JP6830442B2 - 少なくとも一つのスプリング式コンタクトピン又はスプリング式コンタクトピン構造の製造方法及び対応する装置 - Google Patents
少なくとも一つのスプリング式コンタクトピン又はスプリング式コンタクトピン構造の製造方法及び対応する装置 Download PDFInfo
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- 239000002184 metal Substances 0.000 claims description 92
- 229910052751 metal Inorganic materials 0.000 claims description 92
- 238000000034 method Methods 0.000 claims description 75
- 238000000576 coating method Methods 0.000 claims description 66
- 239000011248 coating agent Substances 0.000 claims description 63
- 239000004033 plastic Substances 0.000 claims description 57
- 229920003023 plastic Polymers 0.000 claims description 57
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 41
- 230000008878 coupling Effects 0.000 claims description 32
- 238000010168 coupling process Methods 0.000 claims description 32
- 238000005859 coupling reaction Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 25
- 238000009713 electroplating Methods 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 238000005452 bending Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000001311 chemical methods and process Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 238000000197 pyrolysis Methods 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 4
- 238000000149 argon plasma sintering Methods 0.000 claims description 4
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 19
- 238000007689 inspection Methods 0.000 description 11
- 238000005245 sintering Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005226 mechanical processes and functions Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013499 data model Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (18)
- 電気的な接触に用いられる少なくとも一つのスプリング式コンタクトピン又は少なくとも一つの前記スプリング式コンタクトピンを備えたスプリング式コンタクトピン構成の製造方法であって、以下のステップ、すなわち
− 前記スプリング式コンタクトピン(9)の少なくとも一つのベース部(8)を製造し、その際、前記ベース部(8)の少なくとも一部分がプラスチックから製造されるステップ、及び
− その後に行われる前記ベース部(8)の少なくとも前記プラスチックから成る部分を金属被覆するステップを含み、
− その際、前記ベース部(8)の前記少なくとも一つのプラスチックから成る部分の前記製造が付加製造方法によって行われる製造方法において、
− 前記少なくとも一つのスプリング式コンタクトピン(9)が、回路基板(29)として形成された結合部(24)の電気的接触面(32)上で前記付加製造方法を用いて製造され、
− 前記付加製造方法としては、ディップインレーザリソグラフィ方法が用いられ、
− 前記結合部(24)の前記電気的接触面(32)上で、電気伝導性材料から成る台座部品(33)が設けられること、及び、前記台座部品(33)上で前記スプリング式コンタクトピン(9)が製造され、その際、前記金属被覆が、前記台座部品(33)のうち前記ベース部(8)に隣接する領域まで広げて行われ、前記電気的接触面(32)まで広げては行われないことを特徴とする製造方法。 - 前記回路基板(29)は、プリント基板(30)であることを特徴とする請求項1に記載の方法。
- 前記金属被覆が、少なくとも一つの電気めっきプロセス又は化学的プロセスにおいて行われることを特徴とする請求項1又は2に記載の方法。
- 前記ベース部(8)全体が、プラスチックから前記付加製造方法によって製造されることを特徴とする請求項1から3のいずれか一項に記載の方法。
- 前記ベース部(8)全体が金属被覆されることを特徴とする請求項1から4のいずれか一項に記載の方法。
- 前記電気めっきによる金属被覆の前に、電気伝導性を有する開始層が、前記ベース部(8)の少なくとも前記プラスチックから成る部分上に施されることを特徴とする請求項3に記載の方法。
- 前記金属被覆の前に、シード層が、前記ベース部の少なくとも前記プラスチックから成る部分上に施されることを特徴とする請求項1から5のいずれか一項に記載の方法。
- 前記金属被覆の後に、前記プラスチックから成る部分が除去されないか又は少なくとも部分的に除去されることを特徴とする請求項1から7のいずれか一項に記載の方法。
- 前記金属被覆によって形成された金属シェルには、開口部が設けられており、
前記開口部は、
前記プラスチックから成る部分が熱分解されることにより生成された熱分解生成物を漏出させるのに用いられる、
又は、
前記プラスチックから成る部分を湿式化学的若しくは乾式化学的方法で除去する際に用いられることを特徴とする請求項8に記載の方法。 - 前記スプリング式コンタクトピン(9)のスプリング機能のため、前記スプリング式コンタクトピン(9)の少なくとも一領域(15)が、前記領域(15)の材料の固有の弾性又は形状により、弾性変形することができるように形成されることを特徴とする請求項1から9のいずれか一項に記載の方法。
