KR102192278B1 - Workpiece conveyance device, device for manufacturing electronic component, workpiece conveyance method, and method for manufacturing electronic component - Google Patents

Abstract

There is provided a work conveying device for conveying a plurality of pieces of pieces arranged by cutting into pieces. The work conveying device has a first adsorption device for collectively adsorbing a group of pieces of work made of a plurality of pieced work on a first adsorption surface, and a second adsorption surface having an area smaller than that of the first adsorption surface. In addition, it includes a second adsorption device that adsorbs a part of the segmented work group adsorbed by the first adsorption device to the second adsorption surface. The first adsorption device has a plurality of adsorption circuits for adsorption in different regions of the first adsorption surface.

Description

A work conveyance device, an electronic component manufacturing device, a work conveyance method, and a manufacturing method of an electronic component TECHNICAL FIELD TECHNICAL FIELD The manufacturing method of WORKPIECE CONVEYANCE DEVICE, DEVICE FOR MANUFACTURING ELECTRONIC COMPONENT, WORKPIECE CONVEYANCE METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT}

The present invention provides a work conveying device for conveying individualized workpieces such as electronic parts, an electronic component manufacturing apparatus including the work conveying device, and a work conveying method for conveying individualized workpieces such as electronic components , And a method for manufacturing an electronic component including a method for conveying the work.

As a method of manufacturing electronic components such as IC (Integrated Circuit), a method of forming individual packages by cutting a molded substrate obtained by encapsulating a plurality of ICs with a resin material or the like is known.

For example, Japanese Patent Application Laid-Open No. 2002-214288 discloses a handler system for cutting a semiconductor package device that enables efficient production of a semiconductor package device. In the system disclosed in Japanese Patent Application Laid-Open No. 2002-214288, cleaning, drying, quality inspection, and the like are performed collectively for a plurality of separated semiconductor package devices.

Japanese Unexamined Patent Publication No. 2002-214288

As one of the countermeasures to improve productivity, there is a demand to increase the size of the molded substrate. By cutting the enlarged molded substrate, more packages can be formed at once. In general, for packages formed by cutting, it is necessary to perform post-treatment steps such as inspection, and by employing a large-sized molded substrate, an enlarged apparatus is also required for these post-treatment steps.

The present invention has been made for the purpose of solving such a new problem, and is to provide a mechanism and method capable of suppressing an enlargement of a manufacturing apparatus.

According to an aspect of the present invention, there is provided a work conveying apparatus for conveying a plurality of pieces of pieced pieces arranged by cutting into pieces. The work conveying device has a first adsorption device for collectively adsorbing a group of pieces of work made of a plurality of pieced work on a first adsorption surface, and a second adsorption surface having an area smaller than that of the first adsorption surface. In addition, it includes a second adsorption device that adsorbs a part of the segmented work group adsorbed by the first adsorption device to the second adsorption surface. The first adsorption device has a plurality of adsorption circuits for adsorption in different regions of the first adsorption surface.

Preferably, the first adsorption device further includes a selection mechanism for selectively validating the plurality of adsorption circuits.

Preferably, the second adsorption device has two systems of adsorption circuits for independently effective adsorption in each area with respect to the main area and the sub area formed on the second adsorption surface.

Preferably, the second adsorption device is an operation of adsorbing the pieced work from the first adsorption device a plurality of times when the number of arrangements of the pieced work group is odd, at least once is the second Only the main area of the suction surface is validated.

Preferably, the first adsorption device includes a reinforcing member disposed on the back side of the first adsorption surface.

Preferably, the second adsorption device includes a reinforcing member disposed on the back side of the second adsorption surface.

Preferably, the first adsorption device has a first air delivery circuit for discharging air from the adsorption hole provided on the first adsorption surface to the first adsorption surface side.

Preferably, the second adsorption device has a second air delivery circuit for sending air from the adsorption surface provided on the second adsorption face to the second adsorption face side.

Preferably, the work conveying device further includes a third adsorption device which collectively adsorbs the pieced work adsorbed by the second adsorption device on the third adsorption surface. The third adsorption device has two systems of adsorption circuits for independently effective adsorption in the respective areas with respect to the main area and the sub area formed on the third adsorption surface.

According to another aspect of the present invention, an electronic component manufacturing apparatus including the above-described work conveying device is provided.

A work conveying method according to another aspect of the present invention includes a step of collectively adsorbing a group of segmented workpieces, which are a plurality of segmented workpieces that are segmented and arranged by cutting, on a first suction surface, and a first suction surface. A step of adsorbing a part of the segmented work group adsorbed to the first suction surface to a second suction surface having an area smaller than that of the first suction surface, and a mark inspection step and a flip step for segmented work other than a part of the segmented work group When any one of them is executed, a step of executing a process different from the process being performed for the reorganized work other than a part of the reorganized work group is included in parallel with the reorganized work of a part of the reorganized work group. do.

Preferably, the work conveying method further includes a step of selectively validating a plurality of systems of adsorption circuits connected to different regions of the first adsorption surface in response to adsorption of the pieced work by the second adsorption surface. do.

Preferably, the work conveying method comprises a plurality of suction circuits each connected to the main region and the sub region formed on the second suction surface in response to the number of arrangements of a part of the segmented work group adsorbed on the first suction surface. It also includes a step of selectively validating a.

Preferably, the work conveying method is at least one of a plurality of operations of adsorbing the pieced work on the second adsorption surface when the number of arrangements of a part of the pieced work group adsorbed on the first adsorption surface is an odd number. The conference operation further includes a step of validating only the main region of the second suction surface.

Preferably, in the work conveying method, after completion of the process for the pieced work adsorbed on the second adsorption surface, the pieced work adsorbed on the second adsorption surface is collectively adsorbed on the third adsorption surface. , A step of arranging according to a predetermined rule, a step of selectively validating a plurality of systems of adsorption circuits respectively connected to the main and sub-area formed on the third adsorption surface, and the reorganization of adsorption on the first adsorption surface In the case where the number of arrangements of a part of the work group is odd, among the plurality of operations of adsorbing the pieced work to the third adsorption surface, at least one operation includes a step of validating only the main area of the third adsorption surface. Include.

According to another aspect of the present invention, there is provided a method for manufacturing an electronic component including the above-described method for conveying a work.

The above and other objects, features, aspects and advantages of this invention will become apparent from the following detailed description of the invention, which is understood in connection with the accompanying drawings.

Advantageous Effects of Invention According to the present invention, a mechanism and method capable of suppressing an increase in the size of a manufacturing apparatus can be provided.

1 is a schematic plan view showing the overall configuration of an electronic component manufacturing apparatus according to the present embodiment.
2A to 2C are schematic diagrams for explaining an outline of a cutting process in a cutting module constituting the electronic component manufacturing apparatus according to the present embodiment.
3A and 3B are schematic diagrams for explaining a step in a work conveying apparatus constituting the manufacturing apparatus according to the present embodiment.
4A and 4B are schematic diagrams for explaining a step in a work conveying apparatus constituting the manufacturing apparatus according to the present embodiment.
5A to 5C are schematic diagrams for explaining a step in a work conveying device constituting the manufacturing device according to the present embodiment.
6A to 6C are schematic diagrams for explaining a step in a work conveying apparatus constituting the manufacturing apparatus according to the present embodiment.
Fig. 7 is a schematic diagram for explaining a temporal relationship of each step in a work conveying device constituting the manufacturing device according to the present embodiment.
8A and 8B are diagrams for explaining a work conveyance in a case where the layout of a subset is the same in a work conveyance device constituting the manufacturing apparatus according to the present embodiment.
9A and 9B are diagrams for explaining a work conveyance in a case where the layout of a subset is not the same in a work conveyance apparatus constituting the manufacturing apparatus according to the present embodiment.
10 is a schematic diagram showing a cross-sectional structure of a conveying jig attached to a package conveying mechanism 38 of a work conveying device constituting the manufacturing apparatus according to the present embodiment.
11A and 11B are schematic diagrams in plan view of a state in which a metal rubber plate is removed from a conveying jig attached to a package conveying mechanism of a work conveying device constituting the manufacturing apparatus according to the present embodiment.
12A and 12B are schematic views in plan view showing a state in which a metal rubber plate is removed from a conveying jig attached to a reversing mechanism of a work conveying device constituting the manufacturing apparatus according to the present embodiment.
13A and 13B are schematic views in plan view showing a state in which a metal rubber plate is removed from a conveying jig mounted on an index table of a work conveying device constituting the manufacturing apparatus according to the present embodiment.
14A to 14C are schematic diagrams showing main parts of a pneumatic pressure control mechanism constituting the manufacturing apparatus according to the present embodiment.
15A and 15B are diagrams for explaining an example of a conveyance layout by a work conveyance device constituting the manufacturing apparatus according to the present embodiment.
16A and 16B are diagrams for explaining an example of a conveyance layout by a work conveyance device constituting the manufacturing apparatus according to the present embodiment.
17A and 17B are diagrams for explaining an example of a conveyance layout by a work conveyance device constituting the manufacturing apparatus according to the present embodiment.
Fig. 18 is a diagram for explaining an example of a conveyance layout by a work conveyance device constituting the manufacturing apparatus according to the present embodiment.
19 is a schematic diagram showing a hardware configuration of a control unit constituting the electronic component manufacturing apparatus according to the present embodiment and related components.

An embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same or equivalent parts in the drawings are denoted by the same reference numerals, and the description is not repeated. In an embodiment of the present invention, as a typical example of an electronic component manufacturing apparatus, a configuration for manufacturing an electronic component by singulating (reorganizing) a semiconductor product will be described. However, the technical scope of the present invention is not limited to such singulation of semiconductor products, and is effective for the manufacture of arbitrary electronic components.

<A. Overall configuration of manufacturing equipment>

First, an overall configuration of an electronic component manufacturing apparatus including a work conveying device according to the present embodiment will be described.

1 is a schematic plan view showing the overall configuration of an electronic component manufacturing apparatus 1 according to the present embodiment. Referring to Fig. 1, an electronic component manufacturing apparatus 1 (hereinafter, also simply referred to as "manufacturing apparatus 1") according to the present embodiment is after mounting a plurality of electronic components collectively on a substrate. , A plurality of packages (hereinafter, each package is “separated work 6”) by cutting a substrate sealed and molded using a resin or the like (hereinafter, also referred to as “formed substrate 5”) according to a specified cutting pattern. It is also referred to as ”). The manufacturing apparatus 1 performs a cleaning/drying process (cleaning process) and various inspection processes on the plurality of pieces of work 6 produced, and then rearranges it on a predetermined tray and then sends it to the next process. do.

In the manufacturing apparatus 1, since various processes are often executed collectively after being aligned and arranged, a plurality of individualized workpieces 6 subject to an arbitrary process are referred to as " It is sometimes called collectively as "reorganization work group".

More specifically, the manufacturing apparatus 1 includes a storage module 2, a cutting module 3, and a dispensing module 4. Each module's name corresponds to its function.

