JP2018506152A5 - - Google Patents

Download PDF

Info

Publication number
JP2018506152A5
JP2018506152A5 JP2017541239A JP2017541239A JP2018506152A5 JP 2018506152 A5 JP2018506152 A5 JP 2018506152A5 JP 2017541239 A JP2017541239 A JP 2017541239A JP 2017541239 A JP2017541239 A JP 2017541239A JP 2018506152 A5 JP2018506152 A5 JP 2018506152A5
Authority
JP
Japan
Prior art keywords
paste composition
electrically conductive
organic vehicle
substrate
methacrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017541239A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018506152A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2016/016338 external-priority patent/WO2016126801A1/en
Publication of JP2018506152A publication Critical patent/JP2018506152A/ja
Publication of JP2018506152A5 publication Critical patent/JP2018506152A5/ja
Pending legal-status Critical Current

Links

JP2017541239A 2015-02-04 2016-02-03 導電性ペースト組成物およびそれによって製造された半導体デバイス Pending JP2018506152A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562112030P 2015-02-04 2015-02-04
US62/112,030 2015-02-04
US201562175060P 2015-06-12 2015-06-12
US62/175,060 2015-06-12
PCT/US2016/016338 WO2016126801A1 (en) 2015-02-04 2016-02-03 Conductive paste composition and semiconductor devices made therewith

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020073995A Division JP2020115473A (ja) 2015-02-04 2020-04-17 導電性ペースト組成物およびそれによって製造された半導体デバイス

Publications (2)

Publication Number Publication Date
JP2018506152A JP2018506152A (ja) 2018-03-01
JP2018506152A5 true JP2018506152A5 (enExample) 2019-03-07

Family

ID=55451562

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017541239A Pending JP2018506152A (ja) 2015-02-04 2016-02-03 導電性ペースト組成物およびそれによって製造された半導体デバイス
JP2020073995A Pending JP2020115473A (ja) 2015-02-04 2020-04-17 導電性ペースト組成物およびそれによって製造された半導体デバイス
JP2021111437A Active JP7167262B2 (ja) 2015-02-04 2021-07-05 導電性ペースト組成物およびそれによって製造された半導体デバイス

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2020073995A Pending JP2020115473A (ja) 2015-02-04 2020-04-17 導電性ペースト組成物およびそれによって製造された半導体デバイス
JP2021111437A Active JP7167262B2 (ja) 2015-02-04 2021-07-05 導電性ペースト組成物およびそれによって製造された半導体デバイス

Country Status (5)

Country Link
US (1) US10403770B2 (enExample)
JP (3) JP2018506152A (enExample)
CN (1) CN107250075A (enExample)
DE (1) DE112016000610B4 (enExample)
WO (1) WO2016126801A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016126801A1 (en) 2015-02-04 2016-08-11 E I Du Pont De Nemours And Company Conductive paste composition and semiconductor devices made therewith
US10741300B2 (en) * 2016-10-07 2020-08-11 E I Du Pont De Nemours And Company Conductive paste composition and semiconductor devices made therewith
CN110223799B (zh) * 2019-06-17 2020-11-10 常州宝邦新能源材料有限公司 一种导电浆料及用其制成的半导体装置
GB2592557B (en) * 2019-10-22 2024-07-10 Lumet Tech Ltd Transferable composition and methods for preparing and using the same
CN110964593B (zh) * 2019-12-18 2021-06-01 中国科学院兰州化学物理研究所 一种聚合诱导自组装油凝胶及其制备方法和应用
DE102020106131A1 (de) 2020-03-06 2021-09-09 Carl Freudenberg Kg Elektrisch leitfähige Paste
WO2023133132A1 (en) * 2022-01-05 2023-07-13 Tesla, Inc. Curable electrical joint composition
CN118914469A (zh) * 2024-08-19 2024-11-08 江苏希诚新材料科技有限公司 一种基于结构匹配的导电浆料综合性能评价系统和方法

