JP2018181987A5 - - Google Patents

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Publication number
JP2018181987A5
JP2018181987A5 JP2017077271A JP2017077271A JP2018181987A5 JP 2018181987 A5 JP2018181987 A5 JP 2018181987A5 JP 2017077271 A JP2017077271 A JP 2017077271A JP 2017077271 A JP2017077271 A JP 2017077271A JP 2018181987 A5 JP2018181987 A5 JP 2018181987A5
Authority
JP
Japan
Prior art keywords
wiring board
layer
multilayer wiring
board according
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017077271A
Other languages
English (en)
Japanese (ja)
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JP2018181987A (ja
JP6859165B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017077271A priority Critical patent/JP6859165B2/ja
Priority claimed from JP2017077271A external-priority patent/JP6859165B2/ja
Priority to US15/944,626 priority patent/US10237973B2/en
Publication of JP2018181987A publication Critical patent/JP2018181987A/ja
Publication of JP2018181987A5 publication Critical patent/JP2018181987A5/ja
Application granted granted Critical
Publication of JP6859165B2 publication Critical patent/JP6859165B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017077271A 2017-04-10 2017-04-10 多層配線基板 Active JP6859165B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017077271A JP6859165B2 (ja) 2017-04-10 2017-04-10 多層配線基板
US15/944,626 US10237973B2 (en) 2017-04-10 2018-04-03 Multilayer wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017077271A JP6859165B2 (ja) 2017-04-10 2017-04-10 多層配線基板

Publications (3)

Publication Number Publication Date
JP2018181987A JP2018181987A (ja) 2018-11-15
JP2018181987A5 true JP2018181987A5 (enExample) 2020-04-30
JP6859165B2 JP6859165B2 (ja) 2021-04-14

Family

ID=63710042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017077271A Active JP6859165B2 (ja) 2017-04-10 2017-04-10 多層配線基板

Country Status (2)

Country Link
US (1) US10237973B2 (enExample)
JP (1) JP6859165B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020067303A1 (ja) 2018-09-27 2021-08-30 住友重機械工業株式会社 ショベル、情報処理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
JPS636892A (ja) * 1986-06-27 1988-01-12 大倉電気株式会社 プリント配線板間の高周波接続方法
US6388198B1 (en) * 1999-03-09 2002-05-14 International Business Machines Corporation Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
JP2004265970A (ja) * 2003-02-28 2004-09-24 Ngk Spark Plug Co Ltd 配線基板
JP3905546B2 (ja) * 2003-06-09 2007-04-18 富士通株式会社 プリント基板およびプリント基板ユニット
JP4259311B2 (ja) 2003-12-19 2009-04-30 株式会社日立製作所 多層配線基板
JP2008066487A (ja) * 2006-09-06 2008-03-21 Toppan Printing Co Ltd 半導体素子搭載用基板
JP2008177422A (ja) * 2007-01-19 2008-07-31 Toshiba Corp プリント回路板及び電子機器
US20100108369A1 (en) * 2008-10-31 2010-05-06 Alexander Tom Printed Circuit Boards, Printed Circuit Board Capacitors, Electronic Filters, Capacitor Forming Methods, and Articles of Manufacture
US8035466B2 (en) * 2009-01-12 2011-10-11 Kenneth Ray Payne High frequency electrical connector
JP2017011094A (ja) * 2015-06-22 2017-01-12 イビデン株式会社 プリント配線板

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