JP2018523133A5 - - Google Patents

Download PDF

Info

Publication number
JP2018523133A5
JP2018523133A5 JP2018510315A JP2018510315A JP2018523133A5 JP 2018523133 A5 JP2018523133 A5 JP 2018523133A5 JP 2018510315 A JP2018510315 A JP 2018510315A JP 2018510315 A JP2018510315 A JP 2018510315A JP 2018523133 A5 JP2018523133 A5 JP 2018523133A5
Authority
JP
Japan
Prior art keywords
optical elements
offset beams
diffractive optical
optical element
acousto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018510315A
Other languages
English (en)
Japanese (ja)
Other versions
JP6678233B2 (ja
JP2018523133A (ja
Filing date
Publication date
Priority claimed from US14/982,747 external-priority patent/US9891175B2/en
Application filed filed Critical
Publication of JP2018523133A publication Critical patent/JP2018523133A/ja
Publication of JP2018523133A5 publication Critical patent/JP2018523133A5/ja
Application granted granted Critical
Publication of JP6678233B2 publication Critical patent/JP6678233B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018510315A 2015-05-08 2016-05-04 スポットの2dアレイによる斜め入射走査のシステムおよび方法 Active JP6678233B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562159173P 2015-05-08 2015-05-08
US62/159,173 2015-05-08
US14/982,747 US9891175B2 (en) 2015-05-08 2015-12-29 System and method for oblique incidence scanning with 2D array of spots
US14/982,747 2015-12-29
PCT/US2016/030838 WO2016182820A1 (en) 2015-05-08 2016-05-04 Systems and methods for oblique incidence scanning with 2d array of spots

Publications (3)

Publication Number Publication Date
JP2018523133A JP2018523133A (ja) 2018-08-16
JP2018523133A5 true JP2018523133A5 (https=) 2019-05-30
JP6678233B2 JP6678233B2 (ja) 2020-04-08

Family

ID=57221839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018510315A Active JP6678233B2 (ja) 2015-05-08 2016-05-04 スポットの2dアレイによる斜め入射走査のシステムおよび方法

Country Status (8)

Country Link
US (1) US9891175B2 (https=)
EP (1) EP3295477B1 (https=)
JP (1) JP6678233B2 (https=)
KR (1) KR102374253B1 (https=)
CN (1) CN107580677B (https=)
IL (1) IL255084B (https=)
TW (1) TWI683102B (https=)
WO (1) WO2016182820A1 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10732424B2 (en) * 2018-02-15 2020-08-04 Kla Corporation Inspection-beam shaping on a sample surface at an oblique angle of incidence
US10818005B2 (en) * 2018-03-12 2020-10-27 Kla-Tencor Corp. Previous layer nuisance reduction through oblique illumination
US10679066B2 (en) * 2018-03-22 2020-06-09 General Electric Company Best image grab from video with digital grid assistance for aviation engine borescope inspection
US12416580B2 (en) 2018-05-07 2025-09-16 Unm Rainforest Innovations Method and system for in-line optical scatterometry
US20190355110A1 (en) * 2018-05-15 2019-11-21 Camtek Ltd. Cross talk reduction
EP3803456A4 (en) * 2018-06-07 2022-03-16 Baraja Pty Ltd OPTICAL BEAM DIRECTOR
WO2019241825A1 (en) * 2018-06-21 2019-12-26 Baraja Pty Ltd An optical beam director
US11118903B2 (en) * 2018-10-17 2021-09-14 Kla Corporation Efficient illumination shaping for scatterometry overlay
WO2020168142A1 (en) * 2019-02-14 2020-08-20 Kla Corporation System and method for measuring misregistration of semiconductor device wafers utilizing induced topography
WO2021087345A1 (en) * 2019-11-01 2021-05-06 Unm Rainforest Innovations In-line angular optical multi-point scatterometry for nanomanufacturing systems
US11397153B2 (en) * 2019-12-03 2022-07-26 Kla Corporation Apparatus and method for gray field imaging
CN111624757B (zh) * 2020-06-15 2025-09-05 苏州智立洁医疗器械有限公司 一种三镜头扫描显微装置
JP7554064B2 (ja) * 2020-06-30 2024-09-19 株式会社ヴィーネックス 異物・欠陥検査装置、異物・欠陥検査における画像生成装置、及び異物・欠陥検査方法
JP7608089B2 (ja) * 2020-08-11 2025-01-06 株式会社ヴィーネックス 異物・欠陥検査装置、異物・欠陥検査における画像生成装置、及び異物・欠陥検査方法
TWI779357B (zh) * 2020-09-23 2022-10-01 南亞科技股份有限公司 偵測物品表面缺陷的方法及其系統
US11748871B2 (en) 2020-09-28 2023-09-05 KLA Corp. Alignment of a specimen for inspection and other processes
US11526086B2 (en) * 2021-03-08 2022-12-13 Kla Corporation Multi-field scanning overlay metrology
CN113552725A (zh) * 2021-07-20 2021-10-26 中国工程物理研究院激光聚变研究中心 一种激光束同轴同波面控制系统及方法
US20250341479A1 (en) * 2022-07-25 2025-11-06 Asml Netherlands B.V. Metrology system using multiple radiation spots
WO2024048800A1 (ko) * 2022-08-29 2024-03-07 (주)구일엔지니어링 웨이퍼 검사 시스템
US20240310292A1 (en) * 2023-03-14 2024-09-19 Kla Corporation Oblique uniform illumination for imaging systems
DE102023204171B4 (de) * 2023-05-05 2026-02-19 Carl Zeiss Smt Gmbh Optisches System für ein Metrologiesystem sowie Metrologiesystem mit einem derartigen optischen System
US20250219284A1 (en) * 2023-12-27 2025-07-03 Serguei Matitsine Multi-Beam Mimo Antenna Systems And Methods

