JP2018513545A - 半導体装置および半導体装置の製造方法 - Google Patents
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Abstract
Description
実施の形態1にかかる半導体装置のエッジ終端領域の構造について説明する。図1は、実施の形態1にかかる半導体装置のエッジ終端領域の構造を示す断面図である。図1には、活性領域11とエッジ終端領域12との境界付近からチップ端部までの構造を示す(図2〜9,14〜25,29〜34においても同様)。図1に示す実施の形態1にかかる半導体装置は、活性領域11の周囲を囲むエッジ終端領域12に、トレンチ22の内部に埋め込んだ絶縁膜(以下、埋め込み絶縁膜とする)23と、当該埋め込み絶縁膜23の内部に埋め込んだFP(フィールドプレート)25と、からなる耐圧構造を備える。活性領域11は、オン状態のときに電流が流れる領域である。
次に、実施の形態2にかかる半導体装置の構造について説明する。図14A,14Bは、実施の形態2にかかる半導体装置の構造を示す断面図である。実施の形態2にかかる半導体装置が実施の形態1にかかる半導体装置と異なる点は、基体おもて面から深くなるにしたがって、FP45とトレンチ22の内側の側壁22aとの距離w3を広くした点である。すなわち、FP45は、基体おもて面から深くなるにしたがってトレンチ22の内側の側壁22aから離れるように外側に湾曲している。
次に、実施の形態3にかかる半導体装置の構造について説明する。図21A,21Bは、実施の形態3にかかる半導体装置の構造を示す断面図である。図21Bには、図21Aの一部を拡大して示す。実施の形態3にかかる半導体装置が実施の形態2にかかる半導体装置と異なる点は、埋め込み絶縁膜23の内部において、FP(以下、第1FPとする)45の外側にさらにFP(以下、第2FPとする)47を備える点である。第2FP47は、基体おもて面から深くなるにしたがってトレンチ22の外側の側壁22bから離れるように内側に湾曲している。第2FP47は、第1FP45とは電気的に接続せず、離間する。第2FP47は、n型チャネルストッパー領域21に電気的に接続する。
次に、実施の形態4にかかる半導体装置の構造について説明する。図29は、実施の形態4にかかる半導体装置の構造を示す断面図である。実施の形態4にかかる半導体装置が実施の形態3にかかる半導体装置と異なる点は、第2FP49の深さを第1FP45の深さよりも深くした点である。すなわち、第2FP49を埋め込んだ第2溝48の深さD3は、第1FP45を埋め込んだ第1溝44の深さD2よりも深い。実施の形態4にかかる半導体装置の第2溝48の深さD3以外の構成は、実施の形態3にかかる半導体装置と同様である。
次に、実施の形態5にかかる半導体装置の構造について説明する。図34は、実施の形態5にかかる半導体装置の構造を示す断面図である。実施の形態5にかかる半導体装置が実施の形態2にかかる半導体装置と異なる点は、n-型ドリフト領域2の、トレンチ22の外側の側壁22bに沿った部分にn型領域81を設けた点である。
2 n-型ドリフト領域
3 p型領域
3a 外側端部
4 おもて面電極
5 層間絶縁膜
6 裏面電極
10 半導体基体
11 活性領域
12 エッジ終端領域
20 活性領域の主接合
21 n型チャネルストッパー領域
22 トレンチ
22a,22b トレンチの側壁
22c トレンチの底面
22d トレンチの中心位置
23 埋め込み絶縁膜
24,44,46,48,51,71,73 溝
25,45,47,49 FP
31 犠牲酸化膜
32 LTO膜
44a,44b,46a,46b,51a,51b 溝の側壁
44c,46c 溝の底面
44d,46d 溝の底面のコーナー部
52,72,74 金属膜
61〜63 空乏層
61a,81 n型領域
D1 トレンチの深さ
D2,D3 溝の深さ
w1 トレンチの幅
w2,w4 溝の幅
w3 FPとトレンチの内側の側壁との距離
w5 溝の底面の内側のコーナー部間の距離
θ1 溝の底面の内側のコーナー部を通る接線と基体おもて面との角度
θ2 溝の底面の外側のコーナー部を通る接線と基体おもて面との角度
Claims (12)
- 活性領域よりも外側に設けられ、半導体基板の第1主面から所定深さに達するトレンチと、
