JP5143676B2 - Semiconductor wafer support apparatus and support method - Google Patents

Description

  The present invention relates to a support device and a support method for supporting a semiconductor wafer.

  Conventionally, in the semiconductor manufacturing process, there has been a process of grinding and thinning the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer) in order to reduce the size of a semiconductor chip, and prior to this grinding process, the wafer surface (circuit was formed). A protective adhesive sheet is adhered to the surface). Also, after the semiconductor wafer on which the circuit is formed is diced into chips (dicing), each chip is picked up and bonded to the lead frame (die bonding). A sheet is also pasted on the wafer back surface in advance (see, for example, Patent Document 1).

  The sheet sticking apparatus described in Patent Document 1 places a wafer on a wafer placement table, positions an adhesive sheet directly on the wafer, and presses the adhesive sheet against the wafer with a sticking roller from above. The adhesive sheet is configured to be attached to the wafer. The wafer mounting table in this sticking apparatus is configured to have a table having a diameter substantially the same as the wafer diameter and a flat mounting surface on which the wafer is mounted.

JP 2002-134438 A

  By the way, in the table which is the conventional wafer support apparatus as described in Patent Document 1, since the mounting surface of the table is flat, electrodes (bumps) and the like are formed on the wafer surface in contact with the mounting surface. If the supported surface of the wafer is not flat, such as protruding or having different thickness dimensions between the inner and outer peripheral portions of the wafer, the entire wafer cannot be properly supported. For this reason, a part of the wafer that is not supported by the table is bent by the pressing force of the sticking roller, and the adhesive sheet is lifted from the wafer and a space (air engagement) is formed between the wafer and the wafer. there is a possibility.

  The present invention has been devised by paying attention to the above disadvantages, and the object thereof is a semiconductor that can appropriately support the entire semiconductor wafer even if it has a non-flat surface shape. It is an object of the present invention to provide a wafer support apparatus and a support method.

In order to achieve the above object, a semiconductor wafer support device of the present invention is a semiconductor wafer support device including a support body for supporting a semiconductor wafer having a thickness dimension different between an inner peripheral portion and an outer peripheral portion, The support is an inner support having an outer peripheral shape corresponding to the shape of the outer peripheral edge of the inner peripheral portion of the semiconductor wafer, and an inner periphery along the outer periphery of the inner support that is located outside the inner support. and an outer support which have a shape, wherein the inner support and the outer support along a direction toward the semiconductor wafer is relatively movable, and the inner peripheral portion and the outer peripheral portion of the semiconductor wafer By changing the relative position of the inner support and the outer support according to each surface position, the inner support comes into contact with the inner peripheral part and the outer support comes into contact with the outer peripheral part. To support the semiconductor wafer That adopts a configuration that.

  At this time, in the semiconductor wafer support device of the present invention, it is preferable that at least one of the inner support and the outer support is provided with suction means for sucking the semiconductor wafer.

In addition, the semiconductor wafer support device of the present invention includes a support for supporting at least two types of semiconductor wafers having different thickness dimensions at the inner peripheral portion and the outer peripheral portion and different diameter sizes. The support includes a single support and at least one other support located outside the single support, and the support is configured in multiples . A first inner support having an outer peripheral shape corresponding to the shape of the outer peripheral edge of the inner peripheral portion of the small-diameter semiconductor wafer, and located outside the first inner support, on the outer periphery of the first inner support A first outer support having an inner peripheral shape along the outer periphery, and the other support is located outside the first outer support and has an inner peripheral shape along the outer periphery of the first outer support. According to the shape of the outer peripheral edge of the inner peripheral portion of the semiconductor wafer having a large diameter A second inner support having a peripheral shape, located on the outer side of the second inner support, and a second outer support having an inner peripheral shape along the outer periphery of the second inner support, the first may be 1 and the inner support and the first outer support and a second inner support and the second outer support is relatively movable along a direction to each of the semiconductor wafer, a construction is adopted.

