EP3278118A4 - Prise de test de circuit intégré (ci) avec arrière-plan formant cage de faraday - Google Patents

Prise de test de circuit intégré (ci) avec arrière-plan formant cage de faraday Download PDF

Info

Publication number
EP3278118A4
EP3278118A4 EP15888016.1A EP15888016A EP3278118A4 EP 3278118 A4 EP3278118 A4 EP 3278118A4 EP 15888016 A EP15888016 A EP 15888016A EP 3278118 A4 EP3278118 A4 EP 3278118A4
Authority
EP
European Patent Office
Prior art keywords
integrated circuit
test socket
faraday cage
cage background
background
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15888016.1A
Other languages
German (de)
English (en)
Other versions
EP3278118A1 (fr
Inventor
Victor Landa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xcerra Corp
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of EP3278118A1 publication Critical patent/EP3278118A1/fr
Publication of EP3278118A4 publication Critical patent/EP3278118A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
EP15888016.1A 2015-04-01 2015-04-01 Prise de test de circuit intégré (ci) avec arrière-plan formant cage de faraday Withdrawn EP3278118A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/023839 WO2016160009A1 (fr) 2015-04-01 2015-04-01 Prise de test de circuit intégré (ci) avec arrière-plan formant cage de faraday

Publications (2)

Publication Number Publication Date
EP3278118A1 EP3278118A1 (fr) 2018-02-07
EP3278118A4 true EP3278118A4 (fr) 2019-01-16

Family

ID=57007062

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15888016.1A Withdrawn EP3278118A4 (fr) 2015-04-01 2015-04-01 Prise de test de circuit intégré (ci) avec arrière-plan formant cage de faraday

Country Status (7)

Country Link
EP (1) EP3278118A4 (fr)
JP (1) JP2018511806A (fr)
KR (1) KR20170134612A (fr)
CN (1) CN107683416A (fr)
PH (1) PH12017501810A1 (fr)
SG (1) SG11201708108VA (fr)
WO (1) WO2016160009A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017518505A (ja) * 2014-06-20 2017-07-06 エクセラ・コーポレーションＸｃｅｒｒａ Ｃｏｒｐ． テストソケットアセンブリおよび関連する方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288083A (ja) * 1989-04-26 1990-11-28 Mitsubishi Electric Corp Ｉｃソケット
EP0752741A1 (fr) * 1995-07-07 1997-01-08 Johnstech International Corporation Dispositf d'interconnexion à impédance contrÔlé
US6104204A (en) * 1997-05-12 2000-08-15 Advantest Corporation Semiconductor device testing apparatus
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
JP2004006199A (ja) * 2001-12-27 2004-01-08 Moldec Kk 集積回路用コネクタと、集積回路装着用組立体
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
US20070269999A1 (en) * 2006-05-18 2007-11-22 Centipede Systems, Inc. Socket for an electronic device
EP1950571A1 (fr) * 2005-10-31 2008-07-30 NHK Spring Company Limited Procede de fabrication d'un support de contact conducteur et support de contact conducteur
EP2031710A1 (fr) * 2006-06-16 2009-03-04 Sony Corporation Prise pour monter un composant électronique
US20090104797A1 (en) * 2007-10-22 2009-04-23 Hon Hai Precision Industry Co., Ltd. Electrical socket
US20100207638A1 (en) * 2009-02-17 2010-08-19 Quanta Computer, Inc. Testing System and Testing Method
JP2012243487A (ja) * 2011-05-18 2012-12-10 Alps Electric Co Ltd 電子部品用ソケット

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6515870B1 (en) * 2000-11-27 2003-02-04 Intel Corporation Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
CN100508301C (zh) * 2004-06-10 2009-07-01 Fci亚洲技术有限公司 用于ic卡的插座连接器组件和ic卡连接器
JP2010003511A (ja) * 2008-06-19 2010-01-07 Yokowo Co Ltd Ｉｃパッケージ検査用ソケット

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288083A (ja) * 1989-04-26 1990-11-28 Mitsubishi Electric Corp Ｉｃソケット
EP0752741A1 (fr) * 1995-07-07 1997-01-08 Johnstech International Corporation Dispositf d'interconnexion à impédance contrÔlé
US6104204A (en) * 1997-05-12 2000-08-15 Advantest Corporation Semiconductor device testing apparatus
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
JP2004006199A (ja) * 2001-12-27 2004-01-08 Moldec Kk 集積回路用コネクタと、集積回路装着用組立体
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
EP1950571A1 (fr) * 2005-10-31 2008-07-30 NHK Spring Company Limited Procede de fabrication d'un support de contact conducteur et support de contact conducteur
US20070269999A1 (en) * 2006-05-18 2007-11-22 Centipede Systems, Inc. Socket for an electronic device
EP2031710A1 (fr) * 2006-06-16 2009-03-04 Sony Corporation Prise pour monter un composant électronique
US20090104797A1 (en) * 2007-10-22 2009-04-23 Hon Hai Precision Industry Co., Ltd. Electrical socket
US20100207638A1 (en) * 2009-02-17 2010-08-19 Quanta Computer, Inc. Testing System and Testing Method
JP2012243487A (ja) * 2011-05-18 2012-12-10 Alps Electric Co Ltd 電子部品用ソケット

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016160009A1 *

Also Published As

Publication number Publication date
KR20170134612A (ko) 2017-12-06
EP3278118A1 (fr) 2018-02-07
JP2018511806A (ja) 2018-04-26
SG11201708108VA (en) 2017-10-30
CN107683416A (zh) 2018-02-09
WO2016160009A1 (fr) 2016-10-06
PH12017501810A1 (en) 2018-04-23

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