JP2018511806A - ファラデーケージを用いた集積回路（ｉｃ）テストソケット - Google Patents

ファラデーケージを用いた集積回路（ｉｃ）テストソケット Download PDF

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Publication number
JP2018511806A
JP2018511806A JP2017551649A JP2017551649A JP2018511806A JP 2018511806 A JP2018511806 A JP 2018511806A JP 2017551649 A JP2017551649 A JP 2017551649A JP 2017551649 A JP2017551649 A JP 2017551649A JP 2018511806 A JP2018511806 A JP 2018511806A
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JP
Japan
Prior art keywords
test socket
shield
base
recess
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017551649A
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English (en)
Japanese (ja)
Inventor
ランダ，ビクター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xcerra Corp
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of JP2018511806A publication Critical patent/JP2018511806A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP2017551649A 2015-04-01 2015-04-01 ファラデーケージを用いた集積回路（ｉｃ）テストソケット Pending JP2018511806A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/023839 WO2016160009A1 (fr) 2015-04-01 2015-04-01 Prise de test de circuit intégré (ci) avec arrière-plan formant cage de faraday

Publications (1)

Publication Number Publication Date
JP2018511806A true JP2018511806A (ja) 2018-04-26

Family

ID=57007062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017551649A Pending JP2018511806A (ja) 2015-04-01 2015-04-01 ファラデーケージを用いた集積回路（ｉｃ）テストソケット

Country Status (7)

Country Link
EP (1) EP3278118A4 (fr)
JP (1) JP2018511806A (fr)
KR (1) KR20170134612A (fr)
CN (1) CN107683416A (fr)
PH (1) PH12017501810A1 (fr)
SG (1) SG11201708108VA (fr)
WO (1) WO2016160009A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10037933B2 (en) * 2014-06-20 2018-07-31 Xcerra Corporation Test socket assembly and related methods

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203329B1 (en) * 1995-07-07 2001-03-20 Johnstech International Corporation Impedance controlled interconnection device
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
US6515870B1 (en) * 2000-11-27 2003-02-04 Intel Corporation Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
JP2004006199A (ja) * 2001-12-27 2004-01-08 Moldec Kk 集積回路用コネクタと、集積回路装着用組立体
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
US7553189B2 (en) * 2007-10-22 2009-06-30 Hon Hai Precision Industry Co., Ltd. Electrical socket for interconnecting camera module with substrate
JP2010003511A (ja) * 2008-06-19 2010-01-07 Yokowo Co Ltd Ｉｃパッケージ検査用ソケット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288083A (ja) * 1989-04-26 1990-11-28 Mitsubishi Electric Corp Ｉｃソケット
GB2325358B (en) * 1997-05-12 1999-06-16 Advantest Corp Semiconductor device testing apparatus
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
CN100508301C (zh) * 2004-06-10 2009-07-01 Fci亚洲技术有限公司 用于ic卡的插座连接器组件和ic卡连接器
JP4905876B2 (ja) * 2005-10-31 2012-03-28 日本発條株式会社 導電性接触子ホルダの製造方法および導電性接触子ホルダ
US7601009B2 (en) * 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
JP4516938B2 (ja) * 2006-06-16 2010-08-04 Ｓｍｋ株式会社 電子部品取付用ソケット
TWI382193B (zh) * 2009-02-17 2013-01-11 Quanta Comp Inc 測試系統以及測試方法
JP2012243487A (ja) * 2011-05-18 2012-12-10 Alps Electric Co Ltd 電子部品用ソケット

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203329B1 (en) * 1995-07-07 2001-03-20 Johnstech International Corporation Impedance controlled interconnection device
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6515870B1 (en) * 2000-11-27 2003-02-04 Intel Corporation Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
JP2004006199A (ja) * 2001-12-27 2004-01-08 Moldec Kk 集積回路用コネクタと、集積回路装着用組立体
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
US7553189B2 (en) * 2007-10-22 2009-06-30 Hon Hai Precision Industry Co., Ltd. Electrical socket for interconnecting camera module with substrate
JP2010003511A (ja) * 2008-06-19 2010-01-07 Yokowo Co Ltd Ｉｃパッケージ検査用ソケット

Also Published As

Publication number Publication date
PH12017501810A1 (en) 2018-04-23
EP3278118A4 (fr) 2019-01-16
EP3278118A1 (fr) 2018-02-07
WO2016160009A1 (fr) 2016-10-06
CN107683416A (zh) 2018-02-09
SG11201708108VA (en) 2017-10-30
KR20170134612A (ko) 2017-12-06

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