In this case, in the semiconductor wafer support device of the present invention, the one support includes a first inner support and a first outer support located outside the first inner support. The support body includes a second inner support body located outside the first outer support body, and a second outer support body located outside the second inner support body. Of the different semiconductor wafers, by changing the relative position of the first inner support and the first outer support according to the respective surface positions of the inner peripheral portion and the outer peripheral portion of the semiconductor wafer having a small diameter, The first inner support is in contact with the inner peripheral portion and the first outer support is in contact with the outer peripheral portion to support the small-diameter semiconductor wafer. Depending on the surface position of the inner periphery and outer periphery of a large semiconductor wafer By changing the relative positions of the first inner support, the first outer support, the second inner support and the second outer support, the first inner support and the first outer support on the inner periphery. The body and the second inner support are in contact with each other, and the second outer support is preferably in contact with the outer peripheral portion to support the semiconductor wafer having a large diameter.
Furthermore, in the semiconductor wafer support apparatus of the present invention, the inner support that constitutes at least one of the one support and at least one other support located outside the one support. It is preferable that either one of the body and the outer support is provided with suction means for sucking the semiconductor wafer.

On the other hand, the supporting method of the semiconductor wafer of the present invention, the inner peripheral portion and the outer peripheral portion and the thickness is in contact with the inner peripheral portion of the semiconductor wafer differs in outer peripheral shape corresponding to the shape of the outer peripheral edge of the inner peripheral portion an inner support having, this is located outside of the inner supporting body, the semiconductor wafer for supporting the semiconductor wafer using an apparatus comprising an outer support which have a peripheral shape among along the outer periphery of the inner support The relative position of the inner support and the outer support is changed according to the respective surface positions of the inner peripheral portion and the outer peripheral portion of the semiconductor wafer, and the inner support is used as the semiconductor wafer. And the outer support is brought into contact with the outer peripheral portion of the semiconductor wafer to support the semiconductor wafer.

  According to the present invention as described above, the relative positions of the inner support and the outer support are changed according to the respective surface positions of the inner periphery and the outer periphery of the semiconductor wafer, and the inner support supports the inner surface of the semiconductor wafer. By supporting the peripheral portion and supporting the outer peripheral portion of the semiconductor wafer with the outer support, the entire semiconductor wafer can be appropriately supported. Therefore, an electrode or the like protrudes from the inner peripheral surface of the semiconductor wafer to form a convex portion (bump) and the surface position is different from the outer peripheral portion, or conversely, a convex portion is formed on the outer peripheral surface. Even if the thickness is different between the inner and outer peripheral portions of the inner surface and there are steps on the surface, the inner support and the outer support are moved relative to each other in accordance with the steps. The support can be reliably brought into contact with both the peripheral portion and the outer peripheral portion. By supporting a semiconductor wafer with such a support device of the present invention, even when pressed on the surface of the adhesive sheet, the wafer can be prevented from being bent, and adhesion failure such as air biting can be prevented. can do.

  Moreover, while using a 1st inner side support body and a 1st outer side support body, and a 2nd inner side support body and a 2nd outer side support body as a support body, an inner side support body and an outer side support in a 1st and 2nd support body are used. By providing the body so as to be relatively movable with respect to the semiconductor wafer, two types of semiconductor wafers having different diameters can be supported by a single device. Therefore, since it is not necessary to separately prepare a plurality of types of supports having different diameters, the apparatus cost can be reduced, and the time and labor required for replacing the support can be omitted. And even when the level | step difference is formed in the surface of two types of semiconductor wafers from which a diameter differs, the whole wafer can be supported appropriately as mentioned above, and the adhesion defect of an adhesive sheet can be prevented.

Further, by providing the suction means to the support, it is possible to prevent such floating of the semiconductor wafer, Ru can support the wafer more reliably.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
In the second and subsequent embodiments, the same constituent members as those described in the first embodiment and the constituent members having the same functions are denoted by the same reference numerals as those in the first embodiment. Those descriptions are omitted or simplified.