The housing module 2 is a part that receives the molded substrate 5 from a previous step, and passes the molded substrate 5 to the cutting module 3 at an appropriate timing. The cutting module 3 cuts the molded substrate 5 according to the designated cutting pattern. The dispensing module 4 rearranges a plurality of packages (a plurality of individualized workpieces 6) generated by cutting the molded substrate 5 in a designated tray according to a designated rule, and then sends it to the next process. do.

Typically, each module shown in Fig. 1 is individually assembled and then connected to each other to constitute the manufacturing apparatus 1. By employing such a module-by-module configuration, modules can be easily mounted and separated from each other. For this reason, it becomes easy to exchange modules and add modules afterwards. In addition, it is easy to modify the multiplexing of specific modules. The short circuit of the module may be made smaller or larger. It is not limited to a module structure, and the entire device may be configured integrally.

Hereinafter, each module will be described in more detail. In addition, for convenience of explanation, the left and right directions of the paper are referred to as "X direction", the vertical direction of the paper is referred to as "Y direction", and the vertical direction of the paper is referred to as "Z direction". In addition, the rotation in the XY plane is indicated by "θ".

In the storage module 2, a plurality of magazines 21 containing one or more molded substrates 5 are disposed. The molded substrate 5 housed in the magazine 21 is placed on the supply rail 31 of the cutting module 3 from the magazine 21 by an extrusion member (not shown) at a predetermined sequence and timing. do.

In addition to the supply rail 31, the cutting module 3 includes a substrate transfer mechanism 32, a cut table 33, a cutting mechanism 34, a position recognition unit 35, and a substrate-side cleaning mechanism ( 36), an alignment mechanism 37, a package conveyance mechanism 38, and a resin-side cleaning mechanism 39.

The substrate transfer mechanism 32 arranges the molded substrate 5 disposed on the supply rail 31 on the cut table 33. The cut table 33 is mechanically connected to a moving mechanism (not shown), and when the molded substrate 5 is disposed, it moves in the Y direction so as to approach the cutting mechanism 34. The cutting mechanism 34 has a spindle and a blade mechanically coupled to the spindle.

The alignment mechanism 37 recognizes the shape of the molded substrate 5 before cutting, and gives a correction value to the position command of the cutting mechanism 34, and the substrate transfer mechanism 32 and the package transfer mechanism 38 A correction value is applied to the transport position.

In the cutting process, according to the specified cutting pattern, the moving mechanism moves the cut table 33 (that is, the molded substrate 5 disposed on the cut table 33) in the Y direction and rotates θ, and the cutting mechanism The spindle of (34) moves in the X direction. By this linking operation, the blades of the cutting mechanism 34 pass over the molded substrate 5 according to the designated cutting pattern.

The position recognition unit 35 recognizes a cutting line (groove) after cutting in a cutting process, detects a width and an offset, and performs abnormality detection. Further, the position recognition unit 35 gives a position command to the movement mechanism and the cutting mechanism 34 in order to perform feedback on the next cutting.

When the cutting according to the cutting pattern is completed, the cut table 33 on which the plurality of pieced workpieces 6 are disposed is returned to the original position via the substrate side cleaning mechanism 36 and the alignment mechanism 37. . The substrate-side cleaning mechanism 36 cleans the substrate 51 side of the pieced workpiece 6. More specifically, for example, washing water is sprayed onto the substrate 51 side of the pieced work 6 and air is sprayed to dry the surface thereof.

2A to 2C are schematic diagrams illustrating an outline of a cutting process in the cutting module 3 constituting the electronic component manufacturing apparatus 1 according to the present embodiment.

In FIG. 2A, the segmentation process performed by the cutting mechanism 34 is shown. Each of the cutting mechanisms 34 has a spindle 341 and a blade 342 mechanically coupled to the spindle 341. The blade 342 is rotated by the spindle 341, and the spindle 341 is lowered to a position where the blade 342 can cut the molded substrate 5. Then, each of the cutting mechanisms 34 passes the cut table 33 supporting the molded substrate 5 to the blade cutting position. By repeating this, the molded substrate 5 disposed on the cut table 33 is cut, and a plurality of pieces of work 6 are generated. The molded substrate 5 typically has a substrate 51 and a sealing resin 52 formed on the substrate 51. A plurality of electronic components are mounted on the substrate 51. Further, the cutting target is not limited to the molded substrate 5, but may be a molded lead frame. The substrate or lead frame may be resin-sealed not only on one side but also on both sides (ie, the opposite side). Even in such a case, the subject of the present invention may be.

2B and 2C show a washing/drying process (cleaning process). The substrate-side cleaning mechanism 36 includes a washing water spray unit 361 and an air injection unit 362. In the washing process shown in FIG. 2B, the washing water spraying unit 361 sprays washing water on the plurality of individualized workpieces 6. In the drying process shown in FIG. 2C, the air injection unit 362 jets air to the plurality of pieces of work 6. Further, the washing water spray unit 361 may blow compressed air together with the washing water.

By the above processing, execution of the cutting process is completed. Subsequently, the dispensing process is executed. That is, a process of conveying the plurality of individualized workpieces 6 to the dispensing module 4 is executed.

Referring again to Fig. 1, the dispensing module 4 includes a reversing mechanism 40, an index table 41, a transfer mechanism 42, and a visual inspection mechanism ( 43), a good product tray 44, a defective product tray 45, and a tray supply mechanism 46.

When the execution of the cutting process is completed, the plurality of pieced workpieces 6 arranged on the cut table 33 are conveyed toward the reversing mechanism 40 by the package conveying mechanism 38. That is, the package conveyance mechanism 38 collectively adsorbs a plurality of pieced workpieces 6 arranged on the cut table 33, and moves toward the reversing mechanism 40 while maintaining the adsorption state. .

When the package transfer mechanism 38 conveys the plurality of pieced workpieces 6 toward the reversing mechanism 40, the resin-side cleaning mechanism 39 cleans the sealing resin 52 of the pieced piece 6 do.

The visual inspection mechanism 43 performs a mark inspection process on the individualized workpiece 6 in a state in which the package conveyance mechanism 38 has adsorbed the plurality of segmented workpieces 6, and the reversing mechanism 40 A package inspection process is performed in a state in which a plurality of pieced workpieces are adsorbed. Details of these inspection steps will be described later.

The reversing mechanism 40 receives the plurality of pieced workpieces 6 held by the package conveyance mechanism 38, rotates in the Y-axis direction, and then arranges them on the index table 41. The index table 41 is moved in the Y direction by a movement mechanism (not shown). The transfer mechanism 42 adsorbs a plurality of individualized workpieces 6 arranged on the index table 41 individually, and in response to individual inspection results by the visual inspection mechanism 43, the good product tray 44 or They are sequentially placed on the defective product tray 45. That is, the reorganized work 6 that passed the inspection by the visual inspection mechanism 43 is rearranged in the good product tray 44, and the defective article tray 45 does not pass the inspection by the visual inspection mechanism 43. The undivided work 6 is rearranged.

The good product tray 44 and the defective product tray 45 are carried out of the apparatus when a predetermined number of pieces of pieces 6 are arranged in alignment, respectively. The tray supply mechanism 46 supplies a new tray as the good product tray 44 or the defective product tray 45.

In the present embodiment, the substrate transfer mechanism 32, the package transfer mechanism 38, the reversing mechanism 40, the cut table 33, the index table 41, and the transfer mechanism 42 are respectively molded. The substrate 5 or the pieced workpiece 6 is adsorbed, and as a means for realizing this adsorption, a suction force using a vacuum generator (ejector or vacuum pump) is used. The manufacturing apparatus 1 is provided with a pneumatic pressure control mechanism 50 including an ejector serving as an adsorption source and necessary piping.

In addition, each process in the manufacturing apparatus 1 is controlled by the control part 100. The hardware configuration and software configuration of the control unit 100 will be described later.

Among the constituent elements of the manufacturing apparatus 1 shown in FIG. 1, the workpiece conveying apparatus 8 according to the present embodiment is divided into pieces by cutting and conveys a plurality of divided pieces 6 arranged. It is considerable. Specifically, the work conveying device 8 is mainly a package conveying mechanism 38, a resin-side cleaning mechanism 39, a reversing mechanism 40, an index table 41, and a transfer mechanism 42. Wow, it includes a visual inspection mechanism 43. However, it is not limited to such a configuration, and arbitrary configurations and arrangements may be adopted in accordance with the size of the molded substrate 5 or required specifications.

The arrangement position of the control unit 100 and the pneumatic pressure control mechanism 50 is not particularly limited, and may be arranged at an arbitrary position in response to equipment requirements or the like.

<B. Process in the work conveying device 8>

Next, a process in the work conveying device 8 constituting the manufacturing device 1 according to the present embodiment will be described. In addition, a method of manufacturing an electronic component including a work conveyance method using the work conveyance device 8 according to the present embodiment and a work conveyance method will be described.

The work conveying device 8 collectively adsorbs and accepts a group of pieces of pieces of pieces 6 generated in the cutting step. However, in the work conveyance device 8, the group of individualized work pieces which are collectively adsorbed and received is divided and processed. That is, by partially processing the segmented work group generated by the cutting process, the length in the X direction required for the processing can be reduced compared to the case of collective processing. By adopting such a configuration, it is possible to suppress an increase in the size of the device. Hereinafter, the process in the work conveyance device 8 is described in detail.

3A, 3B, 4A, 4B, 5A to 5C, and 6A to 6C illustrate steps in the work conveying apparatus 8 constituting the manufacturing apparatus 1 according to the present embodiment. It is a schematic diagram for doing.

First, referring to Fig. 3A, when the cutting process is completed, on the cut table 33 of the cutting module 3, a segmented work group 60 comprising a plurality of segmented workpieces 6 is disposed. Each of the pieced workpieces 6 is disposed in a state in which the sealing resin 52 side is in contact with the cut table 33.

In the state of Fig. 3A, a pick-up process is performed. The pick-up process includes a process of collectively adsorbing the segmented workpiece group 60, which is a plurality of segmented workpieces 6 that are segmented and arranged by cutting, onto the suction surface of the package conveyance mechanism 38. That is, the package conveyance mechanism 38 collectively adsorbs the individualized work groups 60 arranged on the cut table 33 and moves in the upper direction of gravity (along the Z direction).

The package conveyance mechanism 38 further moves toward the resin-side cleaning mechanism 39 (along the X direction). The package conveyance mechanism 38 has an adsorption surface for adsorbing a plurality of pieced work 6 (segmented work group 60), and one or more adsorption holes are provided on the adsorption surface. Using the negative pressure generated by a vacuum generator connected to these adsorption holes, a plurality of pieced workpieces 6 (segmented work group 60) is sucked. The detailed structure of the package transfer mechanism 38 will be described later.

The package conveyance mechanism 38 is equivalent to a device (first adsorption device) that collectively adsorbs the segmented work group 60 consisting of a plurality of segmented workpieces 6 on an adsorption surface (first adsorption surface). do. For convenience of explanation, Fig. 3A shows a state in which the segmented work group 60 is divided into two in the X direction. Each group into which the individualized work group 60 is divided is referred to as a subset 61 and a subset 62. However, the division of the subset 61 and the subset 62 is for convenience only, and is not explicitly divided when the cutting process is completed.

