TWI681483B - 用於加熱器的熱動態響應感測系統 - Google Patents

用於加熱器的熱動態響應感測系統 Download PDF

Info

Publication number
TWI681483B
TWI681483B TW104135812A TW104135812A TWI681483B TW I681483 B TWI681483 B TW I681483B TW 104135812 A TW104135812 A TW 104135812A TW 104135812 A TW104135812 A TW 104135812A TW I681483 B TWI681483 B TW I681483B
Authority
TW
Taiwan
Prior art keywords
heater
heating
heater assembly
temperature
layer
Prior art date
Application number
TW104135812A
Other languages
English (en)
Chinese (zh)
Other versions
TW201624588A (zh
Inventor
路易斯 史汀豪賽
Original Assignee
瓦特洛威電子製造公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/530,670 external-priority patent/US10163668B2/en
Application filed by 瓦特洛威電子製造公司 filed Critical 瓦特洛威電子製造公司
Publication of TW201624588A publication Critical patent/TW201624588A/zh
Application granted granted Critical
Publication of TWI681483B publication Critical patent/TWI681483B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
TW104135812A 2014-10-31 2015-10-30 用於加熱器的熱動態響應感測系統 TWI681483B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/530,670 2014-10-31
US14/530,670 US10163668B2 (en) 2011-08-30 2014-10-31 Thermal dynamic response sensing systems for heaters

Publications (2)

Publication Number Publication Date
TW201624588A TW201624588A (zh) 2016-07-01
TWI681483B true TWI681483B (zh) 2020-01-01

Family

ID=54548258

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104135812A TWI681483B (zh) 2014-10-31 2015-10-30 用於加熱器的熱動態響應感測系統

Country Status (6)

Country Link
EP (1) EP3213598B1 (enExample)
JP (2) JP6431190B2 (enExample)
KR (2) KR101999705B1 (enExample)
CN (1) CN107078082B (enExample)
TW (1) TWI681483B (enExample)
WO (1) WO2016069808A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107636817B (zh) * 2015-05-22 2021-08-27 应用材料公司 方位可调整的多区域静电夹具
CN108028221B (zh) * 2016-07-19 2022-12-06 日本碍子株式会社 静电卡盘加热器
US10651095B2 (en) * 2016-08-11 2020-05-12 Applied Materials, Inc. Thermal profile monitoring wafer and methods of monitoring temperature
US11382180B2 (en) * 2017-11-21 2022-07-05 Watlow Electric Manufacturing Company Multi-zone pedestal heater having a routing layer
KR102997441B1 (ko) * 2018-03-08 2026-07-28 와틀로 일렉트릭 매뉴팩츄어링 컴파니 히터 제어를 위한 제어 시스템
JP7006523B2 (ja) * 2018-06-19 2022-01-24 オムロン株式会社 情報処理装置、情報処理方法、およびプログラム
US10872747B2 (en) * 2018-08-08 2020-12-22 Lam Research Corporation Controlling showerhead heating via resistive thermal measurements
US11240881B2 (en) * 2019-04-08 2022-02-01 Watlow Electric Manufacturing Company Method of manufacturing and adjusting a resistive heater
CN113966644B (zh) * 2019-06-07 2025-11-04 沃特洛电气制造公司 用于校准操作电加热器的控制系统的系统和方法
CN118588527A (zh) * 2019-07-25 2024-09-03 朗姆研究公司 衬底处理系统中非均匀性的原位实时感测和补偿
KR102940624B1 (ko) * 2019-11-19 2026-03-17 램 리써치 코포레이션 온도 모니터링
EP4111818B1 (en) * 2020-02-24 2025-04-09 Watlow Electric Manufacturing Company Dynamic calibration of a control system controlling a heater
US11551951B2 (en) * 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
WO2021236812A1 (en) * 2020-05-19 2021-11-25 Watlow Electric Manufacturing Company Passive and active calibration methods for a resistive heater
KR102602807B1 (ko) * 2020-08-14 2023-11-15 세메스 주식회사 히터 제어 장치 및 이를 구비하는 기판 처리 시스템
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법
US12446122B2 (en) 2021-05-10 2025-10-14 Samsung Electronics Co., Ltd. Systems and methods for temperature profile control of microwave oven devices
US12146794B2 (en) 2021-05-17 2024-11-19 Rosemount Aerospace Inc. Infrared inspection system for heaters comprised of positive temperature coefficient resistors
CN116106652B (zh) * 2021-11-09 2025-11-25 苏州外延世电子材料有限公司 Pe-cvd加热板检测装置
US12520391B2 (en) 2022-02-24 2026-01-06 Samsung Electronics Co., Ltd. Systems and methods for mapping heat deposition in a cooking appliance through fast pattern temperature imaging
US12390046B2 (en) 2022-03-29 2025-08-19 Samsung Electronics Company, Ltd. Systems and methods for achieving a user-specified temperature profile in a cooking appliance through heating control algorithms
KR102579663B1 (ko) * 2023-06-27 2023-09-18 시스트로닉스 주식회사 공기 가열을 통해 측정 정확도를 향상시키는 공기성분측정 장치
CN119133323A (zh) * 2024-11-14 2024-12-13 中矿资源(天津)新材料有限公司 电池膜层的退火工艺及退火设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6512207B1 (en) * 1999-02-22 2003-01-28 Steag Hamatech Ag Apparatus and method for the treatment of substrates
US20100240154A1 (en) * 2009-03-19 2010-09-23 Tokyo Electron Limited Temperature control device, temperature control method, and substrate processing apparatus
US20130161305A1 (en) * 2011-08-30 2013-06-27 Watlow Electric Manufacturing Company High definition heater and method of operation