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3932311A (en) 1974-07-29 1976-01-13 Eastman Kodak Company Electrically conducting adhesive composition
DE2746481A1 (de) 1977-10-15 1979-04-19 Bayer Ag Verfahren zur herstellung von reaktiven mikrogelen
US4369063A (en) * 1981-11-12 1983-01-18 Ciba-Geigy Corporation Silver containing conductive coatings
US4753865A (en) 1986-01-22 1988-06-28 E. I. Du Pont De Nemours And Company Photosensitive compositions containing microgels
US4968738A (en) 1989-04-06 1990-11-06 Quantum Materials, Inc. Silver-glass die attach paste with reduced resin
JPH04270140A (ja) 1990-06-21 1992-09-25 Johnson Matthey Inc シーリングガラス組成物および導電性成分を含む同組成物
US5188990A (en) 1991-11-21 1993-02-23 Vlsi Packaging Materials Low temperature sealing glass compositions
AU676971B1 (en) * 1995-08-24 1997-03-27 Dainichiseika Color & Chemicals Mfg. Co. Ltd. Production process of connected microgel particles and articles treated with connected microgel particles
AUPP337298A0 (en) * 1998-05-07 1998-05-28 University Of Melbourne, The Process for microgel preparation
US6001549A (en) * 1998-05-27 1999-12-14 Eastman Kodak Company Electrically conductive layer comprising microgel particles
JP3479463B2 (ja) * 1999-01-29 2003-12-15 太陽インキ製造株式会社 光硬化型導電性組成物及びそれを用いて電極形成したプラズマディスプレイパネル
AU2890601A (en) * 2000-05-27 2001-12-11 Q-Sys Co., Ltd. Electrically conductive microgel and method for preparing the same
DE10116653A1 (de) 2001-04-04 2002-10-10 Dmc2 Degussa Metals Catalysts Cerdec Ag Leitfähigkeitspaste, damit erzeugte Artikel mit einer leitfähigen Beschichtung auf Glas, Keramik und emailliertem Stahl und Verfahren zu deren Herstellung
JP3614152B2 (ja) * 2001-08-07 2005-01-26 株式会社村田製作所 感光性導電ペースト、それを用いた回路基板及びセラミック多層基板の製造方法
JP2003323816A (ja) * 2002-05-01 2003-11-14 Tanaka Kikinzoku Kogyo Kk 導体組成物
US7202244B2 (en) * 2002-05-29 2007-04-10 Millennium Pharmaceuticals, Inc. Chk-1 inhibitors
US20040055635A1 (en) * 2002-09-19 2004-03-25 Hiroshi Nagakubo Conductive paste, method for manufacturing solar battery, and solar battery
AU2002953359A0 (en) * 2002-11-27 2003-01-09 The University Of Melbourne Microgel composition
US7074349B2 (en) * 2003-01-24 2006-07-11 E. I. Du Pont De Nemours And Company Terminal electrode compositions for multilayer ceramic capacitors
JP4635423B2 (ja) * 2003-09-11 2011-02-23 住友ベークライト株式会社 半導体用樹脂ペースト及び半導体装置
DE10344976A1 (de) 2003-09-27 2005-04-21 Rhein Chemie Rheinau Gmbh Mikrogele in vernetzbaren, organischen Medien
DE10344975A1 (de) 2003-09-27 2005-04-21 Rhein Chemie Rheinau Gmbh Mikrogele in nicht-vernetzbaren organischen Medien
JP2006080013A (ja) * 2004-09-10 2006-03-23 Mitsui Mining & Smelting Co Ltd 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板
DE102004062551A1 (de) 2004-12-24 2006-07-06 Rhein Chemie Rheinau Gmbh Mikrogel-enthaltende duroplastische Zusammensetzung
DE102005014271A1 (de) 2005-03-24 2006-09-28 Rhein Chemie Rheinau Gmbh Mikrogele in Kombination mit funktionalen Additiven
DE102005014272A1 (de) 2005-03-24 2006-09-28 Rhein Chemie Rheinau Gmbh Mikrogele und Verdickungsmittel enthaltende Zusammensetzungen
DE102005014270A1 (de) 2005-03-24 2006-10-05 Rhein Chemie Rheinau Gmbh Verwendung von vernetzten Mikrogelen zur Modifikation des temperaturabhängigen Verhaltens von nicht-vernetzbaren organischen Medien
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
JP4138783B2 (ja) * 2005-07-26 2008-08-27 ザイオソフト株式会社 画像処理方法及び画像処理プログラム
JP2009538510A (ja) * 2006-05-24 2009-11-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 外部電極蛍光ランプを作製する方法、それに用いる厚膜電極組成物、それから作製されたランプおよびlcdデバイス
JP2008063457A (ja) 2006-09-07 2008-03-21 Sekisui Chem Co Ltd 無機微粒子分散ペースト組成物
US8367051B2 (en) 2006-10-09 2013-02-05 Carnegie Mellon University Preparation of functional gel particles with a dual crosslink network
CN100556924C (zh) 2007-04-02 2009-11-04 东华大学 温度和pH值敏感性纳米级的微凝胶的制备方法
KR20090108781A (ko) * 2008-04-14 2009-10-19 주식회사 동진쎄미켐 흑색 도전성 페이스트 조성물, 이를 포함하는 전자파차폐용 필터 및 표시 장치
US8288453B2 (en) 2008-06-26 2012-10-16 Ccp Composites Us Process to disperse organic microparticles/nanoparticles into non-aqueous resin medium
CN101645318A (zh) 2008-08-07 2010-02-10 上海昌银电子材料科技有限公司 一种笔记本电脑键盘线路专用导电银浆料及其制备方法
JP2010087251A (ja) 2008-09-30 2010-04-15 Dic Corp 太陽電池用導電性ペースト
