JP2017011059A - Packaging structure and package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging structure capable of reducing leakage amount of RF signals adjacent to signal terminals by increasing the surface pressure in an attachment plane between a housing and the package, and to provide a package.SOLUTION: A packaging structure of an HIC 1 includes: a package 12 which has a machined part 14 for screw-stopping formed in the vicinity of an RF signal terminal 11 for inputting and outputting high frequency signals in a plane in which the RF signal terminal 11; and a through hole 21 which is formed in a housing 2 for mounting the HIC1 corresponding to a tap 14. In the vicinity of the RF signal terminal 11, the package 12 is fixed to the housing 2 with a screw from the side in contact with the housing 2.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a mounting structure of an electronic component that inputs and outputs a high-frequency signal, such as a hybrid IC (Integrated Circuit: hereinafter, HIC) for high-frequency.

  For example, when an HIC that inputs and outputs a high-frequency signal by a signal pin is mounted on a housing, slight unevenness may occur depending on the surface accuracy of a package that forms the HIC. For this reason, there is a slight gap between the housing and the package around the signal pins, and a high-frequency signal (also referred to as an RF (Radio Frequency) signal) may leak.

  In order to solve such a problem, for example, in Patent Document 1, a mounting screw is placed on an upper surface of an IC (Integrated Circuit) package, and the mounting screws are arranged on four sides of the mounting bracket that are separated from the end surface of the IC package. For example, it is disclosed that the mounting bracket is fastened to the mounting surface of the housing housing. Further, it is disclosed that the periphery of the signal pin of the IC package is a protrusion, and a countersunk hole is provided at a corresponding position on the mounting surface of the housing housing.

  Further, in Patent Document 2, a screw is inserted from the solder surface side of the rectifier circuit board into an insertion hole provided in the rectifier circuit board and an insertion hole provided in the bridge diode. It is disclosed that the bridge diode is screwed to the heat radiating plate by screwing.

JP-A-10-012758 JP 2008-271756 A

  However, in the mounting structure of Patent Document 1, the mounting pins are fastened to the mounting surface of the housing housing by the mounting screws arranged on the four sides away from the end surface of the IC package, so that the signal pins of the IC package are separated from the mounting screws. If the mounting surface is not flat, the surface pressure between the IC and the housing may not be sufficiently strong around the signal terminal. In the mounting structure of Patent Document 2, the signal pin of the diode and the insertion hole are separated from each other, and the surface pressure between the diode and the heat sink may not be sufficiently strong around the signal terminal.

  If the mounting surface with the housing is flat without protruding around the signal terminal of the electronic component, the surface pressure between the electronic component and the housing is sufficiently strong around the signal terminal depending on the surface accuracy of the mounting surface. Otherwise, there is a risk of RF signal leakage. Patent Documents 1 and 2 do not disclose a mounting structure that can suppress the leakage amount of the RF signal around the signal terminal when the mounting surface is flat.

  An object of the present invention is to provide a mounting structure and a package that can increase the surface pressure of the mounting surface between the housing and the package and can suppress the leakage amount of the RF signal around the signal terminal.

  In the mounting structure of the present invention, a package in which a processing portion for screwing is provided around the signal terminal on a protruding surface of a signal terminal that inputs and outputs a high-frequency signal, and an electronic component is mounted corresponding to the processing portion. A through hole provided in the mounting target, and screwing the package from the surface side in contact with the mounting target around the signal terminal.

  The package of the present invention has a signal terminal for inputting and outputting a high-frequency signal, and a structure in which a processing portion for screwing is provided around the signal terminal on the surface from which the signal terminal protrudes.

  According to the present invention, the surface pressure between the package and the housing can be increased around the signal terminal, and the leakage amount of the RF signal around the signal terminal can be suppressed.

FIG. 1 is a plan view of the HIC according to the first embodiment of the present invention as viewed from the RF signal terminal side. FIG. 2 is a cross-sectional view showing a configuration in which the HIC according to the first embodiment of the present invention is mounted on a housing. FIG. 3 is a diagram showing a configuration of a modified example of the package unit of FIG. FIG. 4 is a diagram showing a configuration of the second exemplary embodiment of the present invention.

  Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of the HIC according to the first embodiment of the present invention as viewed from the RF signal terminal side.

  The HIC 1 inputs or outputs a high frequency signal. The HIC 1 is not limited to a hybrid IC as long as it inputs or outputs a high-frequency signal.

