JP6281825B2 - Chuck device - Google Patents

Chuck device Download PDF

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JP6281825B2
JP6281825B2 JP2015508443A JP2015508443A JP6281825B2 JP 6281825 B2 JP6281825 B2 JP 6281825B2 JP 2015508443 A JP2015508443 A JP 2015508443A JP 2015508443 A JP2015508443 A JP 2015508443A JP 6281825 B2 JP6281825 B2 JP 6281825B2
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chuck
workpiece
layer
movable member
chuck device
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JPWO2014157014A1 (en
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鈴木　隆太
隆太 鈴木
辰巳　良昭
良昭 辰巳
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Creative Technology Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Description

この発明は、ウェハ等のワークを保持して搬送するためのチャック装置に関するものである。   The present invention relates to a chuck device for holding and transporting a workpiece such as a wafer.

従来、この種のチャック装置としては、静電チャック装置や粘着チャック装置がある（例えば、特許文献１及び特許文献２）。
静電チャック装置は、図１６に示すように、誘電体１１１と吸着電極１１２とで成る静電吸着層１１０を、アルミニュウム等の金属で形成されたベース１００の上に貼り付けた構造になっている。これにより、ワークＷ全体を静電吸着層１１０で吸着して、ワークＷを所望の場所に搬送する。
一方、粘着チャック装置は、図１７に示すように、１枚の粘着パッド２１０を、ベース２００の上に貼り付けた構造になっている。これにより、ワークＷ全体を粘着パッド２１０で粘着して、ワークＷを所望の場所に搬送する。
また、他の粘着チャック装置としては、図１８に示すように、小さな粘着パッド２１０’を、ベース２００上にエンボス状に複数貼り付けた構造のものもある。これにより、ワークＷを 複数の粘着パッド２１０’によって部分的に粘着して搬送する。 Conventionally, as this type of chuck device, there are an electrostatic chuck device and an adhesive chuck device (for example, Patent Document 1 and Patent Document 2).
As shown in FIG. 16, the electrostatic chuck device has a structure in which an electrostatic adsorption layer 110 composed of a dielectric 111 and an adsorption electrode 112 is attached on a base 100 formed of a metal such as aluminum. Yes. Thereby, the whole workpiece | work W is attracted | sucked by the electrostatic adsorption layer 110, and the workpiece | work W is conveyed to a desired place.
On the other hand, as shown in FIG. 17, the adhesive chuck device has a structure in which one adhesive pad 210 is attached on the base 200. Thereby, the whole workpiece | work W is adhere | attached with the adhesion pad 210, and the workpiece | work W is conveyed to a desired place.
As another adhesive chuck device, as shown in FIG. 18, there is a structure in which a plurality of small adhesive pads 210 ′ are attached in an embossed manner on the base 200. As a result, the workpiece W is partially adhered and conveyed by the plurality of adhesive pads 210 ′.

特開２０１０−１２９８４５号公報JP 2010-129845 A 特開２０１０−１３７３４９号公報JP 2010-137349 A

しかし、上記した従来のチャック装置では、次のような問題がある。
第１の問題は、ワークの重さが異なると、最適なチャックが困難になるということである。
例えば、軽いワークと重いワークとを貼り合わせる工程においては、軽いワークをチャックするために保持力を弱く設定したチャック装置と、重いワークをチャックするために保持力を強く設定したチャック装置を準備する。これにより、それぞれのワークに適したチャック装置を用いて、それぞれのワークを最適な保持力でチャックすることができる。
しかし、１つのチャック装置で軽いワークと重いワークの両方をチャックすることができれば、作業効率や設備コストの面で好ましい。
しかしながら、１つのチャック装置で軽いワークと重いワークの両方をチャックしようとすると、チャック装置の保持力を重いワークに合わせる必要があるため、軽いワークに対しては、過剰の力でチャックすることになる。
すなわち、図１６に示した静電チャック装置においては、重いワークＷに合わせて、高電圧を吸着電極１１２に供給することになり、その高電圧がアーキングの原因になる。また、軽いワークＷを高電圧で吸着すると、異常帯電を起こし、ワークＷのデチャックが困難になる。
一方、図１７及び図１８に示した粘着チャック装置においても、同様であり、粘着パッド２１０，２１０’の粘着力を重いワークＷに合わせることで、軽いワークＷのデチャックが困難になるという問題がある。 However, the conventional chuck device described above has the following problems.
The first problem is that an optimum chuck becomes difficult when the workpieces have different weights.
For example, in the process of laminating a light work and a heavy work, prepare a chuck device with a weak holding force for chucking a light work and a chuck device with a strong holding force for chucking a heavy work. . Thereby, each workpiece | work can be chucked with the optimal holding force using the chuck | zipper apparatus suitable for each workpiece | work.
However, if both a light work and a heavy work can be chucked with one chuck device, it is preferable in terms of work efficiency and equipment cost.
However, when trying to chuck both light and heavy workpieces with one chuck device, it is necessary to match the holding force of the chuck device with that of a heavy workpiece. Become.
That is, in the electrostatic chuck device shown in FIG. 16, a high voltage is supplied to the suction electrode 112 in accordance with the heavy workpiece W, and the high voltage causes arcing. Further, when the light workpiece W is attracted by a high voltage, abnormal charging occurs, and it becomes difficult to dechuck the workpiece W.
On the other hand, the same applies to the adhesive chuck device shown in FIGS. 17 and 18, and it is difficult to dechuck the light workpiece W by matching the adhesive force of the adhesive pads 210, 210 ′ with the heavy workpiece W. is there.

第２の問題は、ワークの形状が異なると、最適なチャックが困難になるということである。
すなわち、ある形状のワークに対しては、十分な接触面積を確保することができるチャック装置であっても、ワークの形状が異なると、十分な接触面積を確保することができなくなり、そのワークを最適な保持力でチャックすることが困難になる。 The second problem is that an optimum chuck becomes difficult if the workpiece shapes are different.
In other words, even with a chuck device that can secure a sufficient contact area for a workpiece having a certain shape, if the shape of the workpiece is different, a sufficient contact area cannot be ensured. It becomes difficult to chuck with the optimum holding force.

第３の問題は、デチャック構造が、ワークにダメージを与えるおそれのある構造になっているということである。
すなわち、従来の静電チャック装置や粘着チャック装置においては、作業終了後、残留吸着力や粘着力が、ワークに働くため、ワークをリフトピンやエアパージを用いてデチャックする構造になっている。しかし、静電チャック装置や粘着チャック装置においては、ワークの全面が静電吸着層や粘着パッドに吸着、粘着しているので、このワークをデチャックするには、相当の力を、リフトピンやエアパージを通じてワークに加える必要がある。このように、ワークに過剰の力を加えてデチャックしようとすると、ワークを傷つけるだけでなく、チャック装置自体をも傷つけてしまうおそれがある。 The third problem is that the dechuck structure is a structure that may damage the workpiece.
That is, the conventional electrostatic chuck device or adhesive chuck device has a structure in which the work is dechucked by using lift pins or air purge since the residual adsorption force or adhesive force acts on the workpiece after the work is completed. However, in the electrostatic chuck device and adhesive chuck device, the entire surface of the workpiece is adsorbed and adhered to the electrostatic adsorption layer or adhesive pad. Need to be added to the workpiece. As described above, when an excessive force is applied to the workpiece to dechuck, not only the workpiece is damaged, but also the chuck device itself may be damaged.

