JP2018504228A5 - - Google Patents

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Publication number
JP2018504228A5
JP2018504228A5 JP2017540877A JP2017540877A JP2018504228A5 JP 2018504228 A5 JP2018504228 A5 JP 2018504228A5 JP 2017540877 A JP2017540877 A JP 2017540877A JP 2017540877 A JP2017540877 A JP 2017540877A JP 2018504228 A5 JP2018504228 A5 JP 2018504228A5
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JP
Japan
Prior art keywords
ultrasonic probe
heat
conductive
flexible circuit
cover
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Application number
JP2017540877A
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English (en)
Japanese (ja)
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JP6882983B2 (ja
JP2018504228A (ja
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Priority claimed from PCT/IB2016/050310 external-priority patent/WO2016125040A2/en
Publication of JP2018504228A publication Critical patent/JP2018504228A/ja
Publication of JP2018504228A5 publication Critical patent/JP2018504228A5/ja
Application granted granted Critical
Publication of JP6882983B2 publication Critical patent/JP6882983B2/ja
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JP2017540877A 2015-02-06 2016-01-22 超音波トランスデューサの熱管理のためのシステム、方法、及び装置 Active JP6882983B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562112723P 2015-02-06 2015-02-06
US62/112,723 2015-02-06
PCT/IB2016/050310 WO2016125040A2 (en) 2015-02-06 2016-01-22 Systems, methods, and apparatuses for thermal management of ultrasound transducers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021035180A Division JP7057849B6 (ja) 2015-02-06 2021-03-05 超音波トランスデューサの熱管理のためのシステム、方法、及び装置

Publications (3)

Publication Number Publication Date
JP2018504228A JP2018504228A (ja) 2018-02-15
JP2018504228A5 true JP2018504228A5 (OSRAM) 2020-07-02
JP6882983B2 JP6882983B2 (ja) 2021-06-02

Family

ID=55456841

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017540877A Active JP6882983B2 (ja) 2015-02-06 2016-01-22 超音波トランスデューサの熱管理のためのシステム、方法、及び装置
JP2021035180A Active JP7057849B6 (ja) 2015-02-06 2021-03-05 超音波トランスデューサの熱管理のためのシステム、方法、及び装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021035180A Active JP7057849B6 (ja) 2015-02-06 2021-03-05 超音波トランスデューサの熱管理のためのシステム、方法、及び装置

Country Status (5)

Country Link
US (1) US11090031B2 (OSRAM)
EP (1) EP3253294B1 (OSRAM)
JP (2) JP6882983B2 (OSRAM)
CN (1) CN107205723B (OSRAM)
WO (1) WO2016125040A2 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10488502B2 (en) * 2017-04-26 2019-11-26 General Electric Company Ultrasound probe with thin film flex circuit and methods of providing same
JP6548234B2 (ja) * 2017-11-30 2019-07-24 ゼネラル・エレクトリック・カンパニイ 超音波プローブ及び超音波画像表示装置
US11717271B2 (en) 2018-03-30 2023-08-08 Koninklijke Philips N.V. Thermally-conductive material layer and internal structure for ultrasound imaging
CA3110710A1 (en) 2018-09-21 2020-03-26 Butterfly Network, Inc. Acoustic damping for ultrasound imaging devices
WO2020062258A1 (zh) * 2018-09-30 2020-04-02 深圳迈瑞生物医疗电子股份有限公司 一种超声探头
CN110960252A (zh) * 2018-09-30 2020-04-07 深圳迈瑞生物医疗电子股份有限公司 一种超声探头
US20230233192A1 (en) * 2022-01-25 2023-07-27 GE Precision Healthcare LLC Phase Change Insert for Ultrasound Imaging Probe

