JP2019012782A5

JP2019012782A5 -

Info

Publication number: JP2019012782A5
Application number: JP2017129099A
Authority: JP
Filing date: 2017-06-30
Publication date: 2020-02-06
Anticipated expiration: 2037-06-30

Description

本発明の別の局面に従えば、上述のワーク搬送装置を含む電子部品の製造装置が提供される。
本発明のさらに別の局面に従うワーク搬送方法は、切断により個片化されて配列された複数の個片化ワークである個片化ワーク群を第１の吸着面に一括して吸着するステップと、第１の吸着面に吸着された個片化ワーク群の一部を、第１の吸着面より面積の小さな第
２の吸着面に吸着するステップと、個片化ワーク群の一部以外の個片化ワークに対して、マーク検査工程およびフリップ工程のうちいずれか一つを実行する際に、並行して、個片化ワーク群の一部の個片化ワークに対して、個片化ワーク群の一部以外の個片化ワークに対して実行されている工程とは異なる工程を実行するステップとを含む。 According to another aspect of the present invention, there is provided an electronic component manufacturing apparatus including the above-described work transfer device.
A work transfer method according to yet another aspect of the present invention includes a step of collectively adsorbing a plurality of individualized works, which are a plurality of individualized works arranged by cutting into individual pieces, on a first suction surface. Adsorbing a part of the individualized work group adsorbed on the first adsorption surface to a second adsorption surface having a smaller area than the first adsorption surface; When one of the mark inspection process and the flip process is performed on an individualized work, the individualized work of a part of the individualized work group Performing a process different from the process performed on the individualized workpieces other than a part of the workpiece group.

図１２は、本実施の形態に従う製造装置１を構成するワーク搬送装置８の反転機構４０に装着される搬送ジグ４０８Ａ，４０８Ｂから金属ラバープレートを取り除いた状態を平面視した模式図である。図１２（Ａ）には、サブセットのレイアウトが同一である場合に用いられる搬送ジグ４０８Ａから金属ラバープレートを取り除いた状態を平面視した一例を示し、図１２（Ｂ）には、サブセットのレイアウトが同一ではない場合に用いられる搬送ジグ４０８Ｂから金属ラバープレートを取り除いた状態を平面視した一例を示す。 FIG. 12 is a schematic plan view showing a state in which metal rubber plates have been removed from transfer jigs 408A and 408B mounted on reversing mechanism 40 of work transfer device 8 constituting manufacturing apparatus 1 according to the present embodiment. FIG. 12A shows an example of a plan view of a state in which the metal rubber plate is removed from the transport jig 408A used when the layout of the subset is the same, and FIG. 12B shows the layout of the subset. An example of a plan view of a state in which the metal rubber plate is removed from the transport jig 408B used when the two are not the same is shown.

図１２（Ａ）および図１２（Ｂ）に示すように、金属プレート４０８１の共通した所定位置に複数の孔を形成するとともに、それぞれの孔を主吸着面４０１（主領域）および副吸着面４０２（副領域）にいずれと連通させるかを適宜設計するようにしてもよい。すなわち、金属プレート４０８１に設けられる孔の位置を共通化することで、搬送ジグ４０８Ａ，４０８Ｂの用途が異なっていても、空気圧回路と接続するインターフェイスを共通化できる。 As shown in FIGS. 12A and 12B, a plurality of holes are formed at a predetermined common position of a metal plate 4081, and each hole is formed by a main suction surface 401 (main area) and a sub suction surface 402. It may be designed appropriately to communicate with any of the (sub-regions). That is, by sharing the positions of the holes provided in the metal plate 4081, the interface connected to the pneumatic circuit can be shared even if the uses of the transport jigs 408A and 408B are different.

