JP2018501661A - 金属ゲートを有するスプリットゲート不揮発性フラッシュメモリセル及びその製造方法 - Google Patents
金属ゲートを有するスプリットゲート不揮発性フラッシュメモリセル及びその製造方法 Download PDFInfo
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 17
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 17
- 239000007769 metal material Substances 0.000 claims abstract description 13
- 239000011810 insulating material Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 34
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 32
- 229920005591 polysilicon Polymers 0.000 claims description 32
- 229910021332 silicide Inorganic materials 0.000 claims description 13
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 13
- 230000006870 function Effects 0.000 claims description 9
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 54
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- 125000006850 spacer group Chemical group 0.000 description 9
- 150000004767 nitrides Chemical class 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910010037 TiAlN Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910004200 TaSiN Inorganic materials 0.000 description 1
- 229910008482 TiSiN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Abstract
Description
Claims (20)
- 不揮発性メモリセルであって、
第1の導電型の基板であって、第2の導電型の第1領域と、前記第1の領域から離間している前記第2の導電型の第2の領域と、を有し、それらの間にチャネル領域を形成する、第1の導電型の基板と、
前記第1の領域に隣接した前記チャネル領域の第1の部分上に配設され、そこから絶縁された浮遊ゲートと、
前記第2の領域に隣接した前記チャネル領域の第2の部分上に配設された選択ゲートであって、金属材料で形成され、二酸化シリコンの層及びhigh−K絶縁材料の層によって前記チャネル領域の前記第2の部分から絶縁されている選択ゲートと、
前記浮遊ゲート上に配設されてそこから絶縁された制御ゲートと、
前記第1の領域上に配設されてそこから絶縁され、前記浮遊ゲートに横方向に隣接して配設され、そこから絶縁された消去ゲートと、を含む、不揮発性メモリセル。 - 前記high−K絶縁材料が、HfO2、ZrO2、及びTiO2のうちの少なくとも1つである、請求項1に記載のメモリセル。
- 前記消去ゲートが金属材料で形成されている、請求項1に記載のメモリセル。
- 前記消去ゲートがポリシリコン材料で形成されている、請求項1に記載のメモリセル。
- 前記消去ゲートの上面上に配設されたシリサイドを更に含む、請求項4に記載のメモリセル。
- 前記選択ゲートの上面が、前記基板上の、前記消去ゲートの前記上面より高い位置にある、請求項5に記載のメモリセル。
- 前記第2の領域の前記基板の一部に配設されたシリサイドを更に含む、請求項1に記載のメモリセル。
- 前記消去ゲートが、二酸化シリコンによって及びhigh−K絶縁材料の層によって前記浮遊ゲートから絶縁されている、請求項1に記載のメモリセル。
- 前記選択ゲートの底面及び側面に沿って延在する仕事関数金属層を更に含む、請求項1に記載のメモリセル。
- 前記選択ゲートの底面及び側面に沿って延在する仕事関数金属層と、
前記消去ゲートの底面及び側面に沿って延在する仕事関数金属層と、を更に含む、請求項3に記載のメモリセル。 - 不揮発性メモリセルを形成する方法であって、
第1の導電型の基板内に、第2の導電型の、離間した第1の領域及び第2の領域を形成することであって、それらの間にチャネル領域を画定する、ことと、
前記第1の領域に隣接した前記チャネル領域の第1の部分上に配設されてそこから絶縁された浮遊ゲートを形成することと、
前記浮遊ゲート上に配設されてそこから絶縁された制御ゲートを形成することと、
前記第2の領域に隣接した前記チャネル領域の第2の部分上に配設され、そこから絶縁された第1のポリシリコンのブロックを形成することと、
前記第1の領域上に配設されてそこから絶縁され、前記浮遊ゲートに横方向に隣接して配設され、そこから絶縁された、第2のポリシリコンのブロックを形成することと、
前記第1のポリシリコンのブロックを除去して、前記第1のポリシリコンのブロックを金属材料のブロックに置換することと、
前記金属材料のブロックと、二酸化シリコンの層及びhigh−K絶縁材料の層を構成する前記チャネル領域の前記第2の部分との間に絶縁層を形成することと、を含む、方法。 - 前記high−K絶縁材料が、HfO2、ZrO2、及びTiO2のうちの少なくとも1つである、請求項11に記載の方法。
- 前記第2のポリシリコンのブロックを除去して、前記第2のポリシリコンのブロックを第2の金属材料のブロックに置換することを更に含む、請求項11に記載の方法。
- 前記第1のポリシリコンのブロックを除去すること及び前記第2のポリシリコンのブロックを除去することが同一の処理工程において実行され、
前記第1のポリシリコンのブロックを置換すること及び前記第2のポリシリコンのブロックを置換することが同一の処理工程において実行される、請求項13に記載の方法。 - 前記第2のポリシリコンのブロックの上面上にシリサイドを形成することを更に含む、請求項11に記載の方法。
- 前記材料の金属ブロックの上面が、前記基板上の、前記第2のポリシリコンのブロックの前記上面よりも高い位置にある、請求項15に記載の方法。
- 前記第2の領域の前記基板の一部分上にシリサイドを形成することを更に含む、請求項11に記載の方法。
- 前記第2のポリシリコンのブロックが、二酸化シリコンによって及びhigh−K絶縁材料の層によって前記浮遊ゲートから絶縁されている、請求項11に記載の方法。
- 前記金属材料のブロックの底面及び側面に沿って延在する仕事関数金属層を形成することを更に含む、請求項11に記載の方法。
- 前記金属材料のブロックの底面及び側面に沿って延在する仕事関数金属層を形成することと、
前記第2の金属材料のブロックの底面及び側面に沿って延在する仕事関数金属層を形成することと、を更に含む、請求項13に記載の方法。
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CN111968983B (zh) * | 2019-05-20 | 2023-10-17 | 联华电子股份有限公司 | 存储器元件的结构及其制造方法 |
CN112185970B (zh) * | 2019-07-02 | 2024-05-28 | 硅存储技术公司 | 形成分裂栅存储器单元的方法 |
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