EP3278118A4 - Integrated circuit (ic) test socket with faraday cage background - Google Patents

Integrated circuit (ic) test socket with faraday cage background Download PDF

Info

Publication number
EP3278118A4
EP3278118A4 EP15888016.1A EP15888016A EP3278118A4 EP 3278118 A4 EP3278118 A4 EP 3278118A4 EP 15888016 A EP15888016 A EP 15888016A EP 3278118 A4 EP3278118 A4 EP 3278118A4
Authority
EP
European Patent Office
Prior art keywords
integrated circuit
test socket
faraday cage
cage background
background
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15888016.1A
Other languages
German (de)
French (fr)
Other versions
EP3278118A1 (en
Inventor
Victor Landa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xcerra Corp
Original Assignee
Xcerra Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xcerra Corp filed Critical Xcerra Corp
Publication of EP3278118A1 publication Critical patent/EP3278118A1/en
Publication of EP3278118A4 publication Critical patent/EP3278118A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/18Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/0466Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
EP15888016.1A 2015-04-01 2015-04-01 Integrated circuit (ic) test socket with faraday cage background Withdrawn EP3278118A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/023839 WO2016160009A1 (en) 2015-04-01 2015-04-01 Integrated circuit (ic) test socket with faraday cage background

Publications (2)

Publication Number Publication Date
EP3278118A1 EP3278118A1 (en) 2018-02-07
EP3278118A4 true EP3278118A4 (en) 2019-01-16

Family

ID=57007062

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15888016.1A Withdrawn EP3278118A4 (en) 2015-04-01 2015-04-01 Integrated circuit (ic) test socket with faraday cage background

Country Status (7)

Country Link
EP (1) EP3278118A4 (en)
JP (1) JP2018511806A (en)
KR (1) KR20170134612A (en)
CN (1) CN107683416A (en)
PH (1) PH12017501810A1 (en)
SG (1) SG11201708108VA (en)
WO (1) WO2016160009A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017518505A (en) * 2014-06-20 2017-07-06 エクセラ・コーポレーションXcerra Corp. Test socket assembly and related methods

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288083A (en) * 1989-04-26 1990-11-28 Mitsubishi Electric Corp Ic socket
EP0752741A1 (en) * 1995-07-07 1997-01-08 Johnstech International Corporation Impedance controlled interconnection device
US6104204A (en) * 1997-05-12 2000-08-15 Advantest Corporation Semiconductor device testing apparatus
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
JP2004006199A (en) * 2001-12-27 2004-01-08 Moldec Kk Connector for integrated circuit, and assembly for mounting integrated circuit
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
US20070269999A1 (en) * 2006-05-18 2007-11-22 Centipede Systems, Inc. Socket for an electronic device
EP1950571A1 (en) * 2005-10-31 2008-07-30 NHK Spring Company Limited Method for manufacturing conductive contact holder, and conductive contact holder
EP2031710A1 (en) * 2006-06-16 2009-03-04 Sony Corporation Socket for mounting electronic component
US20090104797A1 (en) * 2007-10-22 2009-04-23 Hon Hai Precision Industry Co., Ltd. Electrical socket
US20100207638A1 (en) * 2009-02-17 2010-08-19 Quanta Computer, Inc. Testing System and Testing Method
JP2012243487A (en) * 2011-05-18 2012-12-10 Alps Electric Co Ltd Socket for electronic component

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6515870B1 (en) * 2000-11-27 2003-02-04 Intel Corporation Package integrated faraday cage to reduce electromagnetic emissions from an integrated circuit
CN100508301C (en) * 2004-06-10 2009-07-01 Fci亚洲技术有限公司 Socket connector assembly for IC card and IC card connector
JP2010003511A (en) * 2008-06-19 2010-01-07 Yokowo Co Ltd Socket for ic package inspection

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02288083A (en) * 1989-04-26 1990-11-28 Mitsubishi Electric Corp Ic socket
EP0752741A1 (en) * 1995-07-07 1997-01-08 Johnstech International Corporation Impedance controlled interconnection device
US6104204A (en) * 1997-05-12 2000-08-15 Advantest Corporation Semiconductor device testing apparatus
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members
JP2004006199A (en) * 2001-12-27 2004-01-08 Moldec Kk Connector for integrated circuit, and assembly for mounting integrated circuit
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
US7106050B1 (en) * 2005-06-08 2006-09-12 Broadcom Corporation Apparatus for shielding a device under test from electromagnetic waves
EP1950571A1 (en) * 2005-10-31 2008-07-30 NHK Spring Company Limited Method for manufacturing conductive contact holder, and conductive contact holder
US20070269999A1 (en) * 2006-05-18 2007-11-22 Centipede Systems, Inc. Socket for an electronic device
EP2031710A1 (en) * 2006-06-16 2009-03-04 Sony Corporation Socket for mounting electronic component
US20090104797A1 (en) * 2007-10-22 2009-04-23 Hon Hai Precision Industry Co., Ltd. Electrical socket
US20100207638A1 (en) * 2009-02-17 2010-08-19 Quanta Computer, Inc. Testing System and Testing Method
JP2012243487A (en) * 2011-05-18 2012-12-10 Alps Electric Co Ltd Socket for electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016160009A1 *

Also Published As

Publication number Publication date
JP2018511806A (en) 2018-04-26
SG11201708108VA (en) 2017-10-30
CN107683416A (en) 2018-02-09
KR20170134612A (en) 2017-12-06
WO2016160009A1 (en) 2016-10-06
EP3278118A1 (en) 2018-02-07
PH12017501810A1 (en) 2018-04-23

Similar Documents

Publication Publication Date Title
IL261803B (en) Test socket assembly
EP3111241A4 (en) Integrated circuit (ic) test socket using kelvin bridge
TWI560449B (en) Method of manufacturing microelectrode circuit test pin and microelectrode circuit test pin manufactured using the same
HK1244591A1 (en) Integrated circuit devices and methods
EP3246717A4 (en) On-chip monitor circuit and semiconductor chip
GB2506825B (en) Functional testing of an integrated circuit chip
KR101769882B9 (en) Test Socket
HK1257027A1 (en) Adapters for testing electrical equipment
GB2506826B (en) Monitoring functional testing of an integrated circuit chip
EP3491406C0 (en) Test system for testing electronic connections
GB201522432D0 (en) Automated test system for integrated circuits
EP3328052A4 (en) Camera and integrated circuit board
FR3018953B1 (en) INTEGRATED CIRCUIT CHIP MOUNTED ON AN INTERPOSER
TWI561839B (en) Integrated circuit testing interface and automatic test equipment
GB2526825B (en) An integrated circuit with interface circuitry, and an interface cell for such interface circuitry
GB201309302D0 (en) Method and test enviroment for testing an integrated circuit
EP3158610A4 (en) Integrated circuit chip tester with an anti-rotation link
EP3346280B8 (en) Ic test system
TWI560453B (en) Circuit board and testing method
EP3101686A4 (en) Semiconductor integrated circuit device
GB201607589D0 (en) Integrated circuit device
GB201702481D0 (en) An electronic circuit
EP3278118A4 (en) Integrated circuit (ic) test socket with faraday cage background
TWI562159B (en) Integrated circuit and method for establishing scah test architecture in integrated circuit
EP3314648A4 (en) Integrated circuit structures with interposers having recesses

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20171102

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20181219

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/66 20060101ALI20181213BHEP

Ipc: G01R 1/18 20060101ALI20181213BHEP

Ipc: G01R 1/067 20060101ALI20181213BHEP

Ipc: G01R 1/02 20060101AFI20181213BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20201103