JP2019041045A - Package for electronic component housing and electronic device - Google Patents

Abstract

To provide a package for an electronic component housing or the like, which is effective for improving transmission characteristic and long-term reliability of a signal.SOLUTION: A package for an electronic component housing 30, comprises: a substrate 1 in which a bottom part of a concave part 1a includes a first bottom surface 11 and a second bottom surface 12 adjacent to the first bottom surface 11 in a plan view while being positioned on an upper side from the first bottom surface 11, and includes a penetration hole 13 in the second bottom surface 12; a wiring board 2 that includes an insulation board 21 and a wiring conductor 22, and is positioned at the second bottom surface 12 near the penetration hole 13; and a connector 3 that penetrates the penetration hole 13, and includes a pin terminal 31 connected to the wiring conductor 22 and a cylinder member 32 surrounding the pin terminal 31. The penetration hole 13 includes sequentially from the second bottom surface 12 side: a first penetration part 14; a second penetration part 15 of which an opening diameter is larger than the first penetration part 14; and a third penetration part 16 of which the opening diameter is larger than the second penetration part 15. In the second penetration part 15, the connector 3 and an inner surface of the penetration hole 13 are connected.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component storage package and an electronic device including a base body having a portion through which a pin terminal passes.

  With the increase in speed and capacity of communication devices that transmit information, the frequency of electronic devices mounted on communication devices is increasing. The electronic device is a device in which a photoelectric conversion element such as an optical modulator is sealed in a package. The package includes, for example, a wiring conductor that transmits a high-frequency signal, and terminals such as lead pins that are electrically connected to the wiring conductor (see, for example, Patent Document 1).

JP 2014-179432 A

  In recent years, there has been a demand for higher frequency in electronic component storage packages and electronic devices. In addition, further improvement in long-term reliability in the terminal portion and the like has been demanded.

  An electronic component storage package according to one aspect of the present invention has a top surface including a recess and a bottom surface opposite to the top surface, and the bottom of the recess includes a first bottom surface including an electronic component mounting portion and the bottom surface. A base body having a second bottom surface located above the first bottom surface and adjacent to the first bottom surface in plan view, and having a through-hole penetrating from the second bottom surface to the bottom surface; An insulating substrate and a wiring conductor located on the surface of the insulating substrate, the wiring substrate located on the second bottom surface in the vicinity of the through hole, and the wiring passing through the through hole and the wiring A pin terminal having an upper portion connected to the conductor, and a connector including a cylindrical member surrounding and holding the pin terminal in a plan view. In addition, the through hole has a first through part, a second through part having a larger opening diameter than the first through part, and the second through part in order from the opening on the second bottom surface side to the opening on the lower surface side. A third penetrating portion having a larger opening diameter. The connector and the inner surface of the through hole are joined to each other in the second through portion.

  An electronic device according to one aspect of the present invention includes the electronic component storage package having the above-described configuration, and an electronic component that is housed in the recess and electrically connected to the wiring conductor.

  According to the wiring board of one aspect of the present invention, it is easy to improve the long-term reliability of the pin terminal portion connected externally. In addition, it is easy to cope with high frequency.

  According to the electronic device of one aspect of the present invention, since the electronic component storage package having the above-described configuration is included, it is possible to provide an electronic device that can easily improve long-term reliability and cope with higher frequency.

(A) is the perspective view which looked at the electronic component storage package of embodiment of this invention from the top, (b) is the perspective view seen from the bottom. FIG. 2 is an exploded perspective view of the electronic component storage package shown in FIG. 1. (A) is the top view which looked at the electronic component storage package of embodiment of this invention from the upper side, (b) is the top view seen from the lower side. It is sectional drawing in the AA line of Fig.3 (a). (A) is a side view of the electronic component storage package shown in FIG. 1, (b) is a front view. It is a perspective view which shows the electronic device of embodiment of this invention.

  An electronic component storage package and an electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the distinction between the upper and lower sides in the following description is for convenience of explanation, and does not limit the upper and lower sides when the electronic component storage package and the electronic device are actually used. Moreover, the impedance in the following description means characteristic impedance.

  FIG. 1A is a perspective view of an electronic component storage package according to an embodiment of the present invention as viewed from above, and FIG. 1B is a perspective view of the electronic component storage package as viewed from below. 2 is an exploded perspective view of the electronic component storage package shown in FIG. FIG. 3A is a plan view (top view) of the electronic component storage package according to the embodiment of the present invention as seen from above, and FIG. 3B is a plan view (bottom view) as seen from below. is there. FIG. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5A is a side view of the electronic component storage package shown in FIG. 1, and FIG. 5B is a front view of the electronic component storage package. FIG. 6 is a perspective view showing an electronic apparatus according to an embodiment of the present invention.