この発明は、上述した課題を解決するためになされたもので、ワークの重さや形状に拘わらず、ワークを最適な保持力でチャックすることができると共に、ワークにダメージを与えることなくデチャックすることができるチャック装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and is capable of chucking a workpiece with an optimum holding force regardless of the weight or shape of the workpiece and dechucking without damaging the workpiece. It is an object of the present invention to provide a chuck device capable of performing the above.

上記課題を解決するために、請求項１の発明は、ベースと、このベースの表面に貼り付けられ且つその表面に当接されたワークを保持するためのチャック層とを備えるチャック装置であって、ベースを、同心円状に配列された複数の可動部材で構成し、複数のアクチュエータによって、複数の可動部材を円心軸に沿ってそれぞれ独立に上下動可能にし、チャック層を、隣の可動部材表面に渡らないようにして、各可動部材の表面に全面的に又は部分的に貼り付け、チャック層を、複数の可動部材のうち１つの可動部材にのみ貼り付けずに、当該可動部材をデチャック用の可動部材とした構成とする。
かかる構成により、重いワークをチャックする場合には、複数のアクチュエータによって、複数の可動部材の全てを上昇させ、全ての可動部材の表面高さを同一にする。これにより、可動部材表面のチャック層の全面が、同一高さになる。
かかる状態で、チャック装置を逆さにし、ワークを下向きのチャック層の表面に当接させると、ワーク全面がチャック層に接触することになる。
したがって、ワークが重い場合にあっても、ワーク全面がチャック層に接触するので、ワークがチャック層によって最適な保持力でチャックされ、落下することはない。
一方、軽いワークをチャックする場合には、複数の可動部材のうち一部の可動部材を上昇させ、これらの可動部材の表面高さを同一にする。
かかる状態で、チャック装置を逆さにし、ワークを下向きのチャック層の表面に当接させると、ワークの面の一部が、上昇した可動部材の表面に位置するチャック層に接触することになる。
したがって、ワークとチャック層との接触面積が小さくなるので、ワークが軽い場合にあっても、ワークに対して過剰の保持力は働かず、ワークがチャック層によって最適な保持力でチャックされることとなる。 In order to solve the above-mentioned problem, the invention of claim 1 is a chuck device comprising a base and a chuck layer for holding a work affixed to the surface of the base and in contact with the surface. The base is composed of a plurality of movable members arranged concentrically, the plurality of movable members can be moved up and down independently along the center axis by a plurality of actuators, and the chuck layer is moved to the next movable member. so as not span the surface, the surface affixed to the entirely or partially of the movable member, Ji jack layer, without adhered to only one of the movable member out of the plurality of movable members, the movable member It is configured as a movable member for dechucking.
With this configuration, when a heavy workpiece is chucked, all of the plurality of movable members are raised by the plurality of actuators, and the surface heights of all the movable members are made the same. Thereby, the entire surface of the chuck layer on the surface of the movable member becomes the same height.
In this state, when the chuck device is turned upside down and the work is brought into contact with the surface of the downward chuck layer, the entire surface of the work comes into contact with the chuck layer.
Therefore, even when the workpiece is heavy, the entire surface of the workpiece contacts the chuck layer, so that the workpiece is chucked by the chuck layer with an optimum holding force and does not fall.
On the other hand, when chucking a light workpiece, some of the movable members are raised, and the surface height of these movable members is made the same.
In such a state, when the chuck device is turned upside down and the workpiece is brought into contact with the surface of the downward chuck layer, a part of the surface of the workpiece comes into contact with the chuck layer positioned on the surface of the raised movable member.
Therefore, since the contact area between the workpiece and the chuck layer is reduced, even if the workpiece is light, excessive holding force does not act on the workpiece, and the workpiece is chucked with the optimum holding force by the chuck layer. It becomes.

また、平坦な形状のワークをチャックする場合には、複数の可動部材を全て上昇させておく。これにより、ワーク全面をチャック層に接触させることができ、平坦な形状のワークを最適な保持力でチャックすることができる。
そして、形状の異なるワークをチャックする場合には、各ワークの形状に合わせて、複数の可動部材の高さを異ならしめる。これにより、ワークとチャック層との十分な接触面積を確保することができ、形状の異なるワークに対しても最適な保持力でチャックすることができる。 When chucking a flat workpiece, all the plurality of movable members are raised. As a result, the entire surface of the workpiece can be brought into contact with the chuck layer, and a flat workpiece can be chucked with an optimum holding force.
When chucking workpieces having different shapes, the heights of the plurality of movable members are made different according to the shape of each workpiece. As a result, a sufficient contact area between the workpiece and the chuck layer can be ensured, and a workpiece having a different shape can be chucked with an optimum holding force.

さらに、ワークをデチャックする場合には、複数の可動部材のうち、中心又は外周に近い可動部材を上下動させることにより、ワークとチャック層との間に隙間を形成する。これにより、作業終了後、リフトピンやエアパージによって、ワークを軽く押すだけで、ワークを、傷つけることなく、デチャックすることができる。   Furthermore, when the workpiece is dechucked, a gap is formed between the workpiece and the chuck layer by moving up and down a movable member close to the center or outer periphery among the plurality of movable members. Thus, after the work is completed, the work can be dechucked without being damaged by simply pressing the work with a lift pin or air purge.

また、複数の可動部材の全てを上昇させて、全ての可動部材の表面高さを同一にすることにより、ワークとチャック層との接触面積を最大にすることができる。
また、複数の可動部材のうち一部の可動部材を上昇させることにより、ワークとチャック層との接触面積を調整することができる。
また、チャック層を一部の可動部材の表面に部分的に貼り付けておくことにより、ワークとチャック層との接触面積をより細かく調整することができる。
さらに、作業終了後、チャック層が貼り付けられていない可動部材のみを上昇させることで、ワークをデチャックすることができる。このとき、可動部材の表面が平坦であり、リフトピン等と比べて、ワークとの接触面積が広い。このため、この可動部材を上昇させることで、ワークを傷つけることなく、デチャックすることができる。 Further, by raising all of the plurality of movable members so that the surface heights of all the movable members are the same, the contact area between the workpiece and the chuck layer can be maximized.
Further, by raising some of the movable members, the contact area between the workpiece and the chuck layer can be adjusted.
In addition, the contact area between the workpiece and the chuck layer can be more finely adjusted by partially attaching the chuck layer to the surface of some of the movable members.
Furthermore, after the operation is completed, the work can be dechucked by raising only the movable member to which the chuck layer is not attached. At this time, the surface of the movable member is flat, and the contact area with the workpiece is larger than that of a lift pin or the like. For this reason, it can dechuck by raising this movable member, without damaging a workpiece | work.

請求項２の発明は、ベースと、このベースの表面に貼り付けられ且つその表面に当接されたワークを保持するためのチャック層とを備えるチャック装置であって、ベースを、同心円状に配列された複数の可動部材で構成し、複数のアクチュエータによって、複数の可動部材を円心軸に沿ってそれぞれ独立に上下動可能にし、１枚のチャック層を、ベースの表面全面に渡って貼り付けた構成とする。
かかる構成により、複数の可動部材を上下動させることで、チャック層全体を可動部材の高さに対応した形状に撓ませることができる。 The invention according to claim 2 is a chuck device comprising a base and a chuck layer for holding a workpiece affixed to and in contact with the surface of the base, the bases being arranged concentrically. It is composed of a plurality of movable members, and a plurality of movable members can be moved up and down independently along the center axis by a plurality of actuators, and one chuck layer is pasted over the entire surface of the base The configuration is as follows.
With this configuration, the entire chuck layer can be bent into a shape corresponding to the height of the movable member by moving the plurality of movable members up and down.