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545942A (en) * 1994-11-21 1996-08-13 General Electric Company Method and apparatus for dissipating heat from a transducer element array of an ultrasound probe
US5961465A (en) * 1998-02-10 1999-10-05 Hewlett-Packard Company Ultrasound signal processing electronics with active cooling
JP3420954B2 (ja) * 1998-12-14 2003-06-30 松下電器産業株式会社 超音波探触子
JP2001074710A (ja) * 1999-09-07 2001-03-23 Matsushita Electric Ind Co Ltd 超音波探触子
JP2003168882A (ja) * 2001-11-30 2003-06-13 Sony Corp 熱伝導性シート
US7314447B2 (en) 2002-06-27 2008-01-01 Siemens Medical Solutions Usa, Inc. System and method for actively cooling transducer assembly electronics
JP4332706B2 (ja) * 2003-05-06 2009-09-16 株式会社日立メディコ 超音波探触子
JP4624659B2 (ja) * 2003-09-30 2011-02-02 パナソニック株式会社 超音波探触子
US7105986B2 (en) * 2004-08-27 2006-09-12 General Electric Company Ultrasound transducer with enhanced thermal conductivity
CN2865867Y (zh) * 2006-03-09 2007-02-07 上海爱培克电子科技有限公司 一种超声换能器
JP4843395B2 (ja) * 2006-07-10 2011-12-21 日本電波工業株式会社 超音波探触子
US7834522B2 (en) 2007-08-03 2010-11-16 Mr Holdings (Hk) Limited Diagnostic ultrasound transducer
JP2009060501A (ja) 2007-09-03 2009-03-19 Fujifilm Corp バッキング材、超音波探触子、超音波内視鏡、超音波診断装置、及び、超音波内視鏡装置
JP2009061112A (ja) * 2007-09-06 2009-03-26 Ge Medical Systems Global Technology Co Llc 超音波探触子および超音波撮像装置
CN101911178A (zh) * 2007-12-27 2010-12-08 皇家飞利浦电子股份有限公司 具有改善的热行为的超声换能器组件
KR101112658B1 (ko) * 2008-11-19 2012-02-15 삼성메디슨 주식회사 초음파 진단장치용 프로브 및 그 제조방법
KR101064601B1 (ko) * 2009-02-10 2011-09-15 주식회사 휴먼스캔 초음파 탐촉자, 초음파 영상 장치 및 그의 제조 방법
KR101137262B1 (ko) * 2009-03-18 2012-04-20 삼성메디슨 주식회사 초음파 진단장치용 프로브 및 그 제조방법
JP5619380B2 (ja) * 2009-06-24 2014-11-05 株式会社東芝 超音波プローブ
US20110062824A1 (en) * 2009-09-15 2011-03-17 Fujifilm Corporation Ultrasonic transducer, ultrasonic probe and producing method
US8232705B2 (en) * 2010-07-09 2012-07-31 General Electric Company Thermal transfer and acoustic matching layers for ultrasound transducer
JP5215372B2 (ja) * 2010-12-08 2013-06-19 富士フイルム株式会社 超音波探触子
JP2014516686A (ja) * 2011-05-17 2014-07-17 コーニンクレッカ フィリップス エヌ ヴェ 受動的な熱放散を用いるマトリクス超音波プローブ
JP2013115537A (ja) * 2011-11-28 2013-06-10 Ge Medical Systems Global Technology Co Llc バッキング部材、超音波プローブ及び超音波画像表示装置
CN103142244B (zh) * 2011-12-07 2015-01-14 深圳迈瑞生物医疗电子股份有限公司 一种超声探头
KR101330733B1 (ko) * 2012-04-30 2013-11-20 삼성전자주식회사 초음파 프로브
US9072487B2 (en) * 2012-05-11 2015-07-07 General Electric Company Ultrasound probe thermal drain
JP5550706B2 (ja) * 2012-10-31 2014-07-16 日立アロカメディカル株式会社 超音波探触子
WO2014080312A1 (en) * 2012-11-20 2014-05-30 Koninklijke Philips N.V. Frameless ultrasound probes with heat dissipation
CN103300889B (zh) * 2013-05-17 2015-04-29 深圳市理邦精密仪器股份有限公司 一种超声阵列探头信号采集元件及其探头与其制备方法
US9419202B2 (en) * 2013-06-21 2016-08-16 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR20150006519A (ko) * 2013-07-08 2015-01-19 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
EP2992829B1 (en) * 2014-09-02 2018-06-20 Esaote S.p.A. Ultrasound probe with optimized thermal management

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