  The electronic component storage package 30 according to the embodiment includes a base 1 having an upper surface including a recess 1a and a lower surface opposite to the upper surface, an insulating substrate 21 and a wiring conductor 22 positioned on the surface of the insulating substrate 21, and the recess 1a. The wiring board 2 is located inside, and the connector 3 includes a pin terminal 31 having an upper portion connected to the wiring conductor 22 and a cylindrical member 32 surrounding and holding the pin terminal 31. The electronic device 40 is basically constituted by the electronic component storage package 30 and the electronic component 41 which is accommodated in the recess 1a and electrically connected to the wiring conductor 22.

  The base body 1 has a function as a container for housing the electronic component 41 in the recess 1a. The bottom of the recess 1a has a first bottom surface 11 including an electronic component mounting portion 11a and a second bottom surface 12 that is located above the first bottom surface 11 and that is adjacent to the first bottom surface 11 in plan view. doing. The mounting portion 11a is appropriately set according to the external dimensions and the like in plan view of the electronic component 41 to be mounted. FIG. 3 shows an example of the mounting portion 11a with a broken line. The base body 1 has a through hole 13 penetrating from the second bottom surface 12 to the bottom surface.

  The first bottom surface 11 of the recess 1a is a portion on which the electronic component 41 is mounted, and the second bottom surface 12 is a portion on which the wiring board 2 electrically connected to the electronic component 41 is disposed. Since the second bottom surface 12 is positioned above the first bottom surface 11, for example, the electrodes on the top surface of the electronic component 41 mounted on the first bottom surface 11 and the wiring board disposed on the second bottom surface 12. Electrical connection with the two wiring conductors 22 is easy.

  The wiring board 2 is electrically connected to the electronic component 41 as described above. The wiring conductor 22 is electrically connected to a pin terminal 31 in a through-hole 13 to be described later to form a conductive path that electrically connects the electronic component 41 and an external electric circuit (not shown). Therefore, the wiring board 2 is located in the vicinity of the through hole 13 on the second bottom surface 12 of the base body 1.

  As described above, the connector 3 has the pin terminal 31, and the pin terminal 31 penetrates the through hole 13 and has an upper portion connected to the wiring conductor 22. The connector 3 includes a cylindrical member 32 that surrounds and holds the pin terminal 31 in a bottom view. In addition, the connector 3 in the example of the embodiment includes a sealing material 33 positioned in the cylindrical portion 32a of the cylindrical member 32. The cylindrical member 32 has one cylindrical portion 32a. Further, as shown in FIG. 3B, the cylindrical member 32 is provided so that a plurality of cylindrical portions 32a are arranged in a line. The pin terminal 31 is fixed to the inner side surface of the cylindrical portion 32a of the cylindrical member 32 via the sealing material 33. In other words, the sealing material 33 is disposed so as to fill the inside of the cylindrical portion 32a of the cylindrical member 32, and the pin terminal 31 is positioned so as to penetrate up and down the sealing material 33.

  For example, as in the example shown in FIG. 4, the upper end of the pin terminal 31 is higher than the upper ends of the cylindrical member 32 and the sealing material 33 for electrical connection with the wiring conductor 22 as described above. And further protrudes upward from the opening above the through-hole 13. The lower end of the pin terminal 31 projects downward from the cylindrical member 32 and the sealing material 33 for electrical connection with the external electric circuit as described above.

  In addition, the through hole 13 of the base body 1 through which the pin terminal 31 penetrates sequentially from the opening on the second bottom surface 12 side to the opening on the lower surface side of the base body 1 than the first through part 14 and the first through part 14. A second through portion 15 having a large opening diameter and a third through portion 16 having a larger opening diameter than the second through portion 15 are provided. In the second through portion 15, the connector 3 and the inner surface of the through hole 13 are joined to each other. That is, the outer side surface of the cylindrical member 32 of the connector 3 is joined to the inner side surface of the second through portion 15 of the through hole 13 (the surface of the base body 1 located in the second through portion 15). That is, the through-hole 13 has a function of arranging and fixing the connector 3, and thereby has a function of assisting electrical connection inside and outside the recess 1 a of the base 1.

  Since the electronic component storage package 30 of the embodiment has the above-described configuration, it is easy to improve the long-term reliability in the pin terminal 31 portion to be externally connected. In addition, for example, it is easy to cope with a high frequency in a signal transmission line including the pin terminal 31 and the wiring conductor 22. Therefore, for example, it is possible to provide the electronic component housing package 30 in which the electronic device 40 such as a photoelectric conversion device excellent in long-term reliability and high-frequency signal transmission characteristics can be easily manufactured. Further, it is possible to provide the electronic device 40 that is excellent in long-term reliability and high-frequency signal transmission characteristics. Hereinafter, an example will be described for each part.