Subsequently, as shown in Fig. 3B, a washing/drying step (cleaning step) is performed on the plurality of segmented workpieces 6 (separated workpiece group 60). In the washing/drying process, the sealing resin 52 side of the pieced workpiece 6 is cleaned. Specifically, the package transfer mechanism 38 reciprocates in the X direction in the vicinity of the resin-side cleaning mechanism 39. The resin-side cleaning mechanism 39 includes a brush roller 391 and an air injection unit 392. The brush roller 391 is rotated in contact with the surface of the sealing resin 52 of the pieced workpiece 6, while the air jetting portion 392 is formed on the surface of the sealing resin 52 of the pieced piece 6 Inject air into the air. By operating each of these parts, foreign matters present on the sealing resin 52 side of the pieced work 6 are removed. Further, the brush roller 391 of the resin-side cleaning mechanism 39 may be replaced with a sponge roller.

In the pick-up process and the washing/drying process, it is processed while being in the state of the segmented work group 60 generated in the cutting process. And the package conveyance mechanism 38 moves toward the visual inspection mechanism 43 (according to an X direction).

In the following steps, each subset constituting the individualized work group 60 is processed. For convenience of explanation, in order to distinguish the processes for the subset 61 and the subset 62 of the reorganized work group 60 from each other, at the end of the name of each process "(Part 1)" and "(Part 2) )” is added respectively.

Subsequently, as shown in Fig. 4A, a mark inspection process (part 1) is performed on the subset 61. The mark inspection process includes a process of inspecting the state of a print marked on the surface of the sealing resin 52 of the pieced work 6. The content of the printing made on the surface of the sealing resin 52 includes information such as product name and model number.

More specifically, the package transport mechanism 38 moves the subset 61 of the individualized work group 60 to a position within the field of view of the camera 431 included in the visual inspection mechanism 43. When the mark inspection process for the subset 61 of the individualized work group 60 by the camera 431 is completed, the package conveyance mechanism 39 moves toward the reversal mechanism 40 (in the X direction). In addition, examples of the camera 431 include a camera equipped with a CCD sensor, a CMOS sensor, or the like.

Subsequently, as shown in Fig. 4B, the first place process (part 1) of the subset 61 is executed. The first placing process includes a process of arranging a subset of the individualized work group 60 adsorbed by the package transfer mechanism 38 in the reversing mechanism 40. When viewed from the reversing mechanism 40, since a subset of the individualized work group 60 is newly disposed, it is also referred to as a first loading step.

More specifically, the package conveyance mechanism 38 moves to a position where the subset 61 of the individualized work group 60 and the reversing mechanism 40 correspond. Then, the package conveyance mechanism 38 moves in the downward direction of gravity (according to the Z direction), and after bringing the subset 61 of the pieced work group 60 into contact with the suction surface of the reversing mechanism 40, The adsorption state for the subset 61 is released. Then, the reversing mechanism 40 adsorbs the subset 61. Then, the subset 61 adsorbed by the package transfer mechanism 38 is disposed on the surface of the reversing mechanism 40. After the subset 61 is placed in the reversing mechanism 40, the package conveying mechanism 38 moves upward by gravity (along the Z direction) to return to its original height.

The reversing mechanism 40 has an adsorption surface for adsorbing a plurality of pieced workpieces 6 (a subset of the pieced work group 60), and one or more adsorption holes are provided on the adsorption surface. . A plurality of segmented workpieces 6 (a subset of segmented workpiece groups 60) are sucked using the negative pressure generated by the vacuum generator connected to these suction holes. The detailed structure of the reversing mechanism 40 will be described later.

As described above, in the first place step, a part of the segmented work group 60 adsorbed on the adsorption surface of the package transfer mechanism 38 is replaced with a reversing mechanism 40 whose area is smaller than that of the adsorption surface of the package transfer mechanism 38. Is adsorbed on the adsorption surface of. The reversing mechanism 40 has an adsorption surface (a second adsorption surface) that is smaller in area than the adsorption surface of the package transfer mechanism 38, and a group of pieces 60 adsorbed by the package transfer mechanism 38 It is equivalent to a device (second adsorption device) that adsorbs a part of the material to the small adsorption surface. That is, since the reversing mechanism 40 only needs to adsorb only a part of the pieced work group 60, the adsorption surface of the reversing mechanism 40 can be made smaller than the adsorption face of the package transfer mechanism 38.

In addition, in the first place step (part 1), of the group of pieces of pieces 60 adsorbed by the package transfer mechanism 38, pieces of pieces other than the subset 61 arranged in the reversing mechanism 40 (6) (i.e., subset 62) should still be adsorbed to the package conveying mechanism 38. In this way, the package transfer mechanism 38 is configured to be capable of independently adsorbing the subset 61 and the subset 62, respectively. That is, the package transfer mechanism 38 (first adsorption device) has a plurality of systems of adsorption circuits for adsorption in different regions of the adsorption surface of the package transfer mechanism 38. Details of the plurality of systems of adsorption circuits will be described later.

Subsequently, as shown in Fig. 5A, a flip process for the subset 61 (part 1) and a mark inspection process for the subset 62 (part 2) are executed in parallel. The flip process includes a process of inverting the vertical direction of the subset 61 adsorbed by the reversing mechanism 40 by rotating the reversing mechanism 40 around the Y direction. That is, the subset 61 disposed in the reversing mechanism 40 is disposed so that the substrate 51 of the segmented workpiece 6 faces upward, but when the reversing mechanism 40 rotates, the segmented workpiece ( The substrate 51 of 6) faces downward.

More specifically, the reversing mechanism 40 rotates about the Y direction in a state in which the subset 61 of the segmented work group 60 is adsorbed. In parallel, the package conveyance mechanism 38 moves the subset 62 of the individualized work group 60 to a position within the field of view of the camera 431 included in the visual inspection mechanism 43. When the mark inspection process for the subset 61 of the segmented work group 60 by the camera 431 is completed, the package transfer mechanism 38 moves toward the reversal mechanism 40 (in the X direction). do.

Subsequently, as shown in Fig. 5B, a package inspection process (part 1) is performed on the subset 61. At this time, when the mark inspection process (part 2) for the subset 62 continues, both processes are executed in parallel.

The package inspection process includes a visual inspection of the pieced work 6 on the substrate 51 side. Specifically, in the package inspection process, an image is taken of the substrate 51 side of the plurality of pieced workpieces 6, and whether the position, number, shape, etc. of the solder balls appearing on the substrate coincide with a predetermined one, Alternatively, it includes processing to check whether the position, number, shape, etc. of the lead frame extending from the molded resin mold coincide with a predetermined one.

More specifically, the reversing mechanism 40 moves the subset 61 of the segmented work group 60 to a position within the field of view of the camera 432 included in the visual inspection mechanism 43. When the package inspection process for the subset 61 of the segmented work group 60 by the camera 432 is completed, the reversing mechanism 40 moves toward the index table 41 (in the X direction). . Further, examples of the camera 432 include a camera equipped with a CCD sensor, a CMOS sensor, or the like.

Subsequently, as shown in Fig. 5C, the second place process (part 1) for the subset 61 is executed. The second placing process includes a process of arranging a subset of the segmented work group 60 adsorbed by the reversing mechanism 40 in the index table 41. When viewed from the index table 41, since a subset of the individualized work group 60 is newly arranged, it is also referred to as a second load step.

More specifically, the reversing mechanism 40 moves to a position where the subset 61 of the reorganized work group 60 and the index table 41 correspond. Then, the index table 41 moves upward by gravity (along the Z direction), and the reversing mechanism 40 releases the suction state with respect to the subset 61. Then, the subset 61 adsorbed by the reversing mechanism 40 is placed in the index table 41. After the subset 61 is placed in the index table 41, the index table 41 moves downward by gravity (along the Z direction) and returns to its original height.

The reversing mechanism 40 has an adsorption surface for adsorbing a plurality of pieced workpieces 6 (a subset of the pieced work group 60), and one or more adsorption holes are provided on the adsorption surface. . A plurality of segmented workpieces 6 (a subset of segmented workpiece groups 60) are sucked using the negative pressure generated by the vacuum generator connected to these suction holes. The detailed structure of the reversing mechanism 40 will be described later.

In addition, the index table 41 collectively adsorbs the segmented work 6 (a subset of the segmented work group 60) adsorbed by the reversing mechanism 40 on the adsorption surface of the index table 41. It corresponds to the device (the third adsorption device). That is, since the adsorption surface of the index table 41 needs to have an area equal to that of the adsorption surface of the reversing mechanism 40, compared to the package transfer mechanism 38, similarly to the reversing mechanism 40, It can be made compact.

Subsequently, as shown in Fig. 6A, the pick and place process for the subset 61 (Part 1) and the first place process for the subset 62 (Part 2) are executed in parallel. .

In the second loading step, after the execution of the step for the pieced workpiece 6 adsorbed on the adsorption surface of the reversing mechanism 40, the pieced workpiece 6 adsorbed on the adsorption surface of the reversing mechanism 40 is removed. It includes a process of collectively adsorbing on the adsorption surface of the index table 41 and arranging according to a predetermined rule. In the pick-and-place process, each of the individualized workpieces 6 included in the subset arranged on the index table 41 is transferred to the good product tray 44 or the defective product tray by a transfer mechanism 42 (see Fig. 1). (45) Including the relocation process.

More specifically, the transfer mechanism 42 corresponds to the inspection result corresponding to each of the individualized workpieces 6 included in the subset 61 arranged on the index table 41, the good product tray 44 or They are sequentially placed on the defective product tray 45. In parallel with this, the package conveyance mechanism 38 moves to a position where the subset 62 of the individualized work group 60 and the reversing mechanism 40 correspond. Then, the package conveyance mechanism 38 moves in the downward direction of gravity (according to the Z direction), and releases the adsorption state for the subset 62. Then, the subset 62 adsorbed by the package conveyance mechanism 38 is disposed on the surface of the reversing mechanism 40. After the subset 62 is placed in the reversing mechanism 40, the package conveying mechanism 38 moves upward by gravity (along the Z direction) to return to its original height.

Subsequently, as shown in Fig. 6B, a package inspection process (part 2) related to the subset 62 is executed.

More specifically, the reversing mechanism 40 moves the subset 62 of the segmented work group 60 to a position within the field of view of the camera 432 included in the visual inspection mechanism 43. When the package inspection process for the subset 62 of the segmented work group 60 by the camera 432 is completed, the reversal mechanism 40 moves toward the index table 41 (in the X direction). .

Subsequently, as shown in Fig. 6C, a second place process (part 2) for the subset 62 is executed.

More specifically, the reversing mechanism 40 moves to a position where the subset 62 of the individualized work group 60 and the index table 41 correspond. Then, the index table 41 moves upward by gravity (along the Z direction), and the reversing mechanism 40 releases the suction state with respect to the subset 62. Then, the subset 62 adsorbed by the reversing mechanism 40 is placed on the index table 41. After the subset 62 is placed on the index table 41, the index table 41 moves downward by gravity (along the Z direction) to return to its original height.

