JP5795521B2 - Support device - Google Patents

Description

The present invention relates to a supporting equipment, more particularly, is utilized in the apparatus for performing predetermined processing on the supporting object, it relates to a support equipment that can remove static electricity to support object.

  Conventionally, a sheet sticking apparatus for sticking an adhesive sheet as a predetermined treatment to an adherend such as a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) has been widely used. Is disclosed in Patent Document 1, for example. The sheet sticking apparatus of Patent Document 1 includes a support table having a support surface for supporting a wafer, a sticking unit for sticking an adhesive sheet to a wafer supported by the support table, and a transport mechanism for carrying the wafer in and out of the support table. And a static elimination device for removing static electricity from the protective tape before being attached to the wafer and the unnecessary tape before recovery.

JP 2004-221469 A JP 2000-68293 A

  However, even when the static eliminator is used, when a statically charged wafer is placed on a support table, or when a statically charged wafer is removed from the support table by an adhesive sheet attaching operation, the wafer or Static electricity charged on the adhesive sheet sparks (discharges by sparks) with respect to the support table, causing a disadvantage that the wafer, particularly a circuit formed on the wafer, is damaged.

  Here, the above-described phenomenon tends to occur also in the sheet peeling apparatus disclosed in Patent Document 2. The sheet peeling apparatus of the same document can peel a protective sheet from a wafer by bonding a peeling tape to an adhesive sheet attached to a wafer and pulling the peeling tape. Even in this peeling apparatus, sparks are generated when a statically charged wafer is placed on a support table, or when a statically charged wafer is removed from the support table by an adhesive sheet peeling operation, and formed on the wafer. This causes the inconvenience of damaging the circuit.

[Object of invention]
An object of the present invention is to provide a supporting equipment capable of preventing the main part of the adherend by spark static electricity damage.

To achieve the above object, the present invention comprises a support table having a support surface for supporting the supporting object, the static electricity charged to the support object in contact with the support object which is supported by the support table can be removed Neutralizing means, and moving means capable of relatively moving the support object and the neutralizing means ,
The neutralizing means includes a power receiving member capable of contacting the support object, and an urging means provided to be able to move the power reception member by a predetermined amount following an approaching or separating operation of the support object with respect to the support surface. equipped with a,
The moving means once brings a predetermined portion of the support object conveyed from the outside onto the support table once closes or comes into contact with the power receiving member, and then separates the support target from the power receiving member. Thus , a configuration is adopted in which it is controlled so that it can be placed on the support table .

Further, the present invention provides a sheet sticking device for sticking an adhesive sheet to an adherend, or a support device used for a sheet peeling device for peeling an adhesive sheet from an adherend.
A support table having a support surface for supporting a support object including the adherend, and a charge eliminating unit capable of removing static electricity charged on the adherend in contact with the support object supported by the support table. Prepared,
The neutralizing means includes a power receiving member capable of contacting the support object, and an urging means provided to be able to move the power reception member by a predetermined amount following an approaching or separating operation of the support object with respect to the support surface. It has a configuration that comprises.

The present invention provides a support table having a support surface for supporting a support object, a static elimination means capable of removing static electricity charged on the support object in contact with the support object supported by the support table, and the support A moving means capable of relatively moving the object and the static eliminating means,
The neutralizing means includes a power receiving member capable of contacting the support object, and an urging means provided to be able to move the power reception member by a predetermined amount following an approaching or separating operation of the support object with respect to the support surface. With
The moving means temporarily separates the support object transported from the support table to the outside from the power receiving member, brings a predetermined part of the support object into contact with or contacts the power receiving member, and then again supports the support object. A configuration may be employed in which the object is controlled to be separable from the power receiving member .

