JP6431190B2 - ヒーター用熱動的応答感知システム - Google Patents

ヒーター用熱動的応答感知システム Download PDF

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Publication number
JP6431190B2
JP6431190B2 JP2017522916A JP2017522916A JP6431190B2 JP 6431190 B2 JP6431190 B2 JP 6431190B2 JP 2017522916 A JP2017522916 A JP 2017522916A JP 2017522916 A JP2017522916 A JP 2017522916A JP 6431190 B2 JP6431190 B2 JP 6431190B2
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Japan
Prior art keywords
heater
heating
heater assembly
layer
temperature
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Expired - Fee Related
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JP2017522916A
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English (en)
Japanese (ja)
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JP2018502443A5 (enExample
JP2018502443A (ja
Inventor
シュタインハウザー、ルイス・ピー
Original Assignee
ワットロー・エレクトリック・マニュファクチャリング・カンパニー
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Priority claimed from US14/530,670 external-priority patent/US10163668B2/en
Application filed by ワットロー・エレクトリック・マニュファクチャリング・カンパニー filed Critical ワットロー・エレクトリック・マニュファクチャリング・カンパニー
Publication of JP2018502443A publication Critical patent/JP2018502443A/ja
Publication of JP2018502443A5 publication Critical patent/JP2018502443A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Resistance Heating (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
JP2017522916A 2014-10-31 2015-10-28 ヒーター用熱動的応答感知システム Expired - Fee Related JP6431190B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/530,670 2014-10-31
US14/530,670 US10163668B2 (en) 2011-08-30 2014-10-31 Thermal dynamic response sensing systems for heaters
PCT/US2015/057905 WO2016069808A1 (en) 2014-10-31 2015-10-28 Thermal dynamic response sensing systems for heaters

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018206740A Division JP6692875B2 (ja) 2014-10-31 2018-11-01 ヒーターシステムに対する熱動的応答感知の方法

Publications (3)

Publication Number Publication Date
JP2018502443A JP2018502443A (ja) 2018-01-25
JP2018502443A5 JP2018502443A5 (enExample) 2018-07-12
JP6431190B2 true JP6431190B2 (ja) 2018-11-28

Family

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Family Applications (2)

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JP2017522916A Expired - Fee Related JP6431190B2 (ja) 2014-10-31 2015-10-28 ヒーター用熱動的応答感知システム
JP2018206740A Active JP6692875B2 (ja) 2014-10-31 2018-11-01 ヒーターシステムに対する熱動的応答感知の方法

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JP2018206740A Active JP6692875B2 (ja) 2014-10-31 2018-11-01 ヒーターシステムに対する熱動的応答感知の方法

Country Status (6)

Country Link
EP (1) EP3213598B1 (enExample)
JP (2) JP6431190B2 (enExample)
KR (2) KR101999705B1 (enExample)
CN (1) CN107078082B (enExample)
TW (1) TWI681483B (enExample)
WO (1) WO2016069808A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107636817B (zh) * 2015-05-22 2021-08-27 应用材料公司 方位可调整的多区域静电夹具
CN108028221B (zh) * 2016-07-19 2022-12-06 日本碍子株式会社 静电卡盘加热器
US10651095B2 (en) * 2016-08-11 2020-05-12 Applied Materials, Inc. Thermal profile monitoring wafer and methods of monitoring temperature
US11382180B2 (en) * 2017-11-21 2022-07-05 Watlow Electric Manufacturing Company Multi-zone pedestal heater having a routing layer
KR102997441B1 (ko) * 2018-03-08 2026-07-28 와틀로 일렉트릭 매뉴팩츄어링 컴파니 히터 제어를 위한 제어 시스템
JP7006523B2 (ja) * 2018-06-19 2022-01-24 オムロン株式会社 情報処理装置、情報処理方法、およびプログラム
US10872747B2 (en) * 2018-08-08 2020-12-22 Lam Research Corporation Controlling showerhead heating via resistive thermal measurements
US11240881B2 (en) * 2019-04-08 2022-02-01 Watlow Electric Manufacturing Company Method of manufacturing and adjusting a resistive heater
CN113966644B (zh) * 2019-06-07 2025-11-04 沃特洛电气制造公司 用于校准操作电加热器的控制系统的系统和方法
CN118588527A (zh) * 2019-07-25 2024-09-03 朗姆研究公司 衬底处理系统中非均匀性的原位实时感测和补偿
KR102940624B1 (ko) * 2019-11-19 2026-03-17 램 리써치 코포레이션 온도 모니터링
EP4111818B1 (en) * 2020-02-24 2025-04-09 Watlow Electric Manufacturing Company Dynamic calibration of a control system controlling a heater
US11551951B2 (en) * 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
WO2021236812A1 (en) * 2020-05-19 2021-11-25 Watlow Electric Manufacturing Company Passive and active calibration methods for a resistive heater
KR102602807B1 (ko) * 2020-08-14 2023-11-15 세메스 주식회사 히터 제어 장치 및 이를 구비하는 기판 처리 시스템
KR102520584B1 (ko) * 2020-10-14 2023-04-10 세메스 주식회사 공정 계측 장치 및 방법
US12446122B2 (en) 2021-05-10 2025-10-14 Samsung Electronics Co., Ltd. Systems and methods for temperature profile control of microwave oven devices
US12146794B2 (en) 2021-05-17 2024-11-19 Rosemount Aerospace Inc. Infrared inspection system for heaters comprised of positive temperature coefficient resistors
CN116106652B (zh) * 2021-11-09 2025-11-25 苏州外延世电子材料有限公司 Pe-cvd加热板检测装置
US12520391B2 (en) 2022-02-24 2026-01-06 Samsung Electronics Co., Ltd. Systems and methods for mapping heat deposition in a cooking appliance through fast pattern temperature imaging
US12390046B2 (en) 2022-03-29 2025-08-19 Samsung Electronics Company, Ltd. Systems and methods for achieving a user-specified temperature profile in a cooking appliance through heating control algorithms
KR102579663B1 (ko) * 2023-06-27 2023-09-18 시스트로닉스 주식회사 공기 가열을 통해 측정 정확도를 향상시키는 공기성분측정 장치
CN119133323A (zh) * 2024-11-14 2024-12-13 中矿资源(天津)新材料有限公司 电池膜层的退火工艺及退火设备

