JP2018511482A - 混成合金ソルダペースト - Google Patents

混成合金ソルダペースト Download PDF

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Publication number
JP2018511482A
JP2018511482A JP2017547978A JP2017547978A JP2018511482A JP 2018511482 A JP2018511482 A JP 2018511482A JP 2017547978 A JP2017547978 A JP 2017547978A JP 2017547978 A JP2017547978 A JP 2017547978A JP 2018511482 A JP2018511482 A JP 2018511482A
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JP
Japan
Prior art keywords
alloy
solder
solder paste
weight
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017547978A
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English (en)
Japanese (ja)
Other versions
JP2018511482A5 (enrdf_load_stackoverflow
Inventor
ザン，ホンウェン
リー，ニン−チェン
Original Assignee
インディウム コーポレーション
インディウム コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/643,868 external-priority patent/US9636784B2/en
Application filed by インディウム コーポレーション, インディウム コーポレーション filed Critical インディウム コーポレーション
Publication of JP2018511482A publication Critical patent/JP2018511482A/ja
Publication of JP2018511482A5 publication Critical patent/JP2018511482A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017547978A 2015-03-10 2016-03-08 混成合金ソルダペースト Pending JP2018511482A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/643,868 2015-03-10
US14/643,868 US9636784B2 (en) 2010-05-03 2015-03-10 Mixed alloy solder paste
PCT/US2016/021343 WO2016144945A1 (en) 2015-03-10 2016-03-08 Mixed alloy solder paste

Publications (2)

Publication Number Publication Date
JP2018511482A true JP2018511482A (ja) 2018-04-26
JP2018511482A5 JP2018511482A5 (enrdf_load_stackoverflow) 2018-09-06

Family

ID=55587375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017547978A Pending JP2018511482A (ja) 2015-03-10 2016-03-08 混成合金ソルダペースト

Country Status (5)

Country Link
JP (1) JP2018511482A (enrdf_load_stackoverflow)
KR (1) KR101913994B1 (enrdf_load_stackoverflow)
CN (1) CN107530834A (enrdf_load_stackoverflow)
TW (1) TWI681063B (enrdf_load_stackoverflow)
WO (1) WO2016144945A1 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏
US10888958B2 (en) * 2018-05-29 2021-01-12 Indium Corporation Hybrid high temperature lead-free solder preform
KR20240042569A (ko) * 2018-10-24 2024-04-02 알파 어셈블리 솔루션스 인크. 중합체 기재, 인쇄 회로 기판 및 기타 접합 응용을 위한 저온 납땜 해법
US12030139B2 (en) * 2018-10-31 2024-07-09 Robert Bosch Gmbh Sn—Cu mixed alloy solder paste, method of making the same and soldering method
CN110029248B (zh) * 2019-04-17 2021-05-11 广东科学技术职业学院 一种3d打印用的金属膏体及其制备方法
US11267080B2 (en) 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
MY208234A (en) * 2020-04-29 2025-04-25 Indium Corp Lead-free solder paste with mixed solder powders for high temperature applications
JP7041710B2 (ja) * 2020-04-30 2022-03-24 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙおよびはんだ継手

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08132279A (ja) * 1994-11-01 1996-05-28 Mitsui Mining & Smelting Co Ltd 熱交換器用はんだ合金
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
JP2005305472A (ja) * 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd はんだ材料およびはんだ付け物品
WO2006095417A1 (ja) * 2005-03-09 2006-09-14 Senju Metal Industry Co., Ltd. 低融点金属粒子の製造方法及びその装置
JP2009283453A (ja) * 2008-04-23 2009-12-03 Panasonic Corp 導電性ペーストおよびこれを用いた実装構造体
JP2010036199A (ja) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd 接合材、半導体装置およびその製造方法
JP2010129664A (ja) * 2008-11-26 2010-06-10 Fujitsu Ltd 電子装置及びその製造方法
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
JP2014007192A (ja) * 2012-06-21 2014-01-16 Industrial Technology Research Institute Ｌｅｄウェハーを接合する方法、ｌｅｄチップを製造する方法及び接合構造
JP2014018803A (ja) * 2012-07-12 2014-02-03 Panasonic Corp はんだ材料及びこれを用いた実装構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11347784A (ja) * 1998-06-01 1999-12-21 Victor Co Of Japan Ltd はんだペースト及びそれを用いた電子回路装置
JP2003211289A (ja) * 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
US7888411B2 (en) * 2003-04-01 2011-02-15 Creative Electron, Inc. Thermally conductive adhesive composition and process for device attachment
JP2005183903A (ja) * 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
EP1952934B1 (en) * 2005-11-11 2015-03-18 Senju Metal Industry Co., Ltd. Soldering paste and solder joints
WO2010114874A2 (en) * 2009-04-02 2010-10-07 Ormet Circuits Inc. Conductive compositions containing blended alloy fillers
US9017446B2 (en) * 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08132279A (ja) * 1994-11-01 1996-05-28 Mitsui Mining & Smelting Co Ltd 熱交換器用はんだ合金
JP2005072173A (ja) * 2003-08-22 2005-03-17 Senju Metal Ind Co Ltd 電子部品およびソルダペースト
JP2005305472A (ja) * 2004-04-19 2005-11-04 Matsushita Electric Ind Co Ltd はんだ材料およびはんだ付け物品
WO2006095417A1 (ja) * 2005-03-09 2006-09-14 Senju Metal Industry Co., Ltd. 低融点金属粒子の製造方法及びその装置
JP2009283453A (ja) * 2008-04-23 2009-12-03 Panasonic Corp 導電性ペーストおよびこれを用いた実装構造体
JP2010036199A (ja) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd 接合材、半導体装置およびその製造方法
JP2010129664A (ja) * 2008-11-26 2010-06-10 Fujitsu Ltd 電子装置及びその製造方法
JP2010167472A (ja) * 2009-01-26 2010-08-05 Fujitsu Ltd はんだ、はんだ付け方法及び半導体装置
WO2012002173A1 (ja) * 2010-06-30 2012-01-05 千住金属工業株式会社 Bi-Sn系高温はんだ合金
JP2014007192A (ja) * 2012-06-21 2014-01-16 Industrial Technology Research Institute Ｌｅｄウェハーを接合する方法、ｌｅｄチップを製造する方法及び接合構造
JP2014018803A (ja) * 2012-07-12 2014-02-03 Panasonic Corp はんだ材料及びこれを用いた実装構造体

Also Published As

Publication number Publication date
WO2016144945A1 (en) 2016-09-15
TWI681063B (zh) 2020-01-01
CN107530834A (zh) 2018-01-02
KR101913994B1 (ko) 2018-12-28
TW201700741A (zh) 2017-01-01
KR20180002606A (ko) 2018-01-08

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