JP2019013944A5 - - Google Patents
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- Publication number
- JP2019013944A5 JP2019013944A5 JP2017131925A JP2017131925A JP2019013944A5 JP 2019013944 A5 JP2019013944 A5 JP 2019013944A5 JP 2017131925 A JP2017131925 A JP 2017131925A JP 2017131925 A JP2017131925 A JP 2017131925A JP 2019013944 A5 JP2019013944 A5 JP 2019013944A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- tin
- connection pad
- based solder
- nickel layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017131925A JP7041477B2 (ja) | 2017-07-05 | 2017-07-05 | 導電性ボール及び電子装置とそれらの製造方法 |
| US16/023,483 US10446512B2 (en) | 2017-07-05 | 2018-06-29 | Conductive ball and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017131925A JP7041477B2 (ja) | 2017-07-05 | 2017-07-05 | 導電性ボール及び電子装置とそれらの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019013944A JP2019013944A (ja) | 2019-01-31 |
| JP2019013944A5 true JP2019013944A5 (cg-RX-API-DMAC7.html) | 2020-04-09 |
| JP7041477B2 JP7041477B2 (ja) | 2022-03-24 |
Family
ID=64903850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017131925A Active JP7041477B2 (ja) | 2017-07-05 | 2017-07-05 | 導電性ボール及び電子装置とそれらの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10446512B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7041477B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10388627B1 (en) * | 2018-07-23 | 2019-08-20 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure and method of forming the same |
| US10347602B1 (en) * | 2018-07-23 | 2019-07-09 | Mikro Mesa Technology Co., Ltd. | Micro-bonding structure |
| AU2019436797B2 (en) * | 2019-03-25 | 2022-10-13 | Mitsubishi Electric Corporation | Printed wiring board and electronic device |
| KR102408109B1 (ko) * | 2020-10-07 | 2022-06-10 | 성균관대학교산학협력단 | 전기화학적 마이그레이션 방지를 위해 솔더를 무전해 팔라듐 및 니켈 도금 방법 |
| TWI849757B (zh) * | 2023-02-18 | 2024-07-21 | 矽品精密工業股份有限公司 | 電子封裝件及其封裝基板與製法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319994A (ja) * | 2000-02-29 | 2001-11-16 | Allied Material Corp | 半導体パッケージとその製造方法 |
| TWI224837B (en) * | 2003-07-10 | 2004-12-01 | Advanced Semiconductor Eng | Ball grid array package substrate and method for manufacturing the same |
| JP2007075856A (ja) * | 2005-09-14 | 2007-03-29 | Nippon Steel Materials Co Ltd | Ｃｕコアボール |
| WO2009051181A1 (ja) * | 2007-10-19 | 2009-04-23 | Nihon Superior Sha Co., Ltd. | 無鉛はんだ合金 |
| JP4831502B2 (ja) * | 2008-09-25 | 2011-12-07 | 日立金属株式会社 | 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品 |
| JP6136690B2 (ja) * | 2012-08-01 | 2017-05-31 | 三菱マテリアル株式会社 | ハンダペースト |
| JP5967316B2 (ja) * | 2013-11-05 | 2016-08-24 | 千住金属工業株式会社 | Ｃｕ核ボール、はんだペースト、フォームはんだ及びはんだ継手 |
| JP7014535B2 (ja) * | 2017-07-07 | 2022-02-01 | 新光電気工業株式会社 | 導電性ボール及び電子装置とそれらの製造方法 |
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2017
- 2017-07-05 JP JP2017131925A patent/JP7041477B2/ja active Active
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2018
- 2018-06-29 US US16/023,483 patent/US10446512B2/en active Active