図１３は、本実施の形態に従う製造装置１を構成するワーク搬送装置８のインデックステーブル４１に装着される搬送ジグ４１８Ａ，４１８Ｂから金属ラバープレートを取り除いた状態を平面視した模式図である。図１３（Ａ）には、サブセットのレイアウトが同一である場合に用いられる搬送ジグ４１８Ａから金属ラバープレートを取り除いた状態を平面視した一例を示し、図１３（Ｂ）には、サブセットのレイアウトが同一ではない場合に用いられる搬送ジグ４１８Ｂから金属ラバープレートを取り除いた状態を平面視した一例を示す。 FIG. 13 is a schematic plan view showing a state in which the metal rubber plates have been removed from the transport jigs 418A and 418B mounted on the index table 41 of the work transport device 8 constituting the manufacturing apparatus 1 according to the present embodiment. FIG. 13A shows an example of a plan view of a state in which the metal rubber plate is removed from the transport jig 418A used when the layout of the subset is the same, and FIG. 13B shows the layout of the subset. An example of a plan view of a state where the metal rubber plate is removed from the transport jig 418B used when the two are not the same is shown.

図１３（Ａ）および図１３（Ｂ）に示すように、金属プレート４１８１の共通した所定位置に複数の孔を形成するとともに、それぞれの孔を主吸着面４１１（主領域）および副吸着面４１２（副領域）にいずれと連通させるかを適宜設計するようにしてもよい。すなわち、金属プレート４１８１に設けられる孔の位置を共通化することで、搬送ジグ４１８Ａ，４１８Ｂの用途が異なっていても、空気圧回路と接続するインターフェイスを共通化できる。 As shown in FIGS. 13 (A) and 13 (B), a plurality of holes are formed at a common predetermined position of a metal plate 4181, and each hole is formed by a main suction surface 411 (main area) and a sub suction surface 412. It may be designed appropriately to communicate with any of the (sub-regions). That is, by sharing the positions of the holes provided in the metal plate 4181, the interface connected to the pneumatic circuit can be shared even if the uses of the transport jigs 418A and 418B are different.

なお、本実施の形態に従うワーク搬送装置８においては、個片化ワーク６を吸着する手法として、空気圧回路を用いる例を示したが、このような構成に限定されず、任意の吸着方法を採用できる。例えば、個片化ワーク６を側面で把持する方法、個片化ワーク６を底面から支持する方法、磁気により生じる吸引力を利用する方法、および、静電気により生じる吸引力を利用する方法などを採用してもよい。 In the workpiece transfer device 8 according to the present embodiment, as a method for adsorbing singulation workpiece 6, an example of using a pneumatic circuit is not limited to such a configuration, any of the intake Chakuhoho Can be adopted. For example, a method of gripping the singulated work 6 on the side, a method of supporting the singulated work 6 from the bottom, a method of using a suction force generated by magnetism, a method of using a suction force generated by static electricity, and the like are adopted. May be.

