SG11201708108VA - Integrated circuit (ic) test socket with faraday cage background - Google Patents

Integrated circuit (ic) test socket with faraday cage background

Info

Publication number
SG11201708108VA
SG11201708108VA SG11201708108VA SG11201708108VA SG11201708108VA SG 11201708108V A SG11201708108V A SG 11201708108VA SG 11201708108V A SG11201708108V A SG 11201708108VA SG 11201708108V A SG11201708108V A SG 11201708108VA SG 11201708108V A SG11201708108V A SG 11201708108VA
Authority
SG
Singapore
Prior art keywords
integrated circuit
test socket
faraday cage
cage background
background
Prior art date
Application number
SG11201708108VA
Inventor
Victor Landa
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of SG11201708108VA publication Critical patent/SG11201708108VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
SG11201708108VA 2015-04-01 2015-04-01 Integrated circuit (ic) test socket with faraday cage background SG11201708108VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/023839 WO2016160009A1 (en) 2015-04-01 2015-04-01 Integrated circuit (ic) test socket with faraday cage background

Publications (1)

Publication Number Publication Date
SG11201708108VA true SG11201708108VA (en) 2017-10-30

Family

ID=57007062

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708108VA SG11201708108VA (en) 2015-04-01 2015-04-01 Integrated circuit (ic) test socket with faraday cage background

Country Status (7)

Country Link
EP (1) EP3278118A4 (en)
JP (1) JP2018511806A (en)
KR (1) KR20170134612A (en)
CN (1) CN107683416A (en)
PH (1) PH12017501810A1 (en)
SG (1) SG11201708108VA (en)
WO (1) WO2016160009A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY193598A (en) * 2014-06-20 2022-10-19 Xcerra Corp Test socket assembly and related methods

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288083A (en) * 1989-04-26 1990-11-28 Mitsubishi Electric Corp Ic socket
CA2180578A1 (en) * 1995-07-07 1997-01-08 David A. Johnson Impedance controlled interconnection device
KR100299783B1 (en) * 1997-05-12 2001-09-06 오우라 히로시 Semiconductor device testing apparatus
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6515870B1 (en) * 2000-11-27 2003-02-04 Intel Corporation Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
JP2004006199A (en) * 2001-12-27 2004-01-08 Moldec Kk Connector for integrated circuit, and assembly for mounting integrated circuit
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
CN100508301C (en) * 2004-06-10 2009-07-01 Fci亚洲技术有限公司 Socket connector assembly for IC card and IC card connector
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
JP4905876B2 (en) * 2005-10-31 2012-03-28 日本発條株式会社 Method for manufacturing conductive contact holder and conductive contact holder
US7601009B2 (en) * 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
JP4516938B2 (en) * 2006-06-16 2010-08-04 Ｓｍｋ株式会社 Socket for mounting electronic components
CN101420076A (en) * 2007-10-22 2009-04-29 鸿富锦精密工业（深圳）有限公司 Connector component
JP2010003511A (en) * 2008-06-19 2010-01-07 Yokowo Co Ltd Socket for ic package inspection
TWI382193B (en) * 2009-02-17 2013-01-11 Quanta Comp Inc Testing system and testing method
JP2012243487A (en) * 2011-05-18 2012-12-10 Alps Electric Co Ltd Socket for electronic component

Also Published As

Publication number Publication date
PH12017501810A1 (en) 2018-04-23
KR20170134612A (en) 2017-12-06
CN107683416A (en) 2018-02-09
EP3278118A1 (en) 2018-02-07
JP2018511806A (en) 2018-04-26
EP3278118A4 (en) 2019-01-16
WO2016160009A1 (en) 2016-10-06

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