前記半導体基板の第1主面側に設けられ、前記活性領域から外側に延在し前記トレンチで終端する第1導電型領域と第2導電型領域との間のpn接合と、
前記トレンチの内部に埋め込まれた絶縁膜と、
前記絶縁膜の内部に設けられた、深さ方向に長い第1フィールドプレートと、
前記第2導電型領域および前記第1フィールドプレートに接する第1電極と、
前記半導体基板の第2主面に設けられた第2電極と、
を備え、
前記第1フィールドプレートと前記トレンチの内側の側壁との距離は、前記第1フィールドプレートの幅よりも広く、
前記第1フィールドプレートは、前記半導体基板の第1主面から深くなるにしたがって前記トレンチの内側の側壁から離れるように湾曲していることを特徴とする半導体装置。 - 前記第1フィールドプレートと前記トレンチの内側の側壁との距離は、前記半導体基板の第2主面側で前記第1フィールドプレートの幅よりも広いことを特徴とする請求項1に記載の半導体装置。
- 前記第1フィールドプレートの深さは、前記半導体基板の第1主面から前記pn接合よりも深く、かつ前記トレンチよりも浅いことを特徴とする請求項1または2に記載の半導体装置。
- 前記第1フィールドプレートの深さは、前記トレンチの深さの30%以上70%以下であることを特徴とする請求項3に記載の半導体装置。
- 前記絶縁膜の内部に設けられた、深さ方向に長い第2フィールドプレートをさらに備え、
前記第2フィールドプレートは、前記第1フィールドプレートよりも外側に前記第1フィールドプレートと離して配置されていることを特徴とする請求項1〜4のいずれか一つに記載の半導体装置。 - 前記第2フィールドプレートは、前記半導体基板の第1主面から深くなるにしたがって前記トレンチの外側の側壁から離れるように湾曲していることを特徴とする請求項1〜5のいずれか一つに記載の半導体装置。
- 前記第2フィールドプレートの深さは、前記第1フィールドプレートの深さよりも深いことを特徴とする請求項5または6に記載の半導体装置。
- 前記半導体基板の第1主面に設けられた前記第1電極に接する前記第2導電型領域と、
前記半導体基板の第2主面に設けられた前記第2電極に接する支持基板と、
前記第2導電型領域と前記支持基板との間の前記第1導電型領域と、で前記半導体基板が構成され、
前記トレンチは、前記pn接合から、前記第1導電型領域の厚さの30%以上、前記第1導電型領域の厚さ未満の深さに達することを特徴とする請求項1〜7のいずれか一つに記載の半導体装置。 - 前記トレンチの幅は、前記トレンチの深さの30%以上60%以下であることを特徴とする請求項1〜8のいずれか一つに記載の半導体装置。
- 半導体基板の第1主面側に、活性領域から外側に延在するように第1導電型領域と第2導電型領域との間のpn接合を形成する第1工程と、
前記活性領域よりも外側に、前記半導体基板の第1主面から所定深さに達し、かつ前記pn接合が終端するトレンチを形成する第2工程と、
前記トレンチの内部に、U字状の断面形状の溝が残るように絶縁膜を埋め込む第3工程と、
前記溝に沿って金属膜を形成する第4工程と、
前記金属膜を選択的に除去し、前記金属膜の残部を第1フィールドプレートとして前記溝の内側の側壁に残す第5工程と、
前記トレンチの内部に、前記第1フィールドプレートを覆うようにさらに前記絶縁膜を埋め込む第6工程と、
を含み、
前記第1フィールドプレートは、前記半導体基板の第1主面から深くなるにしたがって前記トレンチの内側の側壁から離れるように湾曲していることを特徴とする半導体装置の製造方法。 - 前記第4工程の後、前記第5工程の前に、前記金属膜の上に反射防止膜を形成する工程をさらに含み、
前記第5工程は、
前記反射防止膜の上にレジスト膜を塗布する工程と、
前記レジスト膜を露光して、前記第1フィールドプレートの形成領域を覆うレジストマスクを形成する工程と、
前記レジストマスクをマスクとしてエッチングを行い、前記金属膜の残部を前記第1フィールドプレートとして前記溝の内側の側壁に残す工程と、を含むことを特徴とする請求項10に記載の半導体装置の製造方法。 - 前記第5工程では、さらに、前記第1フィールドプレートと離して、前記金属膜の残部を第2フィールドプレートとして前記溝の外側の側壁に残すことを特徴とする請求項10に記載の半導体装置の製造方法。
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