EP3278118A1 - Integrated circuit (ic) test socket with faraday cage background - Google Patents
Integrated circuit (ic) test socket with faraday cage backgroundInfo
- Publication number
- EP3278118A1 EP3278118A1 EP15888016.1A EP15888016A EP3278118A1 EP 3278118 A1 EP3278118 A1 EP 3278118A1 EP 15888016 A EP15888016 A EP 15888016A EP 3278118 A1 EP3278118 A1 EP 3278118A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- test socket
- shield
- base
- test
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 67
- 239000002184 metal Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000013461 design Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 235000020046 sherry Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
Definitions
- the present invention relates to sockets that electrically connects an integrated circuit with an IC board. More particularly, the present invention is directed to a test socket for testing an integrated circuit, wherein the test socket is enclosed in a conductive structure that acts as a faraday cage to eliminate noise and interference during the testing of an IC chip.
- Integrated circuit tester devices have long been used in the semiconductor industry to test and evaluate the quality of the chips off the manufacturing line. Signal integrity is a critical aspect of chip design and testing. To this end, it is desirable to maintain impedance through a conducting portion of a contact interconnecting the integrated circuit lead to its corresponding load board pad at a particular desired level.
- the effective impedance of the design is a function of a number of factors. These include width and length of conduction path, material of which the conductive structure is made, material thickness, etc.
- test socket that secures and connects the IC to the equipment that evaluates its performance, i.e. a handler and a load board.
- Many different test sockets have been devised for quickly and temporarily connecting integrated circuit leads of a chip to be tested to a load board of a tester.
- Typical socket arrangements use force brought to bear upon a contact positioned between a lead of the IC and the load board to deform a probe tip of the contact and engage a pad on the load board.
- Such a configuration provides for positive connection between the pins or contact pads of the DUT and corresponding leads of a test apparatus. Examples of this type of connection can be found, for example, in United States Patent No. 6,409,521 to Rathburn, and United States Patent No. 7,737,708 to Sherry, the teachings and contents of both of which are fully incorporated herein by reference.
- U.S. Patent No. 7,918,669 is a test socket devised by the present inventor.
- the socket of the '669 patent uses a unique linkage to urge the connectors of the test circuit upward where it can make contact with the test equipment.
- This test socket was found to be very successful in ensuring good contact with the test apparatus while reducing force on the circuit itself.
- a component of that test socket was an elastomer element that provided a resiliency to the link, ensuring proper contact in a cost effective and reliable manner.
- the cylindrical elastomer keeps the contact links in place, and their resiliency acts like a spring mechanism for the links. This allows for vertical movement on the link.
- test sockets When such test sockets are used, it is common for small amounts of static charge to build up on the socket, which can affect the results of the testing. Charged test sockets can transfer their charge to the circuit under test, which then leads to noise being introduced into the testing. Noise in the testing impairs the ability of the tester to evaluate the integrated circuit properly. Accordingly, the present invention is designed to reduce or eliminate the build-up of electrical charge on the test socket, leading to more accurate test results.
- the present invention is directed to an integrated circuit test socket that includes a highly conductive compliant material that is cut and installed into the test socket.
- the conductive material draws electrical charge away from the test socket, leading to more accurate testing.
- the test socket base is grounded, and a ground current runs through the base and into conductive strips.
- the configuration forms an electromagnetic impulse shield, protecting the chip from electromagnetic interference.
- the compliance of the shield material allows the shield to be sealed when activated, ensuring that the electromagnetic impulse shield is complete around the semi-conductor chip.
- FIG. 1 is an elevated, perspective view of an embodiment of the test socket and testing apparatus
- FIG. 2 is a side view of the socket and testing apparatus of Figure 1; [0010] FIG. 3 is a top view of the test socket of Figure 1; and [0011] FIG. 4 is a bottom view of the test socket of Figure 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
- FIGs 1 and 2 illustrate an integrated circuit test socket 20 of the type generally described in United States Patent No. 7,918,669, the contents of which are incorporated herein.
- the details of the test socket is omitted herein for brevity.
- the test socket base 20 has a generally square profile with four aligning holes 22 to mount the socket base on the testing equipment.
- a set of pegs 30 may be used to further align and set the base on the test equipment.
- On an upper surface 24 of the test socket base 20 see Figure 3
- a square recess 26 is formed to receive the integrated circuit chip (not shown) under test.
- a plurality of electrical connectors are formed within the recess 26 as described more fully in the patent referenced above.
- the test socket base 20 may be placed, for example, in a handler work press 32 and clamped in the handler 32 in anticipation of testing the integrated chip.
- the handler/work press 32 utilizes a clamping plate 34, where the clamping plate 34 encloses the chip under test.
- Other arrangements, both automated and manual, are also possible with the present invention.
- a Faraday cage is a container or enclosure made of conducting material, such as wire mesh or metal plates, that shields what it encloses from external electric fields. In chip testing, static charge on the socket and surrounding elements generate external
- the present invention forms a Faraday cage around the chip under test to shield the chip from EMI and noise during the testing.
- an EMI shield 40 is formed on the socket base 20 such that it is wedged between the base 20 and the clamp plate 34.
- the shield is made if a conductive material and may be a mesh or solid thin plate.
- the cage may be adhered to the top surface 24 of the base 20 by insertion into a groove, by adhesive, by fastener, or by other means.
- FIG 4 illustrates the bottom surface 28 of the socket base 20, including the test socket 42 connected to four diagonal members 46.