JP2010118158A (ja) 2008-11-11 2010-05-27 Samsung Yokohama Research Institute Co Ltd 光電変換素子用ペースト組成物、光電変換素子用多孔質膜の製造方法及び光電変換素子
KR20100056730A (ko) * 2008-11-20 2010-05-28 에스에스씨피 주식회사 도전성 페이스트 조성물
JP2010126560A (ja) 2008-11-25 2010-06-10 Samsung Sdi Co Ltd ペースト組成物、プラズマディスプレイパネル用パネル基板の製造方法およびプラズマディスプレイパネル
WO2010123967A2 (en) 2009-04-22 2010-10-28 E. I. Du Pont De Nemours And Company Glass compositions used in conductors for photovoltaic cells
TWI483999B (zh) * 2009-06-15 2015-05-11 Toray Industries 黑色複合微粒子、黑色樹脂組成物、彩色濾光片基板及液晶顯示裝置
WO2011014615A1 (en) 2009-07-30 2011-02-03 E. I. Du Pont De Nemours And Company Method of preparing dispersions
US9592341B2 (en) * 2009-10-16 2017-03-14 Sanofi-Aventis Deutschland Gmbh Arrangement for use in a drug delivery device
KR20110049222A (ko) 2009-11-04 2011-05-12 엘지이노텍 주식회사 실리콘 오일을 포함하는 전극 형성용 페이스트 조성물
TWI498308B (zh) 2010-05-04 2015-09-01 杜邦股份有限公司 含有鉛-碲-鋰-鈦-氧化物之厚膜膏及其在半導體裝置之製造中的用途
GB201017099D0 (en) * 2010-10-11 2010-11-24 Black Edward Envelopes and mailers
JP2012140558A (ja) 2011-01-05 2012-07-26 Sekisui Chem Co Ltd 無機微粒子分散ペースト組成物
CN105969773A (zh) 2011-02-03 2016-09-28 米尔纳医疗股份有限公司 Mir-124的合成模拟物
JP2012164772A (ja) * 2011-02-04 2012-08-30 E I Du Pont De Nemours & Co 太陽電池電極作製用光硬化性導電ペースト、該ペーストを用いた太陽電池電極の作製方法及び該ペーストを用いて作製された太陽電池電極
US20130061919A1 (en) * 2011-03-18 2013-03-14 E I Du Pont Nemours And Company Method of manufacturing solar cell electrode
JP5703088B2 (ja) 2011-03-28 2015-04-15 積水化学工業株式会社 色素増感太陽電池電極形成用ペースト
KR102011477B1 (ko) 2011-03-29 2019-08-16 썬 케미칼 코포레이션 왁스 요변체를 함유하는 고-종횡비 스크린 인쇄성 후막 페이스트 조성물
KR101293060B1 (ko) * 2011-03-30 2013-08-05 현대제철 주식회사 전기로용 지붕
US8394396B2 (en) 2011-05-05 2013-03-12 Eastman Kodak Company Method of making inorganic porous particles
US8389324B2 (en) 2011-07-05 2013-03-05 E I Du Pont De Nemours And Company Method of manufacturing solar cell electrode and conductive paste
US8808581B2 (en) 2011-08-15 2014-08-19 E I Du Pont De Nemours And Company Conductive compositions containing Li2RuO3 and ion-exchanged Li2RuO3 and their use in the manufacture of semiconductor devices
US10038109B2 (en) 2011-09-09 2018-07-31 Heraeus Precious Metals North America Conshohocken Llc Silver solar cell contacts
US8771554B2 (en) * 2011-10-20 2014-07-08 E I Du Pont De Nemours And Company Thick film silver paste containing Al2O3 and lead-tellurium—oxide and its use in the manufacture of semiconductor devices
SG10201608690XA (en) 2011-10-25 2016-12-29 Heraeus Precious Metals North America Conshohocken Llc Electroconductive paste composition containing metal nanoparticles
TWI580701B (zh) * 2011-10-27 2017-05-01 三菱麗陽股份有限公司 乙烯基聚合物粉末、硬化性樹脂組成物及硬化物
US20130180583A1 (en) 2012-01-17 2013-07-18 E I Du Pont De Nemours And Company Conductive paste for fine-line high-aspect-ratio screen printing in the manufacture of semiconductor devices
CN104769682B (zh) 2012-08-31 2019-01-18 赫劳斯贵金属有限两和公司 在电极制备中的包含Ag纳米颗粒和球形Ag微米颗粒的导电浆料
CN102881350B (zh) * 2012-09-25 2015-07-22 深圳市首骋新材料科技有限公司 太阳能电池正面电极浆料及玻璃粉
WO2014059577A1 (en) 2012-10-15 2014-04-24 Dow Global Technologies Llc Conductive composition
KR101600652B1 (ko) 2012-11-12 2016-03-07 제일모직주식회사 태양전지 전극용 페이스트 및 이로부터 제조된 전극
US20150315305A1 (en) * 2012-11-30 2015-11-05 Soken Chemical & Engineering Co., Ltd. Paste Composition, and Calcined Body and Production Process for the Same
JP6159173B2 (ja) 2013-06-27 2017-07-05 株式会社ミマキエンジニアリング 絵付耐熱部材の製造方法及び印刷装置
CN103915132A (zh) 2014-02-24 2014-07-09 西北稀有金属材料研究院 一种叠层片式电感器用内电极银浆及其制备方法
CN103996430A (zh) * 2014-04-24 2014-08-20 安徽为民磁力科技有限公司 一种高导电性pcb电路板银浆及其制备方法
KR101696985B1 (ko) 2014-12-30 2017-01-17 삼성에스디아이 주식회사 태양전지 전극 형성용 조성물 및 이로부터 제조된 전극
JP5957546B2 (ja) 2015-01-07 2016-07-27 株式会社ノリタケカンパニーリミテド 導電性組成物
WO2016126801A1 (en) 2015-02-04 2016-08-11 E I Du Pont De Nemours And Company Conductive paste composition and semiconductor devices made therewith
WO2016194882A1 (ja) 2015-06-01 2016-12-08 株式会社ノリタケカンパニーリミテド 導電性組成物と電極形成方法
JP6084270B1 (ja) 2015-11-10 2017-02-22 株式会社ノリタケカンパニーリミテド 導電性組成物
JP7027025B2 (ja) 2015-11-10 2022-03-01 ナミックス株式会社 導電性組成物
JP2017152520A (ja) 2016-02-24 2017-08-31 株式会社ノリタケカンパニーリミテド メタルマスクによるスクリーン印刷用の導体ペーストおよびその利用
US10741300B2 (en) 2016-10-07 2020-08-11 E I Du Pont De Nemours And Company Conductive paste composition and semiconductor devices made therewith

