JP2018182278A5 - - Google Patents

Claims (13)

A semiconductor chip pickup device for picking up a square semiconductor chip attached to an adhesive sheet from the adhesive sheet,
A backup body in which an adsorption surface for adsorbing and holding a portion corresponding to a peripheral portion of the semiconductor chip to be picked up of the adhesive sheet is provided on an upper surface,
The backup body includes a plurality of push-up bodies provided in the backup body in a state in which the push-up bodies are movable in a direction perpendicular to each other with the same axis, and a contact surface of the plurality of push-up bodies with the adhesive sheet is formed by the plurality of push-up bodies. A push-up mechanism that forms the same plane when lowered,
A drive mechanism for raising and lowering the plurality of push-up bodies, wherein the drive mechanism presses a lower surface of a portion of the adhesive sheet to which the semiconductor chip to be picked up is attached, and at least the semiconductor chip together with the adhesive sheet is used for the backup body. By pushing up from the upper surface, a driving mechanism that advances the peeling of the adhesive sheet from the semiconductor chip,
A pickup mechanism for picking up the semiconductor chip from which the peeling of the adhesive sheet has progressed from the adhesive sheet,
The semiconductor chip pickup device, wherein a flatness of the plane formed by the contact surfaces of the plurality of push-up bodies in contact with the adhesive sheet in the lowered state is 20 μm or less.   2. The semiconductor chip pickup device according to claim 1, wherein a gap between the contact surfaces of the plurality of push-up bodies is 2 μm or more and 10 μm or less.   3. The semiconductor chip pickup device according to claim 1, wherein a cutout is provided at a corner on the inner peripheral side of the contact surface of the plurality of push-up bodies. 4.   A first protruding portion that partially supports portions corresponding to four side portions of the semiconductor chip, on the upper surface of at least the outermost pusher of the plurality of pushers, and the adhesive sheet 4. The semiconductor chip pickup device according to claim 1, wherein a concave portion on which a suction force acts is provided between the semiconductor chip and the concave portion.   5. The semiconductor chip pickup device according to claim 4, wherein a second convex portion that supports a portion corresponding to a corner of the semiconductor chip is further provided on an upper surface of the push-up body located at the outermost periphery. The plurality of pushing bodies are an outer periphery pushing body located at an outermost periphery, an inner periphery pushing body located at an innermost periphery, and at least one intermediate member disposed between the outer periphery pushing body and the inner periphery pushing body. Having a push-up body,
The outer peripheral push-up body has a plurality of the first protrusions and a plurality of the recesses arranged between the plurality of the first protrusions,
The intermediate push member has a plurality of the first convex portion, and a plurality of the recess located between said plurality of first convex portions,
The plurality of recesses of the intermediate push-up body, which are adjacent to the intermediate push-up body on the outer peripheral side, are alternately arranged with the plurality of recesses of the outer circumferential push-up body or another intermediate push-up body,
A pickup device for a semiconductor chip according to claim 4.   The length of the concave portion in the circumferential direction of the upper surface of the push-up body is set to be 0.8 times or more and 1.2 times or less with respect to the circumferential length of the first convex portion. A pickup device for a semiconductor chip according to any one of claims 4 to 6.   8. The drive mechanism according to claim 1, wherein the plurality of push-up bodies are driven to move up and down such that a push-up body located on an inner peripheral side is higher than a push-up body located on an outer peripheral side. 9. 2. The semiconductor chip pickup device according to claim 1.   The drive mechanism raises the plurality of push-up bodies to the same height, and then sequentially raises the push-up bodies located on the inner peripheral side higher than the push-up bodies located on the outer peripheral side. A pickup device for a semiconductor chip according to claim 7.   The drive mechanism is located on the outer peripheral side so that the plurality of push-up bodies are raised to the same height, and then the height of the push-up body located on the outer peripheral side is lower than the push-up body located on the inner peripheral side. The semiconductor chip pickup device according to claim 1, wherein the push-up body is lowered.   The drive mechanism is located on the outer peripheral side so that the plurality of push-up bodies are raised to the same height, and then the height of the push-up body located on the outer peripheral side is lower than the push-up body located on the inner peripheral side. 8. The semiconductor chip pickup device according to claim 1, wherein the push-up body is lowered and the push-up body located at the innermost periphery is raised.   12. The semiconductor chip pickup device according to claim 1, wherein the pressure-sensitive adhesive sheet is suction-held on the backup body at a pressure of −80 kPa or less as a gauge pressure. 13. A supply unit for supplying a semiconductor chip,
A transfer unit for transferring the substrate,
A pickup unit that takes out the semiconductor chip from the supply unit, the pickup unit including the pickup device according to any one of claims 1 to 12,
A mounting unit for mounting the semiconductor chip picked up by the pickup unit on the substrate directly or via an intermediate stage.