EP3278118A4 - Integrated circuit (ic) test socket with faraday cage background - Google Patents
Integrated circuit (ic) test socket with faraday cage background Download PDFInfo
- Publication number
- EP3278118A4 EP3278118A4 EP15888016.1A EP15888016A EP3278118A4 EP 3278118 A4 EP3278118 A4 EP 3278118A4 EP 15888016 A EP15888016 A EP 15888016A EP 3278118 A4 EP3278118 A4 EP 3278118A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- integrated circuit
- test socket
- faraday cage
- cage background
- background
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2015/023839 WO2016160009A1 (en) | 2015-04-01 | 2015-04-01 | Integrated circuit (ic) test socket with faraday cage background |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3278118A1 EP3278118A1 (en) | 2018-02-07 |
EP3278118A4 true EP3278118A4 (en) | 2019-01-16 |
Family
ID=57007062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15888016.1A Withdrawn EP3278118A4 (en) | 2015-04-01 | 2015-04-01 | Integrated circuit (ic) test socket with faraday cage background |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3278118A4 (en) |
JP (1) | JP2018511806A (en) |
KR (1) | KR20170134612A (en) |
CN (1) | CN107683416A (en) |
PH (1) | PH12017501810A1 (en) |
SG (1) | SG11201708108VA (en) |
WO (1) | WO2016160009A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017518505A (en) * | 2014-06-20 | 2017-07-06 | エクセラ・コーポレーションXcerra Corp. | Test socket assembly and related methods |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02288083A (en) * | 1989-04-26 | 1990-11-28 | Mitsubishi Electric Corp | Ic socket |
EP0752741A1 (en) * | 1995-07-07 | 1997-01-08 | Johnstech International Corporation | Impedance controlled interconnection device |
US6104204A (en) * | 1997-05-12 | 2000-08-15 | Advantest Corporation | Semiconductor device testing apparatus |
US6300781B1 (en) * | 1998-10-30 | 2001-10-09 | St Assembly Test Services Pte Ltd | Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system |
US6400577B1 (en) * | 2001-08-30 | 2002-06-04 | Tyco Electronics Corporation | Integrated circuit socket assembly having integral shielding members |
JP2004006199A (en) * | 2001-12-27 | 2004-01-08 | Moldec Kk | Connector for integrated circuit, and assembly for mounting integrated circuit |
US7026806B2 (en) * | 2003-06-30 | 2006-04-11 | International Business Machines Corporation | Apparatus for preventing cross talk and interference in semiconductor devices during test |
US7106050B1 (en) * | 2005-06-08 | 2006-09-12 | Broadcom Corporation | Apparatus for shielding a device under test from electromagnetic waves |
US20070269999A1 (en) * | 2006-05-18 | 2007-11-22 | Centipede Systems, Inc. | Socket for an electronic device |
EP1950571A1 (en) * | 2005-10-31 | 2008-07-30 | NHK Spring Company Limited | Method for manufacturing conductive contact holder, and conductive contact holder |
EP2031710A1 (en) * | 2006-06-16 | 2009-03-04 | Sony Corporation | Socket for mounting electronic component |
US20090104797A1 (en) * | 2007-10-22 | 2009-04-23 | Hon Hai Precision Industry Co., Ltd. | Electrical socket |
US20100207638A1 (en) * | 2009-02-17 | 2010-08-19 | Quanta Computer, Inc. | Testing System and Testing Method |
JP2012243487A (en) * | 2011-05-18 | 2012-12-10 | Alps Electric Co Ltd | Socket for electronic component |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6515870B1 (en) * | 2000-11-27 | 2003-02-04 | Intel Corporation | Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit |
CN100508301C (en) * | 2004-06-10 | 2009-07-01 | Fci亚洲技术有限公司 | Socket connector assembly for IC card and IC card connector |
JP2010003511A (en) * | 2008-06-19 | 2010-01-07 | Yokowo Co Ltd | Socket for ic package inspection |
-
2015
- 2015-04-01 SG SG11201708108VA patent/SG11201708108VA/en unknown
- 2015-04-01 WO PCT/US2015/023839 patent/WO2016160009A1/en active Application Filing
- 2015-04-01 EP EP15888016.1A patent/EP3278118A4/en not_active Withdrawn
- 2015-04-01 CN CN201580078675.0A patent/CN107683416A/en active Pending
- 2015-04-01 KR KR1020177031813A patent/KR20170134612A/en not_active Application Discontinuation
- 2015-04-01 JP JP2017551649A patent/JP2018511806A/en active Pending
-
2017
- 2017-10-02 PH PH12017501810A patent/PH12017501810A1/en unknown
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02288083A (en) * | 1989-04-26 | 1990-11-28 | Mitsubishi Electric Corp | Ic socket |
EP0752741A1 (en) * | 1995-07-07 | 1997-01-08 | Johnstech International Corporation | Impedance controlled interconnection device |
US6104204A (en) * | 1997-05-12 | 2000-08-15 | Advantest Corporation | Semiconductor device testing apparatus |
US6300781B1 (en) * | 1998-10-30 | 2001-10-09 | St Assembly Test Services Pte Ltd | Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system |
US6400577B1 (en) * | 2001-08-30 | 2002-06-04 | Tyco Electronics Corporation | Integrated circuit socket assembly having integral shielding members |
JP2004006199A (en) * | 2001-12-27 | 2004-01-08 | Moldec Kk | Connector for integrated circuit, and assembly for mounting integrated circuit |
US7026806B2 (en) * | 2003-06-30 | 2006-04-11 | International Business Machines Corporation | Apparatus for preventing cross talk and interference in semiconductor devices during test |
US7106050B1 (en) * | 2005-06-08 | 2006-09-12 | Broadcom Corporation | Apparatus for shielding a device under test from electromagnetic waves |
EP1950571A1 (en) * | 2005-10-31 | 2008-07-30 | NHK Spring Company Limited | Method for manufacturing conductive contact holder, and conductive contact holder |
US20070269999A1 (en) * | 2006-05-18 | 2007-11-22 | Centipede Systems, Inc. | Socket for an electronic device |
EP2031710A1 (en) * | 2006-06-16 | 2009-03-04 | Sony Corporation | Socket for mounting electronic component |
US20090104797A1 (en) * | 2007-10-22 | 2009-04-23 | Hon Hai Precision Industry Co., Ltd. | Electrical socket |
US20100207638A1 (en) * | 2009-02-17 | 2010-08-19 | Quanta Computer, Inc. | Testing System and Testing Method |
JP2012243487A (en) * | 2011-05-18 | 2012-12-10 | Alps Electric Co Ltd | Socket for electronic component |
Non-Patent Citations (1)
Title |
---|
See also references of WO2016160009A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2018511806A (en) | 2018-04-26 |
SG11201708108VA (en) | 2017-10-30 |
CN107683416A (en) | 2018-02-09 |
KR20170134612A (en) | 2017-12-06 |
WO2016160009A1 (en) | 2016-10-06 |
EP3278118A1 (en) | 2018-02-07 |
PH12017501810A1 (en) | 2018-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
17P | Request for examination filed |
Effective date: 20171102 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
DAV | Request for validation of the european patent (deleted) | ||
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20181219 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/66 20060101ALI20181213BHEP Ipc: G01R 1/18 20060101ALI20181213BHEP Ipc: G01R 1/067 20060101ALI20181213BHEP Ipc: G01R 1/02 20060101AFI20181213BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20201103 |