請求項３の発明は、請求項１又は請求項２に記載のチャック装置において、チャック層は、所定の電圧が印加可能な吸着電極とこの吸着電極を被覆した誘電体とを有し、当該誘電体表面に載置されたワークを吸着電極への通電時に生じる静電気力で吸着可能な静電吸着層である構成とした。
かかる構成により、静電吸着層の吸着電極に通電することで、ワークのうち、この静電吸着層に接触している部分のみを静電気力によって吸着することができる。 A third aspect of the present invention, the chuck device according to請Motomeko 1 or claim 2, Ji jack layer, and a dielectric predetermined voltage is covering the suction electrode and capable of applying attraction electrode, The workpiece placed on the surface of the dielectric is configured to be an electrostatic adsorption layer that can be adsorbed by electrostatic force generated when the adsorption electrode is energized.
With this configuration, by energizing the adsorption electrode of the electrostatic adsorption layer, it is possible to adsorb only the part of the workpiece that is in contact with the electrostatic adsorption layer by electrostatic force.

請求項４の発明は、請求項１又は請求項２に記載のチャック装置において、チャック層は、表面に載置されたワークをその自己粘着力によって保持可能な粘着パッドである構成とした。
かかる構成により、ワークのうち粘着パッドに接触している部分のみを粘着パッドに粘着させることができる。 A fourth aspect of the present invention, the chuck device according to請Motomeko 1 or claim 2, Ji jack layer, a workpiece placed on the surface has a configuration which is adhesive pad which can be held by its self-adhesive strength .
With this configuration, only the part of the workpiece that is in contact with the adhesive pad can be adhered to the adhesive pad.

請求項５の発明は、ベースと、このベースの表面に貼り付けられ且つその表面に当接されたワークを保持するためのチャック層とを備えるチャック装置であって、ベースを、同心円状に配列された複数の可動部材で構成し、複数のアクチュエータによって、複数の可動部材を円心軸に沿ってそれぞれ独立に上下動可能にし、チャック層を、隣の可動部材表面に渡らないようにして、各可動部材の表面に全面的に又は部分的に貼り付け、複数の可動部材のうち一部の可動部材の表面に貼り付けられているチャック層を、所定の電圧が印加可能な吸着電極とこの吸着電極を被覆した誘電体とを有し、当該誘電体表面に載置されたワークを吸着電極への通電時に生じる静電気力で吸着可能な静電吸着層で形成し、他の可動部材の表面に貼り付けられているチャック層を、表面に載置されたワークをその自己粘着力によって保持可能な粘着パッドで形成した構成とする。
かかる構成により、ワークのうち静電吸着層に接触している部分のみを静電気力によって吸着することができ、粘着パッドに接触している部分のみを粘着パッドに粘着させることができる。 The invention according to claim 5 is a chuck device comprising a base and a chuck layer for holding a workpiece affixed to and in contact with the surface of the base, the bases being arranged concentrically. A plurality of movable members, and by a plurality of actuators, the plurality of movable members can be moved up and down independently along the center axis so that the chuck layer does not cross over the surface of the next movable member, surface affixed to entirely or partially of the movable member, the chucking layer that is attached to the surface of the part of the movable member of the multiple movable member, and the attraction electrode, predetermined voltage can be applied A dielectric that covers the adsorption electrode, and a workpiece placed on the surface of the dielectric is formed of an electrostatic adsorption layer that can be adsorbed by electrostatic force generated when the adsorption electrode is energized, and other movable members Pasted on the surface The chucking layer have a workpiece placed on a surface a structure formed by adhesive pad which can be held by its self-adhesive strength.
With this configuration, only the part of the workpiece that is in contact with the electrostatic adsorption layer can be adsorbed by electrostatic force, and only the part of the work that is in contact with the adhesive pad can be adhered to the adhesive pad.

請求項６の発明は、請求項５に記載のチャック装置において、チャック層を、複数の可動部材のうち１つの可動部材にのみ貼り付けずに、当該可動部材をデチャック用の可動部材とした構成とする。 A sixth aspect of the present invention is the chuck device according to the fifth aspect , wherein the movable member is a movable member for dechucking without attaching the chuck layer to only one movable member among the plurality of movable members. And

以上詳しく説明したように、この発明のチャック装置によれば、複数の可動部材の一部を上下動させることにより、ワークとチャック層との接触面積を、ワークの重さや形状に合わせて変化、調整することができるので、ワークの重さや形状に拘わらず、ワークを最適な保持力でチャックすることができるという優れた効果がある。
また、作業終了後、所定の可動部材を上下動させて、ワークとチャック層との間に部分的な隙間を形成することができるので、ワークを傷つけることなく、容易にデチャックすることができるという優れた効果もある。
さらに、リフトピンやエアパージ等を用いることなく、ワークを安全にデチャックすることができるので、部品点数の削減を図ることができ、この結果、製品のコストダウンを図ることができるという効果がある。 As described above in detail, according to the chuck device of the present invention, the contact area between the workpiece and the chuck layer is changed in accordance with the weight and shape of the workpiece by moving a part of the plurality of movable members up and down. Since it can be adjusted, there is an excellent effect that the workpiece can be chucked with an optimum holding force regardless of the weight and shape of the workpiece.
Further, after the work is completed, a predetermined movable member can be moved up and down to form a partial gap between the workpiece and the chuck layer, so that it can be easily dechucked without damaging the workpiece. There is also an excellent effect.
Furthermore, since the workpiece can be safely dechucked without using a lift pin or air purge, the number of parts can be reduced, and as a result, the cost of the product can be reduced.

また、請求項２の発明に係るチャック装置によれば、チャック層全体を可動部材の高さに対応した形状に撓ませることができるので、チャック層が、ワークの形状に沿って密着し、ワークをより最適な保持力でチャックすることができるという効果がある。 According to the chuck device of the second aspect of the invention, since the entire chuck layer can be bent into a shape corresponding to the height of the movable member, the chuck layer adheres along the shape of the workpiece, Can be chucked with a more optimal holding force.

さらに、請求項１〜請求項６の発明に係るチャック装置によれば、ワークを、静電吸着層の静電気力や粘着パッドの粘着力によって、全面的に又は部分的に保持することができるという効果がある。 Further, according to the chuck device of the first to sixth aspects of the invention, the work can be held entirely or partially by the electrostatic force of the electrostatic adsorption layer or the adhesive force of the adhesive pad. effective.

