the thickness of the entire light emitting element mounting package, which is substantially the backlight itself, without impairing durability and light blocking properties.

Further, since the thickness of the side wall portion 10 is made thinner than the thickness of the lead portion 7, the level difference caused by the difference in thickness at the connecting portion between the side wall portion 10 and the lead portion 7 thicker than that is described above. It functions as a guide line at the time of the bending process, and it is possible to easily achieve the bending process at the correct position of the side wall 10.
In addition, the side wall portion 10 is not connected to the die pad portion 6 on which the LED chip 5 that is a light emitting element is mounted, but is connected to a lead portion 7 formed separately from the die pad portion 6. In addition, since the side wall 10 is erected with the lead portion 7 as a bottom surface by bending, the step of mounting the LED chip 5 on the die pad portion 6 is performed completely independently of the bending of the side wall 10. It becomes possible.
Therefore, as compared with the case of a lead frame having a configuration in which a side wall portion disclosed in Patent Document 1 listed as background art is connected to a die pad portion and a backlight incorporating the side frame portion, It is possible to achieve further narrowing of the widths of the die pad portion 6 and the lead portion 7 without being hindered by restrictions such as a dimension margin required for bending. In addition, the degree of freedom of manufacturing process design and the setting of structure and dimensions such as the setting of the process sequence such as the die bonding process, the bending process, and the assembly process, and the clearance between parts are dramatically improved.

It is a figure which shows the structure of the principal part of the whole light emitting element mounting package in which the lead frame which concerns on embodiment of this invention was integrated. It is a figure which shows the state before the bending process of the lead frame which concerns on embodiment of this invention. FIG. 3 is a view showing a state in which a side wall portion is upright after a lead frame bending process and a resin molding process shown in FIG. 2. It is a figure which shows the crushing process (ab) of a lead frame shown in FIG. 2, a redrawing process (bc), a V-groove processing process (cd), and a bending process (de). It is a figure which shows the insert mold process using a mold metal mold | die of the light emitting element mounting package shown in FIG. It is a figure which shows typically the state which inserts the lead frame of the state shown in FIG. 3 in a mold die. It is a figure which shows an example about the case where the angle which makes a side wall part stand up with respect to a lead part is made into a substantially right angle (a), and the case where it makes it an obtuse angle (b), respectively. It is the figure which showed the variation of the planar pattern of the unevenness | corrugation at the time of providing an unevenness | corrugation in a side wall part. It is a figure which shows the notch for a press rising prevention provided in a side wall part. It is a figure which shows an example at the time of providing the fin for a deformation | transformation prevention when forming many lead frames continuously from one hoop material. It is a figure which shows the structure of the principal part of the whole conventional light emitting element mounting package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Outer lead part 3 Lamphouse resin part 4 Opening part 5 LED chip 6 Die pad part 7 Lead part 8 Connecting member 10 Side wall part 26 V groove

Claims (13)

A die pad portion mounted with a light emitting element and connected to one of the positive and negative electrodes of the light emitting element;
A lead portion that is disposed in substantially the same plane as the die pad portion in a state of being electrically insulated with a predetermined gap with respect to the die pad portion, and is connected to the other electrode of the light emitting element via a connecting member. When,
It consists of a single metal plate connected to the lead part, and stands upright with respect to the bottom surface with the lead part and the die pad part as bottom surfaces, and is electrically insulated with a predetermined gap with respect to the die pad part. A side wall portion formed by bending at a portion connected to the lead portion, and having a thickness less than the thickness of the lead portion. Lead frame for light emitting device mounting package. In the lead frame for light emitting element mounting packages according to claim 1,
The lead frame for a light-emitting element mounting package, wherein a thickness of the side wall portion is 80% or less of a thickness of the lead portion. In the lead frame for light emitting element mounting packages according to claim 1 or 2,
A lead frame for a light emitting element mounting package, wherein a bending V-groove is provided at a bending position of the side wall portion with the die pad portion as a bottom surface. In the lead frame for light emitting element mounting packages according to any one of claims 1 to 3,
A lead for a light emitting element mounting package, wherein unevenness for diffusing the light emitted from the light emitting element is provided on a surface on the side receiving light from the light emitting element, of both the front and back surfaces of the side wall portion flame. A step of forming a die pad portion on which the light emitting element is mounted and set so that one of the positive and negative electrodes of the light emitting element is connected;
Providing a lead portion connected to the other electrode of the light emitting element via a connecting member, and a side wall portion made of the same metal plate as the lead portion so as to be connected to the lead portion;
The thickness of the side wall portion is set to a thickness less than the thickness of the lead portion;
Bending the side wall portion so as to stand up at a predetermined angle with respect to the bottom surface with the lead portion as a bottom surface at a portion connected to the lead portion;
And a step of disposing the lead portion in a state of being electrically insulated with a predetermined gap with respect to the die pad portion on substantially the same plane as the die pad portion. Lead frame manufacturing method. In the manufacturing method of the lead frame for light emitting element mounting packages according to claim 5,
A method of manufacturing a lead frame for a light-emitting element mounting package, wherein the thickness of the side wall portion is 80% or less of the thickness of the lead portion. In the manufacturing method of the lead frame for light emitting element mounting packages according to claim 5 or 6,
V-grooves are provided at the folding positions of the side wall portions, and the bending processing is performed so that the side wall portions stand upright with respect to the lead portions using the V-grooves as guide grooves at the time of bending processing. A method of manufacturing a lead frame for a light emitting element mounting package. In the manufacturing method of the lead frame for light emitting element mounting packages given in any 1 paragraph of Claims 5 thru / or 7,
The light emitting device further comprising a step of providing irregularities for diffusing the light emitted from the light emitting device on the surface of the side wall portion on the side receiving light from the light emitting device. Manufacturing method of lead frame for mounting package. In the manufacturing method of the lead frame for light emitting element mounting packages given in any 1 paragraph among Claims 5 thru / or 8,
Crushing the side wall, and making the thickness of the side wall less than the thickness of the lead; and
A method of manufacturing a lead frame for a light-emitting element mounting package, comprising: correcting a dimension of the side wall portion enlarged by the extension accompanying the crushing process to a predetermined set dimension. In the manufacturing method of the lead frame for light emitting element mounting packages given in any 1 paragraph among Claims 5 thru / or 9,
A method of manufacturing a lead frame for a light emitting device mounting package, further comprising the step of edge-processing the top side of the side wall portion into a tapered cross section. In the manufacturing method of the lead frame for light emitting element mounting packages given in any 1 paragraph of Claims 5 thru / or 10,
A method for manufacturing a lead frame for a light-emitting element mounting package, wherein an angle of the side wall portion standing up with respect to the lead portion is an obtuse angle. In the manufacturing method of the lead frame for light emitting element mounting packages given in any 1 paragraph among Claims 5 thru / or 11,
The side wall portion and the lead portion are formed by punching from a single metal plate, and a notch shape is provided at the periphery of the side wall portion to prevent press rising during the punching process. Manufacturing method of lead frame for light emitting device mounting package. In the manufacturing method of the lead frame for light emitting element mounting packages given in any 1 paragraph among Claims 5 thru / or 12,
A plurality of the lead frames for light emitting elements are manufactured from a single continuous metal material plate, and the height of the side wall portion from the bottom surface in the state where the side wall portion is upright with the lead portion as a bottom surface. A method of manufacturing a lead frame for a light emitting device mounting package, further comprising: providing a deformation preventing fin having a large height in the plane of the metal plate material.