[First Embodiment]
FIG. 1 is a cross-sectional view showing a semiconductor wafer support device 1 according to the first embodiment.
In FIG. 1, a support device 1 is a part of a pasting device for pasting a die attach film S, which is an adhesive sheet for die bonding, on the back surface of a semiconductor wafer (hereinafter simply referred to as a wafer W) on which a circuit is formed. It constitutes. This sticking device supports the wafer W from below by the support device 1 and the upper surface side of the release sheet RL with the heat-sensitive adhesive die attach film S temporarily attached to the release sheet RL positioned above the wafer W. The die attach film S that has been heated and pressed is affixed to the wafer W by rolling the heating roller R along. A plurality of bumps (convex portions) B protruding from the surface of the wafer W, such as protruding electrodes, are formed on the surface of the wafer W supported by the support device 1 (the lower surface in FIG. 1).

  As shown in FIG. 2, the support device 1 includes an inner table 2 that is an inner support, an outer table 3 that is an outer support located outside the inner table 2, an inner table 2, and an outer table 3. And a moving device 4 that relatively moves in the vertical direction.

  The inner table 2 includes a generally disc-shaped inner table main body 21 connected to the moving device 4 and a soft resin sheet 22 that is an elastic member provided on the upper surface of the inner table main body 21. A plurality of suction ports 23 as suction means for sucking and holding the wafer W are formed in the upper surface and the soft resin sheet 22. These suction ports 23 communicate with each other inside the inner table body 21 and are connected to a suction device (not shown).

  The outer table 3 includes a generally annular outer table main body 31, a soft resin sheet 32 that is an elastic member provided on the upper surface of the outer table main body 31, and an outer table bottom surface portion continuous to the lower portion of the outer table main body 31. 33. The outer table 3 is placed on a support table T that supports the entire support device 1 and is supported so as not to move up and down. The moving device 4 is supported on the upper surface of the outer table bottom surface portion 33.

  The moving device 4 includes a linear motion motor 41 coupled to the outer table bottom surface portion 33, and the inner table body 21 is coupled to the output shaft 42 of the linear motion motor 41, whereby the inner table 2 and the outer table 3. Can move relative to each other along the vertical direction, that is, the direction toward the wafer W. The relative movement between the inner table 2 and the outer table 3 may be configured such that at least one of the inner table 2 and the outer table 3 moves relative to the other in the vertical direction.

As shown in FIG. 3, the wafer W supported by the above support device 1 has a bump forming region R <b> 1 that is an inner peripheral portion where a plurality of bumps B are formed on the surface thereof, and an outer side of the bump forming region R <b> 1. And a bump non-formation region R2 where the bump B is not formed. And, as shown in FIG. 3 (A), when the bumps B are arranged concentrically, as shown by the phantom line (two-dot chain line) in FIG outer peripheral edge of the bump formation region R1 becomes circular As shown in FIG. 3B, when the bumps B are arranged in a grid, the outer peripheral edge of the bump formation region R1 is a polygon. Further, the bump forming region R1 has a thickness dimension larger than the bump non-forming region R2 by the protruding height of the bump B from the surface of the wafer W. The surface position of the region R1 is lower than the surface position of the bump non-formation region R2.

  In the supporting apparatus 1 that supports the wafer W, the outer peripheral shape of the inner table 2 and the inner peripheral shape of the outer table 3 are the shape of the outer peripheral edge of the bump forming region R1 (the shape of the inner peripheral edge of the bump non-forming region R2). It is supposed to be according to. That is, the inner table 2 and the outer table 3 shown in FIG. 2 are for supporting the wafer W having the bump forming region R1 whose outer peripheral edge is circular as shown in FIG. On the other hand, although not shown in the figure, when supporting the wafer W having the bump forming region R1 having a polygonal outer peripheral edge as shown in FIG. 3B, the outer peripheral shape formed in the same polygon is used. What is necessary is just to prepare the inner table 2 which has, and the outer table 3 which has an inner peripheral shape along the outer periphery of this inner table 2.

  Then, the supporting device 1 drives the moving device 4 according to the difference in surface position between the bump forming region R1 and the bump non-forming region R2, so that the upper surface of the inner table 2 is lower than the upper surface of the outer table 3. The inner table 2 is moved. In this way, by relatively moving the inner table 2 and the outer table 3, the bump formation region R1 of the wafer W comes into contact with the soft resin sheet 22 constituting the upper surface (contact surface) of the inner table 2, and the outer table. The bump non-formation region R2 is brought into contact with the soft resin sheet 32 constituting the upper surface (contact surface) 3, so that the entire lower surface side of the wafer W is supported by the support device 1.