Each of the subdivided workpieces 6 included in the subset 62 arranged on the index table 41 is a transfer mechanism 42 (see FIG. 1), a good product tray 44 or a defective product tray 45 Is relocated to.

The execution of the process in the work conveying device 8 is completed by the above processing procedure. 7 is a schematic diagram for explaining the temporal relationship of each step in the work conveying device 8 constituting the manufacturing device 1 according to the present embodiment. Referring to FIG. 7, with respect to the individualized work group 60 adsorbed by the package conveyance mechanism 38, a pickup process (process P1) and a washing/drying process (process P2) are collectively executed. Subsequently, a mark inspection step (step P31) is performed for only the subset 61 of the individualized work group 60. Then, only the subset 61 of the individualized work group 60 is transferred from the package transfer mechanism 38 to the reversing mechanism 40 (the first place step (step P41))/the first load step ( Step (P51)).

Subsequently, for the subset 62 of the individualized work group 60 remaining in the package transfer mechanism 38, a mark inspection step (step P32) is executed. In parallel with the mark inspection process (process P32), for the subset 61 of the reorganized work group 60 transferred to the reversing mechanism 40, a flip process (process P61) and a package inspection process (process (P71)) is executed. That is, at least, the package inspection process for the subset 61 of the reorganized work group 60 and the mark inspection process for the subset 62 of the reorganized work group 60 are executed in parallel.

Then, the subset 61 of the reorganized work group 60 is transferred from the reversing mechanism 40 to the index table 41 (the second place step (step P81))/the second load step (step (P91))). In addition, the subset 62 of the individualized work group 60 is transferred from the package transfer mechanism 38 to the reversing mechanism 40 (the second place step (step P42))/the first load step ( Step (P52)).

Subsequently, with respect to the subset 61 of the individualized work group 60 moved to the index table 41, a pick and place process (step P101) is executed. In parallel with the pick and place step (step P101), a flip step (step P62) is performed on the subset 62 of the individualized work group 60 transferred to the inversion mechanism 40. That is, at least, a pick and place process for the subset 61 of the individualized work group 60 and a flip process for the subset 62 of the individualized work group 60 are executed in parallel.

In addition, after the package inspection process (step P72) is performed on the subset 62 of the reorganized work group 60 moved to the reversing mechanism 40, a subset of the reorganized work group 60 ( 62) is transferred from the reversing mechanism 40 to the index table 41 (2nd place process (process P82)/second load process (process P92))). Finally, for the subset 62 of the reorganized work group 60 moved to the index table 41, a pick and place process (step P102) is executed. And the process in the work conveyance device 8 ends.

As shown in FIG. 7, with respect to the segmented workpiece 6 (subset 62) other than a part of the segmented workpiece group 60, the mark inspection step (step P32) and the flip step (step ( When executing any one of P62)), in parallel, with respect to the partial reorganization work 6 (subset 61) of the reorganization work group 60, other than a part of the reorganization work group 60 A process (process P61, P71 or process P101) different from the process executed for the segmentation work 6 (subset 62) is executed. By such parallel execution, production efficiency can be improved.

<C. Work return>

Next, the details of the work conveyance by the package conveyance mechanism 38, the reversing mechanism 40, and the index table 41 are demonstrated. As described above, in the work conveying device 8 according to the present embodiment, the individualized work group 60 is divided and conveyed. At this time, the arrangement shape of the individualized workpieces 6 in each subset obtained by dividing the segmented workpiece group 60 may not be the same. For example, in the case where the reorganized work group 60 consists of the even-numbered reorganized work 6, the number of arrangements of each subset may be the same when divided into two, but the reorganized work group 60 ), the number of arrangements of each subset in the case of dividing into two cannot be the same (the number of arrangements in one subset becomes even and the other subset The number of arrays is odd).

In addition, the package transfer mechanism 38, the reversing mechanism 40, and the index table 41 include product specifications (e.g., size, shape, number of pieces) of the molded substrate 5 and the piece pieces 6 Etc.), a dedicated transfer jig is attached. That is, the package conveyance mechanism 38, the reversing mechanism 40, and the area|region where the index table 41 adsorbs the pieced workpiece 6 is designed uniquely to each of the pieced pieces 6.

In the work conveying device 8 according to the present embodiment, a structure that absorbs unevenness between subsets generated when the individualized work group 60 is divided is adopted. Hereinafter, the conveyance processing of the segmented workpiece 6 in the case where the layout of the subset generated by dividing the segmented workpiece group 60 is the same or not the same will be described.

(c1: if the subset has the same layout)

8A and 8B are diagrams for explaining work conveyance when the layout of the subset is the same in the work conveyance device 8 constituting the manufacturing apparatus 1 according to the present embodiment. 8A and 8B show an example in which the segmented work group 60 is divided into a subset 61 and a subset 62, and the subset 61 and the subset 62 are conveyed, respectively.

Fig. 8A shows a process of transporting the subset 61 of the segmented work group 60 adsorbed by the package transport mechanism 38 to the reversing mechanism 40 and the index table 41, and Fig. 8B Shows a process of conveying the subset 62 of the individualized work group 60 adsorbed by the package conveying mechanism 38 to the reversing mechanism 40 and the index table 41.

8A and 8B, a conveyance jig 388A is attached to the package conveyance mechanism 38. The conveyance jig 388A is provided with an adsorption surface 381 for adsorbing the subset 61 and an adsorption surface 382 for adsorbing the subset 62. The adsorption surface 381 and the adsorption surface 382 are provided with one or more adsorption holes 387 in correspondence with the arrangement of the pieced workpieces 6. In the example shown in Figs. 8A and 8B, the suction surface 381 and the suction surface 382 have the same area and the layout of the suction hole 387.

Inside the conveyance jig 388A, the suction hole 387 provided in the suction surface 381 communicates with the control port (pipe) 383 via the space 385. On the other hand, the suction hole 387 provided on the suction surface 382 is in communication with the control port (pipe) 384 through the space 386. As described later, independent pneumatic circuits are connected to the control ports (pipes) 383 and 384, respectively.

In addition, the transfer jig 408A is attached to the reversing mechanism 40. A main adsorption surface 401 is provided in the conveyance jig 408A. The main adsorption surface 401 is commonly used for adsorption of the subset 61 and the subset 62. The main adsorption surface 401 is provided with one or more adsorption holes 407 corresponding to the arrangement of the pieced workpieces 6.

Inside the conveyance jig 408A, the suction hole 407 provided in the main suction surface 401 communicates with the control port (pipe) 403 through the space 405. As described later, a pneumatic circuit is connected to the control port (pipe) 403.

In addition, a transfer jig 418A is attached to the index table 41. The transfer jig 418A is provided with a main suction surface 411. The main adsorption surface 411 is commonly used for adsorption of the subset 61 and the subset 62. The main adsorption surface 411 is provided with one or more adsorption holes 417 corresponding to the arrangement of the pieced workpieces 6.

Inside the conveyance jig 418A, the suction hole 417 provided in the main suction surface 411 communicates with the control port (pipe) 413 via the space 415. As described later, a pneumatic circuit is connected to the control port (pipe) 413.

As shown in Fig. 8A, in the case of passing the subset 61 adsorbed by the package transfer mechanism 38 to the reversing mechanism 40, the suction surface 381 is removed through the control port (pipe) 383. The negative pressure applied to the suction hole 387 is released. On the other hand, in the reversing mechanism 40, a negative pressure is applied to the suction hole 407 of the main suction surface 401 through the control port (pipe) 403.

In addition, in the case of passing the subset 61 adsorbed by the reversing mechanism 40 to the index table 41, the suction hole 407 of the main adsorption surface 401 is passed through the control port (piping) 403. The given negative pressure is released. On the other hand, in the index table 41, negative pressure is applied to the suction hole 417 of the main suction surface 411 through the control port (pipe) 413.

As shown in Fig. 8B, when the subset 62 adsorbed by the package conveyance mechanism 38 is passed to the reversing mechanism 40, the suction surface 382 is removed through the control port (pipe) 384. The negative pressure applied to the suction hole 387 is released. On the other hand, in the reversing mechanism 40, a negative pressure is applied to the suction hole 407 of the main suction surface 401 through the control port (pipe) 403.

In addition, in the case where the subset 62 adsorbed by the reversing mechanism 40 is passed to the index table 41, the suction hole 407 of the main adsorption surface 401 is passed through the control port (pipe) 403. The given negative pressure is released. On the other hand, in the index table 41, negative pressure is applied to the suction hole 417 of the main suction surface 411 through the control port (pipe) 413.

(c2: if the layout of the subset is not the same)

9A and 9B are diagrams for explaining work conveyance when the layout of a subset is not the same in the work conveyance device 8 constituting the manufacturing apparatus 1 according to the present embodiment. 9A and 9B show an example in which the segmented work group 60 is divided into a subset 61 and a subset 62, and the subset 61 and the subset 62 are conveyed, respectively.

9A and 9B, a conveyance jig 388B is attached to the package conveyance mechanism 38. The transfer jig 388B has a different area and the layout of the adsorption hole 387 between the adsorption surface 381 and the adsorption surface 382 compared to the transfer jig 388A shown in FIGS. 8A and 8B. . Others are the same as the transfer jig 388A shown in Figs. 8A and 8B.

Further, the transfer jig 408B is attached to the reversing mechanism 40. In addition to the main adsorption surface 401, the conveyance jig 408B is provided with an auxiliary adsorption surface 402. The main adsorption surface 401 is provided with one or more adsorption holes 407 corresponding to the arrangement of the pieced workpieces 6. In the auxiliary adsorption surface 402, adsorption holes 407 for absorbing differences in layout between the subset 61 and the subset 62 (typically, adsorption holes 407 for one row) There are.

The main adsorption surface 401 is commonly used for adsorption of the subset 61 and the subset 62. The auxiliary adsorption surface 402 is used only for adsorption of the subset 61. In the example shown in Figs. 9A and 9B, both the main adsorption surface 401 and the sub adsorption surface 402 are used for adsorption of the subset 61, and primary adsorption is used for adsorption of the subset 62. Only cotton 401 is used.

Inside the conveyance jig 408B, the suction hole 407 provided in the main suction surface 401 communicates with the control port (pipe) 403 through the space 405. On the other hand, the suction hole 407 provided in the auxiliary suction surface 402 is in communication with the control port (pipe) 404 through the space 406. As described later, independent pneumatic circuits are connected to the control ports (pipes) 403 and 404, respectively.

In addition, a transfer jig 418B is attached to the index table 41. In addition to the main suction surface 411, the transfer jig 418B is provided with an auxiliary suction surface 412. The main adsorption surface 411 is provided with one or more adsorption holes 417 corresponding to the arrangement of the pieced workpieces 6. The auxiliary adsorption surface 412 is provided with adsorption holes 417 (typically, adsorption holes 417 for one row) for absorbing differences in the layout between the subset 61 and the subset 62. .

The main adsorption surface 411 is commonly used for adsorption of the subset 61 and the subset 62. The auxiliary adsorption surface 412 is used only for adsorption of the subset 61. In the example shown in Figs. 9A and 9B, both the main adsorption surface 411 and the sub adsorption surface 412 are used for adsorption of the subset 61, and primary adsorption is used for adsorption of the subset 62. Only the face 411 is used.

