JP2018502443A5 - - Google Patents
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- Publication number
- JP2018502443A5 JP2018502443A5 JP2017522916A JP2017522916A JP2018502443A5 JP 2018502443 A5 JP2018502443 A5 JP 2018502443A5 JP 2017522916 A JP2017522916 A JP 2017522916A JP 2017522916 A JP2017522916 A JP 2017522916A JP 2018502443 A5 JP2018502443 A5 JP 2018502443A5
- Authority
- JP
- Japan
- Prior art keywords
- heating
- heater
- heater assembly
- control system
- controller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 71
- 230000008859 change Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000013507 mapping Methods 0.000 claims description 4
- 230000000638 stimulation Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 230000004044 response Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims 3
- 238000004891 communication Methods 0.000 claims 2
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/530,670 | 2014-10-31 | ||
| US14/530,670 US10163668B2 (en) | 2011-08-30 | 2014-10-31 | Thermal dynamic response sensing systems for heaters |
| PCT/US2015/057905 WO2016069808A1 (en) | 2014-10-31 | 2015-10-28 | Thermal dynamic response sensing systems for heaters |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018206740A Division JP6692875B2 (ja) | 2014-10-31 | 2018-11-01 | ヒーターシステムに対する熱動的応答感知の方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018502443A JP2018502443A (ja) | 2018-01-25 |
| JP2018502443A5 true JP2018502443A5 (enExample) | 2018-07-12 |
| JP6431190B2 JP6431190B2 (ja) | 2018-11-28 |
Family
ID=54548258
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017522916A Active JP6431190B2 (ja) | 2014-10-31 | 2015-10-28 | ヒーター用熱動的応答感知システム |
| JP2018206740A Active JP6692875B2 (ja) | 2014-10-31 | 2018-11-01 | ヒーターシステムに対する熱動的応答感知の方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018206740A Active JP6692875B2 (ja) | 2014-10-31 | 2018-11-01 | ヒーターシステムに対する熱動的応答感知の方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3213598B1 (enExample) |
| JP (2) | JP6431190B2 (enExample) |
| KR (2) | KR101999705B1 (enExample) |
| CN (1) | CN107078082B (enExample) |
| TW (1) | TWI681483B (enExample) |
| WO (1) | WO2016069808A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180011119A (ko) * | 2015-05-22 | 2018-01-31 | 어플라이드 머티어리얼스, 인코포레이티드 | 방위방향으로 튜닝가능한 다중-구역 정전 척 |
| WO2018016384A1 (ja) * | 2016-07-19 | 2018-01-25 | 日本碍子株式会社 | 静電チャックヒータ |
| US10651095B2 (en) | 2016-08-11 | 2020-05-12 | Applied Materials, Inc. | Thermal profile monitoring wafer and methods of monitoring temperature |
| JP7349439B2 (ja) * | 2017-11-21 | 2023-09-22 | ワトロー エレクトリック マニュファクチュアリング カンパニー | 経路層を持つ複数領域ペデスタルヒーター |
| KR20250007684A (ko) | 2018-03-08 | 2025-01-14 | 와틀로 일렉트릭 매뉴팩츄어링 컴파니 | 히터 제어를 위한 제어 시스템 |
| JP7006523B2 (ja) * | 2018-06-19 | 2022-01-24 | オムロン株式会社 | 情報処理装置、情報処理方法、およびプログラム |
| US10872747B2 (en) * | 2018-08-08 | 2020-12-22 | Lam Research Corporation | Controlling showerhead heating via resistive thermal measurements |
| US11240881B2 (en) * | 2019-04-08 | 2022-02-01 | Watlow Electric Manufacturing Company | Method of manufacturing and adjusting a resistive heater |
| KR102848261B1 (ko) * | 2019-06-07 | 2025-08-27 | 와틀로 일렉트릭 매뉴팩츄어링 컴파니 | 전기 히터를 작동시키는 제어 시스템을 교정하는 시스템 및 방법 |
| WO2021016223A1 (en) * | 2019-07-25 | 2021-01-28 | Lam Research Corporation | In situ real-time sensing and compensation of non-uniformities in substrate processing systems |
| CN114729837A (zh) * | 2019-11-19 | 2022-07-08 | 朗姆研究公司 | 温度监测 |
| TWI850533B (zh) * | 2020-02-24 | 2024-08-01 | 美商瓦特洛威電子製造公司 | 控制加熱器之控制系統之動態校準技術 |
| US11551951B2 (en) * | 2020-05-05 | 2023-01-10 | Applied Materials, Inc. | Methods and systems for temperature control for a substrate |
| JP7731373B2 (ja) * | 2020-05-19 | 2025-08-29 | ワトロー エレクトリック マニュファクチュアリング カンパニー | 抵抗ヒーターのための受動的及び能動的な較正方法 |
| KR102602807B1 (ko) * | 2020-08-14 | 2023-11-15 | 세메스 주식회사 | 히터 제어 장치 및 이를 구비하는 기판 처리 시스템 |
| KR102520584B1 (ko) * | 2020-10-14 | 2023-04-10 | 세메스 주식회사 | 공정 계측 장치 및 방법 |