  The base 1 has an upper surface including the recess 1a and a lower surface opposite to the upper surface. An electronic component 41 is accommodated in the recess 1a. The bottom surface of the recess 1a includes a first bottom surface 11 including the mounting portion 11a for the electronic component 41, and a second bottom surface 12 that is located above the first bottom surface 11 and that is adjacent to the first bottom surface 11 in plan view. have. That is, the bottom surface of the recess 1a has a first bottom surface 11 and a second bottom surface 12 having different heights, and the first bottom surface 11 and the second bottom surface 12 are adjacent to each other in a stepped manner. In other words, the bottom surface of the recess 1a has a second bottom surface 12 that is stepwise higher than the first bottom surface 11 including the mounting portion 11a. The base body 1 has a through hole 13 penetrating from the second bottom surface 12 to the bottom surface. The through hole 13 is a part for electrically conducting the inside and outside of the recess. Details of the through hole 13 will be described later.

  The base body 1 functions as a housing member for housing the electronic component 41 and has a function of electromagnetically shielding the outside of the electronic element mounting package. The substrate 1 is made of, for example, stainless steel such as iron-nickel-chromium alloy (JIS standard SUS304, SUS310, etc.), iron-nickel-chromium-molybdenum alloy (JIS standard SUS303, SUS316, etc.), iron-nickel-cobalt alloy, etc. And a material appropriately selected from metal materials such as a copper-zinc alloy.

For example, when the electronic component 41 accommodated in the concave portion 1a of the base 1 is a modulation element (hereinafter referred to as an LN element) using a ferroelectric element LN (lithium niobate), the thermal expansion coefficient of the LN element is 15.4 × 10. A material approximating −6 / ° C. is selected. That is, in this case, for example, SUS303 (thermal expansion coefficient 14.6 × 10 −6 / ° C.), SUS304 (thermal expansion coefficient 17.3 × 10 −6 / ° C.), SUS310 (thermal expansion coefficient 15.8 × 10 −6 / ° C.) A metal material such as SUS316 (coefficient of thermal expansion 16.0 × 10 −6 / ° C.) such as iron-nickel-chromium alloy or iron-nickel-chromium-molybdenum alloy is selected as the material for producing the substrate 1. Thereby, when an LN element is accommodated in the recess 1a of the base body 1 to form an electronic device (photoelectric conversion device), the thermal expansion coefficients of the base body 1 and the electronic component 41 are approximated. Therefore, thermal stress generated by heat generated when the electronic component 41 is operated or heat applied when the electronic component 41 is mounted on the substrate 1 is reduced. Therefore, the possibility of peeling of the electronic component 41 from the base body 1 due to thermal stress can be effectively reduced.

The base body 1 can be manufactured by subjecting the raw material of the metal material forming the base body 1 to processing appropriately selected from metal processing methods such as rolling, punching, electric discharge, cutting and polishing. In this case, the base body 1 is prepared by separately preparing a plate-like portion including the bottom surface of the concave portion 1a and a frame-like portion (side wall portion of the concave portion 1a) located on the outer periphery of the upper surface of the plate-like portion. You may manufacture by the method of mutually joining. The plate-like portion and the frame-like portion can be joined by, for example, a joining method such as joining via a brazing material. The substrate 1 may be coated with a plating layer such as nickel and gold on the exposed surface. Effects such as suppression of oxidation of the substrate 1 and improvement of the wettability of the brazing material can be obtained by the gold plating layer or the like. For example, a nickel layer having a thickness of 0.5 to 9 μm and a gold layer having a thickness of 0.5 to 9 μm are sequentially formed on the substrate 1 by a plating method such as an electroplating method.
Is deposited on the surface. Thereby, it is possible to prevent the base body 1 from being oxidatively corroded. Further, the bonding (details will be described later) of the wiring board 2 and the connector 3 to the base body 1 can be made easy and strong.

  The base 1 may be integrally formed as a whole. Examples of the integral molding method include a method in which the above-described metal processing is performed on a raw material of a metal material such as the iron-nickel-chromium alloy or the iron-nickel-chromium-molybdenum alloy. When the substrate 1 is integrally molded as a whole, it is advantageous in terms of improving the mechanical strength at the boundary portion between the plate-like portion and the frame-like portion and improving the positional accuracy thereof. is there.

