JP2019028044A - 磁気センサ試験装置 - Google Patents
磁気センサ試験装置 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0023—Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/007—Environmental aspects, e.g. temperature variations, radiation, stray fields
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/035—Measuring direction or magnitude of magnetic fields or magnetic flux using superconductive devices
- G01R33/0354—SQUIDS
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Abstract
Description
[2]上記発明において、制御部は、前記熱及び前記磁場を変化させた状態で前記磁気センサを試験してもよい。
[3]上記発明において、温調器は、第1冷媒を流す第1流路と、前記第1冷媒と温度が異なる第2冷媒を流す第2流路を有し、制御部は、前記第1冷媒と前記第2冷媒の混合比を制御することで前記磁気センサの温度を設定してもよい。
[4]上記発明において、温調器は、前記磁気センサの主面に対して熱を加え、電磁石は、前記磁気センサの主面の周囲に設けられてもよい。
[5]上記発明において、磁気センサに接続されるソケットを備え、複数の前記ソケットは、前記磁気センサと電気的に接続する接続面をそれぞれ有し、各接続面が平面上に並ぶように、配置されており、温調器は、前記接続面の上方又は下方から前記磁気センサに向けて熱を加えてもよい。
[6]上記発明において、温調器は、前記磁気センサの主面に接触してもよい。
[7]上記発明において、電磁石は、コア、前記コアに巻かれる主コイル、及び、前記磁場を補正するための補正用コイルを有してもよい。
[8]上記発明において、磁場を測定する磁場測定用センサを備え、制御部は、前記磁場測定用センサにより測定された磁場に基づき、前記補正用コイルへの入力電流を制御してもよい。
[9]上記発明において、制御部は、磁場測定センサで測定された磁場に応じて前記補正用コイルへの入力電流パルスを制御してもよい。
2 蓋
3а〜3d 冷媒管
11、12、13、14 試験機構
20 ソケット
30 温調器
40 温調器
50 電磁石
51 コア
52 主コイル
53 補正用コイル
60 電磁石
61 コア
62 主コイル
63 補正用コイル
71、72 磁場測定用センサ
72 センサ
80 コントローラ
81 磁場制御部
82 温度制御部
83 試験部
100 磁気センサ試験装置
200 磁気センサ
Claims (9)
- 磁気センサに対して磁場を印加する電磁石と、
前記磁気センサに対して局所的に熱を加えて、前記磁気センサの温度を調整する温調器と、
前記電磁石及び前記温調器を制御する制御部とを備え、
前記制御部は、前記温調器により前記磁気センサに熱を加えつつ、前記電磁石により前記磁場を前記磁気センサに印加した状態で、前記磁気センサを試験する磁気センサ試験装置。 - 前記制御部は、前記熱及び前記磁場を変化させた状態で前記磁気センサを試験する請求項1記載の磁気センサ試験装置。
- 前記温調器は、第1冷媒を流す第1流路と、前記第1冷媒と温度が異なる第2冷媒を流す第2流路を有し、
前記制御部は、前記第1冷媒と前記第2冷媒の混合比を制御することで前記磁気センサの温度を調整する請求項1又は2記載の磁気センサ試験装置。 - 前記温調器は、前記磁気センサの主面に対して熱を加え、
前記電磁石は、前記磁気センサの主面の周囲に設けられている請求項1〜3のいずれかに記載の磁気センサ試験装置。 - 前記磁気センサに接続されるソケットを備え、
複数の前記ソケットは、前記磁気センサと電気的に接続する接続面をそれぞれ有し、各接続面が平面上に並ぶように、配置されており、
前記温調器は、前記接続面の上方又は下方から前記磁気センサに向けて熱を加える請求項1〜4のいずれかに記載の磁気センサ試験装置。 - 前記温調器は、前記磁気センサの主面に接触している請求項1〜5のいずれかに記載の磁気センサ試験装置。
- 前記電磁石は、コア、前記コアに巻かれる主コイル、及び、前記磁場を補正するための補正用コイルを有する請求項1〜6のいずれかに記載の磁気センサ試験装置。
- 前記磁場を測定する磁場測定用センサを備え、
前記制御部は、
前記磁場測定用センサにより測定された磁場に基づき、前記補正用コイルへの入力電流を制御する請求項7記載の磁気センサ試験装置。 - 前記制御部は、
前記磁場測定用センサで測定された磁場に応じて前記補正用コイルへの入力電流パルスを制御する
請求項7記載の磁気センサ試験装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017151260A JP6948182B2 (ja) | 2017-08-04 | 2017-08-04 | 磁気センサ試験装置 |
KR1020180076841A KR102406272B1 (ko) | 2017-08-04 | 2018-07-03 | 자기 센서 시험 장치 |
CN201810770844.2A CN109387800B (zh) | 2017-08-04 | 2018-07-13 | 磁传感器试验装置 |
US16/043,396 US10823788B2 (en) | 2017-08-04 | 2018-07-24 | Magnetic sensor testing device |
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JP2017151260A JP6948182B2 (ja) | 2017-08-04 | 2017-08-04 | 磁気センサ試験装置 |
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JP2019028044A true JP2019028044A (ja) | 2019-02-21 |
JP6948182B2 JP6948182B2 (ja) | 2021-10-13 |
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JP (1) | JP6948182B2 (ja) |
KR (1) | KR102406272B1 (ja) |
CN (1) | CN109387800B (ja) |
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JP2022123649A (ja) * | 2021-02-12 | 2022-08-24 | 株式会社アドバンテスト | 磁場発生器の制御装置、試験装置、及び磁場制御方法 |
KR20220126509A (ko) * | 2021-03-09 | 2022-09-16 | 엘에스일렉트릭(주) | 테스트 장치 |
JP2023136130A (ja) * | 2022-03-16 | 2023-09-29 | 株式会社アドバンテスト | 温度調整装置、電子部品ハンドリング装置、及び、電子部品試験装置 |
KR20240070853A (ko) * | 2022-11-15 | 2024-05-22 | 한국표준과학연구원 | 자기장 측정 장치용 냉매 저장 장치 |
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- 2018-07-03 KR KR1020180076841A patent/KR102406272B1/ko active IP Right Grant
- 2018-07-13 CN CN201810770844.2A patent/CN109387800B/zh active Active
- 2018-07-24 US US16/043,396 patent/US10823788B2/en active Active
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JPS63275972A (ja) * | 1987-05-07 | 1988-11-14 | Nikon Corp | 磁気抵抗効果素子の評価方法及びそれに使用される装置 |
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Publication number | Publication date |
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CN109387800B (zh) | 2022-03-01 |
JP6948182B2 (ja) | 2021-10-13 |
KR20190015094A (ko) | 2019-02-13 |
US20190041470A1 (en) | 2019-02-07 |
CN109387800A (zh) | 2019-02-26 |
KR102406272B1 (ko) | 2022-06-10 |
US10823788B2 (en) | 2020-11-03 |
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