According to this embodiment as described above, the following effects are obtained.
That is, even if the surface positions of the bump forming region R1 and the bump non-forming region R2 on the wafer W are different, the inner table 2 and the outer table 3 are moved relative to each other in accordance with the level difference to thereby move the entire wafer W. Even when the adhesive sheet such as the die attach film S is affixed by the heating roller R, it is possible to suppress the bending of the wafer W and prevent adhesion failure such as air biting.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIGS.
4 and 5 are sectional views showing a semiconductor wafer support device 1A according to the second embodiment.
The support device 1A according to the present embodiment constitutes a part of a pasting device for pasting the die attach film S in the same manner as the support device 1 according to the first embodiment, and includes two types of semiconductor wafers having different diameters. A first support (first inner table 5 and first outer table 6) and a second support (second inner table 7 and second outer) that support (small diameter wafer W1 and large wafer W2). Table 8) is different from the first embodiment.

  The support device 1 </ b> A includes a first inner table 5 that is a first inner support, a first outer table 6 that is a first outer support located outside the first inner table 5, and the first outer table 6. A second inner table 7 that is a second inner support body located outside the second inner table 7 and a second outer table 8 that is a second outer support body located outside the second inner table 7. Yes. The first inner table 5, the first outer table 6, the second inner table 7, and the second outer table 8 are respectively moved by the first moving device 9A, the second moving device 9B, the third moving device 9C, and the fourth moving device 9D. It is supported by the support table T.

The first inner table 5 includes a first inner table body 51 that is generally disk-shaped, and the second inner table 7 includes a second inner table body 71 that is generally annular. On the upper surfaces of the first inner table 5 and the second inner table 7, soft resin sheets 52 and 72, which are elastic members, and a plurality of suction ports 53 and 73 as suction means for sucking and holding the wafer W, respectively. Is provided. On the other hand, the first outer table 6 is provided with a first outer table body 61 of overall substantially circular shape and the first outer table bottom section 63, a second outer table 8, the second outer table body of the whole substantially annular 81 and a second outer table bottom surface portion 83. Soft resin sheets 62 and 82, which are elastic members, are provided on the upper surfaces of the first outer table 6 and the second outer table 8, respectively. The outer peripheral shape of the first inner table 5 and the inner peripheral shape of the first outer table 6 are formed corresponding to the shape of the outer peripheral edge of the bump forming region R1 in the small-diameter wafer W1, respectively. The outer peripheral shape of the second outer table 8 and the inner peripheral shape of the second outer table 8 are respectively formed corresponding to the shape of the outer peripheral edge of the bump forming region R1 in the wafer W2 having a large diameter.

  The first to fourth moving devices 9A, 9B, 9C, and 9D are respectively configured by linear motion motors 91, 92, 93, and 94 that are coupled to the support base T, and these linear motion motors 91, 92, 93, and 94, respectively. The first inner table body 51, the first outer table body 61, the second inner table body 71, and the second outer table body 81 are connected to 94 output shafts 95, 96, 97, 98, respectively. As a result, the first inner table 5, the first outer table 6, the second inner table 7, and the second outer table 8 are moved in the vertical direction, that is, the wafer, by the first to fourth moving devices 9A, 9B, 9C, 9D. Relative movement is possible along the direction toward W1 and W2.

  As the operation of the support device 1A, when the small-diameter wafer W1 is supported as shown in FIG. 4, first, the third and fourth moving devices 9C and 9D are driven to drive the second inner table 7 and While retracting the second outer table 8 downward, the first and second moving devices 9A and 9B are driven to raise the first inner table 5 and the first outer table 6 to the support position. At this time, the first inner table 5 and the first outer table 6 have the upper surface of the first inner table 5 having a first surface corresponding to the difference in surface position between the bump forming region R1 and the bump non-forming region R2 of the wafer W1. The movement is controlled to be lower than the upper surface of the outer table 6. By such movement control, the bump forming region R1 of the wafer W1 is brought into contact with the soft resin sheet 52 of the first inner table 5, and the bump non-forming region R2 is brought into contact with the soft resin sheet 62 of the first outer table 6. The entire lower surface side of W1 is supported by the support device 1A.