Inside the conveyance jig 418B, the suction hole 417 provided in the main suction surface 411 communicates with the control port (pipe) 413 via the space 415. On the other hand, the suction hole 417 provided on the auxiliary suction surface 412 is in communication with the control port (pipe) 414 through the space 416. As described later, independent pneumatic circuits are connected to the control ports (pipes) 413 and 414, respectively.

As shown in Fig. 9A, when the subset 61 adsorbed by the package transfer mechanism 38 is handed over to the reversing mechanism 40, the suction surface 381 is removed through the control port (piping) 383. The negative pressure applied to the suction hole 387 is released. On the other hand, in the reversing mechanism 40, while negative pressure is applied to the suction hole 407 of the main suction surface 401 through the control port (pipe) 403, the auxiliary suction through the control port (pipe) 404 A negative pressure is also applied to the suction hole 407 of the surface 402.

In addition, in the case of passing the subset 61 adsorbed by the reversing mechanism 40 to the index table 41, the suction hole 407 of the main adsorption surface 401 is passed through the control port (piping) 403. The applied negative pressure and the negative pressure applied to the suction hole 407 of the auxiliary suction surface 402 through the control port (pipe) 404 are released. On the other hand, in the index table 41, while negative pressure is applied to the suction hole 417 of the main suction surface 411 through the control port (pipe) 413, the auxiliary suction through the control port (pipe) 414 A negative pressure is also applied to the suction hole 417 of the surface 412.

As shown in Fig. 9B, when the subset 62 adsorbed by the package conveyance mechanism 38 is handed over to the reversing mechanism 40, the suction surface 382 is removed through the control port (pipe) 384. The negative pressure applied to the suction hole 387 is released. On the other hand, in the reversing mechanism 40, the negative pressure is applied only to the suction hole 407 of the main suction surface 401 through the control port (pipe) 403.

In addition, in the case where the subset 62 adsorbed by the reversing mechanism 40 is passed to the index table 41, the suction hole 407 of the main adsorption surface 401 is passed through the control port (pipe) 403. The given negative pressure is released. On the other hand, in the index table 41, negative pressure is applied only to the suction hole 417 of the main suction surface 411 through the control port (pipe) 413.

As shown in Figs. 9A and 9B, when the number of arrangements of the segmented work group 60 is odd (when the layout of the subset is not the same), the package transfer mechanism 38 (first adsorption device) During the operation of adsorbing the pieced work (subset) over a plurality of times, only the main adsorption surface 401 (main area) of the reversing mechanism 40 becomes effective at least once.

Similarly, when the number of arrangements of the reorganized work group 60 is odd (when the layout of the subset is not the same), the reversing mechanism 40 (second adsorption device) multiple times and the reorganized work (sub During the operation of adsorbing the set), only the main adsorption surface 411 (main area) of the index table 41 is activated at least once.

<D. Transfer jig>

Next, the package conveyance mechanism 38, the reversing mechanism 40, and the conveyance jig attached to the index table 41 are demonstrated.

10 is a schematic diagram showing a cross-sectional structure of a conveying jig 388 attached to the package conveying mechanism 38 of the work conveying device 8 constituting the manufacturing apparatus 1 according to the present embodiment. Referring to FIG. 10, the conveyance jig 388 has a metal plate 3881, a metal rubber plate 3882, and a two-layer structure. An O-ring 3883 is disposed along the outer periphery of the metal plate 3881 and the metal rubber plate 3882 joined together.

A groove corresponding to the spaces 385 and 386 is formed in the metal plate 3881 to correspond to the arrangement of the suction holes 387. Holes corresponding to the control ports (pipes) 383 and 384 are formed in the bottom surface of the metal plate 3881.

The metal rubber plate 3882 includes a metal layer 3884 disposed on the metal plate 3881 side, and a rubber layer 3885 forming an adsorption surface.

The transfer jig attached to the reversing mechanism 40 and the index table 41 also has the same cross-sectional structure, and thus detailed description is not repeated.

11A and 11B show a state in which the metal rubber plate is removed from the conveying jig 388 attached to the package conveying mechanism 38 of the work conveying device 8 constituting the manufacturing apparatus 1 according to the present embodiment. This is a schematic plan view.

In Fig. 11A, an integral space 385 corresponding to the suction surface 381 for adsorbing the subset 61 and an integral space 385 corresponding to the suction surface 382 for adsorbing the subset 62 ( 386) is provided. In the configuration shown in Fig. 11A, since the spaces 385 and 386 are relatively wide, a reinforcing member 389 may be disposed between the metal plate 3881 and the metal rubber plate 3882. The reinforcing member 389 is disposed for the purpose of alleviating distortion of the suction surface. That is, as shown in Fig. 11A, the package transfer mechanism 38 (first adsorption device) may include a reinforcing member 389 disposed on the back side of the adsorption surface of the package transfer mechanism 38. .

In Fig. 11B, a space 385 corresponding to the suction surface 381 for adsorbing the subset 61 is divided into two, and a space 386 corresponding to the suction surface 382 for adsorbing the subset 62. ) Is divided into two. In the configuration shown in Fig. 11B, since each of the spaces 385 and 386 is relatively narrow, the reinforcing member 389 between the metal plate 3881 and the metal rubber plate 3882 may be omitted. However, in this case, a plurality of control ports (pipes) 383 and 384 corresponding to the spaces 385 and 386 are provided, respectively.

12A and 12B are a state in which the metal rubber plate is removed from the conveying jigs 408A and 408B attached to the reversing mechanism 40 of the work conveying device 8 constituting the manufacturing apparatus 1 according to the present embodiment. It is a schematic diagram in plan view. Fig. 12A shows an example in which the metal rubber plate is removed from the transfer jig 408A used when the layout of the subset is the same, and Fig. 12B shows an example in which the layout of the subset is not the same. An example in which the metal rubber plate is removed from the conveying jig 408B used is shown in plan view.

In the conveyance jig 408A shown in FIG. 12A, a space 405 corresponding to the main adsorption surface 401 is provided on the inner peripheral side of the metal plate 4081. O-ring 4083 is disposed to surround the space 405.

On the other hand, in the conveyance jig 408B shown in FIG. 12B, a space 405 corresponding to the main suction surface 401 is provided on the inner circumferential side of the metal plate 4081. In addition, a space 406 corresponding to the auxiliary suction surface 402 is provided independently of the space 405. The space 405 communicates with the control port (pipe) 403, and the space 406 communicates with the control port (pipe) 404. By controlling the air pressure applied through the control ports (pipes) 403 and 404, it is possible to independently control the adsorption and opening of the main adsorption surface 401 and/or the secondary adsorption surface 402.

In the configuration shown in Figs. 12A and 12B, since the space 405 is relatively wide, a reinforcing member 409 may be disposed between the metal plate 4081 and the metal rubber plate. The reinforcing member 409 is disposed for the purpose of alleviating distortion of the suction surface. That is, the reversing mechanism 40 (second adsorption device) may include the reinforcing member 409 disposed on the rear side of the adsorption surface of the reversing mechanism 40.

12A and 12B, a plurality of holes are formed at predetermined positions in which the metal plate 4081 is common, and each hole is formed with a main suction surface 401 (main area) and a sub suction surface 402. ) (Sub-region) may be properly designed to communicate with. That is, by making the positions of the holes provided in the metal plate 4081 common, the interface to be connected to the pneumatic circuit can be made common even if the transfer jigs 408A and 408B are used differently.

13A and 13B are a state in which the metal rubber plate is removed from the conveying jigs 418A and 418B mounted on the index table 41 of the work conveying device 8 constituting the manufacturing device 1 according to the present embodiment. It is a schematic diagram in plan view. Fig. 13A shows an example in which the metal rubber plate is removed from the transfer jig 418A used when the layout of the subset is the same, and Fig. 13B shows an example in which the layout of the subset is not the same. An example in which the metal rubber plate is removed from the transfer jig 418B to be used is shown in plan view.

In the conveyance jig 418A shown in FIG. 13A, a space 415 corresponding to the main suction surface 411 is provided on the inner circumferential side of the metal plate 4181. An O-ring 4183 is disposed to surround the space 415.

On the other hand, in the conveyance jig 418B shown in FIG. 13B, a space 415 corresponding to the main suction surface 411 is provided on the inner peripheral side of the metal plate 4181. In addition, a space 416 corresponding to the auxiliary suction surface 412 is provided independently of the space 415. The space 415 is in communication with the control port (pipe) 413, and the space 416 is in communication with the control port (pipe) 414. By controlling the air pressure applied through the control ports (pipes) 413 and 414, it is possible to independently control the adsorption and opening of the main adsorption surface 411 and/or the secondary adsorption surface 412.

In the configuration shown in Figs. 13A and 13B, since the space 415 becomes relatively wide, a reinforcing member 419 may be disposed between the metal plate 4181 and the metal rubber plate. The reinforcing member 419 is disposed for the purpose of alleviating distortion of the suction surface. That is, the index table 41 (third adsorption device) may include the reinforcing member 409 disposed on the back side of the adsorption surface of the index table 41.

13A and 13B, a plurality of holes are formed at predetermined positions in which the metal plate 4181 is common, and each hole is formed with a main suction surface 411 (main area) and a sub suction surface 412. ) (Sub-region) may be properly designed to communicate with. That is, by making the positions of the holes provided in the metal plate 4181 common, even if the transfer jigs 418A and 418B are used differently, the interface to be connected to the pneumatic circuit can be shared.

<E. Air pressure control mechanism (50)>

Next, the pneumatic pressure control mechanism 50 for controlling the operation of the work conveying device 8 according to the present embodiment will be described. In addition, the position and number of the pneumatic pressure control mechanism 50 are not particularly limited. In addition, the compressed air source 56 and the adsorption source 54 in Figs. 14A to 14C may each use different compressed air sources 56 and adsorption sources 54, or the same ones may be used.

14A to 14C are schematic diagrams showing main parts of the pneumatic pressure control mechanism 50 constituting the manufacturing apparatus 1 according to the present embodiment. 14A shows an example of the pneumatic circuit 50A associated with the package transfer mechanism 38, and FIG. 14B shows an example of the pneumatic circuit 50B associated with the reversing mechanism 40. 14C shows an example of the pneumatic circuit 50C associated with the index table 41.

Referring to Fig. 14A, the pneumatic circuit 50A controls adsorption and release at the adsorption surfaces 381 and 382 of the package transfer mechanism 38, respectively. More specifically, the pneumatic circuit 50A includes a branch pipe 501 communicating with the control port (pipe) 383 of the package transport mechanism 38 and a control port (pipe) of the package transport mechanism 38. ) (384) and in communication with the branch pipe (502). The branch pipe 501 and the branch pipe 502 are selectively connected to a negative pressure main pipe 55 communicating with the adsorption source 54 or a positive pressure main pipe 58 communicating with the compressed air source 56 do.