  The wiring board 2 is for transmitting a high-frequency signal, and is used, for example, as an input / output terminal for an electrical signal in the electronic component storage package 30. The wiring board 2 is electrically connected to the electronic component 41 as described above. Moreover, it electrically connects with the connector 3 mentioned later. That is, the wiring board 2 has a function of electrically connecting the electronic component 41 and the connector 3. In other words, electrical connection between the electronic component 41 in the recess 1a and the external electric circuit is performed via the wiring board 2 and the connector 3.

  In the wiring substrate 2, a plurality of wiring conductors 22 are arranged on the upper surface of the insulating substrate 21. The plurality of wiring conductors 22 have a function of transmitting a signal such as a high-frequency signal that conducts inside and outside the recess 1a, for example. The plurality of wiring conductors 22 may include those having functions other than signal transmission, such as for grounding. The grounding wiring conductors 22 are, for example, a pair sandwiching the signal wiring conductors 22 and form a coplanar transmission line together with the signal wiring conductors 22. That is, the insulating substrate 21 of the wiring board 2 functions as a base for arranging the plurality of wiring conductors 22 so as to be electrically insulated from each other.

  The insulating substrate 21 is, for example, a rectangular plate-like member when viewed from above. The shape and size of the insulating substrate 21 may be appropriately set according to the use of the wiring substrate 2 or the shape and size of the recess 1a. The insulating substrate 21 may have a flat plate shape, and may have a stepped portion or a curved portion on the outer surface such as the upper surface, the lower surface, and the side surface.

  The insulating substrate 21 is formed of a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. The insulating substrate 21 may be formed of a plurality of insulating layers including such a ceramic sintered body. The number of the insulating layers is appropriately set according to conditions such as predetermined dimensions and mechanical strength of the insulating substrate 21.

If the insulating substrate 21 (insulating layer) is made of, for example, an aluminum oxide sintered body, it is manufactured as follows. First, an appropriate organic binder, organic solvent, plasticizer, dispersant, etc. are added to raw material powders such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO). Mix to make a slurry. Next, this slurry is formed into a belt-like ceramic green sheet by a sheet forming technique such as a doctor blade method. Next, the ceramic green sheet is cut into a predetermined shape and size to obtain a plurality of green sheets. Thereafter, a plurality of these ceramic green sheets are laminated as necessary and fired at a temperature of about 1300 to 1600 ° C. Thereby, the insulating substrate 21 can be manufactured.

  The wiring conductor 22 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt. The wiring conductor 22 may be made of an alloy material of such a metal material, or may be a laminate of a plurality of metal layers. The plurality of metal layers may be made of different kinds of metal materials or may have different thicknesses.

  If the wiring conductor 22 is made of tungsten, for example, it can be formed as follows. First, a powder of a metal material such as tungsten is kneaded together with an effective solvent and a binder to produce a metal paste. Next, this metal paste is printed in a predetermined pattern on the surface of the green sheet to be the insulating substrate 21 by a method such as screen printing. Thereafter, the metal paste and the green sheet are fired simultaneously. Through the above steps, the insulating substrate 21 in which a metallized layer such as tungsten is disposed as the wiring conductor 22 can be manufactured.

  The wiring conductor 22 may be one in which a plating layer such as nickel and gold is further provided on the exposed surface of the metallized layer. The plating layer suppresses oxidation or the like of the wiring conductor 22 and improves reliability. Moreover, the characteristics of the connectivity (such as the wettability or bonding property of the brazing material) of the brazing material or the bonding wire are improved.

  The connector 3 together with the wiring substrate 2 constitutes a conductive path (such as a signal transmission path) that conducts the inside and outside of the recess 1a. As described above, the connector 3 in this embodiment includes a pin terminal 31 penetrating the through hole 13 of the base body 1, a cylindrical member 32 surrounding the pin terminal 31 in plan view, and a cylindrical member 32. A sealing member 33 filled between the cylindrical portion 32a and the pin terminal 31 is provided.

  The pin terminal 31 is a part through which current actually flows, and has a function of transmitting a signal. The cylindrical member 32 has a function of being connected to the ground potential and supplying the ground potential. The upper part of the pin terminal 31 is electrically connected to the wiring conductor 22 of the wiring board 2 by a conductive connecting material (not shown) such as solder. Further, the lower part of the pin terminal 31 is electrically connected to the external electric circuit through a conductive connecting material or the like.

  The pin terminal 31 has, for example, an elongated cylindrical shape (linear shape), a length of 1.5 to 22 mm, and a diameter of 0.1 to 0.5 mm. The pin terminal 31 is made of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy. For example, in the case where the pin terminal 31 is made of an iron-nickel-cobalt alloy, the pin terminal 31 is manufactured by stamping the raw material of the alloy and performing processing appropriately selected from metal processing methods such as rolling, polishing, and etching. be able to.

