JP2018517593A - プリントヘッド - Google Patents
プリントヘッド Download PDFInfo
- Publication number
- JP2018517593A JP2018517593A JP2017565986A JP2017565986A JP2018517593A JP 2018517593 A JP2018517593 A JP 2018517593A JP 2017565986 A JP2017565986 A JP 2017565986A JP 2017565986 A JP2017565986 A JP 2017565986A JP 2018517593 A JP2018517593 A JP 2018517593A
- Authority
- JP
- Japan
- Prior art keywords
- sliver
- printhead
- inkjet
- die
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000007639 printing Methods 0.000 claims abstract description 35
- 239000008393 encapsulating agent Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000012530 fluid Substances 0.000 description 51
- 239000000976 ink Substances 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 20
- 229910052710 silicon Inorganic materials 0.000 description 20
- 239000010703 silicon Substances 0.000 description 20
- 229920006336 epoxy molding compound Polymers 0.000 description 18
- 238000010586 diagram Methods 0.000 description 13
- 239000011521 glass Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 229920001486 SU-8 photoresist Polymers 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 238000004448 titration Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000000347 anisotropic wet etching Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000013060 biological fluid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000002650 laminated plastic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 238000011160 research Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/155—Arrangement thereof for line printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/20—Modules
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【選択図】図1
Description
Claims (15)
- 成形可能な基板内に成形された複数のインクジェットスライバと、
前記インクジェットスライバをサイドコネクタに電気的に結合する複数のワイヤーボンド
を備えるプリントヘッドであって、
前記オーバーモールドされたインクジェットスライバは、少なくとも1つのプリントヘッドダイを形成し、
前記サイドコネクタは、前記インクジェットスライバを印刷装置のコントローラに電気的に結合することからなる、プリントヘッド。 - 前記サイドコネクタは、プリント基板(PCB)サイドコネクタである、請求項1のプリントヘッド。
- 前記PCBサイドコネクタは、前記成形可能な基板内に成形される、請求項2のプリントヘッド。
- 前記サイドコネクタは、前記成形可能な基板に埋め込まれたリードフレームを有し、
前記リードフレームは、
前記ワイヤーボンドからの複数の電気トレースと、
前記電気トレースに結合された複数の接続パッド
を備え、
前記接続パッドは、前記インクジェットスライバを前記印刷装置の前記コントローラに電気的に結合することからなる、請求項1のプリントヘッド。 - 前記ワイヤーボンド上に配置された封入カバーをさらに備える、請求項1のプリントヘッド。
- 前記成形可能な基板は、エポキシモールドコンパウンド(EMC)である。請求項1のプリントヘッド。
- 前記サイドコネクタは、前記インクジェットスライバの各々のエッジにおいて、該インクジェットスライバに電気的に結合される、請求項1のプリントヘッド。
- 成形可能な基板と、
前記成形可能な基板内に成形された複数のインクジェットスライバと、
前記スライバを、前記成形可能な基板に結合されたエッジコネクタに接続する複数の電気リード線
を備えるプリントヘッドダイ。 - 前記エッジコネクタが、
前記成形可能な基板に埋め込まれたプリント基板(PCB)と、
前記PCBを前記インクジェットスライバに前記リード線を介して結合するために前記PCBに結合された第1の組のコネクタと、
前記PCBをプリンタコントローラに結合するために前記PCBに結合された第2の組のコネクタ
を備えることからなる、請求項8のプリントヘッドダイ。 - 前記ワイヤーボンド上に配置された封入材料をさらに備える、請求項8のプリントヘッドダイ。
- 前記封入材料のロープロファイルを維持するために、前記封入材料上に配置された保護膜をさらに備える、請求項10のプリントヘッドダイ。
- プリントヘッドを製造する方法であって、
複数のインクジェットスライバを成形可能な基板内にオーバーモールドするステップであって、該オーバーモールドされたインクジェットスライバは少なくとも1つのプリントヘッドダイを形成することからなる、ステップと、
複数のワイヤーボンドの第1の端部を前記インクジェットスライバに電気的に結合するステップと、
前記ワイヤーボンドの第2の端部を、前記プリントヘッドのエッジに結合されたサイドコネクタに電気的に結合するステップ
を含む方法。 - オーバーモールドする前記ステップが、前記複数のインクジェットスライバと共にプリント基板(PCB)を前記成形可能な基板内にオーバーモールドすることを含む、請求項12の方法。
- 前記ワイヤーボンドを環境にさらさないようにするために、前記ワイヤーボンドを封入材料で封入するステップをさらに含む、請求項12の方法。
- 前記封入材料のロープロファイルを維持するために、前記封入材料上に保護膜を配置するステップをさらに含む、請求項14の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/055109 WO2017065728A1 (en) | 2015-10-12 | 2015-10-12 | Printhead |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018517593A true JP2018517593A (ja) | 2018-07-05 |
