JP2019073792A5 - - Google Patents

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JP2019073792A5
JP2019073792A5 JP2018032500A JP2018032500A JP2019073792A5 JP 2019073792 A5 JP2019073792 A5 JP 2019073792A5 JP 2018032500 A JP2018032500 A JP 2018032500A JP 2018032500 A JP2018032500 A JP 2018032500A JP 2019073792 A5 JP2019073792 A5 JP 2019073792A5
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Japan
Prior art keywords
metal plate
length
wave
steepness
unit
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JP2018032500A
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Japanese (ja)
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JP2019073792A (en
JP6988565B2 (en
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Priority claimed from JP2017199921A external-priority patent/JP6299922B1/en
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Priority to JP2018032500A priority Critical patent/JP6988565B2/en
Priority claimed from JP2018032500A external-priority patent/JP6988565B2/en
Publication of JP2019073792A publication Critical patent/JP2019073792A/en
Publication of JP2019073792A5 publication Critical patent/JP2019073792A5/ja
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Claims (8)

複数の孔がエッチングによって形成されて蒸着マスクの製造に用いられる、帯状を有した金属板である蒸着マスク用基材であって、
前記金属板を構成する材料は、ニッケルまたは鉄ニッケル合金であり、
前記金属板が有する厚みは、10μm以上50μm以下であり、
前記金属板の長さ方向での各位置における前記金属板の幅方向に沿った形状は、相互に異なっており、各形状は、前記金属板の幅方向に繰り返す波を有し、
前記波における一方の谷から他方の谷までを結ぶ幅方向の直線の長さが波の長さであり、
前記波の長さに対する前記波の高さの百分率が単位急峻度であり、
前記長さ方向における単位長さが、500mmであり、
前記単位長さの金属板における単位急峻度の最大値が、第1急峻度であり、
前記第1急峻度が、0.5%以下である
蒸着マスク用基材。
A base material for a thin-film deposition mask, which is a strip-shaped metal plate used for manufacturing a thin-film deposition mask in which a plurality of holes are formed by etching.
The material constituting the metal plate is nickel or an iron-nickel alloy.
The thickness of the metal plate is 10 μm or more and 50 μm or less.
The shapes along the width direction of the metal plate at each position in the length direction of the metal plate are different from each other, and each shape has a wave repeating in the width direction of the metal plate.
The length of the straight line in the width direction connecting one valley to the other valley in the wave is the length of the wave.
The percentage of the height of the wave with respect to the length of the wave is the unit steepness.
The unit length in the length direction is 500 mm, and the unit length is 500 mm.
The maximum value of the unit steepness in the metal plate having the unit length is the first steepness.
A base material for a vapor deposition mask having a first steepness of 0.5% or less.
前記金属板の長さ方向での各位置において、前記金属板の幅方向での単位急峻度の最大値が、第2急峻度であり、
前記単位長さの金属板における前記第2急峻度の平均値が、0.25%以下である
請求項1に記載の蒸着マスク用基材。
At each position in the length direction of the metal plate, the maximum value of the unit steepness in the width direction of the metal plate is the second steepness.
The base material for a vapor deposition mask according to claim 1, wherein the average value of the second steepness of the metal plate having the unit length is 0.25% or less.
前記金属板の長さ方向での各位置において、前記金属板の幅方向に含まれる波の数は、波数であり、
前記単位長さの金属板における前記波数の最大値が4個以下である
請求項1または2に記載の蒸着マスク用基材。
At each position in the length direction of the metal plate, the number of waves included in the width direction of the metal plate is the wave number.
The base material for a vapor deposition mask according to claim 1 or 2, wherein the maximum value of the wave number in the metal plate having the unit length is 4 or less.
前記金属板の長さ方向での各位置において、前記金属板の幅方向に含まれる波の数は、波数であり、
前記単位長さの金属板における前記波数の平均値が2個以下である
請求項1から3のいずれか一項に記載の蒸着マスク用基材。
At each position in the length direction of the metal plate, the number of waves included in the width direction of the metal plate is the wave number.
The base material for a vapor deposition mask according to any one of claims 1 to 3, wherein the average value of the wave numbers in the metal plate having a unit length is 2 or less.
複数の孔がエッチングによって形成されて蒸着マスクの製造に用いられる、帯状を有し
た金属板である蒸着マスク用基材の製造方法であって、
母材を圧延して前記金属板を得ることを含み、
前記金属板を構成する材料は、ニッケルまたは鉄ニッケル合金であり、
前記金属板が有する厚みは、10μm以上50μm以下であり、
前記金属板の長さ方向での各位置における前記金属板の幅方向に沿った形状は、相互に異なっており、各形状は、前記金属板の幅方向に繰り返す波を有し、
前記波における一方の谷から他方の谷までを結ぶ幅方向の直線の長さが波の長さであり、
前記波の長さに対する前記波の高さの百分率が単位急峻度であり、
前記長さ方向における単位長さが、500mmであり、
前記単位長さの金属板における単位急峻度の最大値が第1急峻度であり、
前記第1急峻度が、0.5%以下であるように、前記母材を圧延する
蒸着マスク用基材の製造方法。
A method for manufacturing a base material for a vapor deposition mask, which is a metal plate having a strip shape, in which a plurality of holes are formed by etching and used for manufacturing a vapor deposition mask.
Including rolling the base metal to obtain the metal plate
The material constituting the metal plate is nickel or an iron-nickel alloy.
The thickness of the metal plate is 10 μm or more and 50 μm or less.
The shapes along the width direction of the metal plate at each position in the length direction of the metal plate are different from each other, and each shape has a wave repeating in the width direction of the metal plate.
The length of the straight line in the width direction connecting one valley to the other valley in the wave is the length of the wave.
The percentage of the height of the wave with respect to the length of the wave is the unit steepness.
The unit length in the length direction is 500 mm, and the unit length is 500 mm.
The maximum value of the unit steepness in the metal plate having the unit length is the first steepness.
A method for producing a base material for a thin-film deposition mask, in which the base metal is rolled so that the first steepness is 0.5% or less.
帯状を有した金属板にレジスト層を形成することと、
前記レジスト層をマスクとしたエッチングによって前記金属板に複数の孔を形成してマスク部を形成することと、を含む蒸着マスクの製造方法であって、
前記金属板を構成する材料は、ニッケルまたは鉄ニッケル合金であり、
前記金属板が有する厚みは、10μm以上50μm以下であり、
前記金属板の長さ方向での各位置における前記金属板の幅方向に沿った形状は、相互に異なっており、各形状は、前記金属板の幅方向に繰り返す波を有し、
前記波における一方の谷から他方の谷までを結ぶ幅方向の直線の長さが波の長さであり、
前記波の長さに対する前記波の高さの百分率が単位急峻度であり、
前記長さ方向における単位長さが、500mmであり、
前記単位長さの金属板における単位急峻度の最大値が、第1急峻度であり、
前記第1急峻度が、0.5%以下である
蒸着マスクの製造方法。
Forming a resist layer on a strip-shaped metal plate and
A method for manufacturing a vapor-deposited mask, which comprises forming a mask portion by forming a plurality of holes in the metal plate by etching using the resist layer as a mask.
The material constituting the metal plate is nickel or an iron-nickel alloy.
The thickness of the metal plate is 10 μm or more and 50 μm or less.
The shapes along the width direction of the metal plate at each position in the length direction of the metal plate are different from each other, and each shape has a wave repeating in the width direction of the metal plate.
The length of the straight line in the width direction connecting one valley to the other valley in the wave is the length of the wave.
The percentage of the height of the wave with respect to the length of the wave is the unit steepness.
The unit length in the length direction is 500 mm, and the unit length is 500 mm.
The maximum value of the unit steepness in the metal plate having the unit length is the first steepness.
A method for manufacturing a thin-film deposition mask in which the first steepness is 0.5% or less.
前記マスク部を形成することは、単一の前記金属板に複数の前記マスク部を形成することであり、
前記各マスク部が、前記複数の孔を有した1つの側面を別々に備え、
前記各マスク部の側面と、1体のフレーム部とを、前記複数の孔を前記マスク部ごとに前記1体のフレーム部が囲うように、相互に接合することをさらに含む
請求項6に記載の蒸着マスクの製造方法。
Forming the mask portion means forming a plurality of the mask portions on the single metal plate.
Each of the mask portions separately includes one side surface having the plurality of holes.
The sixth aspect of claim 6 further includes joining the side surfaces of the respective mask portions and one frame portion to each other so that the plurality of holes are surrounded by the one frame portion for each mask portion. Manufacturing method of vapor deposition mask.
請求項6または7に記載の蒸着マスクの製造方法による蒸着マスクを準備することと、
前記蒸着マスクを用いた蒸着によってパターンを形成することとを含む
表示装置の製造方法。
To prepare a thin-film mask according to the method for producing a thin-film mask according to claim 6 or 7.
A method for manufacturing a display device, which comprises forming a pattern by vapor deposition using the vapor deposition mask.
JP2018032500A 2017-10-13 2018-02-26 A base material for a vapor deposition mask, a method for manufacturing a base material for a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device. Active JP6988565B2 (en)