この発明の第１実施例に係るチャック装置を示す概略平面図である。1 is a schematic plan view showing a chuck device according to a first embodiment of the present invention. 第１実施例のチャック装置の概略断面図である。It is a schematic sectional drawing of the chuck apparatus of 1st Example. ワークを全面保持した状態を示す概略断面図である。It is a schematic sectional drawing which shows the state which hold | maintained the whole surface. ワークを部分的に保持した状態を示す概略断面図である。It is a schematic sectional drawing which shows the state which hold | maintained the workpiece | work partially. ワークを静電吸着層でのみ保持した状態を示す概略断面図である。It is a schematic sectional drawing which shows the state hold | maintained only by the electrostatic adsorption layer. ワークを粘着パッドでのみ保持した状態を示す概略断面図である。It is a schematic sectional drawing which shows the state hold | maintained only with the adhesion pad. 形状の異なるワークを保持する方法を示す概略断面図である。It is a schematic sectional drawing which shows the method of hold | maintaining the workpiece | work from which a shape differs. デチャック状態を示す概略断面図である。It is a schematic sectional drawing which shows a dechuck state. この発明の第２実施例に係るチャック装置を示す概略断面図である。It is a schematic sectional drawing which shows the chuck apparatus based on 2nd Example of this invention. この発明の第３実施例に係るチャック装置を示す概略断面図である。It is a schematic sectional drawing which shows the chuck apparatus based on 3rd Example of this invention. チャック装置のチャック層に関する変形例を示す概略平面図である。It is a schematic plan view which shows the modification regarding the chuck | zipper layer of a chuck | zipper apparatus. この発明の第４実施例に係るチャック装置を示す概略断面図である。It is a schematic sectional drawing which shows the chuck | zipper apparatus which concerns on 4th Example of this invention. 保持力の調整状態を示す概略断面図である。It is a schematic sectional drawing which shows the adjustment state of holding force. デチャック状態を示す概略断面図である。It is a schematic sectional drawing which shows a dechuck state. チャック層の他の変形例を示す概略平面図である。It is a schematic plan view which shows the other modification of a chuck | zipper layer. 第１従来例に係るチャック装置を示す概略断面図である。It is a schematic sectional drawing which shows the chuck apparatus which concerns on a 1st prior art example. 第２従来例に係るチャック装置を示す概略断面図である。It is a schematic sectional drawing which shows the chuck apparatus which concerns on a 2nd prior art example. 第３従来例に係るチャック装置を示す概略断面図である。It is a schematic sectional drawing which shows the chuck | zipper apparatus which concerns on a 3rd prior art example.

以下、この発明の最良の形態について図面を参照して説明する。   The best mode of the present invention will be described below with reference to the drawings.

（実施例１）
図１は、この発明の第１実施例に係るチャック装置を示す概略平面図であり、図２は、第１実施例のチャック装置の概略断面図である。
図１に示すように、この実施例のチャック装置は、ベース１とチャック層２とを備えている。 Example 1
FIG. 1 is a schematic plan view showing a chuck device according to a first embodiment of the present invention, and FIG. 2 is a schematic sectional view of the chuck device of the first embodiment.
As shown in FIG. 1, the chuck device of this embodiment includes a base 1 and a chuck layer 2.

ベース１は、アルミニュウム等で形成された基材であり、同心軸Ｏを中心に、同心円状に配列された４つの可動部材１１〜１４で構成されている。
具体的には、最内の可動部材１１が平面視において円形状に形成され、可動部材１１の外側の３つの可動部材１２〜１４がリング状に形成されている。これらの可動部材１１〜１４は、図２に示すように、独立に同心軸Ｏに沿って上下動可能に組み付けられており、４つのアクチュエータ３１〜３４によって上下（図２の上下方向）に駆動されるようになっている。
詳しくは、アクチュエータ３１がアーム３１ａによって可動部材１１を支持し、アクチュエータ３２がアーム３２ａによって可動部材１２を支持し、アクチュエータ３３がアーム３３ａによって可動部材１３を支持し、アクチュエータ３４がアーム３４ａによって可動部材１４を支持しており、アクチュエータ３１〜３４が、アーム３１ａ〜３４ａを上下動することによって、可動部材１１〜１４を上下に駆動する。
なお、アクチュエータ３１〜３４は、実施例の理解を容易にするため、模式的に表されているが、これらはシリンダ等の周知のアクチュエータであるので、その詳細な記載は省略する。 The base 1 is a base material formed of aluminum or the like, and includes four movable members 11 to 14 arranged concentrically around a concentric axis O.
Specifically, the innermost movable member 11 is formed in a circular shape in plan view, and the three movable members 12 to 14 outside the movable member 11 are formed in a ring shape. As shown in FIG. 2, these movable members 11 to 14 are assembled so as to be movable up and down independently along the concentric axis O, and are driven up and down (up and down direction in FIG. 2) by four actuators 31 to 34. It has come to be.
Specifically, the actuator 31 supports the movable member 11 by the arm 31a, the actuator 32 supports the movable member 12 by the arm 32a, the actuator 33 supports the movable member 13 by the arm 33a, and the actuator 34 moves by the arm 34a. 14, and the actuators 31 to 34 move the arms 31 a to 34 a up and down to drive the movable members 11 to 14 up and down.
The actuators 31 to 34 are schematically shown in order to facilitate understanding of the embodiment. However, since these are known actuators such as cylinders, detailed description thereof is omitted.

チャック層２は、その表面に当接されたワークを保持するための層体であり、ベース１の表面に貼り付けられている。
この実施例では、チャック層２を、静電吸着層２１と粘着パッド２２，２４とで構成した。具体的には、円形の静電吸着層２１を、可動部材１１の表面全面に貼り付け、リング状の粘着パッド２２，２４を、可動部材１２，１４の表面全面にそれぞれ貼り付けた。そして、可動部材１３の表面全面には、非粘着パッド２３を貼り付けた。 The chuck layer 2 is a layer body for holding a workpiece in contact with the surface thereof, and is attached to the surface of the base 1.
In this embodiment, the chuck layer 2 is composed of an electrostatic adsorption layer 21 and adhesive pads 22 and 24. Specifically, the circular electrostatic adsorption layer 21 was attached to the entire surface of the movable member 11, and the ring-shaped adhesive pads 22 and 24 were attached to the entire surface of the movable members 12 and 14, respectively. Then, a non-adhesive pad 23 was attached to the entire surface of the movable member 13.

静電吸着層２１は、吸着電極２５と、吸着電極２５を被覆した誘電体２６とで成り、スイッチ２８をオンすることで、電源２７の電圧を吸着電極２５に印加することができる。
また、粘着パッド２２，２４は、その自己粘着力によってワークを保持可能なパッドであり、例えばシリコンゴムやエチレン−プロピレン−ジエンゴム等を素材としたパッドである。
なお、チャック装置の初期状態では、可動部材１１〜１４の高さが同一に設定され、静電吸着層２１，パッド２２〜２４の表面が面一になるように設定されている。 The electrostatic adsorption layer 21 includes an adsorption electrode 25 and a dielectric 26 that covers the adsorption electrode 25, and the voltage of the power source 27 can be applied to the adsorption electrode 25 by turning on the switch 28.
The adhesive pads 22 and 24 are pads that can hold a workpiece by their self-adhesive force, and are pads made of, for example, silicon rubber or ethylene-propylene-diene rubber.
In the initial state of the chuck device, the heights of the movable members 11 to 14 are set to be the same, and the surfaces of the electrostatic adsorption layer 21 and the pads 22 to 24 are set to be flush with each other.

