JP2018534786A5

JP2018534786A5 -

Info

Publication number: JP2018534786A5
Application number: JP2018526210A
Authority: JP
Filing date: 2016-10-19
Publication date: 2019-12-05
Anticipated expiration: 2036-10-19

Claims

A light emitting diode (LED) device ,
A LED die having a plurality of light emitting elements includes a pair of bond pads, each coupled thereto of the plurality of light emitting elements, each of the bond pads have a rectangular shape with four orthogonal edges, each A die wherein at least one of the pair of bond pads has at least one cut-out corner, each cut-off corner forming an additional non-orthogonal edge;
Have
Wherein the plurality of light emitting elements, the bond pads of the at least two oblique faces is taken Ri off, and to have a non-orthogonal edges facing one another and disposed in said die,
Device .

The device further includes a substrate on which the die is mounted, the substrate includes a single interconnect layer, the plurality of light emitting elements includes four light emitting elements, and the bond pad includes the substrate. The device of claim 1, wherein the device is configured to allow selection of a nominal operating voltage of 3, 6 or 12 volts using the single interconnect layer above .

The four light emitting elements are arranged in a 2 × 2 array, the device according to claim 2.

The four light emitting elements are arranged in a 1 × 4 array device of claim 2.

The device of claim 1, wherein each of the cut bond pads has five edges including the four orthogonal edges and a non-orthogonal edge.

The device of claim 1, wherein at least one of the cut bond pads has six edges including the four orthogonal edges and two non-orthogonal edges.

The device further comprises a substrate on which the die is mounted, the substrate has a single interconnect layer, wherein the bond pads, using the single interconnect layer, wherein the plurality of light emitting elements The device of claim 1, wherein the device is configured to allow external coupling to all series connections.

The device further comprises a substrate on which the die is mounted, the substrate has a single interconnect layer, wherein the bond pads, using the single interconnect layer on the substrate, wherein external binding to all of the parallel connection of a plurality of light emitting elements, and is configured to allow device of claim 1.

The bond pads, using the single interconnect layer on the substrate, all are configured to allow the external coupling, to series-parallel connection of the plurality of light emitting elements, according to claim 8 Device described in.

The die includes three or more pairs of bond pads, each bond pad of each pair having at least one cut-out corner with a corresponding non-orthogonal edge, and each of the plurality of light emitting elements is associated with each bond pad. 9. The device of claim 8, wherein is arranged to have at least one non-orthogonal edge facing the non-orthogonal edge of the diagonally opposite bond pad.

At least one bond pad is disposed in the die such that at least one non-orthogonal edge of the at least one bond pad faces two non-orthogonal edges of two separate bond pads. Item 11. The device according to Item 10.

The device of claim 10, wherein each pair of bond pads includes a p-type bond pad coupled to the p-layer of the corresponding light-emitting element and an n-type bond pad coupled to the n-layer of the corresponding light-emitting element. .

A plurality of LED devices further comprises a substrate disposed thereon, the substrate comprising:
A first conductive segment electrically coupled to all of the plurality of p-type bond pads for external connection to a negative node of a voltage source;
A second conductive segment electrically coupled to all of the plurality of n-type bond pads for external connection to a positive node of the voltage source;
The device of claim 12, comprising:

A plurality of LED devices further comprises a substrate disposed thereon, the substrate comprising:
A first conductive segment configured for electrical coupling of at least one n-type bond pad to the negative node of the voltage source;
A second conductive segment configured for electrical coupling of at least one p-type bond pad to the positive node of the voltage source;
At least one third conductive segment coupled directly between an n-type bond pad of one light emitting device and a p-type bond pad of another light emitting device;
The device of claim 12, comprising:

A plurality of LED devices further comprises a substrate disposed thereon, the substrate comprising:
At least one first conductive segment configured for electrical coupling of at least one n-type bond pad to the positive node of the voltage source;
At least one second conductive segment configured for electrical coupling of at least one n-type bond pad to a negative node of the voltage source;
A third conductive segment electrically coupled to all other p-type and n-type bond pads;
The device of claim 12, comprising:

The device of claim 1, wherein the bond pads are positioned at a separation distance that accepts manufacturing tolerances for an interconnect pattern on a substrate on which the plurality of light emitting elements are mounted.