According to the present invention, when a support object charged with static electricity is placed on a support surface such as a support table, the support object is positioned at a position apart from a distance at which no spark occurs between the support object and the support surface. A limited part of the object and the power receiving member can be brought close to each other. According to this, for example, when the supporting object is a wafer, a circuit is not formed in the outer peripheral area having a width of about 3 mm from the outer edge to the inner side, so that this area is in contact with the power receiving member, When the object to be supported is an optical disc such as a compact disc (CD) or a digital versatile disc (DVD), an outer peripheral area having a width of about 2 mm from the outer edge to the inner side, or an inner diameter of about 5 mm from the inner edge to the outer side of the central hole. Since the information recording layer is not formed in the peripheral area, if these areas are in contact with the power receiving member, the main surface where the semiconductor circuit and the information recording layer are provided is sparked on the support surface. The semiconductor circuit and the information recording layer can be prevented from being damaged by sparks.
In addition, when removing a support object that has been subjected to a predetermined process such as attaching or peeling an adhesive sheet from a support surface such as a support table, a distance at which no spark occurs between the support object and the support surface Until the power receiving member follows the support object, it is possible to prevent static electricity charged on the support object from sparking on the support surface and to prevent damage to the adherend due to this spark. It becomes possible.
Even when the support object is removed from the support surface, the power receiving member is separated from the limited part of the support object at a position where a spark is not generated between the support object and the support surface. Can do. According to this, for example, when the object to be supported is a wafer or an optical disk, the semiconductor circuit and the information recording layer are provided if the outer peripheral area and the inner peripheral area similar to the above are separated from the power receiving member at the end. Therefore, the semiconductor circuit and the information recording layer can be prevented from being damaged by the spark without being sparked from the main part.
The distance at which no spark is generated between the support object and the support surface depends on the charge amount of the support object, but can be exemplified by about 50 mm exceeding 0 mm, and the charge amount of the support object is extremely high. Depending on the environmental conditions of the atmosphere and the like, it may be more than that, so the amount of movement of the urging means can be appropriately selected according to the charge amount of the support object.

  Further, if the corner of the support object can be brought into contact with the power receiving member first or last, spark (discharge) tends to occur from a pointed part such as a corner of the charged object. The charged static electricity can be positively removed by the power receiving member.

  In addition, if the predetermined part of the support object can be approached or contacted with the power receiving member before the support target object is brought into contact with the power receiving member or after being separated from the power receiving member, static electricity charged on the support target object can be obtained. Can be more positively removed by the power receiving member.

The schematic front view of the support apparatus which concerns on 1st Embodiment. (A)-(F) are explanatory drawings of the operation | movement point of a winding spring. The schematic front view of the support apparatus which concerns on 2nd Embodiment. (A) And (B) is explanatory drawing of the static elimination means which concerns on a modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this specification, “right”, “left”, “upper”, and “lower” are used with reference to FIG. 1 unless otherwise specified.

[First Embodiment]
The support apparatus 10 of 1st Embodiment is utilized for the sheet sticking apparatus SD provided in the position shown with a dashed-two dotted line in FIG. This sheet sticking device SD is provided so that a mounting sheet MS as an adhesive sheet can be stuck to and integrated with the wafer WF and the ring frame RF as adherends supported by the support device 10. . The sheet sticking device SD can be substantially the same as the transfer tape mount unit shown in Japanese Patent Application Laid-Open No. 2000-68293 filed by the present applicant. Omitted.

  The support device 10 includes a support table 11 that can support the wafer WF and the ring frame RF, and a static elimination unit 12 that can remove static electricity charged on the wafer WF and the like. A protective sheet PS is affixed to the lower surface of the wafer WF, and a mounting sheet MS is affixed from the side of the wafer WF where the protective sheet PS is not affixed.

  The support table 11 is formed at a position lower than the first support surface 15 on the first support surface 15 that sucks and holds the protective sheet PS, and on the outside of the first support surface 15, and holds the ring frame RF by suction. Two support surfaces 16 and a step forming surface 17 which stands between the first and second support surfaces 15 and 16 and contacts the inner peripheral edge of the ring frame RF to position the ring frame RF. Yes. The support table 11 is a drive device and is provided so as to be movable in the left-right direction via a slider 20 of a linear motion motor 19 as a moving means.

  The static elimination means 12 includes winding springs 23 and 24 as urging means provided in concave receiving portions 15A and 16A formed on the first and second support surfaces 15 and 16, and the winding springs 23 and 24. And a cable 25 having one end connected to the lower end and grounded at the other end. The coil springs 23 and 24 have power receiving members 23A and 24A that extend in the vertical direction at the respective upper ends and can contact the protective sheet PS and the ring frame RF. The power receiving members 23A and 24A are elastic forces of the springs 23 and 24. Is provided so as to be movable in the vertical direction. Accordingly, the power receiving members 23A and 24A receive static electricity, and the static electricity charged on the support object is grounded via the cable 25, so that the static electricity can be removed. The power receiving members 23A and 24A protrude from the first and second support surfaces 15 and 16 in a no-load state, but when they are loaded with the wafer WF and the ring frame RF, they are accommodated in the receiving portions 15A and 16A. The first and second support surfaces 15 and 16 are buried in the power receiving members 23A and 24A so that the wafer WF and the ring frame RF follow or approach or separate from the first and second support surfaces 15 and 16. Thus, a predetermined amount can be moved. Note that the length of the power receiving members 23A and 24A protruding from the first and second support surfaces 15 and 16 in a no-load state is a spark between each support object and the first and second support surfaces 15 and 16. Is set to a distance at which no occurrence occurs, for example, about 20 mm.