  As shown in FIG. 1, the HIC 1 includes an input side RF signal terminal 11 a and an output side RF signal terminal 11 b, and a package 12.

  The input side RF signal terminal 11 a and the output side RF signal terminal 11 b are electrically connected to an electronic circuit housed in the package 12. The input-side RF signal terminal 11a inputs a high-frequency signal generated outside to an electronic circuit accommodated in the package 12. The output side RF signal terminal 11b outputs a high frequency signal generated in an electronic circuit accommodated in the package 12 to the outside. In the following description, when there is no need to separately describe the input side RF signal terminal 11a and the output side RF signal terminal 11b for the input side and the output side, the input side RF signal terminal 11a and the output side RF signal terminal 11b will be described as an RF signal terminal 11 comprehensively.

  The package 12 is formed in a rectangular plate shape. The package 12 is configured by, for example, a resin molded product.

  Further, as shown in FIG. 1, the package 12 of the HIC 1 of the present embodiment is provided with through holes 13 around the RF signal terminal 11 at two locations, for example, with the RF signal terminal 11 interposed therebetween. The through hole 13 is used when the HIC 1 is mounted on the housing 2 with the screw 3.

  Further, in the HIC 1 of the present embodiment, as shown in FIG. 1, on the surface of the RF signal terminal 11 where the RF signal terminal 11 of the package 12 protrudes, a processing portion for screwing is provided around the RF signal terminal 11. 14. For example, a tap is provided. The distance between the processed portion 14 and the RF signal terminal 11 is set so that the screw 3 can be disposed outside a through hole 22 provided in the casing 2 described later corresponding to the RF signal terminal 11. Further, the processed portion 14 is provided at an angle shifted from an angle at which the through hole 13 is formed with the RF signal terminal 11 as a center, for example. For example, as shown in FIG. 1, when two through holes 13 are provided and two processed portions 14 are disposed, the through holes 13 may be provided in a direction perpendicular to the through holes 13. In addition, the processing unit 14 has a distance from the processing unit 14 to the RF signal terminal 11 so that the screw 3 can be disposed around the through-hole 22 around the RF signal terminal 11 and the casing 2 can be sufficiently pressed. May be the same. It is desirable that the processed portion 14 does not penetrate the package 12 and has a length equal to or larger than the diameter of the screw 3.

  FIG. 2 is a cross-sectional view showing a configuration in which the HIC according to the first embodiment of the present invention is mounted on a housing.

  A through hole 13 is provided in the package 12 of the HIC 1, and a processing portion 14 for fixing a screw, for example, a tap is provided in the housing 2 at a position corresponding to the through hole 13, and the HIC 1 is provided around the RF signal terminal 11. Mount on the body 2 with screws. At the same time, a processing portion 14 is provided on the back surface in contact with the housing 2 and around the RF signal terminal 11, and a through hole 21 is provided in the housing 2 corresponding to the processing portion 14. The HIC 1 is also screwed to the housing 2 from the housing side.

  The package portion 12 may have a structure in which the entire thickness of the package 12 of the HIC 1 is increased as shown in FIG. The package 12 may have a partially thick structure.

  An individual component 15 is accommodated on the surface of the package portion 12 opposite to the housing-side surface.

  Next, the configuration of a modification of the package will be described. FIG. 3 is a diagram showing a configuration of a modified example of the package. As shown in FIG. 3, the package 16 is thickened at the periphery of the signal terminal 11 to ensure the length of the processed portion 14, and the thickness of the package 16 is reduced at the portion other than the periphery of the signal terminal 11. It is a modified example.

  Alternatively, the individual component 15 accommodated in the package 16 at the periphery of the signal terminal 11 may be a short component, and the surface of the package 16 on the side where the individual component 15 is accommodated may be partially raised. Then, the surface of the package 16 other than the periphery of the signal terminal 11 is partially lowered on the side where the individual component 15 is accommodated so that the individual component 15 is tall enough to have the top surface of the individual component 15 approximately equal in height. It may be an electrical component. And it is good also as a structure which provides the process part 14 in the location where the peripheral part of the signal terminal 11 was raised.