| US12446122B2 (en) | 2021-05-10 | 2025-10-14 | Samsung Electronics Co., Ltd. | Systems and methods for temperature profile control of microwave oven devices |
| US12146794B2 (en) * | 2021-05-17 | 2024-11-19 | Rosemount Aerospace Inc. | Infrared inspection system for heaters comprised of positive temperature coefficient resistors |
| CN116106652B (zh) * | 2021-11-09 | 2025-11-25 | 苏州外延世电子材料有限公司 | Pe-cvd加热板检测装置 |
| US12520391B2 (en) | 2022-02-24 | 2026-01-06 | Samsung Electronics Co., Ltd. | Systems and methods for mapping heat deposition in a cooking appliance through fast pattern temperature imaging |
| US12390046B2 (en) | 2022-03-29 | 2025-08-19 | Samsung Electronics Company, Ltd. | Systems and methods for achieving a user-specified temperature profile in a cooking appliance through heating control algorithms |
| KR102579663B1 (ko) * | 2023-06-27 | 2023-09-18 | 시스트로닉스 주식회사 | 공기 가열을 통해 측정 정확도를 향상시키는 공기성분측정 장치 |
| CN119133323A (zh) * | 2024-11-14 | 2024-12-13 | 中矿资源(天津)新材料有限公司 | 电池膜层的退火工艺及退火设备 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6016383A (en) * | 1990-01-19 | 2000-01-18 | Applied Materials, Inc. | Rapid thermal heating apparatus and method including an infrared camera to measure substrate temperature |
| EP0511294B1 (en) * | 1990-01-19 | 1996-04-03 | Applied Materials, Inc. | Heating apparatus for semiconductor wafers or substrates |
| US5549874A (en) * | 1992-04-23 | 1996-08-27 | Ebara Corporation | Discharge reactor |
| JP2651793B2 (ja) * | 1993-12-20 | 1997-09-10 | 坂口電熱株式会社 | セラミックファイバーヒーター |
| US6073577A (en) | 1998-06-30 | 2000-06-13 | Lam Research Corporation | Electrode for plasma processes and method for manufacture and use thereof |
| DE19907497C2 (de) * | 1999-02-22 | 2003-05-28 | Steag Hamatech Ag | Vorrichtung und Verfahren zur Wärmebehandlung von Substraten |
| DE10059665C1 (de) * | 2000-12-01 | 2002-07-11 | Steag Hamatech Ag | Verfahren zum thermischen Behandeln von Substraten |
| US7196295B2 (en) | 2003-11-21 | 2007-03-27 | Watlow Electric Manufacturing Company | Two-wire layered heater system |
| US7178353B2 (en) | 2004-02-19 | 2007-02-20 | Advanced Thermal Sciences Corp. | Thermal control system and method |
| JP2006339447A (ja) * | 2005-06-02 | 2006-12-14 | Sumco Corp | エピタキシャル成長装置及びエピタキシャル成長方法 |
| US7763831B2 (en) * | 2006-12-15 | 2010-07-27 | Ngk Insulators, Ltd. | Heating device |
| JP5117146B2 (ja) * | 2006-12-15 | 2013-01-09 | 日本碍子株式会社 | 加熱装置 |
| EP1937032B1 (en) * | 2006-12-20 | 2020-11-04 | Electrolux Home Products Corporation N.V. | Household appliance |
| US7942969B2 (en) * | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
| US8540819B2 (en) * | 2008-03-21 | 2013-09-24 | Ngk Insulators, Ltd. | Ceramic heater |
| US8532832B2 (en) | 2008-09-23 | 2013-09-10 | Be Aerospace, Inc. | Method and apparatus for thermal exchange with two-phase media |
| JP5430192B2 (ja) * | 2009-03-19 | 2014-02-26 | 東京エレクトロン株式会社 | 温度調節装置、温度調節方法、基板処理装置及び対向電極 |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
| WO2013033394A2 (en) * | 2011-08-30 | 2013-03-07 | Watlow Electric Manufacturing Company | High definition heater system having a fluid medium |
| EP2834839A4 (en) * | 2012-02-29 | 2016-03-30 | Oasis Materials Corp | PRESSURE-FREE CONNECTION OF ALUMINUM NITRIDE COMPONENTS WITH TEMPORARY LIQUID PHASE |
| CN102975486B (zh) * | 2012-12-11 | 2015-04-15 | 苏州市晨彩纺织研发有限公司 | 一种印花均热装置 |
| JP6140457B2 (ja) * | 2013-01-21 | 2017-05-31 | 東京エレクトロン株式会社 | 接着方法、載置台及び基板処理装置 |
-
2015
- 2015-10-28 KR KR1020177011493A patent/KR101999705B1/ko active Active
- 2015-10-28 KR KR1020197016773A patent/KR102110267B1/ko active Active
- 2015-10-28 EP EP15795267.2A patent/EP3213598B1/en active Active
- 2015-10-28 CN CN201580058429.9A patent/CN107078082B/zh active Active
- 2015-10-28 JP JP2017522916A patent/JP6431190B2/ja active Active
- 2015-10-28 WO PCT/US2015/057905 patent/WO2016069808A1/en not_active Ceased
- 2015-10-30 TW TW104135812A patent/TWI681483B/zh active
-
2018
- 2018-11-01 JP JP2018206740A patent/JP6692875B2/ja active Active
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