１製造装置、２受入モジュール、３切断モジュール、４払出モジュール、５成形済基板、６個片化ワーク、８ワーク搬送装置、２１マガジン、３１供給レール、３２基板搬送機構、３３カットテーブル、３４切断機構、３５位置認識部、３６基板側クリーニング機構、３７整列機構、３８パッケージ搬送機構、３９樹脂側クリーニング機構、４０反転機構、４１インデックステーブル、４２移載機構、４３視覚検査機構、４４良品トレイ、４５不良品トレイ、４６トレイ供給機構、５０空気圧制御機構、５０Ａ，５０Ｂ，５０Ｃ空気圧回路、５１基板、５２封止樹脂、５４吸着源、５５負圧用主管、５６圧縮空気源、５７レギュレータ、５８正圧用主管、６０個片化ワーク群、１００制御部、１０２入力部、１０４出力部、１０６メインメモリ、１０８光学ドライブ、１０８Ａ記録媒体、１１０プロセッサ、１１２ネットワークインターフェイス、１１４サーボモータインターフェイス、１１５，１１７，１１８フィールドバス、１１６アクチュエータインターフェイス、１１９内部バス、１２０ＨＤＤ、１２２汎用ＯＳ、１２４リアルタイムＯＳ、１２６ＨＭＩプログラム、１２８制御プログラム、５１１，５１２，５１３，５１４，５３１，５３２，５３３，５３４，５５１，５５２，５５３，５５４電磁弁、１５２シリンダー、３４１スピンドル、３４２ブレード、３６１洗浄水噴霧部、３６２，３９２エアー噴射部、３８１，３８２吸着面、３８３，３８４，４０３，４０４，４１３，４１４制御ポート（配管）、３８５，３８６，４０５，４０６，４１５，４１６空間、３８７，４０７，４１７吸着孔、３８８，３８８Ａ，３８８Ｂ，４０８Ａ，４０８Ｂ，４１８Ａ，４１８Ｂ搬送ジグ、３８９，４０９，４１９
補強部材、３９１ブラシローラ、４０１，４１１主吸着面、４０２，４１２副吸着面、４３１，４３２カメラ、５０１，５０２，５０３，５０４，５０５，５０６支管、５２１，５２２，５２３，５２４，５４１，５４２，５４３，５４４，５６１，５６２，５６３，５６４メカバルブ、３８８１，４０８１，４１８１金属プレート、３８８２金属ラバープレート、３８８３，４０８３，４１８３Ｏリング、３８８４金属層、３８８５ラバー層。 DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus, 2 receiving module, 3 cutting module, 4 payout module, 5 molded substrate, 6 piece work, 8 work transfer device, 21 magazine, 31 supply rail, 32 substrate transfer mechanism, 33 cut table, 34 cutting Mechanism, 35 position recognition unit, 36 substrate-side cleaning mechanism, 37 alignment mechanism, 38 package transport mechanism, 39 resin-side cleaning mechanism, 40 inversion mechanism, 41 index table, 42 transfer mechanism, 43 visual inspection mechanism, 44 good product tray, 45 defective tray, 46 tray supply mechanism, 50 air pressure control mechanism, 50A, 50B, 50C pneumatic circuit, 51 substrate, 52 sealing resin, 54 suction source, 55 negative pressure main pipe, 56 compressed air source, 57 regulator, 58 positive Main pipe for pressure, 60 singulated work group, 100 control unit, 102 input unit, 104 Output unit, 106 main memory, 108 optical drive, 108A recording medium, 110 processor, 112 network interface, 114 servo motor interface, 115, 117, 118 field bus, 116 actuator interface, 119 internal bus, 120 HDD, 122 general-purpose OS, 124 Real-time OS, 126 HMI program, 128 control program , 5, 11 , 512 , 513 , 514 , 531 , 532 , 533 , 534 , 551 , 552 , 553 , 554 Solenoid valve, 152 cylinder, 341 spindle, 342 blade, 361 cleaning Water spray unit, 362, 392 Air injection unit, 381, 382 suction surface, 383, 384, 403, 404, 413, 414 Control port (piping), 385, 38 , 405,406,415,416 space, 387,407,417 suction holes, 388,388A, 388B, 4 08A, 408B, 4 18A, 418B conveying jig, 389,409,419
Reinforcement member, 391 brush roller, 401, 411 main suction surface, 402, 412 sub suction surface, 431, 432 camera, 501, 502, 503, 504, 505, 506 branch pipe, 521, 522, 523, 524, 541, 542 , 543, 544, 561, 562, 563, 564 mechanical valve, 3881, 4081, 4181 metal plate, 3882 metal rubber plate, 3883, 4083, 4183 O-ring, 3884 metal layer, 3885 rubber layer.

Claims

A workpiece transport device for transporting a plurality of singulated workpieces that are singulated by cutting,
A first suction device that collectively suctions a plurality of individualized work groups including a plurality of individualized works on a first suction surface;
A second suction surface having a second suction surface having an area smaller than that of the first suction surface, wherein a part of the individualized work group sucked by the first suction device is sucked by the second suction surface. And two suction devices,
The work transfer device, wherein the first suction device has a plurality of systems of suction circuits for performing suction in different regions of the first suction surface.

  The singulated work group is divided into a plurality of subsets, and at least one of the subsets is arranged with the plurality of singulated works in two directions intersecting each other,
  The second suction device, as a part of the individualized work group, collectively adsorbs the plurality of individualized works for each of the subsets,
  2. The work according to claim 1, wherein in the first suction device, the suction circuit is configured to be able to collectively suction and release a suction state of the plurality of individualized works for each subset. 3. Transport device.