次に、この実施例のチャック装置が示す作用及び効果について説明する。
図３は、ワークを全面保持した状態を示す概略断面図であり、図４は、ワークを部分的に保持した状態を示す概略断面図である。
重いワークＷをチャックする場合には、図３に示すように、ワークＷを、面一状態になっている静電吸着層２１及びパッド２２〜２４上に載置する。すると、ワークＷの裏面全面が、静電吸着層２１及びパッド２２〜２４に当接した状態になる。この状態で、スイッチ２８をオンにして、電源２７の電圧を静電吸着層２１の吸着電極２５に印加すると、ワークＷの中央部が静電気力によって静電吸着層２１に吸着される。これと並行して、ワークＷの外側部分が粘着パッド２２，２４によって粘着され、ワークＷのほぼ全面がチャック層２によって保持された状態になる。このため、ワークＷは、このチャック装置が持つ最大保持力によってチャックされることになる。
したがって、チャック装置を逆さにして、重いワークＷを下向きの静電吸着層２１及びパッド２２〜２４に当接させると、ワークＷは、落下することなく、チャック層２による最適な保持力でチャックされることとなる。 Next, the operation and effect of the chuck device of this embodiment will be described.
FIG. 3 is a schematic cross-sectional view showing a state where the work is held on the entire surface, and FIG. 4 is a schematic cross-sectional view showing a state where the work is partially held.
When chucking a heavy workpiece W, as shown in FIG. 3, the workpiece W is placed on the electrostatic adsorption layer 21 and the pads 22 to 24 that are in a flush state. Then, the entire back surface of the workpiece W comes into contact with the electrostatic adsorption layer 21 and the pads 22 to 24. In this state, when the switch 28 is turned on and the voltage of the power source 27 is applied to the adsorption electrode 25 of the electrostatic adsorption layer 21, the central portion of the workpiece W is adsorbed to the electrostatic adsorption layer 21 by electrostatic force. In parallel with this, the outer portion of the workpiece W is adhered by the adhesive pads 22, 24, and almost the entire surface of the workpiece W is held by the chuck layer 2. For this reason, the workpiece W is chucked by the maximum holding force of the chuck device.
Therefore, when the chuck device is inverted and the heavy workpiece W is brought into contact with the downward electrostatic adsorption layer 21 and the pads 22 to 24, the workpiece W does not fall and is chucked with an optimum holding force by the chuck layer 2. Will be.

軽いワークＷをチャックする場合には、図４に示すように、可動部材１４のみをアクチュエータ３４によって上昇させる。これにより、ワークＷを、チャック装置に載置させると、ワークＷが可動部材１４の粘着パッド２４にのみ接触することとなり、ワークＷとチャック層２との接触面積が小さくなる。
したがって、チャック装置を逆さして、軽いワークＷを下向きの粘着パッド２４に当接させると、ワークＷは、過剰な力を受けることなく、ワークＷによって最適な保持力でチャックされることとなる。 When chucking a light workpiece W, only the movable member 14 is raised by an actuator 34 as shown in FIG. As a result, when the work W is placed on the chuck device, the work W comes into contact only with the adhesive pad 24 of the movable member 14, and the contact area between the work W and the chuck layer 2 is reduced.
Therefore, when the chuck device is inverted and the light workpiece W is brought into contact with the downward adhesive pad 24, the workpiece W is chucked by the workpiece W with an optimum holding force without receiving an excessive force.

図５は、ワークＷを静電吸着層２１でのみ保持した状態を示す概略断面図であり、図６は、ワークＷを粘着パッド２２，２４でのみ保持した状態を示す概略断面図である。
ワークＷのサイズが小さい場合には、図５に示すように、可動部材１１のみをアクチュエータ３１によって上昇させ、静電吸着層２１の吸着電極２５を通電状態にすることで、小サイズのワークＷを最適な保持力でチャックすることができる。
また、ワークＷを、粘着パッド２２，２４でのみ保持する場合には、図６に示すように、可動部材１２，１４をアクチュエータ３２，３４によって上昇させることにより、ワークＷを粘着パッド２２，２４による最適な粘着力でチャックすることができる。 FIG. 5 is a schematic cross-sectional view showing a state where the workpiece W is held only by the electrostatic adsorption layer 21, and FIG. 6 is a schematic cross-sectional view showing a state where the workpiece W is held only by the adhesive pads 22 and 24.
When the size of the workpiece W is small, as shown in FIG. 5, only the movable member 11 is raised by the actuator 31, and the suction electrode 25 of the electrostatic suction layer 21 is energized, whereby the small size workpiece W is obtained. Can be chucked with an optimum holding force.
Further, when the workpiece W is held only by the adhesive pads 22 and 24, the movable members 12 and 14 are raised by the actuators 32 and 34 as shown in FIG. It is possible to chuck with the optimum adhesive force.

図７は、形状の異なるワークＷを保持する方法を示す概略断面図である。
図７の（ａ）に示すように、上面に凸部Ｗａを有するワークＷを下面Ｗｂ側で保持する場合には、ワークＷとチャック層２との間に、十分な接触面積を確保することができる。
しかし、図７の（ｂ）に示すように、凸部Ｗａがある上面側でワークＷを保持しようとすると、ワークＷとチャック層２との間に十分な接触面積を確保することができない。
したがって、このような場合には、図７の（ｃ）に示すように、可動部材１２〜１４をアクチュエータ３２〜３４によって上昇させる。これにより、凹部を可動部材１１の上に形成することができるので、凸部Ｗａをこの凹部内に嵌めるようにして、ワークＷをチャック層２に当接させることにより、ワークＷと静電吸着層２１及びパッド２２〜２４との間に十分な接触面積を確保することができる。
つまり、可動部材１１〜１４の高さを異ならしめることにより、チャック層２の形状をワークＷの形状に対応した形状に変化させることができるので、形状の異なるワークＷであっても、１つのチャック装置によって、最適な保持力でチャックすることができる。 FIG. 7 is a schematic cross-sectional view illustrating a method for holding workpieces W having different shapes.
As shown in FIG. 7A, when a workpiece W having a convex portion Wa on the upper surface is held on the lower surface Wb side, a sufficient contact area must be ensured between the workpiece W and the chuck layer 2. Can do.
However, as shown in FIG. 7B, if the workpiece W is held on the upper surface side where the convex portion Wa is, a sufficient contact area cannot be ensured between the workpiece W and the chuck layer 2.
Therefore, in such a case, the movable members 12 to 14 are raised by the actuators 32 to 34 as shown in FIG. Thereby, since the concave portion can be formed on the movable member 11, the workpiece W is brought into contact with the chuck layer 2 by fitting the convex portion Wa into the concave portion, thereby electrostatically attracting the workpiece W and the workpiece W. A sufficient contact area can be ensured between the layer 21 and the pads 22 to 24.
That is, by making the heights of the movable members 11 to 14 different, the shape of the chuck layer 2 can be changed to a shape corresponding to the shape of the workpiece W. The chuck device can perform chucking with an optimum holding force.

図８は、デチャック状態を示す概略断面図である。
ワークＷを全面保持した状態のチャック装置（図３参照）において、ワークＷをデチャックする場合には、図８に示すように、スイッチ２８をオフにして、吸着電極２５への通電を停止すると共に、可動部材１３をアクチュエータ３３によって上昇させる。
これにより、ワークＷは、非粘着パッド２３を有した可動部材１３によって、静電吸着層２１及びパッド２２，２４から引き剥がされた状態になる。
このとき、可動部材１３の表面は、平坦なリング状をなしているので、先の尖ったリフトピン等と比べて、ワークＷとの接触面積が広い、このため、この可動部材１３が、その上昇時に、ワークＷを傷つけることはない。 FIG. 8 is a schematic cross-sectional view showing a dechucked state.
In the chuck device in a state where the workpiece W has been entirely held (see FIG. 3), when de-chucking the workpiece W, as shown in FIG. 8, and turns off the switch 28 stops the energization of the suction electrode 25 The movable member 13 is raised by the actuator 33.
Thereby, the workpiece W is peeled off from the electrostatic adsorption layer 21 and the pads 22 and 24 by the movable member 13 having the non-adhesive pad 23.
At this time, since the surface of the movable member 13 has a flat ring shape, the contact area with the workpiece W is larger than a pointed lift pin or the like. For this reason, the movable member 13 is raised. Sometimes the work W is not damaged.

