JP2018527552A - 少なくとも一つのスプリング式コンタクトピン又はスプリング式コンタクトピン構造の製造方法及び対応する装置 - Google Patents
少なくとも一つのスプリング式コンタクトピン又はスプリング式コンタクトピン構造の製造方法及び対応する装置 Download PDFInfo
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- 238000000034 method Methods 0.000 claims abstract description 94
- 239000004033 plastic Substances 0.000 claims abstract description 56
- 229920003023 plastic Polymers 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims description 68
- 229910052751 metal Inorganic materials 0.000 claims description 68
- 230000008878 coupling Effects 0.000 claims description 58
- 238000010168 coupling process Methods 0.000 claims description 58
- 238000005859 coupling reaction Methods 0.000 claims description 58
- 239000011248 coating agent Substances 0.000 claims description 50
- 238000000576 coating method Methods 0.000 claims description 50
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 24
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- 239000000126 substance Substances 0.000 claims description 19
- 238000001465 metallisation Methods 0.000 claims description 18
- 239000000654 additive Substances 0.000 claims description 16
- 230000000996 additive effect Effects 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 9
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- 238000000197 pyrolysis Methods 0.000 claims description 7
- 238000001311 chemical methods and process Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 4
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
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- 150000002739 metals Chemical class 0.000 description 3
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
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- 230000005226 mechanical processes and functions Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
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- 238000003892 spreading Methods 0.000 description 2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
【選択図】図4
Description
Claims (28)
- 電気的な接触に用いられる少なくとも一つのスプリング式コンタクトピン又は少なくとも一つの前記スプリング式コンタクトピンを備えたスプリング式コンタクトピン構造の製造方法において、以下のステップ、すなわち
− 前記スプリング式コンタクトピン(9)の少なくとも一つのベース部(8)を製造し、その際、前記ベース部(8)の少なくとも一部分がプラスチックから製造されるステップ、及び
− その後に行われる前記ベース部(8)の少なくとも前記プラスチックから成る部分を金属被覆するステップを特徴とする製造方法。 - 前記ベース部(8)の前記少なくとも一つのプラスチックから成る部分の前記製造が付加製造方法によって行われることを特徴とする請求項1に記載の方法。
- 前記付加製造方法としては、二光子レーザリソグラフィ、とりわけディップインレーザリソグラフィ方法が用いられることを特徴とする請求項1又は2に記載の方法。
- 前記金属被覆が、少なくとも一つの電気めっきプロセス及び/又は化学的プロセスにおいて行われることを特徴とする請求項1から3のいずれか一項に記載の方法。
- 前記ベース部(8)全体が、プラスチックから好ましくは前記付加製造方法によって製造され、とりわけ一体的な前記ベース部(8)として製造されることを特徴とする請求項1から4のいずれか一項に記載の方法。
- 前記ベース部(8)全体が金属被覆されることを特徴とする請求項1から5のいずれか一項に記載の方法。
