JP2018511178A - 半導体素子用の受動冷却機能を備えた担体 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000001816 cooling Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 7
- 230000006870 function Effects 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 230000015654 memory Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims description 2
- 150000002118 epoxides Chemical class 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 230000005693 optoelectronics Effects 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
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Abstract
Description
提案するのは、半導体素子用の受動冷却機能を備えた担体であって、これは、上面および下面を備えた基体と、この基体中に埋め込まれた少なくとも1つの電気素子とを有する担体である。この担体は、さらに、基体の上面から少なくとも1つの電気素子へと伸張する第1サーマルヴィアを有する。担体は、少なくとも1つの電気素子から基体の下面へと伸張する第2サーマルヴィアを有する。この少なくとも1つの埋め込まれた電気素子は、第1および第2サーマルヴィアにより電気的に接触されている。
以下に、本発明を図面に基づいてより詳細に説明する。
2 担体
3 半導体素子
4 保護層
5 リン層
6 基体
7 上面
8 下面
9 接触面
10 下方層
11 中央層
12 上方層
13 電気素子
13a 電気素子
13b 電気素子
14 第1サーマルヴィア
15 第2サーマルヴィア
16 電気接点
17 第3サーマルヴィア
18 第4サーマルヴィア
19 さらなるサーマルヴィア
20 反射層
21 SMD素子
22 第5サーマルヴィア
23 第6サーマルヴィア
24 金属構造部
Claims (12)
- 半導体素子(3)用の受動冷却機能を備えた担体(2)であって、
上面(7)および下面(8)を備えた基体(6)と、前記基体(6)中に埋め込まれた少なくとも1つの電気素子(13、13a、13b)とを有し、
前記担体(2)は、前記基体(6)の前記上面(7)から前記少なくとも1つの電気素子(13、13a、13b)へと伸張する第1サーマルヴィア(14)を有し、
前記担体(2)は、前記少なくとも1つの電気素子(13、13a、13b)から前記基体(6)の前記下面(8)へと伸張する第2サーマルヴィア(15)を有し、
前記少なくとも1つの埋め込まれた電気素子(13、13a、13b)は、前記第1および前記第2サーマルヴィア(14、15)により電気的に接触されている、担体。 - 前記担体(2)は、前記基体(6)の前記上面(7)から前記基体(6)の前記下面(8)へと伸張する少なくとも1つのさらなるサーマルヴィア(19)を有する、請求項1に記載の担体(2)。
- 前記さらなるサーマルヴィア(19)の直径は、前記第1サーマルヴィア(14)の直径よりも、かつ、前記第2サーマルヴィア(15)の直径よりも大きい、請求項2に記載の担体(2)。
- 前記担体は、さらに、前記基体(6)中に埋め込まれていて、かつ前記基体(6)の前記上面(7)に平行な方向に伸びている金属構造部(24)を有し、
前記金属構造部(24)は、前記さらなるサーマルヴィア(19)に直接当接する、請求項2または3のいずれか1項に記載の担体(2)。 - 前記基体(6)は多層構造を有し、かつ、
前記金属構造部(24)と前記少なくとも1つの埋め込まれた電気素子(13、13a、13b)とは、同じ層(11)中に配置されている、請求項4に記載の担体(2)。 - 前記少なくとも1つの埋め込まれた電気素子(13、13a、13b)は、バリスタ、ダイオード、NTCサーミスタ、PTCサーミスタ、セラミック製多層チップコンデンサ、多層インダクタンスまたは前記半導体素子(3)用の駆動回路である、請求項1から5のいずれか1項に記載の担体(2)。
- 前記少なくとも1つの埋め込まれた電気素子(13、13a、13b)は、能動電子部品例えば電子チップとりわけ半導体チップ、または受動電子部品例えばコンデンサ、抵抗、バリスタ、NTC、PTCもしくはインダクタンス、または埋め込まれたモジュールであり、
前記埋め込まれたモジュールとは、例えばDRAMもしくは任意のこれ以外のあらゆるメモリなどのデータメモリ、例えば高域フィルタ、低域フィルタもしくは帯域通過フィルタとして構成可能でありかつ例えば周波数フィルタとして機能可能であるフィルタ、例えば論理集積回路などの集積回路、例えばマイクロプロセッサなどの信号処理部品、電力管理部品、例えば光電子素子などの光電インタフェース素子、例えばDC/DCコンバータもしくはAC/DCコンバータなどの電圧変換器、例えばPZTセンサおよび/もしくはアクチュエータなどの電気機械変換器、例えばRFIDチップもしくはトランスポンダなどの電磁波用の送信および/もしくは受信ユニット、暗号化部品、容量部、インダクタンス、例えばトランジスタベースのスイッチなどのスイッチ、ならびに、これらおよび別の機能電子構成部品の組み合わせであり、