（実施例２）
次に、この発明の第２実施例について説明する。
図９、この発明の第２実施例に係るチャック装置を示す概略断面図である。
図９に示すように、この実施例のチャック装置は、粘着パッド２１’を可動部材１１の表面に貼り付けることにより、チャック層２を全て粘着パッド２１’，２２，２４で構成した。
かかる構成により、チャック装置の構造を単純化することができ、この結果、製品のコストダウンを図ることができる。
その他の構成，作用及び効果は、上記第１実施例と同様であるので、その記載は省略する。
なお、この実施例では、チャック層２を全て粘着パッドで構成したが、チャック層２を全て静電吸着層２１で構成することもできることは勿論である。 (Example 2)
Next explained is the second embodiment of the invention.
FIG. 9 is a schematic cross-sectional view showing a chuck device according to a second embodiment of the present invention.
As shown in FIG. 9, in the chuck device of this embodiment, the adhesive layer 21 ′ is attached to the surface of the movable member 11 so that the chuck layer 2 is composed of the adhesive pads 21 ′, 22, and 24.
With this configuration, the structure of the chuck device can be simplified, and as a result, the cost of the product can be reduced.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.
In this embodiment, the chuck layer 2 is entirely composed of the adhesive pad, but it is needless to say that the chuck layer 2 can be entirely composed of the electrostatic adsorption layer 21.

（実施例３）
次に、この発明の第３実施例について説明する。
図１０は、この発明の第３実施例に係るチャック装置を示す概略断面図である。
図１０に示すように、この実施例のチャック装置では、粘着パッド２１’を可動部材１１の表面に貼り付けることにより、チャック層２の全てを粘着パッド２１’，２２，２４で構成するだけでなく、粘着パッド２２，２４を可動部材１２，１４の表面に部分的に貼り付けた。
具体的には、複数の円形の粘着パッド２２を可動部材１２の表面に一定間隔で貼り付けると共に、複数の円形の粘着パッド２４を可動部材１４の表面に一定間隔で貼り付けた。
すなわち、この実施例のチャック装置では、小面積の粘着パッド２２，２４が、可動部材１２，１４に複数貼り付けられており、これにより、ワークＷとチャック層２との接触面積をより細かく調整することができる。
また、この実施例では、複数の粘着パッド２２，２４をエンボス状にベース１の表面に貼り付けることにより、ワークＷとの接触面積を小さくして、チャック時に受けるワークＷのダメージを小さくしている。
その他の構成，作用及び効果は、上記第１及び第２実施例と同様であるので、その記載は省略する。
なお、この実施例では、粘着パッド２１’を可動部材１１の表面に貼り付けたが、粘着パッド２１’の代わりに、静電吸着層２１を可動部材１１に貼り付けた構成のチャック装置も、この実施例のチャック装置とほぼ同様の作用及び効果を奏する。 (Example 3)
Next explained is the third embodiment of the invention.
FIG. 10 is a schematic sectional view showing a chuck device according to a third embodiment of the present invention.
As shown in FIG. 10, in the chuck device of this embodiment, the adhesive pad 21 ′ is attached to the surface of the movable member 11 so that all of the chuck layer 2 is composed of the adhesive pads 21 ′, 22, and 24. The adhesive pads 22 and 24 were partially attached to the surfaces of the movable members 12 and 14.
Specifically, a plurality of circular adhesive pads 22 were affixed to the surface of the movable member 12 at regular intervals, and a plurality of circular adhesive pads 24 were affixed to the surface of the movable member 14 at regular intervals.
That is, in the chuck device of this embodiment, a plurality of adhesive pads 22 and 24 having a small area are attached to the movable members 12 and 14, thereby finely adjusting the contact area between the workpiece W and the chuck layer 2. can do.
Further, in this embodiment, a plurality of adhesive pads 22 and 24 are affixed to the surface of the base 1 in an embossed manner, thereby reducing the contact area with the workpiece W and reducing the damage to the workpiece W received during chucking. Yes.
Other configurations, operations, and effects are the same as those in the first and second embodiments, and thus description thereof is omitted.
In this embodiment, the adhesive pad 21 ′ is attached to the surface of the movable member 11, but a chuck device having a configuration in which the electrostatic adsorption layer 21 is attached to the movable member 11 instead of the adhesive pad 21 ′ There are substantially the same operations and effects as the chuck device of this embodiment.

（変形例）
図１１は、チャック装置のチャック層２に関する変形例を示す概略平面図である。
上記第１〜第３実施例では、可動部材１１〜１４のうち、１つの可動部材１３をデチャック用の部材としたチャック装置を例示したが、この発明では、図１１に示すように、デチャック用の部材を有しないチャック装置も提示することができる。 (Modification)
FIG. 11 is a schematic plan view showing a modified example related to the chuck layer 2 of the chuck device.
In the first to third embodiments, the chuck device in which one movable member 13 among the movable members 11 to 14 is used as a dechucking member is illustrated. However, in the present invention, as shown in FIG. It is also possible to present a chuck device that does not have the above members.

例えば、図１１の（ａ）に示すように、各粘着パッド２１’，２２，２３’，２４を各可動部材１１〜１４の表面全面に貼り付けて、チャック装置を構成することができる。
なお、この変形例において、静電吸着層を各可動部材１１〜１４の表面全面に貼り付けて、チャック装置を構成することもできる。 For example, as shown in FIG. 11 (a), each of the adhesive pads 21 ′, 22, 23 ′, 24 can be attached to the entire surface of each of the movable members 11-14 to constitute a chuck device.
In this modification, the chucking device can also be configured by attaching an electrostatic adsorption layer to the entire surface of each movable member 11-14.

また、図１１の（ｂ）に示すように、複数の円形の粘着パッド２１’，２２，２３’，２４を、各可動部材１１〜１４の表面に部分的に貼り付けて、チャック装置を構成することもできる。   Further, as shown in FIG. 11B, a plurality of circular adhesive pads 21 ′, 22, 23 ′, and 24 are partially attached to the surfaces of the movable members 11 to 14 to constitute a chuck device. You can also

さらに、図１１の（ｃ）に示すように、静電吸着層２１を可動部材１１の表面全面に貼り付けると共に、粘着パッド２２，２３’，２４を可動部材１２〜１４の表面全面に貼り付けて、チャック装置を構成することもできる。   Further, as shown in FIG. 11 (c), the electrostatic adsorption layer 21 is attached to the entire surface of the movable member 11, and the adhesive pads 22, 23 ', 24 are attached to the entire surface of the movable members 12-14. Thus, a chuck device can be configured.

また、図１１の（ｄ）に示すように、静電吸着層２１を可動部材１１の表面全面に貼り付けると共に、複数の円形の粘着パッド２２，２３’，２４を各可動部材１２〜１４表面に、一定間隔で貼り付けることにより、チャック装置を構成することができる。   Further, as shown in FIG. 11 (d), the electrostatic adsorption layer 21 is attached to the entire surface of the movable member 11, and a plurality of circular adhesive pads 22, 23 ', 24 are attached to the surfaces of the movable members 12-14. Moreover, a chuck | zipper apparatus can be comprised by affixing on a fixed space | interval.