- 前記電気めっきによる金属被覆の前に、電気伝導性を有する開始層が、前記ベース部(8)の少なくとも前記プラスチックから成る部分上に施されるか、又は前記部分の表面で生成されることを特徴とする請求項1から6のいずれか一項に記載の方法。
- 前記金属被覆の前に、シード層が、前記ベース部の少なくとも前記プラスチックから成る部分上に施され、とりわけ浸漬方法若しくはプラズマ方法において施されるか、又は前記部分の表面で生成されることを特徴とする請求項1から7のいずれか一項に記載の方法。
- 前記金属被覆の後に、前記プラスチックから成る部分が除去されないか又は少なくとも部分的に、とりわけ熱分解方法、湿式化学的方法、及び/若しくは乾式化学的方法によって除去されることを特徴とする請求項1から8のいずれか一項に記載の方法。
- 前記金属被覆によって形成された金属シェルでは、少なくとも一つの開口部が生成されるか又はそのままにしておかれ、前記開口部が、熱分解生成物を漏出させるのに用いられ、且つ/又は前記湿式化学的及び/若しくは前記乾式化学的方法を実施する際に少なくとも一つの湿式化学的及び/若しくは乾式化学的なプロセスの介入を可能にすることを特徴とする請求項1から9のいずれか一項に記載の方法。
- 前記スプリング式コンタクトピン(9)のスプリング機能のため、前記スプリング式コンタクトピン(9)の少なくとも一領域(15)が、前記領域(15)の材料の固有の弾性及び/又は形状により、弾性変形することができるように形成されることを特徴とする請求項1から10のいずれか一項に記載の方法。
- 前記弾性領域(15)が、前記スプリング式コンタクトピン(9)の残りの区間と一体的に形成されることを特徴とする請求項1から11のいずれか一項に記載の方法。
- 前記弾性領域(15)が、少なくとも一つの圧縮スプリング、引張スプリング、曲げスプリング、及び/若しくはねじりスプリングに成形することにより、並びに/又は屈曲ワイヤの原理に基づくたわみ性を有した領域として、製造されることを特徴とする請求項1から12のいずれか一項に記載の方法。
- 前記スプリング式コンタクトピン(9)の端部側に、前記接触のための少なくとも一つのヘッド(12、13)が形成され、前記ヘッド(12、13)が、前記接触のための少なくとも一つの尖った先端及び/又は尖ったエッジを得ることが好ましいことを特徴とする請求項1から13のいずれか一項に記載の方法。
- 前記スプリング式コンタクトピン(9)に、少なくとも一つの除去可能な、とりわけ切断可能な結合部(24)が備えられることを特徴とする請求項1から14のいずれか一項に記載の方法。
- 複数のスプリング式コンタクトピン(9)が、前記少なくとも一つの結合部(24)を介して、とりわけ二次元又は三次元のグリッドにおいてまとまるように製造されることを特徴とする請求項1から15のいずれか一項に記載の方法。
- 前記結合部(24)が、結合バー又は結合プレート(26)、とりわけ案内プレート(27)として形成されることを特徴とする請求項1から16のいずれか一項に記載の方法。
- 前記結合部(24)を製造する、または、前記結合部(24)を前記付加製造方法に合わせて製造することを特徴とする請求項1から17のいずれか一項に記載の方法。
- 前記結合部(24)が、予め製造した供給部として用いられることを特徴とする請求項1から18のいずれか一項に記載の方法。
- 前記結合部(24)が、電気回路基板(29)、とりわけプリント基板(30)であることを特徴とする請求項1から19のいずれか一項に記載の方法。
- 前記少なくとも一つのスプリング式コンタクトピン(9)が、前記結合部(24)の電気的接触面(32)上で生成されることを特徴とする請求項1から20のいずれか一項に記載の方法。
- 前記電気的接触面(32)も金属被覆されることを特徴とする請求項1から21のいずれか一項に記載の方法。
- 少なくとも二つのスプリング式コンタクトピン(9)の間にある金属被覆が、前記両方のスプリング式コンタクトピン(9)の互いの電気絶縁のために、とりわけレーザ、集束イオンビーム、及び/又はマスキング及びエッチングによる除去(リフトオフ)によって除去されることを特徴とする請求項1から22のいずれか一項に記載の方法。
- 前記結合部(24)の前記接触面(32)上で、電気伝導性材料、好ましくは金属から成る台座部品(33)が製造/固定されること、及び、前記台座部品(33)上で前記スプリング式コンタクトピン(9)が製造され、その際、前記金属被覆が、前記台座部品(33)のうち前記ベース部(8)に隣接する領域まで広げて行われ、前記接触面(32)まで広げては行われないことを特徴とする請求項1から23のいずれか一項に記載の方法。
- 前記台座部品(33)が、前記付加製造方法において、とりわけ粉末素材の焼結、好ましくはレーザ焼結によって製造されることを特徴とする請求項1から24のいずれか一項に記載の方法。
- 前記台座部品(33)の前記製造が、前記接触面上で、とりわけ前記接触面と電気的に結合するように行われることを特徴とする請求項1から25のいずれか一項に記載の方法。
- 前記台座部品(33)が、とりわけ一体的な前記台座部品(33)の少なくとも一つの弾性構造、とりわけ弾性領域により、スプリング作用が前記接触方向に働くように製造されることを特徴とする請求項1から26のいずれか一項に記載の方法。
- 請求項1から27のいずれか一項に記載の方法に基づいて製造されたスプリング式コンタクトピン(9)又は少なくとも一つのスプリング式コンタクトピン(9)を備えたスプリング式コンタクトピン構造(25)。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102015004151.7A DE102015004151B4 (de) | 2015-03-31 | 2015-03-31 | Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften |
DE102015004151.7 | 2015-03-31 | ||