Next, a wafer WF transfer method in the present embodiment will be described.

When the wafer WF is transferred by a transfer means (not shown), as shown in FIG. 2A, a position separated from the first support surface 15 at a distance where no spark is generated, in the case of this embodiment. The wafer WF is temporarily stopped at a position 20 mm above the first support surface 15. Thereafter, the linear motor 19 is driven, and as shown in FIG. 2B, the power receiving member 23A is applied to the corner WF1 of the wafer WF as the support object or the corner PS1 of the protective sheet PS as the support object. Control is performed so as to approach or abut once and then separate again. Thus, even if the wafer WF or the protective sheet PS is charged by once approaching or contacting the power receiving member 23A to the support target, a portion (an internal region of the wafer WF) where a circuit as a main part is formed. The first support surface 15 and other regions are not sparked from the outer peripheral region having a width of about 3 mm toward the inside from the outer edge where no circuit is formed, and the power receiving member 23A is sparked or transmitted. It is possible to prevent the circuit from being damaged by the spark.
Next, as shown in FIG. 2C, the wafer WF is placed on the first support surface 15 and sucked and held by the transfer means (not shown) with the side to which the protective sheet PS is attached facing downward. Also at this time, it is preferable that the linear motion motor 19 is driven so that the corner portion WF1 of the wafer WF or the corner portion PS1 of the protective sheet PS is first brought into contact with the power receiving member 23A.
When the ring frame RF is transported by a transport means (not shown), as shown in FIG. 2 (D), a position separated from the second support surface 16 by a distance at which no spark occurs, this embodiment In this case, the ring frame RF is temporarily stopped at a position 25 mm above the second support surface 16. Thereafter, as shown in FIG. 2 (E), the linear motion motor 19 is driven and the power receiving member 23A is once approached or brought into contact with the left corner RF1 of the ring frame RF as a support object, as described above. Then, control is performed so as to separate them again, and spark or power transmission is performed. Next, as shown in FIG. 2F, the ring frame RF is placed on the second support surface 16 and sucked and held by a conveying means (not shown). Also at this time, it is preferable that the linear motion motor 19 is driven so that the corner portion RF1 of the ring frame RF is first brought into contact with the power receiving member 24A.
With this mounting, the power receiving members 23A and 24A protruding from the first and second support surfaces 15 and 16 are pushed down against the urging force of the winding springs 23 and 24 in a state where they are in contact with the wafer WF and the ring frame RF. Embedded in the receiving portions 15A and 16A. In this state, the state in which the power receiving members 23A and 24A of the winding springs 23 and 24 are in contact with the lower surface of the wafer WF and the ring frame RF is maintained by the elasticity of the winding springs 23 and 24.

  After the wafer WF and the ring frame RF are supported on the support table 11, the linear motion motor 19 is operated to move the support table 11. Then, the mounting sheet MS is attached to each upper surface of the wafer WF and the ring frame RF by the above-described sheet attaching apparatus SD, and these are integrated to form an integrated object WR as a support object. When the mounting sheet MS is affixed, the mounting sheet MS is peeled off from a release sheet (not shown) or pressed by a pressing means or the like, so that static electricity is charged. However, each power receiving member 23A, 24A Is in contact with the wafer WF and the ring frame RF, the charged static electricity is grounded via the cable 25 and is eliminated.