The adsorption source 54 is made of an ejector or the like, and supplies a negative pressure for adsorbing the pieced work 6. The compressed air source (56) is made of a compressor or the like that generates compressed air. Further, the compressed air source 56 is in communication with the positive pressure main pipe 58 via the regulator 57.

A mechanical valve 521 is disposed between the branch pipe 501 and the negative pressure main pipe 55, and a mechanical valve 523 is disposed between the branch pipe 501 and the positive pressure main pipe 58. have.

Similarly, a mechanical valve 522 is disposed between the branch pipe 502 and the negative pressure main pipe 55, and a mechanical valve 524 is disposed between the branch pipe 502 and the positive pressure main pipe 58. It is placed.

Pilot circuits driven by solenoid valves 511, 512, 513 and 514 are connected to the control circuits of the mechanical valves 521, 522, 523, and 524, respectively. That is, when the solenoid valves 511, 512, 513, and 514 are driven, respectively, the shut-off/open state of the corresponding mechanical valves 521, 522, 523, and 524 are converted.

For example, in the case of adsorbing the pieced workpiece 6 on the adsorption surface 381 of the package transfer mechanism 38, the solenoid valve 511 is set to shut off the pilot air, and the mechanical valve 521 is opened. Switch. As a result, the suction source 54 and the suction hole of the suction surface 381 communicate with each other, and a negative pressure is generated in the suction hole. Similarly, in the case of adsorbing the pieced workpiece 6 on the suction surface 382 of the package transfer mechanism 38, the solenoid valve 512 is turned off by pilot air, and the mechanical valve 522 is switched to the open state. . As a result, the suction source 54 and the suction hole of the suction surface 382 communicate with each other, and a negative pressure is generated in the suction hole.

Conversely, in the case of releasing the adsorption state on the adsorption surface 381 of the package transfer mechanism 38, the solenoid valve 511 is used as a pilot air supply, while the mechanical valve 521 is switched to the shut-off state. , The solenoid valve 513 is turned off by pilot air, and the mechanical valve 523 is switched to an open state. As a result, the compressed air source 56 and the suction hole of the suction surface 381 communicate with each other, and a positive pressure is generated in the suction hole. Similarly, in the case of releasing the adsorption state on the adsorption surface 382 of the package transfer mechanism 38, the solenoid valve 512 is used as a pilot air supply, while the mechanical valve 522 is switched to the shut-off state, The solenoid valve 514 is set to shut off the pilot air, and the mechanical valve 524 is switched to the open state. As a result, the compressed air source 56 and the suction hole of the suction surface 382 communicate with each other, and a positive pressure is generated in the suction hole.

In this way, the package conveyance mechanism 38 (first adsorption device) is air from the adsorption hole 387 provided in the adsorption face 381 and the adsorption face 382 (as well as the first adsorption face) to the adsorption face side. It has an air delivery circuit (compressed air source 56, solenoid valves 512 and 514, mechanical valves 522 and 524, etc.) for delivering air.

As described above, the pneumatic circuit 50A can independently control the state of adsorption on the adsorption surface 381 and the adsorption surface 382 of the package transfer mechanism 38, respectively. That is, the package conveyance mechanism 38 is a selection mechanism (mechanical valves 521, 522, 523, 524) and solenoid valves (mechanical valves 521, 522, 523, 524) for selectively validating a plurality of systems of adsorption circuits (branch pipe 501 and branch pipe 502). 511, 512, 513, 514)). By using such a selection mechanism, a piece of work by the suction surface (the main suction surface 401 and the secondary suction surface 402: the second suction surface) of the reversing mechanism 40 (the second suction device) ( In response to the adsorption of 6), a plurality of systems of adsorption circuits connected to different regions (the adsorption surfaces 381 and 382) of the package transfer mechanism 38 are selectively activated.

Next, referring to Fig. 14B, the pneumatic circuit 50B controls suction and opening of the main suction surface 401 and the auxiliary suction surface 402 of the reversing mechanism 40, respectively. More specifically, the pneumatic circuit 50B includes a branch pipe 503 communicating with the control port (pipe) 403 of the reversing mechanism 40, the control port (pipe) 404 of the reversing mechanism 40, and It includes a branch pipe 504 communicating. The branch pipe 503 and the branch pipe 504 are selectively connected to a negative pressure main pipe 55 communicating with the adsorption source 54 or a positive pressure main pipe 58 communicating with the compressed air source 56.

A mechanical valve 541 is arranged between the branch pipe 503 and the negative pressure main pipe 55, and a mechanical valve 543 is arranged between the branch pipe 503 and the positive pressure main pipe 58. have. Similarly, a mechanical valve 542 is disposed between the branch pipe 504 and the negative pressure main pipe 55, and a mechanical valve 544 is disposed between the branch pipe 504 and the positive pressure main pipe 58. It is placed.

Pilot circuits driven by solenoid valves 531, 532, 533, and 534 are connected to the control circuits of the mechanical valves 541, 542, 543, and 544, respectively. That is, when the solenoid valves 531, 532, 533, and 534 are driven, respectively, the shut-off/open state of the corresponding mechanical valves 541, 542, 543, and 544 are converted.

For example, in the case of adsorbing the pieced workpiece 6 on the main suction surface 401 of the reversing mechanism 40, the solenoid valve 531 is set to shut off the pilot air, and the mechanical valve 541 is opened. Switch. Accordingly, the suction source 54 and the suction hole of the main suction surface 401 communicate with each other, and a negative pressure is generated in the suction hole. Similarly, in the case of adsorbing the pieced workpiece 6 on the auxiliary suction surface 402 of the reversing mechanism 40, the solenoid valve 532 is turned off by pilot air, and the mechanical valve 542 is switched to the open state. . Thereby, the adsorption hole of the adsorption source 54 and the sub adsorption surface 402 communicate with each other, and negative pressure is generated in the adsorption hole.

Conversely, in the case of releasing the adsorption state on the main adsorption surface 401 of the reversing mechanism 40, the solenoid valve 531 is used as a pilot air supply, and the mechanical valve 541 is switched to the shut-off state. , The solenoid valve 533 is turned off by pilot air, and the mechanical valve 543 is switched to an open state. Thereby, the compressed air source 56 and the suction hole of the main suction surface 401 communicate with each other, and a positive pressure is generated in the suction hole. Similarly, in the case of releasing the suction state on the auxiliary suction surface 402 of the reversing mechanism 40, the solenoid valve 532 is used as a pilot air supply, while the mechanical valve 542 is switched to the shut-off state, The solenoid valve 534 is set to shut off the pilot air, and the mechanical valve 544 is switched to the open state. As a result, the compressed air source 56 and the adsorption hole of the auxiliary adsorption surface 402 communicate with each other, and a positive pressure is generated in the adsorption hole.

In this way, the reversing mechanism 40 (the second adsorption device) is air from the adsorption hole 407 provided in the main adsorption surface 401 and the secondary adsorption surface 402 (the second adsorption surface) toward the adsorption surface. It has an air delivery circuit (compressed air source 56, solenoid valves 532, 534, mechanical valves 542, 544, etc.) for delivering the air.

As described above, the pneumatic circuit 50B can independently control the adsorption state of the main adsorption surface 401 and the sub adsorption surface 402 of the reversing mechanism 40, respectively. That is, the reversing mechanism 40 prevents adsorption in each region with respect to the main adsorption surface 401 (main region) and the sub adsorption surface 402 (sub region) formed on the suction surface of the reversing mechanism 40. It has two suction circuits (branches 503, 504, mechanical valves 541, 542, 543, 544, and solenoid valves 531, 532, 533, 534) for independent activation. Using such a selection mechanism, a group of pieces of work adsorbed on the suction surface 381 and the suction surface 382 (as well as the first suction surface) of the package transfer mechanism 38 (first suction device) ( In response to the number of arrangements of 60), a plurality of suction circuits connected to the main suction surface 401 and the auxiliary suction surface 402 formed in the reversing mechanism 40, respectively, are selectively activated.

In addition, depending on the type of the transfer jig 408A, 408B mounted on the reversing mechanism 40, there is a case where the auxiliary adsorption surface 402 does not exist and consists only of the main adsorption surface 401. In this case, since the control ports (pipes) 403 and 404 are commonly connected to the space 405 corresponding to the main suction surface 401, the mechanical connection to the branch pipe 503 and the branch pipe 504 The valve may be operated in common.

Next, referring to Fig. 14C, the pneumatic circuit 50C controls suction and opening of the index table 41 on the main suction surface 411 and the sub suction surface 412, respectively. More specifically, the pneumatic circuit 50C includes a branch pipe 505 communicating with the control port (pipe) 413 of the index table 41, and the control port (pipe) 414 of the index table 41. It includes a branch pipe 506 communicating. The branch pipe 503 and the branch pipe 504 are selectively connected to a negative pressure main pipe 55 communicating with the adsorption source 54 or a positive pressure main pipe 58 communicating with the compressed air source 56.

Between the branch pipe 505 and the negative pressure main pipe 55, a mechanical valve 561 is disposed, and between the branch pipe 505 and the positive pressure main pipe 58, a mechanical valve 563 is disposed. have. Similarly, a mechanical valve 562 is disposed between the branch pipe 506 and the negative pressure main pipe 55, and a mechanical valve 564 is disposed between the branch pipe 506 and the positive pressure main pipe 58. It is placed.

Pilot circuits driven by solenoid valves 551, 552, 553 and 554 are connected to the control circuits of the mechanical valves 561, 562, 563, and 564, respectively. That is, when the solenoid valves 551, 552, 553, and 554 are driven respectively, the shut-off/open state of the corresponding mechanical valves 561, 562, 563, and 564 are converted.

For example, in the case of adsorbing the pieced workpiece 6 on the main suction surface 411 of the index table 41, the solenoid valve 551 is set to shut off the pilot air, and the mechanical valve 561 is opened. Switch. As a result, the suction source 54 and the suction hole of the main suction surface 411 communicate with each other, and a negative pressure is generated in the suction hole. Likewise, in the case of adsorbing the pieced workpiece 6 on the auxiliary adsorption surface 412 of the index table 41, the solenoid valve 553 is set to shut off the pilot air, and the mechanical valve 562 is switched to the open state. . Thereby, the adsorption hole of the adsorption source 54 and the sub adsorption surface 412 communicate with each other, and negative pressure is generated in the adsorption hole.

Conversely, in the case of releasing the adsorption state on the main adsorption surface 411 of the index table 41, the solenoid valve 551 is used as a pilot air supply, and the mechanical valve 561 is switched to the shut-off state. , The solenoid valve 552 is switched off to the pilot air, and the mechanical valve 563 is switched to the open state. As a result, the compressed air source 56 and the suction hole of the main suction surface 411 communicate with each other, and a positive pressure is generated in the suction hole. Similarly, in the case of releasing the adsorption state on the auxiliary adsorption surface 412 of the index table 41, the solenoid valve 553 is used as a pilot air supply, while the mechanical valve 562 is switched to the shut-off state, The solenoid valve 554 is set to shut off the pilot air, and the mechanical valve 564 is switched to the open state. As a result, the suction hole of the compressed air source 56 and the auxiliary suction surface 412 communicate with each other, and a positive pressure is generated in the suction hole.