PCT/EP2016/053183 WO2016155936A2 (de) | 2015-03-31 | 2016-02-15 | Verfahren zur herstellung mindestens eines federkontaktstifts oder einer federkontaktstift-anordnung sowie entsprechende vorrichtungen |
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JP2018527552A true JP2018527552A (ja) | 2018-09-20 |
JP6830442B2 JP6830442B2 (ja) | 2021-02-17 |
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JP2017551225A Active JP6830442B2 (ja) | 2015-03-31 | 2016-02-15 | 少なくとも一つのスプリング式コンタクトピン又はスプリング式コンタクトピン構造の製造方法及び対応する装置 |
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US (1) | US10611139B2 (ja) |
EP (1) | EP3277504B1 (ja) |
JP (1) | JP6830442B2 (ja) |
KR (1) | KR101968085B1 (ja) |
CN (1) | CN107567668B (ja) |
DE (1) | DE102015004151B4 (ja) |
SG (1) | SG11201707737VA (ja) |
TW (1) | TWI613873B (ja) |
WO (1) | WO2016155936A2 (ja) |
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CN110036300B (zh) | 2016-11-30 | 2020-03-06 | 日本电产理德股份有限公司 | 接触端子、检查夹具和检查装置 |
KR101860923B1 (ko) * | 2017-05-30 | 2018-05-24 | 황동원 | 반도체 디바이스 테스트용 콘택트 및 테스트 소켓장치 |
JP6969930B2 (ja) * | 2017-08-24 | 2021-11-24 | 株式会社日本マイクロニクス | プローブ |
US11835103B2 (en) * | 2017-11-27 | 2023-12-05 | Stratasys, Inc. | Deformable body and method for the production thereof |
DE102018104262A1 (de) | 2018-02-26 | 2019-08-29 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Verfahren zur herstellung eines hochfrequenz-steckverbinders sowie zugehörige vorrichtung |
CN109633225A (zh) * | 2018-12-27 | 2019-04-16 | 深圳市海维光电科技有限公司 | 一种电路板检测用测试针的生产工艺 |
IT201900014214A1 (it) * | 2019-08-07 | 2021-02-07 | Technoprobe Spa | Metodo di fabbricazione di sonde di contatto per teste di misura di dispositivi elettronici e relativa sonda di contatto |
JP2021076486A (ja) * | 2019-11-11 | 2021-05-20 | 株式会社日本マイクロニクス | 電気的接続装置 |
US11228125B1 (en) * | 2020-06-03 | 2022-01-18 | Juniper Networks, Inc | Apparatus, system, and method for facilitating electrical continuity between sockets and warped electrical components |
TWI837460B (zh) * | 2021-02-22 | 2024-04-01 | 林昆賢 | 探針製造方法 |
EP4080684A1 (en) * | 2021-04-20 | 2022-10-26 | Preci-Dip Sa | Piston assembly and spring-loaded contact |
KR102556869B1 (ko) * | 2021-06-16 | 2023-07-18 | 주식회사 아이에스시 | 전기 접속 커넥터 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62157576A (ja) * | 1985-12-20 | 1987-07-13 | オ−ガツト・インコ−ポレ−テツド | テストプロ−ブ |
JP2004356362A (ja) * | 2003-05-29 | 2004-12-16 | Dainippon Screen Mfg Co Ltd | プローブカード製造用基板、検査装置、3次元造形装置および3次元造形方法 |
US20050189959A1 (en) * | 2003-02-04 | 2005-09-01 | Microfabrica Inc. | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
US20120218535A1 (en) * | 2011-02-25 | 2012-08-30 | Nanoscribe Gmbh | Method and device for a spatially resolved introduction of an intensity pattern comprising electro-magnetic radiation into a photosensitive substance as well as applications thereof |