After the mounting sheet MS is pasted, the integrated object WR is transported from the support table 11 to the next process by transport means (not shown). In this conveyance, when the integrated object WR is lifted, static electricity is further generated in association with the lifting operation, and the integrated object WR is charged. When the charge amount increases, each support surface 15 is moved from an unspecified position of the integrated object WR. , 16 will be sparked at unspecified positions. However, in the case of the present embodiment, the winding springs 23 and 24 follow and move upward in accordance with the detachment movement of the integrated object WR from the support surfaces 15 and 16, so that the power receiving members 23 </ b> A and 24 </ b> A and Contact with the ring frame RF is maintained, and no spark is generated between the integrated object WR and each of the support surfaces 15 and 16, and the power receiving members 23A and 24A are kept at a distance that does not generate a park between them. The static elimination is performed in contact with the wafer WF and the ring frame RF. Note that either one of the power receiving member 23A or 24A may be prevented from extending upward by a driving device (not shown) or the like (hereinafter, the power receiving member 23A will be described as not extending upward).
Then, after the winding spring 24 is in an unloaded state, the power receiving member 24A and the ring frame RF are separated from each other by further raising of the integrated object WR. Here, when the power receiving member 24A and the ring frame RF are separated from each other, the charge amount of the integrated object WR is reduced due to the effect of neutralization via the winding spring 24. Therefore, a spark is generated between the integrated object WR and the power receiving member 24A. The possibility of occurrence is very low. Nevertheless, if the charge removal of the integrated object WR has not been performed completely, a spark may occur between the integrated object WR and the power receiving member 24A at the moment when the integrated object WR is separated from the power receiving member 24A. . However, in the case of the present embodiment, since the integrated object WR is separated to a distance at which no spark is generated between the support surfaces 15 and 16, the portion where the integrated object WR can inevitably spark is the ring frame RF. Therefore, it is possible to effectively prevent a spark from a portion where the circuit of the wafer WF is formed. That is, the power receiving member 24A serves as a lightning rod, and the region where the single member WR sparks to the power receiving member 24A can be made as narrow as possible.
The power receiving member 24A is once separated from the ring frame RF, and then a predetermined portion of the ring frame RF, for example, the corner portion RF1 of the ring frame RF is brought close to or in contact with the power receiving member 24A, and then the integrated object WR is conveyed again. You may do it. This has the effect of triggering static electricity that could not be sparked by the previous separation.

  Therefore, according to such an embodiment, when carrying out the support object, it is possible to prevent a spark from occurring between the portion of the wafer WF where the circuit is formed and the first and second support surfaces 15 and 16. Thus, it is possible to avoid the occurrence of damage to the circuit formation site, which is the main part of the wafer WF, due to the spark.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. In the following description, the same reference numerals are used for the same or equivalent components as in the first embodiment, and the description is omitted or simplified.

  The support apparatus 10 of 2nd Embodiment is utilized for the sheet | seat peeling apparatus RD provided in the position shown with a dashed-two dotted line in FIG. This sheet peeling apparatus RD applies a peeling tape PT to a protective sheet PS as an adhesive sheet affixed to a wafer WF as an adherend, and pulls the peeling tape PT to protect the sheet from the wafer WF. PS is provided to be peelable. The sheet peeling device RD can employ substantially the same protective tape peeling unit as disclosed in Japanese Patent Application Laid-Open No. 2000-68293 filed by the present applicant. Omitted.

  The support table 11 of the second embodiment includes a support surface 30 that holds and holds the mounting sheet MS in the integrated object WR with the protective sheet PS facing upward and the mounting sheet MS facing downward. A receiving portion 30 </ b> A that receives the winding spring 24 is formed in a region of the support surface 30 that supports the ring frame RF. The power receiving member 24A of the winding spring 24 can contact the mounting sheet MS in the ring frame RF plane.