In this way, the index table 41 (third adsorption device) is air from the adsorption hole 417 provided in the main adsorption surface 411 and the sub adsorption surface 412 (third adsorption surface) to the adsorption surface side. It has an air delivery circuit (compressed air source 56, solenoid valves 552 and 554, mechanical valves 562 and 564, etc.) for delivering air. Using such a selection mechanism, a group of pieces of work adsorbed on the suction surface 381 and the suction surface 382 (as well as the first suction surface) of the package transfer mechanism 38 (first suction device) ( In response to the number of arrangements (60), a plurality of suction circuits connected to the main suction surface 411 and the auxiliary suction surface 412 formed on the index table 41, respectively, are selectively activated.

As described above, the pneumatic circuit 50C can independently control the state of adsorption on the main adsorption surface 411 and the sub adsorption surface 412 of the index table 41, respectively. In other words, the index table 41 prevents adsorption in each area with respect to the main adsorption surface 411 (main area) and the sub adsorption surface 412 (sub area) formed on the adsorption surface of the index table 41. It has two suction circuits (branches 505, 506, mechanical valves 561, 562, 563, 564, and solenoid valves 551, 552, 553, 554) for independent activation.

In addition, depending on the type of the transfer jig 418A, 418B mounted on the index table 41, there is a case where the auxiliary adsorption surface 412 does not exist and consists only of the main adsorption surface 411. In this case, since the control ports (pipes) 413 and 414 are commonly connected to the space 415 corresponding to the main suction surface 411, the mechanical connection to the branch pipe 505 and the branch pipe 506 The valve may be operated in common.

In addition, in the work conveying device 8 according to the present embodiment, by using a compressed air source 56 to apply pressure to the pieced work 6 adsorbed on the adsorption surface, Although the configuration in which (6) is actively separated has been exemplified, it is not limited to such a configuration. That is, if the application of the negative pressure to the pieced work 6 is stopped, the adsorption of the pieced work 6 can be released. For example, the adsorption hole provided on the adsorption surface is opened and reorganized. The pressure on the chemical work 6 may be matched with the atmospheric pressure. By doing in this way, by its own weight, the pieced workpiece 6 falls in the downward direction of gravity.

In addition, in the work conveying device 8 according to the present embodiment, an example using a pneumatic circuit was shown as a method of adsorbing the pieced work 6, but is not limited to such a configuration, and an arbitrary fastening method is used. Can be adopted. For example, a method of gripping the pieced work 6 from the side, a method of supporting the pieced work 6 from the bottom, a method of using a suction force generated by magnetism, and static electricity. A method of using the suction force generated by this method or the like may be employed.

<F. Return Layout>

Next, with respect to several layouts of the individualized work group, a layout example of a subset conveyed by each part of the work conveying device 8 is shown.

15A, 15B, 16A, 16B, 17A, 17B, and 18 illustrate an example of a conveyance layout by the work conveyance device 8 constituting the manufacturing device 1 according to the present embodiment. It is a drawing for. In the following description, the number of rows viewed from the X direction is referred to as "columns", and the number of rows viewed from the Y direction is referred to as "rows".

Fig. 15A shows an example in which the individualized workpieces 6 arranged in 4 rows by 5 rows are generated by the cutting process. In the example shown in Fig. 15A, since the number of arrangements is even in the X direction, the subsets 201 and 202 having the same layout can be determined by dividing them into the center of the X direction. The package transfer mechanism 38 is equipped with a transfer jig corresponding to the layout of the individualized workpieces 6 arranged in 4 columns by 5 rows, and a reversing mechanism 40 (and an index table 41 not shown) ), a transport jig corresponding to the subset 201 (and the subset 202) is mounted. In this case, the common portion 203 corresponding to both subsets is provided only with the main suction surface, and the auxiliary suction surface becomes unnecessary.

Fig. 15B shows an example in which the individualized workpieces 6 arranged in 5 rows by 5 rows are generated by the cutting process. In the example shown in Fig. 15B, since the number of arrangements is odd when viewed in the X direction, a subset 211 for 3 rows and a subset 212 for 2 rows are divided by dividing so that the difference in the number of columns after division is minimized. ) Can be determined. The package transfer mechanism 38 is equipped with a transfer jig corresponding to the layout of the individualized work 6 arranged in 5 rows by 5 rows, and the reversing mechanism 40 (and an index table 41 not shown) ), a transfer jig corresponding to the larger subset 211 is mounted. In this case, a common portion 213 between the subset 211 and the subset 212 is provided as a main adsorption surface, and a difference portion that is the difference between the subset 211 and the common portion 213 ( 214) is provided as an auxiliary adsorption surface.

Next, an example in which a small set (hereinafter, also referred to as Island) of the reorganized work 6 is generated will be described. For example, when the number of electronic components collectively mounted on a substrate is relatively small, mounting only them on a single substrate cannot improve production efficiency. In such a case, by arranging a plurality of sub-assemblies of a plurality of electronic components on a single substrate, a layout that improves mounting efficiency in appearance may be employed. In this case, an island as shown in Fig. 16A is formed.

Fig. 16A shows an example in which islands of the pieced work 6 arranged in one column by two rows are generated by the cutting process. In the example shown in Fig. 16A, when viewed in the X direction, the number of arrangements of the islands is 1 (odd), but since the island itself is made up of a plurality of individualized walks 6, the island itself is centered in the X direction. By dividing, it is possible to determine the subsets 221 and 222 having the same layout. The package transfer mechanism 38 is equipped with a transfer jig corresponding to the layout of the islands arranged in one column x 2 rows, and the reversing mechanism 40 (and an index table 41 not shown) is a subset. A transfer jig corresponding to 221 (and a subset 222) is mounted. In this case, the common portion 223 corresponding to both subsets is provided only with the main suction surface, and the auxiliary suction surface becomes unnecessary.

Fig. 16B shows an example in which islands of the pieced workpiece 6 arranged in two columns by two rows are generated by the cutting process. In the example shown in Fig. 16B, since the number of arrangements is even in the X direction, the subsets 231 and 232 having the same layout can be determined by dividing them into the center of the X direction. The package transfer mechanism 38 is equipped with a transfer jig corresponding to the layout of the islands arranged in two columns by two rows, and the reversing mechanism 40 (and an index table 41 not shown) is a subset. A transfer jig corresponding to 231 (and a subset 232) is mounted. In this case, the common portion 233 corresponding to both subsets is provided only with the main suction surface, and the auxiliary suction surface becomes unnecessary.

Fig. 17A shows an example in which islands of segmented workpieces 6 arranged in 3 rows by 3 rows are generated by the cutting process. In the example shown in Fig. 17A, when viewed in the X direction, the number of arrangements of the islands is 3 (odd), but since the island itself is made up of a plurality of segmented walks 6, the island itself is centered in the X direction. By dividing, it is possible to determine the subsets 241 and 242 having the same layout. The package conveyance mechanism 38 is equipped with a conveying jig corresponding to the layout of the islands arranged in 3 rows by 3 rows.

However, since the layout is symmetrical between the subset 241 and the subset 242, difference portions 243 and 244 are generated in addition to the common portion 245 of both. Therefore, in the reversal mechanism 40 (and the index table 41 (not shown)), the common portion 245 and the difference portion 243 corresponding to the subset 241 and the subset 242 are corresponded. A transfer jig in which the common portion 245 and the difference portion 244 are formed is mounted. In this case, while the common portion 245 is provided as the main adsorption surface, the difference part 243 and the difference part 244 are provided as an auxiliary adsorption surface. As the pneumatic pressure control mechanism 50, an adsorption circuit for independently adsorbing the common part 245 and the difference parts 243 and 244 is prepared.

In Fig. 17B, as in Fig. 17A, an example in which the islands of the pieced work 6 arranged in three columns by three rows are generated by a cutting process is shown. In the example shown in Fig. 17B, since the number of arrangements is odd when viewed in the X direction, a subset 251 for one column and a subset 252 for two rows are divided by dividing so that the difference in the number of columns after division is minimized. ) Can be determined. The package transfer mechanism 38 is equipped with a transfer jig corresponding to the layout of the islands arranged in 3 columns by 3 rows, while the reversing mechanism 40 (and index table 41 not shown) has a larger A transfer jig corresponding to the subset 252 is mounted. In this case, the common portion 253 between the subset 251 and the subset 252 is provided as a main suction surface, and the difference portion 254 that is the difference between the subset 251 and the subset 252 is negative. It is provided as an adsorption surface.

In Fig. 18, as in Figs. 17A and 17B, there is shown an example in which islands of segmented workpieces 6 arranged in three columns by three rows are generated by a cutting process. In the example shown in Fig. 18, the subsets 261, 262, and 263 for one row can be determined by dividing for each island. That is, by dividing into three, the layout of the subset can be made the same.

The package transfer mechanism 38 is equipped with a transfer jig corresponding to the layout of the islands arranged in three columns by three rows, and the reversing mechanism 40 (and an index table 41 not shown) is a subset. A transfer jig corresponding to 261 (and subsets 262 and 263) is mounted. In this case, the common portion 264 corresponding to each subset is provided only with the main suction surface, and the auxiliary suction surface becomes unnecessary.

<G. Control unit 100>

Next, the configuration of the control unit 100 constituting the manufacturing apparatus 1 according to the present embodiment will be described.

19 is a schematic diagram showing a hardware configuration of the control unit 100 constituting the electronic component manufacturing apparatus 1 according to the present embodiment and related components. 19 shows a configuration example of the control unit 100 employing a computer according to a general-purpose architecture as a typical example. In the control unit 100, a general-purpose operating system (OS) and a lar-time OS are executed, respectively, so that a human-machine interface (HMI) function and a communication function, and a control function requiring lar-time characteristics are compatible.

The control unit 100, as main components, is an input unit 102, an output unit 104, a main memory 106, an optical drive 108, a processor 110, a hard disk drive (HDD) ( 120), a network interface 112, a servo motor interface 114, and an actuator interface 116. These components are connected so that data can be exchanged with each other through an internal bus 119.

The input unit 102 is a component that accepts an operation from a user, and typically includes a keyboard, a touch panel, a mouse, a track ball, and the like. The output unit 104 is a component that outputs a result of processing by the control unit 100 to the outside, and typically includes a display, a printer, various displays, and the like. The main memory 106 is composed of a DRAM (Dynamic Random Access Memory) or the like, and holds a code of a program executed in the processor 110 and various work data required for execution of the program.

The processor 110 is a processing entity that reads a program stored in the HDD 120 and executes processing on input data. The processor 110 is configured to be able to execute a general-purpose OS, various applications operating on the general-purpose OS, and a lartime OS and various applications operating on the lartime OS in parallel, respectively. As an example, the processor 110 includes a configuration consisting of a plurality of processors (so-called ``multi-processor''), a configuration including a plurality of cores in a single processor (so-called ``multi-core''), and a multi-processor and multi-core It is realized in one of the configurations having both features of.