  Next, when supporting the wafer W2 having a large diameter as shown in FIG. 5, the first inner table 5 and the first outer table are driven by driving the first to fourth moving devices 9A, 9B, 9C and 9D. 6. Raise the second inner table 7 and the second outer table 8 to the support position. At this time, the first inner table 5, the first outer table 6, the second inner table 7, and the second outer table 8 are different in the surface positions of the bump forming region R1 and the non-bump forming region R2 of the wafer W2. Accordingly, the movement control is performed so that the upper surfaces of the first inner table 5, the first outer table 6, and the second inner table 7 are lower than the upper surface of the second outer table 8. That is, the support position of each table is such that the top surfaces of the first inner table 5, the first outer table 6 and the second inner table 7 are flat and only the upper surface of the second outer table 8 protrudes upward. Yes. By moving to such a support position, the bump forming region R1 of the wafer W2 comes into contact with the soft resin sheets 52, 62, 72 of the first inner table 5, the first outer table 6, and the second inner table 7, The bump non-formation region R2 comes into contact with the soft resin sheet 82 of the second outer table 8, so that the entire lower surface side of the wafer W2 is supported by the support device 1A.

According to the present embodiment as described above, the following effects can be obtained in addition to the same effects as those of the first embodiment.
That is, since two types of wafers W1 and W2 having different diameters can be supported by the single support device 1A, a plurality of support devices and separate support tables are prepared for each diameter of the wafers W1 and W2. This eliminates the need to reduce the cost of the apparatus and eliminates the time and labor required for replacing the support table.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above-described embodiment, the case where the semiconductor wafer having the bumps B formed on the inner peripheral portions (bump formation regions R1) of the wafers W, W1, and W2 is shown. Not only the semiconductor wafer having a thickness dimension different from that of the non-forming region R2, but according to the supporting device of the present invention, various semiconductor wafers can be supported. That is, as the semiconductor wafer supported by the support device of the present invention, for example, the grinding thickness between the inner peripheral portion and the outer peripheral portion, such as a semiconductor wafer having a convex portion on the outer peripheral portion described in Japanese Patent Application Laid-Open No. 2007-19379. However, it is possible to use a semiconductor wafer that is flat and has no step.
Moreover, in the said embodiment, although it intended for what comprises a part of sticking apparatus which sticks the die attach film S to the back surface of a semiconductor wafer as support apparatus 1 and 1A, not only this but this invention, It may be a single support device or may be incorporated into a device other than the sticking device.
Further, the semiconductor wafer may be a silicon wafer or a compound wafer.

  In the first embodiment, the support device 1 that supports the wafer W having a single diameter is shown. In the second embodiment, the support device 1A that supports the wafers W1 and W2 having two types of diameters is shown. However, the support device of the present invention may support a semiconductor wafer having three or more types of diameters. That is, if the third inner support body and the third outer support body that can be moved relative to each other in the same manner as the second inner and outer support bodies are provided outside the second outer table 8 in the support device 1A of the second embodiment. In addition, it is possible to correspond to three kinds of diameter dimensions, and further, a support body after the fourth support body can be provided to correspond to four or more kinds of diameter dimensions.

  In the second embodiment, the first inner table 5, the first outer table 6, the second inner table 7, and the second outer table 8 are respectively connected to the first to fourth moving devices 9A, 9B, 9C, 9D. However, the present invention is not limited to such a configuration. That is, in the present invention, the first inner table 5 and the first outer table 6 in the second embodiment can be moved relative to each other, and the second inner table 7 and the second outer table 8 can be moved relative to each other. For example, the first inner table 5 and the second inner table 7 are provided so as not to move to the same height position, and the first outer table 6 and the second outer table 8 can be moved relative to each other. The first outer table 6 and the second outer table 8 are provided so as to be immovable at the same height position. On the other hand, the first inner table 5 and the second inner table 7 Are also included in the present invention.