The pin terminal 31 is effective for suppressing deformation such as bending when its diameter is larger than 0.1 mm. Thereby, it is possible to easily control the impedance at the pin terminal 31 portion with high accuracy. In addition, if the diameter of the pin terminal 31 is 0.5 mm or less, it is advantageous in suppressing the diameter of the through hole 13 and the like, and effective for downsizing the electronic device 40 and the like.

  The cylindrical member 32 is a holding member that holds the pin terminal 31 via the sealing material 33, and has, for example, a cylindrical shape having one cylindrical portion 32a. In the cylindrical tubular member 32, the pin terminal 31 is located at the central portion when viewed in plan with respect to the opening. Further, as shown in FIG. 3B, the cylindrical member 32 is provided with a semicircular end portion on the short side in a bottom view, and a plurality of cylindrical portions 32a are arranged in a line along the long side direction. The pin member 31 is located at the central portion of each opening, which is the arranged holding member when viewed in plan. The cylindrical member 32 is made of, for example, the same metal material as that of the base 1 and is manufactured by metal processing similar to that of the base 1.

  In the electronic component storage package 30 and the electronic device 40 of the embodiment, a plurality of pin terminals 31 are held side by side on the inner surface of the through hole 13. In such a case, if the pin terminal 31 is held by the cylindrical member 32, it is easy to arrange the plurality of pin terminals 31 in the through hole 13, and the positional relationship between the plurality of pin terminals 31 is Adjustment accuracy and workability can be improved. Therefore, it is advantageous to obtain the electronic component storage package 30 and the electronic device 40 in which productivity and electrical characteristics can be easily improved.

  The cylindrical member 32 is joined to the surface of the base 1 in the through hole 13 by a low melting point brazing material (not shown) such as a gold-tin alloy. The cylindrical member 32 is joined to the inner surface of the through hole 13 in the second through portion 15 as described above. In this case, the brazing material has a function of fixing the cylindrical member 32 in the through hole 2 of the base body 1 and a function of hermetically sealing between the through hole 13 and the cylindrical member 32.

  The sealing material 33 is made of an insulating inorganic material such as glass or ceramics, and ensures the insulation between the pin terminal 31 and the cylindrical member 32 and has a function of fixing the pin terminal 31 in the cylindrical member 32. Have. Examples of such a sealing material 33 include glass materials such as borosilicate glass and soda glass. Further, the sealing material 33 may be a material obtained by adding a filler for adjusting the thermal expansion coefficient or relative dielectric constant of the sealing material 33 to these glass materials. The filler material may be appropriately selected in consideration of impedance adjustment of the sealing material 33, that is, impedance matching as the electronic component storage package 30 and the electronic device 40. The filler content in the sealing material 33 may be set as appropriate in the same manner. Examples of the filler that lowers the dielectric constant include lithium oxide. For example, in order to set the characteristic impedance to 50Ω, when the inner diameter of the cylindrical portion 32a is 1.75 mm and the outer diameter of the pin terminal 31 is 0.2 mm, the sealing material 33 having a relative dielectric constant of 6.8 is used. That's fine. Further, when the inner diameter of the cylindrical portion 32a is 1.65 mm and the outer diameter of the pin terminal 31 is 0.25 mm, the sealing material 33 having a relative dielectric constant of 5 may be used.

  In order to fix the pin terminal 31 through the sealing material 33 filled in the cylindrical portion 32a, the following may be performed. For example, when the sealing material 33 is made of glass, first, glass powder is molded using a powder pressing method, an extrusion molding method, etc., and the inner diameter is matched with the outer diameter of the pin terminal 31, and the outer diameter is a cylindrical portion. A cylindrical molded body matching the inner diameter of 32a is produced. Next, the molded body of the sealing material 33 is inserted into the cylindrical portion 32 a, and the pin terminal 31 is inserted through the hole of the sealing material 33. Thereafter, the sealing material 33 is melted by heating to a predetermined temperature, and then cooled and solidified. Through the above steps, the cylindrical portion 32a is hermetically sealed by the sealing material 33. Further, the pin terminal 31 is insulated and fixed from the cylindrical member 32 by the sealing material 33, and a coaxial line is formed.