JP6659738B2 JP6659738B2 (ja) | 2020-03-04 |
Family
ID=58518511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017565986A Active JP6659738B2 (ja) | 2015-10-12 | 2015-10-12 | プリントヘッド |
Country Status (6)
Country | Link |
---|---|
US (2) | US10471714B2 (ja) |
EP (1) | EP3291991B1 (ja) |
JP (1) | JP6659738B2 (ja) |
KR (2) | KR102131318B1 (ja) |
CN (1) | CN107949481B (ja) |
WO (1) | WO2017065728A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6992079B2 (ja) | 2017-04-23 | 2022-01-13 | ヒューレット-パッカード デベロップメント カンパニー エル.ピー. | 粒子分離 |
BR112019017673A2 (pt) * | 2017-04-24 | 2020-06-30 | Hewlett-Packard Development Company, L.P. | matriz de ejeção de fluido moldada em corpo moldado |
CN110770031A (zh) * | 2017-07-26 | 2020-02-07 | 惠普发展公司,有限责任合伙企业 | 管芯接触结构 |
JP6967151B2 (ja) | 2017-07-31 | 2021-11-17 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 内蔵されたクロスチャネルを有する流体射出ダイ |
CN110891792B (zh) * | 2017-07-31 | 2021-06-01 | 惠普发展公司,有限责任合伙企业 | 具有封闭式横向通道的流体喷射装置 |
CN110920251B (zh) * | 2018-09-19 | 2021-03-12 | 精工爱普生株式会社 | 打印头、及液体喷出装置 |
EP3727864A1 (en) | 2019-02-06 | 2020-10-28 | Hewlett-Packard Development Company, L.P. | Fluid ejection devices including electrical interconnect elements for fluid ejection dies |
EP3990286A4 (en) * | 2019-06-25 | 2023-04-26 | Hewlett-Packard Development Company, L.P. | CAST STRUCTURES WITH CHANNELS |
WO2020263234A1 (en) | 2019-06-25 | 2020-12-30 | Hewlett-Packard Development Company, L.P. | Molded structures with channels |
WO2023140856A1 (en) * | 2022-01-21 | 2023-07-27 | Hewlett-Packard Development Company, L.P. | Polymer based conductive paths for fluidic dies |
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2015
- 2015-10-12 KR KR1020197028545A patent/KR102131318B1/ko active IP Right Grant
- 2015-10-12 WO PCT/US2015/055109 patent/WO2017065728A1/en active Application Filing
- 2015-10-12 CN CN201580082481.8A patent/CN107949481B/zh active Active
- 2015-10-12 US US15/748,914 patent/US10471714B2/en active Active
- 2015-10-12 KR KR1020187003872A patent/KR20180056638A/ko active Search and Examination
- 2015-10-12 EP EP15906339.5A patent/EP3291991B1/en active Active
- 2015-10-12 JP JP2017565986A patent/JP6659738B2/ja active Active
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2019
- 2019-10-07 US US16/595,015 patent/US11020967B2/en active Active
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JPH06316065A (ja) * | 1993-05-10 | 1994-11-15 | Brother Ind Ltd | インク噴射装置 |
JP2004228142A (ja) * | 2003-01-20 | 2004-08-12 | Fujitsu Ltd | 半導体素子およびマルチチップパッケージ |
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WO2014133600A1 (en) * | 2013-02-28 | 2014-09-04 | Hewlett-Packard Development Company, L.P. | Molded printhead |
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US20190001676A1 (en) | 2019-01-03 |
US11020967B2 (en) | 2021-06-01 |
EP3291991A4 (en) | 2018-12-26 |
EP3291991A1 (en) | 2018-03-14 |
KR102131318B1 (ko) | 2020-08-05 |
WO2017065728A1 (en) | 2017-04-20 |
EP3291991B1 (en) | 2021-12-01 |
CN107949481B (zh) | 2021-01-05 |
KR20190112863A (ko) | 2019-10-07 |
US10471714B2 (en) | 2019-11-12 |
US20200031126A1 (en) | 2020-01-30 |
KR20180056638A (ko) | 2018-05-29 |
JP6659738B2 (ja) | 2020-03-04 |
CN107949481A (zh) | 2018-04-20 |
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