Sectional drawing of the support apparatus of the semiconductor wafer which concerns on 1st Embodiment. The top view of the support apparatus of FIG. (A), (B) is a top view of the semiconductor wafer which is a support object. Sectional drawing of the support apparatus of the semiconductor wafer which concerns on 2nd Embodiment. Operation | movement explanatory drawing of the support apparatus of FIG.

Explanation of symbols

1,1A Semiconductor wafer support device 2 Inner table (inner support)
3 Outer table (outer support)
5 First inner table (first inner support)
6 First outer table (first outer support)
7 Second inner table (second inner support)
8 Second outer table (second outer support)
22, 32 Soft resin sheet (elastic member)
23 Suction port (suction means)
52,62 Soft resin sheet (elastic member)
72,82 Soft resin sheet (elastic member)
53,73 Suction port (suction means)
R1 Bump formation area (inner circumference)
R2 Bump non-formation area (outer periphery)
W, W1, W2 wafer (semiconductor wafer)

Claims (5)

A semiconductor wafer support device including a support for supporting a semiconductor wafer having a thickness dimension different between an inner peripheral portion and an outer peripheral portion,
The support is an inner support having an outer peripheral shape corresponding to the shape of the outer peripheral edge of the inner peripheral portion of the semiconductor wafer, and an inner support located on the outer side of the inner support along the outer periphery of the inner support. and an outer support which have a peripheral shape, wherein the inner support and the outer support is provided to be relatively movable along a direction toward the semiconductor wafer,
By changing the relative positions of the inner support and the outer support according to the surface positions of the inner and outer peripheral portions of the semiconductor wafer, the inner support comes into contact with the inner peripheral portion. A semiconductor wafer support device, wherein the outer support is in contact with the outer peripheral portion to support the semiconductor wafer.   2. The semiconductor wafer support apparatus according to claim 1, wherein at least one of the inner support and the outer support is provided with a suction means for sucking the semiconductor wafer. A semiconductor wafer support device including a support body for supporting at least two kinds of semiconductor wafers having different thickness dimensions between an inner peripheral portion and an outer peripheral portion, and different diameter dimensions,
The support includes a single support and at least one other support positioned outside the single support .
The one support is located on the outer side of the first inner support having an outer peripheral shape corresponding to the shape of the outer peripheral edge of the inner peripheral part of the small-diameter semiconductor wafer, and the first support A first outer support having an inner peripheral shape along the outer periphery of one inner support;
The other support is located outside the first outer support, has an inner peripheral shape along the outer periphery of the first outer support, and an outer peripheral edge of the inner peripheral portion of the large-diameter semiconductor wafer. A second inner support having an outer peripheral shape corresponding to the shape of the second inner support, and a second outer support having an inner peripheral shape along the outer periphery of the second inner support, which is located outside the second inner support. With
The semiconductor wafer, characterized by being relatively movable along the direction in which the first inner support and a first outer support and a second inner support and the second outer support is directed to each of the semiconductor wafer Support device. Among the one support and at least one other support located outside the one support, either the inner support or the outer support constituting the at least one support includes The apparatus for supporting a semiconductor wafer according to claim 3, wherein suction means for sucking the semiconductor wafer is provided. The inner peripheral portion and the outer peripheral portion and an inner support having a peripheral shape corresponding to the shape of the outer peripheral edge of the abut against the inner peripheral portion of the semiconductor wafer the inner peripheral portion thickness is different, the outside of the inner support position, and a support method of a semiconductor wafer for supporting the semiconductor wafer using an apparatus comprising an outer support which have a peripheral shape among along the outer periphery of the inner support,
According to each surface position of the inner peripheral portion and the outer peripheral portion in the semiconductor wafer, the relative position between the inner support and the outer support is changed,
A method of supporting a semiconductor wafer, wherein the inner support is brought into contact with an inner periphery of the semiconductor wafer, and the outer support is brought into contact with an outer periphery of the semiconductor wafer to support the semiconductor wafer. .

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