WO2014090356A1 (de) * | 2012-12-11 | 2014-06-19 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Kontaktelement und verfahren zu seiner herstellung |
WO2016155937A1 (de) * | 2015-03-31 | 2016-10-06 | Feinmetall Gmbh | Verfahren zur herstellung eines kontaktabstandswandlers sowie kontaktabstandswandler |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3440110C1 (de) * | 1984-11-02 | 1986-05-28 | Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe | Verfahren zur Herstellung mechanisch trennbarer Vielfach-Verbindungen fuer den elektrischen Anschluss mikroelektronischer Bauelemente |
US4969842A (en) | 1989-11-30 | 1990-11-13 | Amp Incorporated | Molded electrical connector having integral spring contact beams |
US6029344A (en) * | 1993-11-16 | 2000-02-29 | Formfactor, Inc. | Composite interconnection element for microelectronic components, and method of making same |
US6504223B1 (en) * | 1998-11-30 | 2003-01-07 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
JP3773396B2 (ja) * | 2000-06-01 | 2006-05-10 | 住友電気工業株式会社 | コンタクトプローブおよびその製造方法 |
US6627092B2 (en) * | 2001-07-27 | 2003-09-30 | Hewlett-Packard Development Company, L.P. | Method for the fabrication of electrical contacts |
JP2003315361A (ja) * | 2002-04-26 | 2003-11-06 | Japan Electronic Materials Corp | プローブの製造方法、このプローブの製造用マスク及びプローブ |
DE10254524B4 (de) | 2002-11-22 | 2007-07-26 | Ims Connector Systems Gmbh | Verfahren zur Herstellung eines Halters mit einer Planarantenne sowie Halter für eine Planarantenne |
US7094117B2 (en) | 2004-02-27 | 2006-08-22 | Micron Technology, Inc. | Electrical contacts with dielectric cores |
US7462800B2 (en) * | 2004-12-03 | 2008-12-09 | Sv Probe Pte Ltd. | Method of shaping lithographically-produced probe elements |
CN100516885C (zh) * | 2005-03-22 | 2009-07-22 | 旺矽科技股份有限公司 | 弹性微接触元件及其制造方法 |
CN101385204A (zh) * | 2006-02-17 | 2009-03-11 | 森蒂彼得系统有限公司 | 高性能的电连接器 |
JP2008128882A (ja) * | 2006-11-22 | 2008-06-05 | Sumitomo Electric Ind Ltd | コンタクトプローブおよびその製造方法 |
KR20100045079A (ko) * | 2008-10-23 | 2010-05-03 | 허재웅 | 검사용 탐침 장치 및 그 제조 방법 |
TWI387753B (zh) * | 2008-12-12 | 2013-03-01 | King Yuan Electronics Co Ltd | 測試插座之製作方法及其所使用的彈性測試探針 |
US8324919B2 (en) * | 2009-03-27 | 2012-12-04 | Delaware Capital Formation, Inc. | Scrub inducing compliant electrical contact |
US8562359B2 (en) * | 2011-01-18 | 2013-10-22 | Tyco Electronics Corporation | Electrical contact for interconnect member |
DE102011102791A1 (de) | 2011-05-27 | 2012-11-29 | Feinmetall Gmbh | Federkontaktstiftanordnung |
CH704988A1 (de) * | 2011-06-21 | 2012-12-31 | Reichle & De Massari Fa | Stecker und Verfahren zu dessen Herstellung. |
