JP2019023321A - 導電性細線の形成方法 - Google Patents

導電性細線の形成方法 Download PDF

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Publication number
JP2019023321A
JP2019023321A JP2015246519A JP2015246519A JP2019023321A JP 2019023321 A JP2019023321 A JP 2019023321A JP 2015246519 A JP2015246519 A JP 2015246519A JP 2015246519 A JP2015246519 A JP 2015246519A JP 2019023321 A JP2019023321 A JP 2019023321A
Authority
JP
Japan
Prior art keywords
line
metal layer
line segment
forming
thin wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015246519A
Other languages
English (en)
Japanese (ja)
Inventor
大屋　秀信
Hidenobu Oya
秀信 大屋
圭一郎 鈴木
Keiichiro Suzuki
圭一郎 鈴木
正好 山内
Masayoshi Yamauchi
正好 山内
小俣　猛憲
Takenori Omata
猛憲 小俣
直人 新妻
Naoto NIIZUMA
直人 新妻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP2015246519A priority Critical patent/JP2019023321A/ja
Priority to PCT/JP2016/087031 priority patent/WO2017104652A1/fr
Publication of JP2019023321A publication Critical patent/JP2019023321A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
JP2015246519A 2015-12-17 2015-12-17 導電性細線の形成方法 Pending JP2019023321A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015246519A JP2019023321A (ja) 2015-12-17 2015-12-17 導電性細線の形成方法
PCT/JP2016/087031 WO2017104652A1 (fr) 2015-12-17 2016-12-13 Procédé de formation de fil fin conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015246519A JP2019023321A (ja) 2015-12-17 2015-12-17 導電性細線の形成方法

Publications (1)

Publication Number Publication Date
JP2019023321A true JP2019023321A (ja) 2019-02-14

Family

ID=59056649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015246519A Pending JP2019023321A (ja) 2015-12-17 2015-12-17 導電性細線の形成方法

Country Status (2)

Country Link
JP (1) JP2019023321A (fr)
WO (1) WO2017104652A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6683117B2 (ja) * 2016-12-16 2020-04-15 コニカミノルタ株式会社 細線パターン形成方法及び細線パターン形成装置
JP6804574B2 (ja) * 2019-01-22 2020-12-23 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
JP6804597B1 (ja) * 2019-08-01 2020-12-23 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0434914A (ja) * 1990-05-31 1992-02-05 Nippon Oil & Fats Co Ltd 導体パタンのトリミング方法
JPH06169149A (ja) * 1992-06-04 1994-06-14 Fujitsu Ltd 基板修正装置及び方法
JP2005142420A (ja) * 2003-11-07 2005-06-02 Konica Minolta Holdings Inc 導電パターンの形成方法
CN105934802B (zh) * 2014-01-28 2018-04-17 柯尼卡美能达株式会社 导电性图案、带导电性图案的基材、带导电性图案的基材的制造方法、在表面具有导电性图案的结构体及该结构体的制造方法

Also Published As

Publication number Publication date
WO2017104652A1 (fr) 2017-06-22

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