  Therefore, also in such an embodiment, after the protective sheet PS is peeled off from the wafer WF, the unloaded object WR is unloaded from the support table 11 between the portion where the circuit of the wafer WF is formed and the support surface 30. It is possible to prevent the occurrence of a spark, and it is possible to avoid the occurrence of damage to a circuit formation site that is a main part of the wafer WF due to the spark.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, the static elimination means can be variously modified and can be replaced with the configuration shown in FIG. FIG. 2A includes a winding spring 35 as an urging means and a projecting and retracting pin 36 as a power receiving member connected to the upper end of the winding spring 35. The upper end of the projecting and retracting pin 36 has a tapered shape, is provided so as to be able to contact the lower surface of the support object, and is provided so as to be able to project and retract from the second support surface 16 through the elastic force of the winding spring 35. The neutralizing means in FIG. 5B is composed of a leaf spring 39 as urging means connected to the cable 25. The front end 39A of the leaf spring 39 serves as a power receiving member, and is provided so as to be in contact with the lower surface of the ring frame RF.
Further, the number of removing means 12 may be one or more for one support object, or a plurality of power receiving members may be provided for one removing means 12. .
Further, when the supporting object is an optical disk, the power receiving member is brought into contact with an outer peripheral area having a width of about 2 mm facing inward from the outer edge where no information is recorded or an inner peripheral area having a width of about 5 mm facing outward from the inner edge. By doing so, it is possible to prevent the information recording layer from being damaged.
Further, the corner of the support object can be exemplified by two intersections where the V notch formed on the wafer and the arc portion intersect, two intersections where the straight portion and the arc portion of the orientation flat intersect, and the like.
Furthermore, you may comprise a power receiving member so that it may contact from the upper side of a support target object.
Further, the urging means may be constituted by an air cylinder, a linear motion motor or the like as a drive device in addition to the spring. In this case, the driving device can be actively driven to separate and contact the power receiving member and the support object a plurality of times.
Furthermore, since the distance at which no spark is generated between the support object and the support surfaces 15 and 16 varies depending on the charge amount of the support object, the atmospheric environment conditions, and the like, the power receiving members 23A and 24A protrude from the support surfaces 15 and 16. The length to be performed is not limited to 20 mm or 25 mm, and may be longer or shorter, and can be changed as appropriate.
Further, the moving means may be constituted by a conveying means (not shown) that conveys the wafer WF, the ring frame RF, and the integrated object WR, or may be constituted by both the linear motor 19 and a conveying means (not shown).
Furthermore, in the said embodiment, the support table 11 was moved in the state which stopped the support target object, and the said support target object and power receiving member 23A, 24A were contacted, but it supports in the state which stopped the support table 11 Move the object to bring the support object into contact with the power receiving members 23A, 24A, or move both the support table 11 and the support object to bring the support object into contact with the power receiving members 23A, 24A. Or you may.
Further, the tips of the power receiving members 23A and 24A are not tapered, but may be other shapes such as a flat shape, a spherical shape, and an uneven shape.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

  Further, the type and material of the adherend and the adhesive sheet in the present invention are not particularly limited. For example, the adhesive sheet has an intermediate layer between the base sheet and the adhesive layer, or the base sheet. Three or more layers such as those having a cover layer on the upper surface may be used. Further, the adherend may be an appropriate article (for example, food or resin container), the adhesive sheet may be a label, the adherend is a semiconductor wafer, and the adhesive sheet AS is a protective sheet or dicing. It may be a tape, a die attach film, or the like. In this case, the semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, etc., and the adhesive sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, a dicing tape, a die attach film, but any other sheet, An adhesive sheet having an arbitrary use and shape such as a film and a tape can be applied. Further, the adherend may be an optical disk substrate, and the adhesive sheet S may have a resin layer constituting a recording layer. As described above, as the adherend, not only a glass plate, a steel plate, a resin plate, and other plate-like members, but also members and articles in any form can be targeted.

DESCRIPTION OF SYMBOLS 10 Support apparatus 11 Support table 12 Static elimination means 15 1st support surface 16 2nd support surface 23 Winding spring (biasing means)
23A Power receiving member 24 Winding spring (biasing means)
24A Power receiving member 30 Support surface MS Mounting sheet (adhesive sheet)
SD sheet affixing device PS protective sheet (adhesive sheet)
RD sheet peeling device RF ring frame (adhered body) (supported object)
WF Semiconductor wafer (adherent) (supported object)
WR integrated object (supported object)

Claims (2)

Neutralizing a support table having a support surface for supporting the supporting object, charged with static electricity removable static elimination means is in the support object into contact with the supported support object on the support table, and the supporting object And means for moving relative to the means ,
The neutralizing means includes a power receiving member capable of contacting the support object, and an urging means provided to be able to move the power reception member by a predetermined amount following an approaching or separating operation of the support object with respect to the support surface. equipped with a,
The moving means once brings a predetermined portion of the support object conveyed from the outside onto the support table once closes or comes into contact with the power receiving member, and then separates the support target from the power receiving member. The support device is controlled so as to be placed on the support table . A support table having a support surface for supporting the support object; a charge eliminating unit capable of removing static electricity charged on the support object by contacting the support object supported by the support table; and the support object and the charge eliminating device. And means for moving relative to the means,
The neutralizing means includes a power receiving member capable of contacting the support object, and an urging means provided to be able to move the power reception member by a predetermined amount following an approaching or separating operation of the support object with respect to the support surface. With
The moving means temporarily separates the support object transported from the support table to the outside from the power receiving member, brings a predetermined part of the support object into contact with or contacts the power receiving member, and then again supports the support object. The support device is controlled so that the object can be separated from the power receiving member.

Images