JP2019065302A - 封止用樹脂組成物、および半導体装置 - Google Patents

封止用樹脂組成物、および半導体装置 Download PDF

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Publication number
JP2019065302A
JP2019065302A JP2018242962A JP2018242962A JP2019065302A JP 2019065302 A JP2019065302 A JP 2019065302A JP 2018242962 A JP2018242962 A JP 2018242962A JP 2018242962 A JP2018242962 A JP 2018242962A JP 2019065302 A JP2019065302 A JP 2019065302A
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resin composition
sealing
group
sealing resin
semiconductor element
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JP2019065302A5 (https=
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洋史 黒田
Yoji Kuroda
洋史 黒田
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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JP2018242962A 2018-12-26 2018-12-26 封止用樹脂組成物、および半導体装置 Pending JP2019065302A (ja)

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JP2018242962A JP2019065302A (ja) 2018-12-26 2018-12-26 封止用樹脂組成物、および半導体装置

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JP2018242962A JP2019065302A (ja) 2018-12-26 2018-12-26 封止用樹脂組成物、および半導体装置

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JP2014060297A Division JP6632791B2 (ja) 2014-03-24 2014-03-24 封止用樹脂組成物、および半導体装置

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JP2019065302A true JP2019065302A (ja) 2019-04-25
JP2019065302A5 JP2019065302A5 (https=) 2019-12-05

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063549A (ja) * 2005-08-05 2007-03-15 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2008208176A (ja) * 2007-02-23 2008-09-11 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
WO2011070739A1 (ja) * 2009-12-07 2011-06-16 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置
JP2013108024A (ja) * 2011-11-24 2013-06-06 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063549A (ja) * 2005-08-05 2007-03-15 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP2008208176A (ja) * 2007-02-23 2008-09-11 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
WO2011070739A1 (ja) * 2009-12-07 2011-06-16 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置
JP2013108024A (ja) * 2011-11-24 2013-06-06 Sumitomo Bakelite Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置

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