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6016383A (en) * 1990-01-19 2000-01-18 Applied Materials, Inc. Rapid thermal heating apparatus and method including an infrared camera to measure substrate temperature
EP0511294B1 (en) * 1990-01-19 1996-04-03 Applied Materials, Inc. Heating apparatus for semiconductor wafers or substrates
US5549874A (en) * 1992-04-23 1996-08-27 Ebara Corporation Discharge reactor
JP2651793B2 (ja) * 1993-12-20 1997-09-10 坂口電熱株式会社 セラミックファイバーヒーター
US6073577A (en) 1998-06-30 2000-06-13 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
DE19907497C2 (de) * 1999-02-22 2003-05-28 Steag Hamatech Ag Vorrichtung und Verfahren zur Wärmebehandlung von Substraten
DE10059665C1 (de) * 2000-12-01 2002-07-11 Steag Hamatech Ag Verfahren zum thermischen Behandeln von Substraten
US7196295B2 (en) 2003-11-21 2007-03-27 Watlow Electric Manufacturing Company Two-wire layered heater system
US7178353B2 (en) 2004-02-19 2007-02-20 Advanced Thermal Sciences Corp. Thermal control system and method
JP2006339447A (ja) * 2005-06-02 2006-12-14 Sumco Corp エピタキシャル成長装置及びエピタキシャル成長方法
JP5117146B2 (ja) * 2006-12-15 2013-01-09 日本碍子株式会社 加熱装置
US7763831B2 (en) * 2006-12-15 2010-07-27 Ngk Insulators, Ltd. Heating device
EP1937032B1 (en) * 2006-12-20 2020-11-04 Electrolux Home Products Corporation N.V. Household appliance
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8540819B2 (en) * 2008-03-21 2013-09-24 Ngk Insulators, Ltd. Ceramic heater
US8532832B2 (en) 2008-09-23 2013-09-10 Be Aerospace, Inc. Method and apparatus for thermal exchange with two-phase media
JP5430192B2 (ja) * 2009-03-19 2014-02-26 東京エレクトロン株式会社 温度調節装置、温度調節方法、基板処理装置及び対向電極
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
US9263305B2 (en) * 2011-08-30 2016-02-16 Watlow Electric Manufacturing Company High definition heater and method of operation
WO2013130918A1 (en) * 2012-02-29 2013-09-06 Harris, Jonathan, H. Transient liquid phase, pressureless joining of aluminum nitride components
CN102975486B (zh) * 2012-12-11 2015-04-15 苏州市晨彩纺织研发有限公司 一种印花均热装置
JP6140457B2 (ja) * 2013-01-21 2017-05-31 東京エレクトロン株式会社 接着方法、載置台及び基板処理装置

Also Published As

Publication number Publication date
JP2019061960A (ja) 2019-04-18
TWI681483B (zh) 2020-01-01
CN107078082A (zh) 2017-08-18
JP6692875B2 (ja) 2020-05-13
EP3213598B1 (en) 2023-07-05
CN107078082B (zh) 2021-04-09
JP2018502443A (ja) 2018-01-25
KR20190069624A (ko) 2019-06-19
EP3213598A1 (en) 2017-09-06
KR20170078645A (ko) 2017-07-07
WO2016069808A1 (en) 2016-05-06
KR101999705B1 (ko) 2019-07-12
KR102110267B1 (ko) 2020-05-14
TW201624588A (zh) 2016-07-01

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