- the four diagonal members 46 on the bottom of the base 20 make contact with the printed circuit board.
- the corresponding paths on the printed circuit board are grounded. This ground current runs through the base and into the EMI shield.
- the shield serves as a mini-faraday cage for the device, shielding the device with the conductive socket shield grounded to the printed circuit board.
- the conductive shield 40 is preferably formed as part of the socket base 20.
- the socket may be constructed to include the shield 40, the chip test socket 42, and the base 20 as a single piece, and together these components cooperate to constitute the integrated shield.
- the contact footprint of the socket base 20 to the printed circuit board is defined by the grounding requirements of the application.
- the shield 40 can be constructed of four discrete plates 40a or meshes that are placed in a recess sized to hold the plates.
- the four plates 40a cooperate to form an octagon above and around the square recess 26, so that the clamp 34 contacts the upper surface of the shield 40.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/023839 WO2016160009A1 (en) | 2015-04-01 | 2015-04-01 | Integrated circuit (ic) test socket with faraday cage background |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3278118A1 true EP3278118A1 (en) | 2018-02-07 |
EP3278118A4 EP3278118A4 (en) | 2019-01-16 |
Family
ID=57007062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15888016.1A Withdrawn EP3278118A4 (en) | 2015-04-01 | 2015-04-01 | Integrated circuit (ic) test socket with faraday cage background |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3278118A4 (en) |
JP (1) | JP2018511806A (en) |
KR (1) | KR20170134612A (en) |
CN (1) | CN107683416A (en) |
PH (1) | PH12017501810A1 (en) |
SG (1) | SG11201708108VA (en) |
WO (1) | WO2016160009A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3158345B1 (en) * | 2014-06-20 | 2023-11-15 | Xcerra Corporation | Test socket assembly and related methods |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02288083A (en) * | 1989-04-26 | 1990-11-28 | Mitsubishi Electric Corp | Ic socket |
CA2180578A1 (en) * | 1995-07-07 | 1997-01-08 | David A. Johnson | Impedance controlled interconnection device |
DE19821194B4 (en) * | 1997-05-12 | 2005-09-22 | Advantest Corp. | Semiconductor device tester |
US6300781B1 (en) * | 1998-10-30 | 2001-10-09 | St Assembly Test Services Pte Ltd | Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system |
US6515870B1 (en) * | 2000-11-27 | 2003-02-04 | Intel Corporation | Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit |
US6400577B1 (en) * | 2001-08-30 | 2002-06-04 | Tyco Electronics Corporation | Integrated circuit socket assembly having integral shielding members |
JP2004006199A (en) * | 2001-12-27 | 2004-01-08 | Moldec Kk | Connector for integrated circuit, and assembly for mounting integrated circuit |
US7026806B2 (en) * | 2003-06-30 | 2006-04-11 | International Business Machines Corporation | Apparatus for preventing cross talk and interference in semiconductor devices during test |
CN100508301C (en) * | 2004-06-10 | 2009-07-01 | Fci亚洲技术有限公司 | Socket connector assembly for IC card and IC card connector |
US7106050B1 (en) * | 2005-06-08 | 2006-09-12 | Broadcom Corporation | Apparatus for shielding a device under test from electromagnetic waves |
JP4905876B2 (en) * | 2005-10-31 | 2012-03-28 | 日本発條株式会社 | Method for manufacturing conductive contact holder and conductive contact holder |
US7601009B2 (en) * | 2006-05-18 | 2009-10-13 | Centipede Systems, Inc. | Socket for an electronic device |
JP4516938B2 (en) * | 2006-06-16 | 2010-08-04 | Smk株式会社 | Socket for mounting electronic components |
CN101420076A (en) * | 2007-10-22 | 2009-04-29 | 鸿富锦精密工业(深圳)有限公司 | Connector component |
JP2010003511A (en) * | 2008-06-19 | 2010-01-07 | Yokowo Co Ltd | Socket for ic package inspection |
TWI382193B (en) * | 2009-02-17 | 2013-01-11 | Quanta Comp Inc | Testing system and testing method |
JP2012243487A (en) * | 2011-05-18 | 2012-12-10 | Alps Electric Co Ltd | Socket for electronic component |
-
2015
- 2015-04-01 WO PCT/US2015/023839 patent/WO2016160009A1/en active Application Filing
- 2015-04-01 SG SG11201708108VA patent/SG11201708108VA/en unknown
- 2015-04-01 CN CN201580078675.0A patent/CN107683416A/en active Pending
- 2015-04-01 KR KR1020177031813A patent/KR20170134612A/en not_active Application Discontinuation
- 2015-04-01 EP EP15888016.1A patent/EP3278118A4/en not_active Withdrawn
- 2015-04-01 JP JP2017551649A patent/JP2018511806A/en active Pending
-
2017
- 2017-10-02 PH PH12017501810A patent/PH12017501810A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG11201708108VA (en) | 2017-10-30 |
KR20170134612A (en) | 2017-12-06 |
PH12017501810A1 (en) | 2018-04-23 |
EP3278118A4 (en) | 2019-01-16 |
CN107683416A (en) | 2018-02-09 |
WO2016160009A1 (en) | 2016-10-06 |
JP2018511806A (en) | 2018-04-26 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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Extension state: BA ME |
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DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20181219 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/66 20060101ALI20181213BHEP Ipc: G01R 1/18 20060101ALI20181213BHEP Ipc: G01R 1/067 20060101ALI20181213BHEP Ipc: G01R 1/02 20060101AFI20181213BHEP |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20201103 |