Priority Applications (1)

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JP2018032500A JP6988565B2 (en) 2017-10-13 2018-02-26 A base material for a vapor deposition mask, a method for manufacturing a base material for a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017199921A JP6299922B1 (en) 2017-10-13 2017-10-13 Vapor deposition mask substrate, vapor deposition mask substrate production method, vapor deposition mask production method, and display device production method
JP2018032500A JP6988565B2 (en) 2017-10-13 2018-02-26 A base material for a vapor deposition mask, a method for manufacturing a base material for a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device.

Related Parent Applications (1)

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Publications (3)

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JP2019073792A JP2019073792A (en) 2019-05-16
JP2019073792A5 true JP2019073792A5 (en) 2020-11-19
JP6988565B2 JP6988565B2 (en) 2022-01-05

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6299921B1 (en) 2017-10-13 2018-03-28 凸版印刷株式会社 Vapor deposition mask substrate, vapor deposition mask substrate production method, vapor deposition mask production method, and display device production method
CN111778476B (en) * 2020-07-14 2023-01-10 京东方科技集团股份有限公司 Mask plate for support, preparation method and mask plate assembly

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JP5382259B1 (en) * 2013-01-10 2014-01-08 大日本印刷株式会社 Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate
JP5455099B1 (en) * 2013-09-13 2014-03-26 大日本印刷株式会社 Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate
TWI665319B (en) * 2015-07-17 2019-07-11 日商凸版印刷股份有限公司 Metal mask substrate for vapor deposition, metal mask for vapor deposition, method of producing metal mask substrate for vapor deposition, and method of producing metal mask for vapor deposition
CN107849682B (en) * 2016-04-14 2019-04-19 凸版印刷株式会社 The manufacturing method of deposition mask substrate, the manufacturing method of deposition mask substrate and deposition mask

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