  As described above, the through hole 13 of the base body 1 in which the connector 3 is disposed extends in order from the opening on the second bottom surface 12 side to the opening on the lower surface side of the base body 1. The second penetrating portion 15 having a larger opening diameter and the third penetrating portion 16 having a larger opening diameter than the second penetrating portion 15 are provided. In the second through portion 15, the connector 3 and the inner surface of the through hole 13 are joined to each other. The first penetrating portion 14 and the second penetrating portion 15 are, for example, circular when viewed from above (in top view), and the diameters of the openings are different from each other. The third penetrating portion 16 is, for example, a circular shape having a diameter larger than that of the second penetrating portion 15, a rectangular shape having a short side longer than the diameter of the second penetrating portion 15, or a rectangle with rounded corners. Is. In the case of the third penetrating portion 16 having a rectangular shape or the like, a plurality of second penetrating portions 15 are arranged side by side in the long side direction in one third penetrating portion 16. In addition, as shown in FIG. 3B, the rectangular third penetrating portion 16 is arranged with one rectangular second penetrating portion 15 along the long side direction of one third penetrating portion 16. .

  Therefore, the lower part of the connector 3, which is an external connection terminal joined to the inner surface of the through hole 13 in the second through part 15, has a space or air in the third through part 16 having a larger opening diameter than the second through part 15. It is a free end facing the At this free end, deformation according to the stress generated by the difference in thermal expansion coefficient among the base body 1, the cylindrical member 32, and the sealing material 33 is easy, and reduction of stress such as thermal stress due to this deformation is easy.

  Further, the characteristic impedance of the lower portion of the pin terminal 31 can be adjusted by the opening diameter of the third through portion 16, that is, the distance between adjacent air layers. Therefore, impedance matching is easy, and it is easy to improve the transmission characteristics of the high frequency signal by reducing the reflection loss of the high frequency signal as the electronic component storage package 30 and the electronic device 40. Therefore, according to the electronic component storage package 30 and the electronic device 40 having the above-described configuration, it is easy to improve the long-term reliability in the pin terminal 31 portion connected externally. In addition, it is easy to cope with high frequency.

  Further, in the above configuration, since the opening diameter of the through hole 13 is relatively large in the third through portion 16, it is easy to arrange a connection member (not shown) for external connection in the through hole. Therefore, the electronic component storage package 30 and the electronic device 40 can be easily connected to each other via the connector 3 including the pin terminals 31. The connection member for external connection is, for example, a flexible substrate, a lead terminal (lead frame), an external wiring substrate, or the like.

  In the electronic component storage package 30 and the electronic device 40 having the above-described configuration, the opening diameter of the first through portion 14 located at the upper end of the through hole 13 is relatively small. Therefore, it is easy to hermetically seal the connector 3 by closing the through hole 13. That is, it is possible to provide the electronic component storage package 30 that is advantageous in terms of improving the reliability and productivity of hermetic sealing of the electronic measure 40.

  The opening diameter of the first penetrating portion 14 is set between the pin terminal 31 in consideration of the electrical short circuit between the base 1 and the pin terminal 31 and the miniaturization and productivity of the base 1. What is necessary is just to be able to ensure an interval (clearance) of about 0.1 to 0.3 mm.

  Further, the opening diameter of the second through portion 15 is slightly smaller than the outer dimensions of the connector 3 (tubular member 32) in FIG. 4 in consideration of the ease of joining of the connector 3 and the reliability of hermetic sealing. Any material that is large (about 0.03 to 0.1 mm) may be used.

  Further, the opening diameter of the third through portion 16 is set so that the outer shape of the connector 3 (cylindrical member 32) in FIG. 4 is taken into consideration in consideration of ease of joining and reliability of the connector 3 (pin terminal 31) and the joining member. What is necessary is just about 1-10 mm larger than a dimension.

The length (vertical dimension) of the first through portion 14 is set to, for example, about the difference in height between the first bottom surface 11 and the second bottom surface 12. The length (the dimension in the vertical direction) of the second penetrating portion 15 is set to such an extent that the lower end portion of the tubular member 32 of the connector 3 protrudes downward. The length (dimension in the vertical direction) of the third through portion 16 is, for example, such a length that the lower end portion of the connector 3 protruding downward from the lower end of the second through portion 15 can be accommodated in the third through hole 16. Is set. In other words, the upper portion of the pin terminal 31 can protrude above the upper end of the through hole 13, the lower portion of the pin terminal 31 can be accommodated in the through hole 13, and the connector 3 can be stably held. The lengths of the first penetrating part 14, the second penetrating part 15 and the third penetrating part 16 may be set to a certain length.