KR20140041746A (ko) * | 2011-06-22 | 2014-04-04 | 메이코 일렉트로닉스 컴파니 리미티드 | 스파이럴 프로브 및 그 제조 방법 |
CN103630712B (zh) * | 2012-08-23 | 2016-01-27 | 技鼎股份有限公司 | 刀片状微探针结构及其制作方法 |
DE102012018635A1 (de) | 2012-09-21 | 2014-03-27 | BIAS - Bremer Institut für angewandte Strahltechnik GmbH | Verfahren zum Herstellen einer 3D-Struktur |
-
2015
- 2015-03-31 DE DE102015004151.7A patent/DE102015004151B4/de active Active
-
2016
- 2016-02-15 US US15/554,445 patent/US10611139B2/en active Active
- 2016-02-15 WO PCT/EP2016/053183 patent/WO2016155936A2/de active Application Filing
- 2016-02-15 KR KR1020177027909A patent/KR101968085B1/ko active IP Right Grant
- 2016-02-15 JP JP2017551225A patent/JP6830442B2/ja active Active
- 2016-02-15 EP EP16704626.7A patent/EP3277504B1/de active Active
- 2016-02-15 SG SG11201707737VA patent/SG11201707737VA/en unknown
- 2016-02-15 CN CN201680020289.0A patent/CN107567668B/zh active Active
- 2016-03-08 TW TW105107056A patent/TWI613873B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62157576A (ja) * | 1985-12-20 | 1987-07-13 | オ−ガツト・インコ−ポレ−テツド | テストプロ−ブ |
US20050189959A1 (en) * | 2003-02-04 | 2005-09-01 | Microfabrica Inc. | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
JP2004356362A (ja) * | 2003-05-29 | 2004-12-16 | Dainippon Screen Mfg Co Ltd | プローブカード製造用基板、検査装置、3次元造形装置および3次元造形方法 |
US20120218535A1 (en) * | 2011-02-25 | 2012-08-30 | Nanoscribe Gmbh | Method and device for a spatially resolved introduction of an intensity pattern comprising electro-magnetic radiation into a photosensitive substance as well as applications thereof |
WO2014090356A1 (de) * | 2012-12-11 | 2014-06-19 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Kontaktelement und verfahren zu seiner herstellung |
WO2016155937A1 (de) * | 2015-03-31 | 2016-10-06 | Feinmetall Gmbh | Verfahren zur herstellung eines kontaktabstandswandlers sowie kontaktabstandswandler |
Non-Patent Citations (1)
Title |
---|
ANKE WERNER, "DIP-IN LASER LITHOGRAFIE (DILL)", JPN5018001249, 19 September 2012 (2012-09-19), ISSN: 0004231979 * |
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US10611139B2 (en) | 2020-04-07 |
KR20170130449A (ko) | 2017-11-28 |
TWI613873B (zh) | 2018-02-01 |
JP6830442B2 (ja) | 2021-02-17 |
SG11201707737VA (en) | 2017-10-30 |
KR101968085B1 (ko) | 2019-04-11 |
DE102015004151B4 (de) | 2022-01-27 |
EP3277504B1 (de) | 2019-04-10 |
DE102015004151A1 (de) | 2016-10-20 |
US20180236758A1 (en) | 2018-08-23 |
WO2016155936A3 (de) | 2016-11-24 |
CN107567668B (zh) | 2020-06-26 |
CN107567668A (zh) | 2018-01-09 |
TW201707315A (zh) | 2017-02-16 |
WO2016155936A2 (de) | 2016-10-06 |
EP3277504A2 (de) | 2018-02-07 |
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