JP2019068661A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2019068661A JP2019068661A JP2017193433A JP2017193433A JP2019068661A JP 2019068661 A JP2019068661 A JP 2019068661A JP 2017193433 A JP2017193433 A JP 2017193433A JP 2017193433 A JP2017193433 A JP 2017193433A JP 2019068661 A JP2019068661 A JP 2019068661A
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Abstract
Description
[先行技術文献]
[特許文献]
[特許文献1] 特開2013−165498号公報
[特許文献2] 特開2009−195054号公報
[数1]
TIF0a+Trra<TIF0b
[数2]
VDD1={Lx+Ly+(La・Lb)/(La+Lb)}・(di/dt)
[数3]
VDD1=(Lx+Ly)・(di/dt)
[数4]
di/dt=(dia/dt)+(dib/dt)
[数5]
VDD2=La・(dia/dt)=Lb・(dib/dt)
[数6]
dia/dt=IFa/TIF0a
[数7]
dib/dt=IFb/TIF0b
[数8]
TIF0a=IFa・(La/VDD2)
[数9]
TIF0b=IFb・(Lb/VDD2)
[数10]
IFa・La+VDD2・Trra<IFb・Lb
[数11]
IFa・La+VDD1・Trra<IFb・Lb
Claims (9)
- MOSFET部と、
前記MOSFET部に対して逆並列に接続されるダイオード部と
を備え、
前記MOSFET部の逆回復電流がゼロになった時よりも後に、前記ダイオード部に逆回復電流が流れる
半導体装置。 - 前記ダイオード部は、前記MOSFET部の寄生ダイオードの順方向電圧よりも低い順方向電圧を有する
請求項1に記載の半導体装置。 - 前記MOSFET部に直列に接続され、インダクタンスがLaである第1のインダクタンス部と、
前記ダイオード部に直列に接続され、インダクタンスがLbである第2のインダクタンス部と
をさらに備え、
前記第1のインダクタンス部の前記Laは、前記第2のインダクタンス部の前記Lbよりも小さい
請求項1または2に記載の半導体装置。 - 前記MOSFET部の逆回復時間をTrraとし、
前記MOSFET部および前記第1のインダクタンス部と、前記ダイオード部および前記第2のインダクタンス部とを有し、前記MOSFET部および前記第1のインダクタンス部と、前記ダイオード部および前記第2のインダクタンス部とが並列に接続された並列回路部において、前記並列回路部の一端である第1の接続点と、前記並列回路部の一端とは反対側の一端である第2の接続点との間に印加される電圧をVDD2とし、
前記MOSFET部に流れる電流をIFaとし、
前記ダイオード部に流れる電流をIFbとした場合に、
IFa・La+Trra・VDD2<IFb・Lb
が満たされる
請求項3に記載の半導体装置。 - 前記並列回路部の前記第1の接続点に対して直列に接続され、第1のリードフレームの一部により構成されており、インダクタンスがLxである第3のインダクタンス部と、
前記並列回路部の前記第2の接続点に対して直列に接続され、第2のリードフレームの一部により構成されており、インダクタンスがLyである第4のインダクタンス部と
をさらに備え、
前記LxおよびLyの和は、前記Laおよび前記Lbのいずれよりも十分に大きい
請求項4に記載の半導体装置。 - 前記第1のインダクタンス部は、
第1のワイヤーと、
前記第1のリードフレームの前記一部とは異なり且つ前記第1のワイヤーと接触する前記第1のリードフレームの第1領域と
を有し、
前記第2のインダクタンス部は、
第2のワイヤーと、
前記第1のリードフレームの前記一部および前記第1領域とは異なり、且つ、前記第2のワイヤーと接触する前記第1のリードフレームの第2領域と
を有し、
前記第1領域の厚さは、前記第2領域の厚さよりも大きい
請求項5に記載の半導体装置。 - 前記第1のインダクタンス部は、第1のワイヤーを含み、
前記第2のインダクタンス部は、第2のワイヤーを含み、
前記第4のインダクタンス部は、第3のワイヤーを含み、
前記第3のワイヤーの長さが前記第1のワイヤーの長さおよび前記第2のワイヤーの長さのいずれよりも長い、または、前記第3のワイヤーの直径が前記第1のワイヤーの直径および前記第2のワイヤーの直径のいずれよりも小さい
請求項5または6に記載の半導体装置。 - 前記第1のインダクタンス部は、1本以上の第1のワイヤーを含み、
前記第2のインダクタンス部は、1本以上の第2のワイヤーを含み、
前記第4のインダクタンス部は、1本以上の第3のワイヤーを含み、
前記第3のワイヤーの数は、前記第1のワイヤーの数および前記第2のワイヤーの数のいずれよりも少ない
請求項5から7のいずれか一項に記載の半導体装置。 - 前記第1のインダクタンス部は、1本以上の第1のワイヤーを含み、
前記第2のインダクタンス部は、2本以上の第2のワイヤーを含み、
前記第1のワイヤーの数は、前記第2のワイヤーの数よりも少ない
請求項3から8のいずれか一項に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017193433A JP6977460B2 (ja) | 2017-10-03 | 2017-10-03 | 半導体装置 |
US16/114,218 US10389351B2 (en) | 2017-10-03 | 2018-08-28 | Semiconductor apparatus |
Applications Claiming Priority (1)
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