JP2019013960A5 - - Google Patents

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Publication number
JP2019013960A5
JP2019013960A5 JP2017133267A JP2017133267A JP2019013960A5 JP 2019013960 A5 JP2019013960 A5 JP 2019013960A5 JP 2017133267 A JP2017133267 A JP 2017133267A JP 2017133267 A JP2017133267 A JP 2017133267A JP 2019013960 A5 JP2019013960 A5 JP 2019013960A5
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JP
Japan
Prior art keywords
tin
copper
layer
connection pad
based solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017133267A
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English (en)
Japanese (ja)
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JP7014535B2 (ja
JP2019013960A (ja
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Priority to JP2017133267A priority Critical patent/JP7014535B2/ja
Priority claimed from JP2017133267A external-priority patent/JP7014535B2/ja
Priority to US16/023,500 priority patent/US10446513B2/en
Publication of JP2019013960A publication Critical patent/JP2019013960A/ja
Publication of JP2019013960A5 publication Critical patent/JP2019013960A5/ja
Application granted granted Critical
Publication of JP7014535B2 publication Critical patent/JP7014535B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017133267A 2017-07-07 2017-07-07 導電性ボール及び電子装置とそれらの製造方法 Active JP7014535B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017133267A JP7014535B2 (ja) 2017-07-07 2017-07-07 導電性ボール及び電子装置とそれらの製造方法
US16/023,500 US10446513B2 (en) 2017-07-07 2018-06-29 Conductive ball having a tin-based solder covering an outer surface of the copper ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017133267A JP7014535B2 (ja) 2017-07-07 2017-07-07 導電性ボール及び電子装置とそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2019013960A JP2019013960A (ja) 2019-01-31
JP2019013960A5 true JP2019013960A5 (cg-RX-API-DMAC7.html) 2020-04-09
JP7014535B2 JP7014535B2 (ja) 2022-02-01

Family

ID=64903406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017133267A Active JP7014535B2 (ja) 2017-07-07 2017-07-07 導電性ボール及び電子装置とそれらの製造方法

Country Status (2)

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US (1) US10446513B2 (cg-RX-API-DMAC7.html)
JP (1) JP7014535B2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7041477B2 (ja) * 2017-07-05 2022-03-24 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法
US11145614B2 (en) * 2019-10-18 2021-10-12 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacture
KR102461313B1 (ko) * 2020-05-19 2022-11-01 엠케이전자 주식회사 리버스 리플로우용 심재를 이용한 반도체 패키지
US12313478B2 (en) * 2021-10-01 2025-05-27 Sensitronics, LLC Low drift force sensor with capacitive capability
JP2024026932A (ja) * 2022-08-16 2024-02-29 日立Astemo株式会社 電子装置、電子装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007075856A (ja) 2005-09-14 2007-03-29 Nippon Steel Materials Co Ltd Ｃｕコアボール
WO2009051181A1 (ja) 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
JP4831502B2 (ja) 2008-09-25 2011-12-07 日立金属株式会社 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品
JP2013031864A (ja) 2011-08-01 2013-02-14 Hitachi Metals Ltd はんだボールおよびはんだボールを用いた半導体装置
JP2015072996A (ja) 2013-10-02 2015-04-16 新光電気工業株式会社 半導体装置
JP2015186826A (ja) 2015-06-05 2015-10-29 日立金属株式会社 はんだボールおよび半導体装置
TWI637465B (zh) * 2017-06-03 2018-10-01 Siliconware Precision Industries Co., Ltd. 電子封裝件及其製法

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