JP2018534786A5 - - Google Patents

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Publication number
JP2018534786A5
JP2018534786A5 JP2018526210A JP2018526210A JP2018534786A5 JP 2018534786 A5 JP2018534786 A5 JP 2018534786A5 JP 2018526210 A JP2018526210 A JP 2018526210A JP 2018526210 A JP2018526210 A JP 2018526210A JP 2018534786 A5 JP2018534786 A5 JP 2018534786A5
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JP
Japan
Prior art keywords
substrate
light emitting
bond pads
emitting elements
bond pad
Prior art date
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Application number
JP2018526210A
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English (en)
Japanese (ja)
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JP6927970B2 (ja
JP2018534786A (ja
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Priority claimed from PCT/US2016/057655 external-priority patent/WO2017087116A1/en
Publication of JP2018534786A publication Critical patent/JP2018534786A/ja
Publication of JP2018534786A5 publication Critical patent/JP2018534786A5/ja
Application granted granted Critical
Publication of JP6927970B2 publication Critical patent/JP6927970B2/ja
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JP2018526210A 2015-11-20 2016-10-19 異なる電気的構成を可能にするダイボンドパッド設計 Active JP6927970B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562258385P 2015-11-20 2015-11-20
US62/258,385 2015-11-20
PCT/US2016/057655 WO2017087116A1 (en) 2015-11-20 2016-10-19 Die bond pad design to enable different electrical configurations

Publications (3)

Publication Number Publication Date
JP2018534786A JP2018534786A (ja) 2018-11-22
JP2018534786A5 true JP2018534786A5 (enExample) 2019-12-05
JP6927970B2 JP6927970B2 (ja) 2021-09-01

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ID=64355318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018526210A Active JP6927970B2 (ja) 2015-11-20 2016-10-19 異なる電気的構成を可能にするダイボンドパッド設計

Country Status (1)

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JP (1) JP6927970B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7319551B2 (ja) * 2020-03-31 2023-08-02 日亜化学工業株式会社 発光装置
CN114937679A (zh) * 2021-04-20 2022-08-23 友达光电股份有限公司 发光二极管元件以及发光二极管电路
JP7780963B2 (ja) * 2022-01-21 2025-12-05 旭化成エレクトロニクス株式会社 赤外線発光装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107549A (ja) * 1987-10-20 1989-04-25 Mitsubishi Electric Corp 半導体集積回路装置
JP4904628B2 (ja) * 2001-03-14 2012-03-28 パナソニック株式会社 複合発光素子
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP2006012916A (ja) * 2004-06-22 2006-01-12 Toyoda Gosei Co Ltd 発光素子
US10586787B2 (en) * 2007-01-22 2020-03-10 Cree, Inc. Illumination devices using externally interconnected arrays of light emitting devices, and methods of fabricating same
US10074778B2 (en) * 2011-03-22 2018-09-11 Seoul Viosys Co., Ltd. Light emitting diode package and method for manufacturing the same
DE102013101367A1 (de) * 2013-02-12 2014-08-14 Osram Opto Semiconductors Gmbh Halbleiterchip
EP2973714B1 (en) * 2013-03-15 2019-05-08 Lumileds Holding B.V. Light emitting structure and mount
WO2015052616A1 (en) * 2013-10-09 2015-04-16 Koninklijke Philips N.V. Monolithic led arrays for uniform and high-brightness light sources
JP6548066B2 (ja) * 2013-12-26 2019-07-24 大日本印刷株式会社 Ｌｅｄ素子搭載用リードフレーム、ｌｅｄ素子搭載用樹脂付きリードフレーム及び半導体装置
JP6519135B2 (ja) * 2014-09-26 2019-05-29 日亜化学工業株式会社 発光装置及び発光装置用基板

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