（実施例４）
次に、この発明の第４実施例について説明する。
図１２は、この発明の第４実施例に係るチャック装置を示す概略断面図であり、図１３は、保持力の調整状態を示す概略断面図である。 Example 4
Next explained is the fourth embodiment of the invention.
FIG. 12 is a schematic cross-sectional view showing a chuck device according to a fourth embodiment of the present invention, and FIG. 13 is a schematic cross-sectional view showing a holding force adjustment state.

図１２に示すように、この実施例のチャック装置は、チャック層としての１枚の粘着パッド２’を、ベース１の表面全面に渡って貼り付けた構成をとっている。
具体的には、１枚の粘着パッド２’を、可動部材１１〜１４の表面全面に渡って貼り付けた。
これにより、図１３に示すように、可動部材１１〜１４を上下動させることで、ワークＷに対する保持力を調整することができる。
また、可動部材１１〜１４を上下動させることで、粘着パッド２’全体をワークＷの形状に対応させて撓ませることができるので、ワークＷの表面に凹凸がある場合においても、ワークＷの形状に対応した最適な保持力でワークＷをチャックすることができる。 As shown in FIG. 12, the chuck device of this embodiment has a configuration in which one adhesive pad 2 ′ as a chuck layer is attached to the entire surface of the base 1.
Specifically, one adhesive pad 2 ′ was pasted over the entire surface of the movable members 11-14.
Thereby, as shown in FIG. 13, the holding force with respect to the workpiece | work W can be adjusted by moving the movable members 11-14 up and down.
Moreover, since the adhesive pad 2 'whole can be bent according to the shape of the workpiece | work W by moving the movable members 11-14 up and down, even when the surface of the workpiece | work W has an unevenness | corrugation, The workpiece W can be chucked with an optimum holding force corresponding to the shape.

図１４は、デチャック状態を示す概略断面図である。
この実施例のチャック装置によれば、図１４の（ａ）に示すように、可動部材１２〜１４を上昇させ、可動部材１４を最も高く位置させることで、ワークＷの中央部と粘着パッド２’との間に隙間Ｇ１を形成することができる。また、図１４の（ｂ）に示すように、可動部材１２〜１４を下降させ、可動部材１１を最も高く位置させることで、ワークＷの外周部と粘着パッド２’との間に隙間Ｇ２を形成することができる。これにより、リフトピンやエアパージを用いて、ワークＷを軽く押し上げることにより、ワークＷを、傷つけることなく、安全且つ容易にデチャックすることができる。
その他の構成，作用及び効果は、上記第１〜第３実施例と同様であるので、その記載は省略する。
また、この実施例では、チャック層として、１枚の粘着パッド２’を適用したが、チャック層として、１枚の静電吸着層２１を可動部材１１〜１４全面に貼り付けた構成のチャック装置も、この実施例のチャック装置とほぼ同様の作用及び効果を奏する。 FIG. 14 is a schematic cross-sectional view showing a dechucked state.
According to the chuck device of this embodiment, as shown in FIG. 14A, the movable members 12 to 14 are raised and the movable member 14 is positioned highest so that the central portion of the workpiece W and the adhesive pad 2 are located. Gap G1 can be formed between the Further, as shown in FIG. 14 (b), by moving the movable members 12 to 14 down and positioning the movable member 11 to the highest position, a gap G2 is formed between the outer peripheral portion of the workpiece W and the adhesive pad 2 ′. Can be formed. Thereby, the work W can be dechucked safely and easily without damaging it by pushing up the work W lightly using a lift pin or air purge.
Other configurations, operations, and effects are the same as those in the first to third embodiments, and thus description thereof is omitted.
In this embodiment, one adhesive pad 2 'is applied as the chuck layer. However, the chuck device has a configuration in which one electrostatic adsorption layer 21 is attached to the entire surface of the movable members 11 to 14 as the chuck layer. Also, there are substantially the same operations and effects as the chuck device of this embodiment.

なお、この発明は、上記実施例に限定されるものではなく、発明の要旨の範囲内において種々の変形や変更が可能である。
例えば、上記第１〜第３実施例では、チャック層２を構成する静電吸着層２１及びパッド２１’，２２，２３’，２４が、隣の可動部材の表面に渡らないように、各可動部材１１〜１４の表面に、全面的に又は部分的に貼り付けたチャック装置を例示した。
しかし、図１５に示すように、チャック層２を構成する粘着パッド２２，２４が、隣の可動部材の表面に渡るように貼り付けたチャック装置も、この発明の範囲に含まれることは勿論である。 In addition, this invention is not limited to the said Example, A various deformation | transformation and change are possible within the range of the summary of invention.
For example, in the first to third embodiments, the electrostatic adsorption layer 21 and the pads 21 ′, 22, 23 ′, 24 constituting the chuck layer 2 are movable so that they do not cross the surface of the adjacent movable member. A chuck device in which the entire surface or a part of the members 11 to 14 are attached to the surface of the members 11 to 14 is illustrated.
However, as shown in FIG. 15, a chuck device in which the adhesive pads 22 and 24 constituting the chuck layer 2 are attached so as to extend over the surface of the adjacent movable member is also included in the scope of the present invention. is there.

１，１００，２００…ベース、 ２…チャック層、 ２’，２１’，２２，２３’，２４，２１０，２１０’…粘着パッド、 １１〜１４…可動部材、 ２１，１１０…静電吸着層、 ２３…非粘着パッド、 ２５，１１２…吸着電極、 ２６，１１１…誘電体、 ２７…電源、 ２８…スイッチ、 ３１〜３４…アクチュエータ、 ３１ａ〜３４ａ…アーム、Ｇ１，Ｇ２…隙間、 Ｏ…同心軸、 Ｗ…ワーク。 DESCRIPTION OF SYMBOLS 1,100,200 ... Base, 2 ... Chuck layer, 2 ', 21', 22, 23 ', 24, 210, 210' ... Adhesive pad, 11-14 ... Movable member, 21, 110 ... Electrostatic adsorption layer, 23 ... Non-adhesive pad, 25, 112 ... Adsorption electrode, 26, 111 ... Dielectric, 27 ... Power supply, 28 ... Switch, 31-34 ... Actuator, 31a-34a ... Arm, G1, G2 ... Gap , O ... Concentric shaft W ... Work.