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6016383A (en) * 1990-01-19 2000-01-18 Applied Materials, Inc. Rapid thermal heating apparatus and method including an infrared camera to measure substrate temperature
EP0511294B1 (en) * 1990-01-19 1996-04-03 Applied Materials, Inc. Heating apparatus for semiconductor wafers or substrates
US5549874A (en) * 1992-04-23 1996-08-27 Ebara Corporation Discharge reactor
JP2651793B2 (ja) * 1993-12-20 1997-09-10 坂口電熱株式会社 セラミックファイバーヒーター
US6073577A (en) 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
DE10059665C1 (de) * 2000-12-01 2002-07-11 Steag Hamatech Ag Verfahren zum thermischen Behandeln von Substraten
US7196295B2 (en) 2003-11-21 2007-03-27 Watlow Electric Manufacturing Company Two-wire layered heater system
US7178353B2 (en) 2004-02-19 2007-02-20 Advanced Thermal Sciences Corp. Thermal control system and method
JP2006339447A (ja) * 2005-06-02 2006-12-14 Sumco Corp エピタキシャル成長装置及びエピタキシャル成長方法
JP5117146B2 (ja) * 2006-12-15 2013-01-09 日本碍子株式会社 加熱装置
US7763831B2 (en) * 2006-12-15 2010-07-27 Ngk Insulators, Ltd. Heating device
EP1937032B1 (en) * 2006-12-20 2020-11-04 Electrolux Home Products Corporation N.V. Household appliance
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8540819B2 (en) * 2008-03-21 2013-09-24 Ngk Insulators, Ltd. Ceramic heater
US8532832B2 (en) 2008-09-23 2013-09-10 Be Aerospace, Inc. Method and apparatus for thermal exchange with two-phase media
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
WO2013130918A1 (en) * 2012-02-29 2013-09-06 Harris, Jonathan, H. Transient liquid phase, pressureless joining of aluminum nitride components
CN102975486B (zh) * 2012-12-11 2015-04-15 苏州市晨彩纺织研发有限公司 一种印花均热装置
JP6140457B2 (ja) * 2013-01-21 2017-05-31 東京エレクトロン株式会社 接着方法、載置台及び基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6512207B1 (en) * 1999-02-22 2003-01-28 Steag Hamatech Ag Apparatus and method for the treatment of substrates
US20100240154A1 (en) * 2009-03-19 2010-09-23 Tokyo Electron Limited Temperature control device, temperature control method, and substrate processing apparatus
US20130161305A1 (en) * 2011-08-30 2013-06-27 Watlow Electric Manufacturing Company High definition heater and method of operation

Also Published As

Publication number Publication date
JP2019061960A (ja) 2019-04-18
CN107078082A (zh) 2017-08-18
JP6692875B2 (ja) 2020-05-13
EP3213598B1 (en) 2023-07-05
CN107078082B (zh) 2021-04-09
JP2018502443A (ja) 2018-01-25
KR20190069624A (ko) 2019-06-19
EP3213598A1 (en) 2017-09-06
KR20170078645A (ko) 2017-07-07
WO2016069808A1 (en) 2016-05-06
KR101999705B1 (ko) 2019-07-12
JP6431190B2 (ja) 2018-11-28
KR102110267B1 (ko) 2020-05-14
TW201624588A (zh) 2016-07-01

Similar Documents

Publication Publication Date Title
US20240371665A1 (en) Thermal dynamic response sensing systems for heaters
JP6692875B2 (ja) ヒーターシステムに対する熱動的応答感知の方法
US10043685B2 (en) High definition heater and method of operation
CN108432341B (zh) 集成加热器和传感器系统
US10475687B2 (en) Electrostatic chuck device
KR101944691B1 (ko) 와이어 수가 감소된 가열기 어레이 블럭