Similar Documents

Publication Publication Date Title
JP2018506152A5 (enExample)
US9150735B2 (en) Superhydrophilic and water-capturing surfaces
JP5898065B2 (ja) シリコンウエハの前面上にグリッド電極を形成する方法
JP2011096748A5 (enExample)
WO2013023169A8 (en) Aluminium paste with no or poor fire -through capability and use thereof for back electrodes of passivated emitter and rear contact silicon solar cells
TWI576863B (zh) 一種含無鉛玻璃熔塊之導電漿(一)
JP5519292B2 (ja) 導電性ポリマーの高仕事関数および高導電率組成物
KR101050529B1 (ko) 입도분포 및 크기가 제어된 알루미늄 분말을 포함하는 전극형성용 조성물과 이를 이용하여 제조되는 전극
TWI504010B (zh) 在矽晶圓的前側上形成柵極電極之方法
US9490454B2 (en) Method for producing a high efficiency organic light emitting device having a transparent composite electrode comprising a film of conductive nanowires, carbon nanoparticles, light scattering nanoparticles, and a polymer support
JP2017507484A5 (enExample)
JP2012527780A5 (enExample)
CN111480206A (zh) 导电性糊剂
WO2012106589A3 (en) Solar cell electrode, and method for manufacturing the same, and paste for the solar cell electrode
Del Mauro et al. Study of the effect of the doped poly (3, 4-ethylenedioxythiophene): poly (styrene sulfonate) polymeric anode on the organic light-emitting diode performances
CN103408993A (zh) 导电油墨、透明导电体及其制备方法
CN104756197A (zh) 用于形成太阳能电池电极的组成物及由其制备的电极
TW200912528A (en) Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby
Otsuka et al. Effect of electric field concentration using nanopeak structures on the current–voltage characteristics of resistive switching memory
JP2018537588A5 (enExample)
CN106660310A (zh) 压敏响应性层叠体、涂层及压敏响应性赋予材料
JP4888643B2 (ja) 導電性高分子微粒子分散体及びそれを用いる導電性塗料
EP1873790A4 (en) PULP COMPOSITION, ELECTRODE AND SOLAR CELL DEVICE COMPRISING THE SAME
US3938069A (en) Metal oxide varistor with passivating coating
JP2018098509A (ja) 光起電力モジュールの製造方法およびそれによって得られた光起電力モジュール