  In the electronic component storage package 30 and the electronic device 40 of the embodiment, the outer edge position of the second bottom surface 12 opposite to the pin terminal 31 is more than the outer edge position of the insulating substrate 21 opposite to the pin terminal 31 in plan view. Close to pin terminal 31. In other words, the edge portion of the insulating substrate 21 (wiring substrate 2) may protrude inside the recess 1a from the edge portion of the second bottom surface 12 that is stepped with respect to the first bottom surface 11. In the example shown in FIG. 4, the edge portion of the insulating substrate 21 protrudes into the recess 1 a by a distance d from the edge portion of the second bottom surface 12.

In this case, stress concentration on the edge portion of the insulating substrate 21 in the wiring board 2 is suppressed, the stress generated on the edge portion of the insulating substrate 21 is effectively relieved, and cracks and cracks occur in the insulating substrate 21. The possibility can be reduced. Therefore, the electronic component storage package 30 and the electronic device 40 that are advantageous in improving the reliability can be obtained. If the distance d is in the range of, for example, about 0.2 to 2 mm, it is advantageous for obtaining the above effect.

  In the electronic component storage package 30 and the electronic device 40 according to the embodiment, the first bottom surface 11 may be located below the upper end of the second through portion 15. Further, at this time, the through hole 13 is located between the first through part 14 and the second through part 15 and has an opening diameter larger than that of the first through part 14 and larger than that of the second through part 15. The fourth through part 17 may be further small. In this case, the change in the distance between the connector 3 and the inner surface of the through hole 13 changes step by step in smaller units. That is, the change in capacitance between the first penetration part 14 and the second penetration part 15, that is, the change (gradient) in impedance is made more gradual in the fourth penetration part 17 having an opening diameter between the two. be able to. Thereby, the reflection loss of a high frequency signal can be reduced, and a transmission characteristic can be improved effectively.

  Further, in this case, a part of the upper end portion of the connector 3 (around the pin terminal 31) is not in direct contact with the base 1. Therefore, the thermal stress generated due to the difference in thermal expansion coefficient between the cylindrical member 32, the sealing material 33, and the base body 1 causes the upper end portion of the connector 3 and the base body 1 (the bottom portion of the second through portion 15 in the bottom view). The possibility of concentrating on the interface portion with the) is effectively reduced. This can also effectively reduce the possibility of mechanical destruction of the connector 3 and the like.

  The base 1 may have a part including the first bottom surface 11 and a part including the second bottom surface 12 as separate bodies. In other words, the part on which the wiring board 2 is mounted in the base 1 may be manufactured separately and then bonded to the other part. In this case, it is easy to adjust the difference in height of the second bottom surface 12 with respect to the first bottom surface 11.

  Further, in the base body 1, the portion including the first bottom surface 11 and the portion including the second bottom surface 12 may be integrated. In this case, it is not necessary to separately manufacture a portion including the second bottom surface 12 or to join it to another portion. Therefore, it is advantageous in terms of productivity and economy as the electronic component storage package 30 including the substrate 1. Further, the mechanical strength of the substrate 1 is also advantageous.

In the electronic component storage package 30 and the electronic device 40 of the embodiment, the third through portion 16 has a lower end located at the same height as the lower end of the cylindrical member 32, and the first portion 16a and the first portion 16a. It may further include a second portion 16b having a large opening diameter and positioned below the first portion 16a. At this time, the height position of the lower end of the cylindrical member 32 and the height position of the lower end of the first portion 16a may be the same.

  In this case, when the lower part of the pin terminal 31 and the lower end of the cylindrical member 32 are connected to the connection member for external connection in the third penetration portion 16, the length is perpendicular to the length direction of the pin terminal 31. It is possible to easily arrange and connect the connecting member in the direction to be connected. That is, for example, if the lower end of the pin terminal 31 is positioned at the lower end of the first portion 16a, there is no step between the lower end of the first portion 16a and the lower end of the pin terminal 31, and the lower end of the first portion 16a and the pin By pressing the upper surface of the connection member (the surface facing the connector 3) against the lower end of the terminal 31, the connection member can be easily connected in a direction orthogonal to the length direction of the pin terminal 31. Therefore, the electronic component storage package 30 and the electronic device 40 can be easily connected to the connection member for external connection. In this case, the second portion 16b can also function as a space for storing a connection member such as a flexible substrate.

  In the electronic component storage package 30 and the electronic device 40 of the embodiment, a portion of the lower surface of the base body 1 that is adjacent to the third through portion 16 is above a part of the outer edge side of the base body 1 above the other part. It may be located. In this case, a connecting member such as a flexible substrate can be projected outward from a portion where the lower surface of the outer substrate 1 is slightly raised. This protruding portion is easily connected to an external electric circuit. Thereby, for example, the stress generated when the connection member is connected to the external electric circuit can be reduced. Therefore, the electronic device 40 that is effective for improving reliability at the time of external connection can be obtained. Also, the electronic component storage package 30 in which the electronic device 40 can be easily manufactured can be obtained.