The HDD 120 is a storage unit, and typically stores a general-purpose OS 122, a radial time OS 124, an HMI program 126, and a control program 128. The HMI program 126 operates under the execution environment of the general-purpose OS 122, and mainly realizes processing related to exchange with users. The control program 128 operates under the execution environment of the Raaltime OS 124 and controls each component constituting the manufacturing apparatus 1.

Various programs executed by the control unit 100 are stored and distributed in a recording medium 108A such as a DVD-ROM (Digital Versatile Disc Read Only Memory). The contents of the recording medium 108A are read from the optical drive 108 and installed in the HDD 120. That is, certain aspects of the present invention include a program for realizing the control unit 100 and any one recording medium storing the program. As these recording media, in addition to optical recording media, magnetic recording media, magneto-optical recording media, semiconductor recording media, or the like may be used.

19 illustrates a form in which plural types of programs are installed in the HDD 120, but these programs may be integrated as one program, or may be decorated as part of another program.

The network interface 112 exchanges data with an external device through a network.

The program installed on the HDD 120 may be acquired from the server via the network interface 112. That is, the program for realizing the control unit 100 according to the present embodiment may be downloaded by an arbitrary method and installed on the HDD 120.

The servo motor interface 114 and the actuator interface 116 mediate control of components (servo motors, solenoid valves, cylinders, etc.) constituting the manufacturing apparatus 1. The servo motor interface 114 gives a command to a servo driver that drives a servo motor provided in the manufacturing apparatus 1. More specifically, the servo motor interface 114 is connected to the servo drivers 130_1 to 130_N via the field bus 115. The servo drivers 130_1 to 130_N drive servo motors 132_1 to 132_N, respectively.

The actuator interface 116 is connected to the relays 140_1 to 140_N via the field bus 117 and to the relays 150_1 to 150_N via the field bus 118. The relays 140_1 to 140_N supply pilot air to the solenoid valves 142_1 to 142_N, respectively, in response to a command from the control unit 100. The relays 150_1 to 150_N drive cylinders 152_1 to 152_N, respectively, in response to a command from the control unit 100.

In Fig. 19, a configuration example for realizing the control unit 100 according to the present embodiment by executing a program by the processor 110 has been described, but the manufacturing apparatus or conveyance method according to the present invention is not limited thereto. It is possible to appropriately adopt a configuration corresponding to the technological level of the times implemented in this reality. For example, instead of a general-purpose computer, a PLC (Programmable Logic Controller), which is an industrial controller, may be used. Alternatively, all or part of the functions provided by the control unit 100 may be mounted using an integrated circuit such as LSI (Large Scale Integration) or ASIC (Application Specific Integrated Circuit), or a field-programmable gate array (FPGA), etc. It may be mounted using a reprogrammable circuit element. Alternatively, the functions provided by the control unit 100 shown in Fig. 19 may be realized by a plurality of processing subjects cooperating with each other. For example, the functions provided by the control unit 100 may be realized by linking a plurality of computers.

<H. Advantage>

The workpiece conveying device 8 included in the electronic component manufacturing apparatus 1 according to the present embodiment is a segmented workpiece group 60 comprising a plurality of segmented workpieces 6 generated by executing a cutting process. The mark inspection process, the package inspection process, the place process on the index table 41, and the pick-and-place process by the transfer mechanism 42 are divided and executed instead of collectively. By dividing and processing the individualized work group 60 into a plurality of subsets, compared to the case of collective processing, the space to be secured for the processing can be reduced. In particular, the lengths of the reversing mechanism 40 and the index table 41 in the X direction of the manufacturing apparatus 1 can be reduced. By reducing the space required for such processing, an increase in the size of the electronic component manufacturing apparatus 1 including the work conveyance device 8 and the work conveyance device 8 can be suppressed.

The work conveyance device 8 included in the electronic component manufacturing apparatus 1 according to the present embodiment collectively adsorbs the pieced work group 60 from the cut table 33, and the pieced work group Different processes can be executed in parallel for each of the subsets included in (60). Therefore, compared to the case where the individualized work groups 60 are collectively performed and each step is sequentially executed, the portion that becomes the bottle neck is reduced, and the production efficiency as a whole can be improved.

Further, as shown in Fig. 18, the individualized work group 60 may be divided into three or more subsets. That is, in the work conveying apparatus 8 according to the present embodiment, the number of divisions into subsets is not particularly limited.

Although the embodiment of the present invention has been described, it should be considered that the embodiment disclosed this time is illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, and it is intended that the meanings equivalent to the claims and all changes within the scope are included.

1: manufacturing device
2: storage module
3: cutting module
4: dispensing module
5: Formed substrate
6: Reorganization work
8: work conveying device
21: magazine
31: supply rail
32: substrate transfer mechanism
33: cut table
34: cutting mechanism
35: location recognition unit
36: substrate side cleaning mechanism
37: alignment mechanism
38: package transfer mechanism
39: resin side cleaning mechanism
40: inversion mechanism
41: index table
42: transfer mechanism
43: visual inspection apparatus
44: good product tray
45: defective product tray
46: tray supply mechanism
50: air pressure control mechanism
50A, 50B, 50C: pneumatic circuit
51: substrate
52: sealing resin
54: adsorption source
55: main pipe for negative pressure
56: compressed air source
57: regulator
58: Main pipe for static pressure
60: reorganization work group
100: control unit
102: input unit
104: output
106: main memory
108: optical drive
108A: recording medium
110: processor
112: network interface
114: servo motor interface
115, 117, 118: field bus
116: actuator interface
119: internal bus
120: HDD
122: Universal OS
124: Raaltime OS
126: HMI program
128: control program
130_1∼130_N: Servo driver
132_1∼132_N: Servo motor
140_1∼140_N, 150_1∼150_N: Relay
142_1∼142_N, 511, 512, 513, 514, 531, 532, 533, 534, 551, 552, 553, 554: solenoid valve
152: cylinder
341: spindle
342: blade
361: washing water spray unit
362, 392: air injection unit
381, 382: adsorption surface
383, 384, 403, 404, 413, 414: Control port (piping)
385, 386, 405, 406, 415, 416: space
387, 407, 417: suction hole
388A, 388B, 408A, 408B, 418A, 418B: Transfer jig
389, 409, 419: reinforcing member
391: brush roller
401, 411: main adsorption surface
402, 412: auxiliary adsorption surface
431, 432: camera
501, 502, 503, 504, 505, 506: branch office
521, 522, 523, 524, 541, 542, 543, 544, 561, 562, 563, 564: Mechanical valve
3881, 4081, 4181: metal plate
3882: Metal rubber plate
3883, 4083, 4183: O-ring
3884: metal layer
3885: rubber layer

Claims (16)

As a work conveying device for conveying a plurality of pieces of pieces arranged by cutting into pieces,
A first adsorption device for collectively adsorbing a group of pieced work pieces comprising a plurality of pieced work pieces on the first adsorption surface,
A second adsorption surface that has a second adsorption surface that is smaller in area than the first adsorption surface, and adsorbs a part of the segmented work group adsorbed by the first adsorption device to the second adsorption surface. Equipped with a device,
The first adsorption device has a plurality of adsorption circuits for adsorption in different regions of the first adsorption surface,
The segmentation work group is divided into a plurality of subsets, and in at least one of the subsets, a plurality of segmentation works are arranged in each of two directions intersecting each other,
The second adsorption device collectively adsorbs a plurality of the segmented workpieces for each of the subsets,
In the first adsorption device, the adsorption circuit is configured so that the adsorption and adsorption state can be canceled by collectively adsorbing a plurality of pieced workpieces for each of the subsets. The method of claim 1,
The first adsorption device further includes a selection mechanism for selectively validating the plurality of adsorption circuits. The method of claim 1,
The second adsorption device has two systems of adsorption circuits for independently effective adsorption in each area with respect to the main area and the sub area formed on the second adsorption surface. Device. The method of claim 3,
In the second adsorption device, in the operation of adsorbing the pieced work from the first adsorption device a plurality of times when the number of arrangements of the pieced work group is odd, at least once is the second A work conveying device, characterized in that only said main area of the suction surface is made effective. The method according to any one of claims 1 to 4,
The first adsorption device includes a reinforcing member disposed on the back side of the first adsorption surface. The method according to any one of claims 1 to 4,
The second adsorption device includes a reinforcing member disposed on the rear side of the second adsorption surface. The method according to any one of claims 1 to 4,
The first adsorption device has a first air delivery circuit for discharging air from the adsorption hole provided on the first adsorption surface to the first adsorption surface side. The method according to any one of claims 1 to 4,
The second adsorption device has a second air delivery circuit for discharging air from the adsorption surface provided on the second adsorption surface to the second adsorption surface side. The method according to any one of claims 1 to 4,
Further comprising a third adsorption device for collectively adsorbing the pieced work adsorbed by the second adsorption device on the third adsorption surface,
The third adsorption device comprises two suction circuits for independently effective adsorption in each of the main and sub-areas formed on the third adsorption surface. Device. An electronic component manufacturing apparatus comprising the work conveying device according to any one of claims 1 to 4. A step of collectively adsorbing a plurality of segmented workpieces, which are a plurality of segmented workpieces that are segmented and arranged by cutting, on a first suction surface, wherein the segmented workpiece group is divided into a plurality of subsets, In at least one of the subsets, a plurality of individualized workpieces are arranged in each of two directions intersecting each other,
Adsorbing one subset included in the segmented work group adsorbed on the first adsorption surface to a second adsorption surface having an area smaller than that of the first adsorption surface;
When performing any one of a mark inspection process and a flip process for individualized workpieces other than the subset adsorbed on the second adsorption surface of the segmented workpiece group, in parallel, the second And a step of executing a process different from the process being performed for the pieced work other than the subset adsorbed on the second adsorption surface with respect to the pieced work of the subset adsorbed on the adsorption surface. How to return the work. The method of claim 11,
And a step of selectively validating a plurality of systems of suction circuits connected to different regions of the first suction surface in response to adsorption of the pieced work by the second suction surface. Way. The method of claim 11 or 12,
Responsive to the number of arrangements of a part of the segmented work group adsorbed on the first adsorption surface, selectively validating a plurality of adsorption circuits connected to the main and sub-areas formed on the second adsorption surface Work conveying method characterized in that it further comprises. The method of claim 13,
When the number of arrangements of a part of the segmented work group adsorbed on the first adsorption surface is an odd number, among a plurality of operations of adsorbing the segmented work to the second adsorption surface, at least one operation is And a step of validating only the main area of the suction surface of 2. The method of claim 14,
After the execution of the process for the pieced work adsorbed on the second adsorption surface is completed, the pieced work adsorbed on the second adsorption surface is collectively adsorbed on the third adsorption surface, and according to a predetermined rule. The steps to place,
A step of selectively validating a plurality of systems of adsorption circuits each connected to a main region and a sub region formed on the third suction surface;
When the number of arrangements of a part of the segmented work group adsorbed on the first adsorption surface is an odd number, among a plurality of operations for adsorbing the segmented work to the third adsorption surface, at least one operation is And a step of validating only the main region of the suction surface of step 3. A method for manufacturing an electronic component, comprising the method for conveying the work according to claim 11 or 12.

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