3. The work transfer device according to claim 1, wherein the first suction device further includes a selection mechanism for selectively enabling the plurality of systems of suction circuits. 4.

The second suction device has two systems of suction circuits for independently enabling suction in each of the main region and the sub-region formed on the second suction surface. The work transfer device according to any one of claims 1 to 3 .

The second suction device, when the number of arrangement of the individualized work group is an odd number, at least one of the operations of suctioning the individualized work from the first suction device a plurality of times, The work transfer device according to claim 4 , wherein only the main area of the second suction surface is enabled.

The said 1st adsorption device has a 1st air sending-out circuit for sending out air to the said 1st adsorption surface side from the adsorption hole provided in the said 1st adsorption surface. 6. The work transfer device according to any one of 5 .

The said 2nd adsorption | suction apparatus has a 2nd air sending circuit for sending out air from the adsorption | suction surface provided in the said 2nd adsorption | suction surface to the said 2nd adsorption | suction surface. 7. The work transfer device according to any one of 6 .

The apparatus further includes a third suction device that collectively suctions the singulated workpieces suctioned by the second suction device on a third suction surface,
The third suction device has two suction circuits for independently enabling suction in each of the main area and the sub-area formed on the third suction surface. The work transfer device according to any one of claims 1 to 7 .

Including workpiece transfer device according to any one of claims 1-8, the electronic component manufacturing apparatus.

A step of collectively adsorbing a plurality of individualized work groups, which are a plurality of individualized works arranged by being cut into individual pieces by cutting, on the first suction surface;
Adsorbing a part of the individualized work group adsorbed on the first adsorption surface to a second adsorption surface having a smaller area than the first adsorption surface;
A mark inspection step and a flip test are performed on the individualized workpieces other than a part of the individualized workpiece group.
When performing any one of the singulation steps, in parallel, with respect to a part of the singulated work group, the singulation other than a part of the singulated work group is performed. Performing a process different from the process being performed on the workpiece.

  A step of collectively adsorbing a plurality of individualized work groups, which are a plurality of individualized works arranged by being cut into individual pieces by cutting, on the first suction surface;
  The singulated work group is divided into a plurality of subsets, and at least one of the subsets is arranged with the plurality of singulated works in each of two directions crossing each other, and is suctioned to the first suction surface. Collectively adhering the individualized works included in one of the subsets of the individualized work group to a second suction surface having an area smaller than the first suction surface;
  When performing any one of a mark inspection step and a flip step on an individualized work of a subset other than the subset sucked on the second suction surface, the second suction Performing a process different from the process performed on the individualized work of the subset other than the subset adsorbed on the second suction surface on the individualized work of the subset adsorbed on the surface; A work transfer method comprising:

The method according to claim 1, further comprising the step of selectively enabling a plurality of systems of suction circuits connected to different areas of the first suction surface in accordance with the suction of the individualized workpieces by the second suction surface. 12. The work transfer method according to 10 or 11.

A plurality of suction systems respectively connected to the main area and the sub-area formed on the second suction surface according to the number of arrangements of a part of the individualized work group sucked on the first suction surface. The method according to claim 10 , further comprising selectively activating a circuit.

When the arrangement number of a part of the individualized work group adsorbed on the first suction surface is an odd number, among a plurality of operations of adsorbing the individualized work on the second suction surface, 14. The work transfer method according to claim 13, wherein at least one operation further includes a step of validating only the main area of the second suction surface.

After the execution of the process on the singulated work sucked on the second suction surface is completed, the singulated work sucked on the second suction surface is collectively sucked on the third suction surface, and the predetermined work is determined in advance. Placing according to the rules set forth;
Selectively enabling a plurality of suction circuits connected to the main area and the sub-area formed on the third suction surface, respectively;
When the arrangement number of a part of the individualized work group adsorbed on the first suction surface is an odd number, among a plurality of operations of adsorbing the individualized work on the third suction surface, The method according to claim 14, wherein at least one operation further includes the step of validating only the main area of the third suction surface.

A method for manufacturing an electronic component, comprising the method for transporting a workpiece according to claim 10 .