JP2018512738A5 - - Google Patents

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JP2018512738A5
JP2018512738A5 JP2017552449A JP2017552449A JP2018512738A5 JP 2018512738 A5 JP2018512738 A5 JP 2018512738A5 JP 2017552449 A JP2017552449 A JP 2017552449A JP 2017552449 A JP2017552449 A JP 2017552449A JP 2018512738 A5 JP2018512738 A5 JP 2018512738A5
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wafer shape
controller
overlay
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JP2017552449A
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JP6762317B2 (ja
JP2018512738A (ja
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別の実施形態では、チャックされた状態の基板の面内歪みを取得すると、コントローラ１１２（または別のコントローラ）は、この情報を用いて、下流の計測ツール１１５に情報をフィードフォワードしてもよい。例えば、面内歪み情報を（その他のウェハ形状情報とともに）、オーバーレイ高度プロセス制御（ＡＰＣ）ループでのフィードフォワード制御スキームに用いてもよい。オーバーレイの誤差を予測するためのウェハ形状解析の使用については、２０１４年９月１８日に出願された、Ｖｕｋｋａｄａｌａ他による米国特許出願公開第２０１５／０１２０２１６号に記載されており、同出願は全体の参照により本明細書に組み込まれる。
JP2017552449A 2015-04-06 2016-04-06 基板の面内歪みを検査する方法およびシステム Active JP6762317B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562143708P 2015-04-06 2015-04-06
US62/143,708 2015-04-06
US15/091,021 2016-04-05
US15/091,021 US10024654B2 (en) 2015-04-06 2016-04-05 Method and system for determining in-plane distortions in a substrate
PCT/US2016/026148 WO2016164415A1 (en) 2015-04-06 2016-04-06 Method and system for determining in-plane distortions in a substrate

Publications (3)

Publication Number Publication Date
JP2018512738A JP2018512738A (ja) 2018-05-17
JP2018512738A5 true JP2018512738A5 (ja) 2019-05-16
JP6762317B2 JP6762317B2 (ja) 2020-09-30

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JP2017552449A Active JP6762317B2 (ja) 2015-04-06 2016-04-06 基板の面内歪みを検査する方法およびシステム

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US (1) US10024654B2 (ja)
JP (1) JP6762317B2 (ja)
KR (1) KR102353250B1 (ja)
CN (1) CN107431030B (ja)
SG (1) SG11201708137VA (ja)
TW (1) TWI661175B (ja)
WO (1) WO2016164415A1 (ja)

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EP3457213A1 (en) * 2017-09-18 2019-03-20 ASML Netherlands B.V. Methods and apparatus for use in a device manufacturing method
US11300889B2 (en) 2018-08-22 2022-04-12 Asml Netherlands B.V. Metrology apparatus
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TWI731760B (zh) * 2020-07-28 2021-06-21 亞亞科技股份有限公司 電路板翹曲檢測裝置
CN113203357B (zh) * 2021-04-09 2022-08-09 中国科学院上海光学精密机械研究所 一种双侧斐索干涉仪检测装置
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WO2023219982A1 (en) * 2022-05-13 2023-11-16 Applied Materials, Inc. Dose mapping using substrate curvature to compensate for out-of-plane distortion
CN117238812B (zh) * 2023-11-10 2024-04-05 四川省农业机械科学研究院 基板翘曲测量装置及测量方法

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