  The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention. For example, a separate auxiliary substrate may be inserted and fixed in the through hole 13 from the lower surface side of the substrate 1, and a plurality of first through portions 14 and second through portions 15 may be provided on the auxiliary substrate. The auxiliary substrate may be a flat plate-like member having a shape and size that can be accommodated in the through hole 13, for example. In this case, after the connector 3 is inserted and fixed in each of the plurality of second through portions 15 provided in the auxiliary base body, these can be joined together to the base body 1. Therefore, it is effective for improving the productivity and accuracy of the positional relationship between the plurality of connectors 3 (impedance matching thereby).

  Further, the base body 1 may have an opening 1b in a side wall portion or the like on the short side of the base body 1 having a rectangular shape in plan view. The opening 1b has, for example, a circular shape in a plan view facing the side surface (front surface) of the base 1. The opening 1b is located on one short side of the rectangular recess 1a in plan view as in the example shown in FIG. The opening 1b functions as a portion to be fixed through an optical signal connecting material (not shown) such as an optical fiber and a ferrule holding the optical fiber. If the optical signal connecting member is fixed so as to block the opening, the optical signal can be transmitted to and received from the electronic component 41. If the electronic component 41 is an LN element, an electrical signal (high frequency signal or the like) is transmitted / received to / from the outside via the wiring board 2 and the connector 3, and an optical signal to / from the outside is transmitted via the optical signal connecting material. Sending and receiving is done. As a result, an electronic device 40 for optical communication and the like effective for improving reliability and high-frequency signal transmission characteristics is formed.

1. ・ Base 1a ・ ・ Recess
11. First bottom
11a ・ ・ Mounting part
12. ・ Second bottom
13. ・ Through hole
14 ・ ・ First penetration
15. ・ Second penetrating part
16. Third penetration
16a ・ ・ 1st part
16b ... Second part
17 .. 4th penetration part 1b
21 ・ ・ Insulating substrate
22 ・ ・ Wiring conductor 3 ・ ・ Connector
31 ・ ・ Pin terminal
32 ・ ・ Cylindrical members
33 ・ ・ Encapsulant
30 ・ ・ Electronic component storage package
40 ・ ・ Electronic equipment
41 ・ ・ Electronic parts

Claims (7)

It has a top surface including a recess and a bottom surface opposite to the top surface, and the bottom of the recess is positioned above the first bottom surface including the electronic component mounting portion and the first bottom surface, and in plan view And a base having a second bottom surface adjacent to the first bottom surface and having a through hole penetrating from the second bottom surface to the lower surface;
An insulating substrate and a wiring conductor located on a surface of the insulating substrate; and a wiring substrate located on the second bottom surface in the vicinity of the through hole;
A pin terminal that penetrates the through-hole and has an upper portion connected to the wiring conductor, and a connector that includes a cylindrical member that surrounds and holds the pin terminal in plan view. However, from the opening on the second bottom surface side to the opening on the lower surface side, the first penetration portion, the second penetration portion having an opening diameter larger than that of the first penetration portion, and the opening diameter of the second penetration portion are sequentially provided. An electronic component storage package having a large third through portion, wherein the connector and the inner surface of the through hole are joined to each other in the second through portion.   2. The electronic component storage package according to claim 1, wherein an outer edge position of the second bottom surface opposite to the pin terminal is closer to the pin terminal than an outer edge position of the insulating substrate opposite to the pin terminal in a plan view. .   The first bottom surface is located below the upper end of the second through part, the through hole is located between the first through part and the second through part, and the first 3. The electronic component storage package according to claim 1, further comprising a fourth through portion having an opening diameter larger than that of the through portion and smaller than that of the second through portion.   4. The electronic component storage package according to claim 1, wherein the base includes a part including the first bottom surface and a part including the second bottom surface. A first portion having a lower end located at the same height as the lower end of the cylindrical body; and a third opening having a larger opening diameter than the first portion and located below the first portion. A second part that includes:
The electronic component storage package according to any one of claims 1 to 4, wherein a height position of a lower end of the cylindrical member is the same as a height position of a lower end of the first portion.   6. The part of the lower surface of the base that is adjacent to the third penetrating part is located above the other part in a part of the outer edge side of the base. 6. Item 1. An electronic component storage package according to item 1. The electronic component storage package according to any one of claims 1 to 6,
An electronic device comprising: an electronic component housed in the recess and electrically connected to the wiring conductor.

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