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5864394A (en) 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US6341006B1 (en) 1995-04-07 2002-01-22 Nikon Corporation Projection exposure apparatus
US6081325A (en) * 1996-06-04 2000-06-27 Kla-Tencor Corporation Optical scanning system for surface inspection
US6236454B1 (en) * 1997-12-15 2001-05-22 Applied Materials, Inc. Multiple beam scanner for an inspection system
TW539845B (en) * 2000-07-27 2003-07-01 Ebara Corp Sheet beam-type inspection device
JP4472931B2 (ja) 2001-05-03 2010-06-02 ケーエルエー−テンカー コーポレイション 光ビームに試料全体を走査させるためのシステムおよび方法
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner
US7489393B2 (en) 2005-03-02 2009-02-10 Kla-Tencor Technologies Corporation Enhanced simultaneous multi-spot inspection and imaging
US7385688B1 (en) * 2005-06-22 2008-06-10 Kla-Tencor Technologies Corp. Multi-spot illumination and collection optics for highly tilted wafer planes
US8525138B2 (en) 2006-03-31 2013-09-03 Energetiq Technology, Inc. Laser-driven light source
US7705331B1 (en) 2006-06-29 2010-04-27 Kla-Tencor Technologies Corp. Methods and systems for providing illumination of a specimen for a process performed on the specimen
US7728969B2 (en) 2006-12-05 2010-06-01 Kla-Tencor Technologies Corp. Methods and systems for identifying defect types on a wafer
US8194301B2 (en) * 2008-03-04 2012-06-05 Kla-Tencor Corporation Multi-spot scanning system and method
JP2009236819A (ja) * 2008-03-28 2009-10-15 Topcon Corp 光学装置、フォトマスク検査装置および露光装置
DE112010000850B4 (de) 2009-02-13 2017-04-06 Kla-Tencor Corp. Verfahren und Vorrichtung zum Aufrechterhalten und Erzeugen eines Plasmas
CN102269858A (zh) * 2010-06-02 2011-12-07 北京智朗芯光科技有限公司 自动聚焦系统和自动聚焦方法
US8462329B2 (en) 2010-07-30 2013-06-11 Kla-Tencor Corp. Multi-spot illumination for wafer inspection
US9599805B2 (en) 2011-10-19 2017-03-21 National Synchrotron Radiation Research Center Optical imaging system using structured illumination
US9927094B2 (en) 2012-01-17 2018-03-27 Kla-Tencor Corporation Plasma cell for providing VUV filtering in a laser-sustained plasma light source
US9390892B2 (en) 2012-06-26 2016-07-12 Kla-Tencor Corporation Laser sustained plasma light source with electrically induced gas flow
US8796652B2 (en) 2012-08-08 2014-08-05 Kla-Tencor Corporation Laser sustained plasma bulb including water
US9945792B2 (en) * 2012-12-19 2018-04-17 Kla-Tencor Corporation Generating an array of spots on inclined surfaces
US8995746B2 (en) 2013-03-15 2015-03-31 KLA—Tencor Corporation Image synchronization of scanning wafer inspection system
US9395340B2 (en) * 2013-03-15 2016-07-19 Kla-Tencor Corporation Interleaved acousto-optical device scanning for suppression of optical crosstalk
WO2015055387A1 (en) 2013-10-17 2015-04-23 Asml Netherlands B.V. Photon source, metrology apparatus, lithographic system and device manufacturing method

Similar Documents

Publication Publication Date Title
JP2018523133A5 (https=)
JP6678233B2 (ja) スポットの2dアレイによる斜め入射走査のシステムおよび方法
TWI892023B (zh) 疊對度量衡系統及方法
JP6346615B2 (ja) 光学顕微鏡および顕微鏡観察方法
US9764424B2 (en) Method and arrangement for forming a structuring on surfaces of components by means of a laser beam
US6195202B1 (en) Laser microscope and a pattern inspection apparatus using such laser microscope
US6248988B1 (en) Conventional and confocal multi-spot scanning optical microscope
CN108802989B (zh) 一种并行多区域成像装置
US6809808B2 (en) Wafer defect detection system with traveling lens multi-beam scanner
EP3488221B1 (en) An integrated lens free imaging device
US9316536B2 (en) Spatial frequency reproducing apparatus and optical distance measuring apparatus
KR102052414B1 (ko) 반사 위상 현미경
CN111936817B (zh) 测距单元及光照射装置
CN108885336A (zh) 用于研究样品的方法和显微镜
JP2009086669A5 (https=)
CN110967958A (zh) 一种基于多狭缝扩展记录频域全息成像的方法及装置
JP6076618B2 (ja) 光学的分解能向上装置
JP5548505B2 (ja) コヒーレント放射を一様化するための装置
US7528940B2 (en) System and method for inspecting an object using an acousto-optic device
JP6239166B2 (ja) 光学的分解能向上装置
NL2034478B1 (en) An aberration compensating unit and method, and a light optical device comprising such a unit.
JP6187761B2 (ja) 顕微分光システム
RU2574863C1 (ru) Многоканальный конфокальный микроскоп (варианты)
JP2023124463A (ja) 撮像装置、および、撮像方法
WO2019065271A1 (ja) 共焦点顕微鏡及び画像化システム