JP2018200301A5 - - Google Patents

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Publication number
JP2018200301A5
JP2018200301A5 JP2018047641A JP2018047641A JP2018200301A5 JP 2018200301 A5 JP2018200301 A5 JP 2018200301A5 JP 2018047641 A JP2018047641 A JP 2018047641A JP 2018047641 A JP2018047641 A JP 2018047641A JP 2018200301 A5 JP2018200301 A5 JP 2018200301A5
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JP
Japan
Prior art keywords
sensor
stress
sensor module
data
parallel
Prior art date
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Application number
JP2018047641A
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English (en)
Japanese (ja)
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JP7037967B2 (ja
JP2018200301A (ja
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Priority claimed from DE102017204402.0A external-priority patent/DE102017204402A1/de
Application filed filed Critical
Publication of JP2018200301A publication Critical patent/JP2018200301A/ja
Publication of JP2018200301A5 publication Critical patent/JP2018200301A5/ja
Application granted granted Critical
Publication of JP7037967B2 publication Critical patent/JP7037967B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018047641A 2017-03-16 2018-03-15 微小機械センサモジュールを備える構成要素 Expired - Fee Related JP7037967B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017204402.0 2017-03-16
DE102017204402.0A DE102017204402A1 (de) 2017-03-16 2017-03-16 Bauelement mit mikromechanischem Sensormodul

Publications (3)

Publication Number Publication Date
JP2018200301A JP2018200301A (ja) 2018-12-20
JP2018200301A5 true JP2018200301A5 (enExample) 2022-01-12
JP7037967B2 JP7037967B2 (ja) 2022-03-17

Family

ID=63372418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018047641A Expired - Fee Related JP7037967B2 (ja) 2017-03-16 2018-03-15 微小機械センサモジュールを備える構成要素

Country Status (3)

Country Link
US (1) US10788387B2 (enExample)
JP (1) JP7037967B2 (enExample)
DE (1) DE102017204402A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020212591A1 (de) 2020-10-06 2022-04-07 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltungsanordnung, Steuergerät mit einer Schaltungsanordnung und Verfahren zum Betreiben einer Schaltungsanordnung
CN112484902B (zh) * 2020-12-15 2021-08-24 吉林大学 一种电容式压力传感器及温漂解决方法
DE102021212327A1 (de) * 2021-11-02 2023-05-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Einrichtung zum Ermitteln dynamischer Parameter einer MEMS-Vorrichtung, und MEMS-Vorrichtung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5195046A (en) * 1989-01-10 1993-03-16 Gerardi Joseph J Method and apparatus for structural integrity monitoring
US6948377B2 (en) * 2003-12-08 2005-09-27 Honeywell International, Inc. Method and apparatus for detecting the strain levels imposed on a circuit board
US7812261B2 (en) * 2004-01-16 2010-10-12 Ibiden Co., Ltd. Multilayer printed wiring board and test body for printed wiring board
US7036387B2 (en) * 2004-05-11 2006-05-02 Sun Microsystems, Inc. Integrated strain gages for board strain characterization
JP4938779B2 (ja) * 2006-08-25 2012-05-23 京セラ株式会社 微小電子機械機構装置およびその製造方法
US20090303076A1 (en) * 2008-06-04 2009-12-10 Seagate Technology Llc Wireless and battery-less monitoring unit
US20120043999A1 (en) * 2008-07-01 2012-02-23 Quevy Emmanuel P Mems stabilized oscillator
US9021887B2 (en) * 2011-12-19 2015-05-05 Infineon Technologies Ag Micromechanical semiconductor sensing device
US9080932B2 (en) * 2013-05-13 2015-07-14 Apple Inc. Electronic device with printed circuit board stress monitoring
US9888561B2 (en) * 2015-07-21 2018-02-06 Apple Inc. Packaged electrical components with supplemental conductive structures
US9593991B2 (en) * 2015-07-29 2017-03-14 Apple Inc. Printed circuits with embedded strain gauges
US10353503B2 (en) * 2015-10-29 2019-07-16 Texas Instruments Incorporated Integrated force sensing element
US10562761B2 (en) * 2015-11-18 2020-02-18 Kathirgamasundaram Sooriakumar Waterproof microphone and associated packing techniques
US10549982B2 (en) * 2016-02-15 2020-02-04 Stmicroelectronics S.R.L. Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor
EP3261366B1 (en) * 2016-06-21 2021-09-22 Sciosense B.V. Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
WO2019178355A1 (en) * 2018-03-16 2019-09-19 Vesper Technologies, Inc. Transducer system with configurable acoustic overload point
US20190354238A1 (en) * 2018-05-21 2019-11-21 UltraSense Systems, Inc. Ultrasonic touch detection and decision
US11095990B2 (en) * 2018-06-19 2021-08-17 Knowles Electronics, Llc Microphone assembly with reduced noise

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