Claims (6)

ベースと、このベースの表面に貼り付けられ且つその表面に当接されたワークを保持するためのチャック層とを備えるチャック装置であって、
上記ベースを、同心円状に配列された複数の可動部材で構成し、
複数のアクチュエータによって、上記複数の可動部材を円心軸に沿ってそれぞれ独立に上下動可能にし、
上記チャック層を、隣の可動部材表面に渡らないようにして、各可動部材の表面に全面的に又は部分的に貼り付け、
上記チャック層を、上記複数の可動部材のうち１つの可動部材にのみ貼り付けずに、当該可動部材をデチャック用の可動部材とした、
ことを特徴とするチャック装置。 A chuck device comprising a base and a chuck layer for holding a work affixed to and in contact with the surface of the base,
The base is composed of a plurality of movable members arranged concentrically,
With the plurality of actuators, the plurality of movable members can be moved up and down independently along the center axis,
The chuck layer is stuck to the surface of each movable member so as not to cross over the surface of the adjacent movable member,
Without attaching the chuck layer to only one movable member among the plurality of movable members, the movable member was used as a movable member for dechucking.
A chuck device characterized by that. ベースと、このベースの表面に貼り付けられ且つその表面に当接されたワークを保持するためのチャック層とを備えるチャック装置であって、
上記ベースを、同心円状に配列された複数の可動部材で構成し、
複数のアクチュエータによって、上記複数の可動部材を円心軸に沿ってそれぞれ独立に上下動可能にし、
１枚の上記チャック層を、上記ベースの表面全面に渡って貼り付けた、
ことを特徴とするチャック装置。 A chuck device comprising a base and a chuck layer for holding a work affixed to and in contact with the surface of the base,
The base is composed of a plurality of movable members arranged concentrically,
With the plurality of actuators, the plurality of movable members can be moved up and down independently along the center axis,
A piece of the chuck layer was pasted over the entire surface of the base.
A chuck device characterized by that. 請求項１又は請求項２に記載のチャック装置において、
上記チャック層は、所定の電圧が印加可能な吸着電極とこの吸着電極を被覆した誘電体とを有し、当該誘電体表面に載置されたワークを吸着電極への通電時に生じる静電気力で吸着可能な静電吸着層である、
ことを特徴とするチャック装置。 The chuck device according to claim 1 or 2,
The chuck layer has an adsorption electrode to which a predetermined voltage can be applied and a dielectric covering the adsorption electrode, and the workpiece placed on the surface of the dielectric is adsorbed by electrostatic force generated when the adsorption electrode is energized. Possible electrostatic adsorption layer,
A chuck device characterized by that. 請求項１又は請求項２に記載のチャック装置において、
上記チャック層は、表面に載置されたワークをその自己粘着力によって保持可能な粘着パッドである、
ことを特徴とするチャック装置。 The chuck device according to claim 1 or 2,
The chuck layer is an adhesive pad that can hold the workpiece placed on the surface by its self-adhesive force.
A chuck device characterized by that. ベースと、このベースの表面に貼り付けられ且つその表面に当接されたワークを保持するためのチャック層とを備えるチャック装置であって、
上記ベースを、同心円状に配列された複数の可動部材で構成し、
複数のアクチュエータによって、上記複数の可動部材を円心軸に沿ってそれぞれ独立に上下動可能にし、
上記チャック層を、隣の可動部材表面に渡らないようにして、各可動部材の表面に全面的に又は部分的に貼り付け、
上記複数の可動部材のうち一部の可動部材の表面に貼り付けられているチャック層を、所定の電圧が印加可能な吸着電極とこの吸着電極を被覆した誘電体とを有し、当該誘電体表面に載置されたワークを吸着電極への通電時に生じる静電気力で吸着可能な静電吸着層で形成し、
他の可動部材の表面に貼り付けられているチャック層を、表面に載置されたワークをその自己粘着力によって保持可能な粘着パッドで形成した、
ことを特徴とするチャック装置。 A chuck device comprising a base and a chuck layer for holding a work affixed to and in contact with the surface of the base,
The base is composed of a plurality of movable members arranged concentrically,
With the plurality of actuators, the plurality of movable members can be moved up and down independently along the center axis,
The chuck layer is stuck to the surface of each movable member so as not to cross over the surface of the adjacent movable member,
The chuck layer attached to the surface of a part of the movable members among the plurality of movable members has an adsorption electrode to which a predetermined voltage can be applied and a dielectric covering the adsorption electrode. The workpiece placed on the surface is formed with an electrostatic adsorption layer that can be adsorbed by the electrostatic force generated when the adsorption electrode is energized.
The chuck layer attached to the surface of another movable member was formed with an adhesive pad that can hold the workpiece placed on the surface by its self-adhesive force,
A chuck device characterized by that. 請求項５に記載のチャック装置において、
上記チャック層を、上記複数の可動部材のうち１つの可動部材にのみ貼り付けずに、当該可動部材をデチャック用の可動部材とした、
ことを特徴とするチャック装置。 The chuck device according to claim 5,
Without attaching the chuck layer to only one movable member among the plurality of movable members, the movable member was used as a movable member for dechucking.
A chuck device characterized by that.
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US11338556B2 (en) 2016-06-28 2022-05-24 Corning Incorporated Laminating thin strengthened glass to curved molded plastic surface for decorative and display cover application
US11850942B2 (en) 2016-07-05 2023-12-26 Corning Incorporated Cold-formed glass article and assembly process thereof
US11292343B2 (en) 2016-07-05 2022-04-05 Corning Incorporated Cold-formed glass article and assembly process thereof
US11607958B2 (en) 2016-07-05 2023-03-21 Corning Incorporated Cold-formed glass article and assembly process thereof
US11384001B2 (en) 2016-10-25 2022-07-12 Corning Incorporated Cold-form glass lamination to a display
US11586306B2 (en) 2017-01-03 2023-02-21 Corning Incorporated Vehicle interior systems having a curved cover glass and display or touch panel and methods for forming the same
US11899865B2 (en) 2017-01-03 2024-02-13 Corning Incorporated Vehicle interior systems having a curved cover glass and a display or touch panel and methods for forming the same
US11685684B2 (en) 2017-05-15 2023-06-27 Corning Incorporated Contoured glass articles and methods of making the same
US11332011B2 (en) 2017-07-18 2022-05-17 Corning Incorporated Cold forming of complexly curved glass articles
US11459268B2 (en) 2017-09-12 2022-10-04 Corning Incorporated Tactile elements for deadfronted glass and methods of making the same
US11713276B2 (en) 2017-09-12 2023-08-01 Corning Incorporated Tactile elements for deadfronted glass and methods of making the same
US11660963B2 (en) 2017-09-13 2023-05-30 Corning Incorporated Curved vehicle displays
US11772491B2 (en) 2017-09-13 2023-10-03 Corning Incorporated Light guide-based deadfront for display, related methods and vehicle interior systems
US11919396B2 (en) 2017-09-13 2024-03-05 Corning Incorporated Curved vehicle displays
US11745588B2 (en) 2017-10-10 2023-09-05 Corning Incorporated Vehicle interior systems having a curved cover glass with improved reliability and methods for forming the same
US11768369B2 (en) 2017-11-21 2023-09-26 Corning Incorporated Aspheric mirror for head-up display system and methods for forming the same
US11767250B2 (en) 2017-11-30 2023-09-26 Corning Incorporated Systems and methods for vacuum-forming aspheric mirrors
US11550148B2 (en) 2017-11-30 2023-01-10 Corning Incorporated Vacuum mold apparatus, systems, and methods for forming curved mirrors
US11718071B2 (en) 2018-03-13 2023-08-08 Corning Incorporated Vehicle interior systems having a crack resistant curved cover glass and methods for forming the same
US11518146B2 (en) 2018-07-16 2022-12-06 Corning Incorporated Method of forming a vehicle interior system
US11685685B2 (en) 2019-07-31 2023-06-27 Corning Incorporated Method and system for cold-forming glass
US20210032150A1 (en) * 2019-07-31 2021-02-04 Corning Incorporated Method and system for cold-forming glass
US11772361B2 (en) 2020-04-02 2023-10-03 Corning Incorporated Curved glass constructions and methods for forming same

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