- 前記領域(15)が、前記スプリング式コンタクトピン(9)の残りの区間と一体的に形成されることを特徴とする請求項10に記載の方法。
- 前記領域(15)が、
圧縮スプリング、引張スプリング、曲げスプリング若しくはねじりスプリングに成形することにより、
又は、
屈曲ワイヤの原理に基づくたわみ性を有した領域として、
製造されることを特徴とする請求項10又は11に記載の方法。 - 前記スプリング式コンタクトピン(9)の端部側に、前記接触のための少なくとも一つのヘッド(12、13)が形成され、前記ヘッド(12、13)が、前記接触のための少なくとも一つの尖った先端又は尖ったエッジを有することを特徴とする請求項1から12のいずれか一項に記載の方法。
- 複数のスプリング式コンタクトピン(9)が、前記結合部(24)を介して製造されることを特徴とする請求項1から13のいずれか一項に記載の方法。
- 前記結合部(24)を前記付加製造方法において製造することを特徴とする請求項1から14のいずれか一項に記載の方法。
- 前記台座部品(33)が、前記付加製造方法において、粉末素材のレーザ焼結によって製造されることを特徴とする請求項1〜15のいずれか一項に記載の方法。
- 前記台座部品(33)の前記製造が、前記電気的接触面上で行われることを特徴とする請求項1〜16のいずれか一項に記載の方法。
- 前記台座部品(33)が、少なくとも一つの弾性構造により、スプリング作用が接触方向に働くように製造されることを特徴とする請求項1〜17のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102015004151.7A DE102015004151B4 (de) | 2015-03-31 | 2015-03-31 | Verfahren zur Herstellung einer Federkontaktstift-Anordnung mit mehreren Federkontaktstiften |
DE102015004151.7 | 2015-03-31 | ||
PCT/EP2016/053183 WO2016155936A2 (de) | 2015-03-31 | 2016-02-15 | Verfahren zur herstellung mindestens eines federkontaktstifts oder einer federkontaktstift-anordnung sowie entsprechende vorrichtungen |
Publications (2)
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JP2018527552A JP2018527552A (ja) | 2018-09-20 |
JP6830442B2 true JP6830442B2 (ja) | 2021-02-17 |
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US (1) | US10611139B2 (ja) |
EP (1) | EP3277504B1 (ja) |
JP (1) | JP6830442B2 (ja) |
KR (1) | KR101968085B1 (ja) |
CN (1) | CN107567668B (ja) |
DE (1) | DE102015004151B4 (ja) |
SG (1) | SG11201707737VA (ja) |
TW (1) | TWI613873B (ja) |
WO (1) | WO2016155936A2 (ja) |
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KR101860923B1 (ko) * | 2017-05-30 | 2018-05-24 | 황동원 | 반도체 디바이스 테스트용 콘택트 및 테스트 소켓장치 |
JP6969930B2 (ja) * | 2017-08-24 | 2021-11-24 | 株式会社日本マイクロニクス | プローブ |
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-
2015
- 2015-03-31 DE DE102015004151.7A patent/DE102015004151B4/de active Active
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2016
- 2016-02-15 US US15/554,445 patent/US10611139B2/en active Active
- 2016-02-15 WO PCT/EP2016/053183 patent/WO2016155936A2/de active Application Filing
- 2016-02-15 KR KR1020177027909A patent/KR101968085B1/ko active IP Right Grant
- 2016-02-15 JP JP2017551225A patent/JP6830442B2/ja active Active
- 2016-02-15 EP EP16704626.7A patent/EP3277504B1/de active Active
- 2016-02-15 SG SG11201707737VA patent/SG11201707737VA/en unknown
- 2016-02-15 CN CN201680020289.0A patent/CN107567668B/zh active Active
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US10611139B2 (en) | 2020-04-07 |
KR20170130449A (ko) | 2017-11-28 |
TWI613873B (zh) | 2018-02-01 |
SG11201707737VA (en) | 2017-10-30 |
JP2018527552A (ja) | 2018-09-20 |
KR101968085B1 (ko) | 2019-04-11 |
DE102015004151B4 (de) | 2022-01-27 |
EP3277504B1 (de) | 2019-04-10 |
DE102015004151A1 (de) | 2016-10-20 |
US20180236758A1 (en) | 2018-08-23 |
WO2016155936A3 (de) | 2016-11-24 |
CN107567668B (zh) | 2020-06-26 |
CN107567668A (zh) | 2018-01-09 |
TW201707315A (zh) | 2017-02-16 |
WO2016155936A2 (de) | 2016-10-06 |
EP3277504A2 (de) | 2018-02-07 |
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