ならびに/または
前記埋め込まれた電気素子(13、13a、13b)は、微小電気機械システム(MEMS)、バッテリ、カメラもしくはアンテナを有する、請求項1から6のいずれか1項に記載の担体(2)。 - 前記基体(6)は、樹脂、とりわけビスマレイミドトリアジン樹脂、ガラス、とりわけガラス繊維、プリプレグ材料、ポリイミド、液晶ポリマー、シアン酸エステル、エポキシドベースのビルドアップフィルム、FR4材料、セラミックおよび金属酸化物からなる群からの少なくとも1つの材料を有する、請求項1から7のいずれか1項に記載の担体(2)。
- 前記担体(2)の高さは500μm未満である、請求項1から8のいずれか1項に記載の担体(2)。
- 前記担体(2)は、前記基体(6)の前記上面(7)から前記少なくとも1つの電気素子(13、13a、13b)へと伸張する第3サーマルヴィア(17)を有し、
前記担体(2)は、前記少なくとも1つの電気素子(13、13a、13b)から前記基体(6)の前記下面(8)へと伸張する第4サーマルヴィア(18)を有し、かつ、
前記少なくとも1つの埋め込まれた電気素子(13、13a、13b)は、前記第3および第4サーマルヴィア(17、18)によっても電気的に接触されている、請求項1から9のいずれか1項に記載の担体(2)。 - 少なくとも1つの第2電気素子(13a)は、前記基体中(6)に埋め込まれていて、
前記担体(2)は、前記基体(6)の前記上面(7)から前記第2電気素子(13b)へと伸張する第5サーマルヴィア(22)を有し、
前記担体(2)は、前記第2電気素子(13b)から前記基体(6)の前記下面(8)へと伸張する第6サーマルヴィア(23)を有し、かつ、
前記埋め込まれた第2電気素子(13b)は、前記第5および前記第6サーマルヴィア(22、23)により電気的に接触されている、請求項1から10のいずれか1項に記載の担体(2)。 - 請求項1から11のいずれか1項に記載の担体(2)と、前記担体(2)の前記上面(7)上に配置された半導体素子(3)とを有する装置。
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DE102015104641.5 | 2015-03-26 | ||
DE102015104641.5A DE102015104641A1 (de) | 2015-03-26 | 2015-03-26 | Träger mit passiver Kühlfunktion für ein Halbleiterbauelement |
PCT/EP2016/054321 WO2016150662A1 (de) | 2015-03-26 | 2016-03-01 | Träger mit passiver kühlfunktion für ein halbleiterbauelement |
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DE102017118490A1 (de) * | 2017-08-14 | 2019-02-14 | Tdk Electronics Ag | LED Modul |
US10578861B2 (en) * | 2017-10-25 | 2020-03-03 | Microsoft Technology Licensing, Llc | Piezoelectric mirror system |
DE102017126268A1 (de) | 2017-11-09 | 2019-05-09 | Osram Opto Semiconductors Gmbh | Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers |
US10251309B1 (en) | 2018-04-11 | 2019-04-02 | General Electric Company | Systems and methods for passive cooling of electrical modules within electrical units |
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JP6588103B2 (ja) | 2019-10-09 |
WO2016150662A1 (de) | 2016-09-29 |
TW201644019A (zh) | 2016-12-16 |
CN107690701A (zh) | 2018-02-13 |
US20180070436A1 (en) | 2018-03-08 |
DE102015104641A1 (de) | 2016-09-29 |
EP3275018A1 (de) | 2018-01-31 |
KR102350223B1 (ko) | 2022-01-14 |
EP3275018B1 (de) | 2021-07-21 |
KR20180002611A (ko) | 2018-01-08 |
US10980105B2 (en) | 2021-04-13 |
TWI682510B (zh) | 2020-01-11 |
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