  As described above, according to the first embodiment, the projecting surface of the RF signal terminal 11 that inputs and outputs the high-frequency signal of the HIC 1 is flat, and the process for screwing around the RF signal terminal 11 on this surface is performed. A portion 14 is provided, and the package 12 is screwed to the housing 2 from the back side in contact with the housing 2 around the RF signal terminal 11. By adopting such a mounting structure, the surface pressure between the package 12 and the housing 2 is increased, so that the contact between the periphery of the RF signal terminal 11 and the housing 2 is good, and the periphery of the RF signal terminal 11 and the housing are There is no gap between the bodies 2. As a result, an RF performance improvement effect such as suppression of the amount of signal (radio wave) leakage can be expected.

  Next, a second embodiment will be described. FIG. 4 is a plan view of the HIC according to the second embodiment of the present invention as viewed from the RF signal terminal side. The HIC 4 of this embodiment is different from that of the first embodiment in that only a processing portion 14 for screwing, for example, a tap is provided around the RF signal terminal 11 and no through hole is provided. The number of the processing parts 14 for screwing from the side of the surface in contact with the housing of the package 12 of this embodiment may be three around one RF signal terminal 11 as shown in FIG. As shown in FIG. 4, the left and right three processed portions 14 may be arranged symmetrically with respect to the center line of the package 12. The distances from the three processed portions 14 to the RF signal terminal 11 may be the same. Similar to the first embodiment, the distance between the processed portion 14 and the RF signal terminal 11 is set so that the screw 3 can be disposed outside the through hole 22 provided in the housing 2 corresponding to the RF signal terminal 11. The Further, the processed portion 14 is provided at an angle shifted from an angle at which the through hole 13 is formed with the RF signal terminal 11 as a center, for example. For example, as shown in FIG. 1, when two through holes 13 are provided and two processed portions 14 are disposed, the through holes 13 may be provided in a direction perpendicular to the through holes 13. In addition, the processing unit 14 has a distance from the processing unit 14 to the RF signal terminal 11 so that the screw 3 can be disposed around the through-hole 22 around the RF signal terminal 11 and the casing 2 can be sufficiently pressed. May be the same. Note that the number of processed portions 14 may be three or more.

  According to the present embodiment, since the surface pressure between the package 12 and the housing 2 is increased by screwing at three or more locations near the periphery of the RF signal terminal 11, the periphery of the RF signal terminal 11 and the housing 2. And the gap between the periphery of the RF signal terminal 11 and the housing 2 is eliminated. As a result, an RF performance improvement effect such as suppression of the amount of signal (radio wave) leakage can be expected.

  Note that the HIC 1 can be applied not only to a hybrid IC with a signal terminal used in an apparatus using a microwave but also to all hybrid ICs with a signal terminal used for other high-frequency applications.

  While the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

  For example, in the above embodiment, the example in which the processing portion 14 for screwing provided in the peripheral portion of the RF signal terminal 11 is a tap has been described, but the present invention is not limited to this. The processing portion 14 for screwing may be, for example, a hole or groove that is not threaded. In this case, the HIC 1 may be screwed to the housing 2 using a tapping screw. Moreover, the processing part 14 for screwing may be a screwed pin. In this case, the HIC 1 may be screwed to the housing 2 using a nut.

  The present invention can be applied to a hybrid IC having a signal terminal for inputting / outputting microwave communication and other high-frequency signals, and a device using the hybrid IC.

1, 4 HIC
2 Housing 3 Screw 11 RF signal terminal 12, 16 Package 13, 21 Through hole 14 Processed part 15 Individual parts

Claims (5)

A package in which a processing portion for screwing is provided around the signal terminal on the protruding surface of the signal terminal for inputting and outputting a high-frequency signal;
A through hole provided in a mounting target for mounting an electronic component corresponding to the processed portion;
Have
A mounting structure in which the package is screwed from the side in contact with the mounting target around the signal terminal. The package further has a through hole,
The mounting target further has a processing part for screwing corresponding to the through hole of the package,
The mounting structure according to claim 1, wherein the package is screwed to the mounting target from the package side around the signal terminal.   The mounting structure according to claim 1, wherein the processing portion provided around the signal terminal is a tap, does not penetrate the package, and has a length equal to or greater than a screw diameter of the tap. The mounting structure according to claim 1, wherein the package has a partially thick structure around the signal terminal. A signal terminal for inputting and outputting a high-frequency signal;
A structure in which a processing portion for screwing is provided around the signal terminal on the protruding surface of the signal terminal;
Having a package.

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