JP2018167246A - Processing method for printed circuit board with component, and recovery method for valuable metal from printed circuit board with component - Google Patents
Processing method for printed circuit board with component, and recovery method for valuable metal from printed circuit board with component Download PDFInfo
- Publication number
- JP2018167246A JP2018167246A JP2017069180A JP2017069180A JP2018167246A JP 2018167246 A JP2018167246 A JP 2018167246A JP 2017069180 A JP2017069180 A JP 2017069180A JP 2017069180 A JP2017069180 A JP 2017069180A JP 2018167246 A JP2018167246 A JP 2018167246A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- components
- component
- sieve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 238000003672 processing method Methods 0.000 title claims abstract description 7
- 238000011084 recovery Methods 0.000 title abstract description 13
- 239000000696 magnetic material Substances 0.000 claims abstract description 17
- 239000002699 waste material Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 16
- 238000007873 sieving Methods 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 150000002739 metals Chemical class 0.000 claims description 12
- 238000010298 pulverizing process Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 239000012254 powdered material Substances 0.000 claims description 2
- 238000012216 screening Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007885 magnetic separation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011090 solid board Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
本発明は、部品付プリント基板の処理方法及び部品付プリント基板からの有価金属の回収方法に関する。 The present invention relates to a method for processing a printed circuit board with components and a method for recovering valuable metals from the printed circuit board with components.
プリント基板、部品を搭載したプリント基板、及びこれらの製造工程で発生する成形残から銅滓などの有価金属を回収する方法が提案されている。 Methods have been proposed for recovering valuable metals such as copper troughs from printed circuit boards, printed circuit boards on which components are mounted, and molding residues generated in these manufacturing processes.
例えば、特許文献１には、処理対象物を粗粉砕し、続けて圧縮力やせん断力などの外力を加えて微粉砕し、微粉砕物を金属分などの比重の大きな物質を多く含む部分及び樹脂などの比重の小さな物質を多く含む部分の比重差を使用して分離し、さらに導電体を多く含む部分と、絶縁体を多く含む部分とに静電分離することにより、有価金属を回収する方法が開示されている。 For example, Patent Document 1 discloses that a processing object is roughly pulverized, and then finely pulverized by applying an external force such as a compressive force or a shearing force. Separation is performed using the specific gravity difference of a part containing a large amount of a material having a small specific gravity such as a resin, and further valuable metal is recovered by electrostatic separation into a part containing a large amount of conductor and a part containing a large amount of an insulator. A method is disclosed.
プリント基板から有価金属を回収するためには、まず、電子部品等が実装されていないプリント基板を回収する。電子部品等が実装されていないプリント基板としては、例えば、電子部品を実装する前のプリント基板、電子部品が実装された回路基板の製造工程において、打ち抜きにより発生するプリント基板の成形残、及び切断により発生するプリント基板の切れ端等があげられる。しかしながら、これらの量は、例えばＯＡ機器や家電製品等の解体時に回収される、電子部品が実装されたプリント基板（以後、部品付プリント基板と呼ぶ）の量と比較して少ないため、部品付プリント基板から、電子部品等が実装されていないプリント基板をできるだけ多く回収することが望ましい。 In order to collect valuable metals from the printed circuit board, first, a printed circuit board on which electronic components or the like are not mounted is collected. As a printed circuit board on which electronic components or the like are not mounted, for example, a printed circuit board before electronic components are mounted, a printed circuit board formed by punching in a manufacturing process of a circuit board on which electronic components are mounted, and cutting For example, a piece of a printed circuit board generated by the above. However, these amounts are small compared to the amount of printed circuit boards on which electronic components are mounted (hereinafter referred to as printed circuit boards with components), which are collected at the time of dismantling of OA equipment, home appliances, etc. It is desirable to collect as many printed circuit boards on which no electronic components or the like are mounted as possible from the printed circuit boards.
本発明は上記の課題に鑑み、部品付プリント基板からのプリント基板屑の回収効率を向上させる部品付プリント基板の処理方法と、部品付プリント基板からの有価金属の回収効率を向上させる部品付プリント基板からの有価金属の回収方法と、を提供することを目的とする。 In view of the above problems, the present invention is directed to a method for processing a printed circuit board with a component that improves the recovery efficiency of printed circuit board waste from a printed circuit board with a component, and a print with a component that improves the recovery efficiency of valuable metals from the printed circuit board with a component. It is an object of the present invention to provide a method for recovering valuable metals from a substrate.
本発明に係る部品付プリント基板の処理方法は、部品付プリント基板を衝撃式回転破砕機により破砕する工程と、前記破砕した物を磁性物と非磁性物とに磁力選別する工程と、前記非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別し、篩上物をプリント基板屑として得る工程と、を有することを特徴とする。 The method of processing a printed circuit board with components according to the present invention includes a step of crushing a printed circuit board with components using an impact rotary crusher, a step of magnetically sorting the crushed material into a magnetic material and a non-magnetic material, Screening the magnetic material with a sieve having an opening of 10 mm to 20 mm and obtaining the material on the sieve as printed circuit board waste.
この場合において、部品付プリント基板の処理方法は、前記非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別して得られる篩下物を、目開き５ｍｍ〜１０ｍｍ篩で篩別する工程と、篩上物を破砕機により部品と基板とに分離することにより、プリント基板屑を得る工程と、を有していてもよい。 In this case, the processing method of the printed circuit board with components includes a step of sieving the non-magnetic material with a sieve having an opening of 10 mm to 20 mm and a sieve with an opening of 5 mm to 10 mm. And separating a product into components and a substrate by a crusher to obtain printed circuit board waste.
また、部品付プリント基板の処理方法は、前記プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕する工程と、前記プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、を有していてもよい。 Also, the processing method of the printed circuit board with components includes a step of pulverizing the printed circuit board waste in one or two stages with an impact pulverizer, and a pulverized product after pulverizing the printed circuit board waste with a final pulverizer. And a step of forming a powder product having an average particle size (D50) of 200 μm to 360 μm.
この場合において、前記衝撃式粉砕機はハンマーミルであってもよい。また、前記ハンマーミルのスクリーン径が３ｍｍ以上５ｍｍ以下であってもよい。 In this case, the impact pulverizer may be a hammer mill. The screen diameter of the hammer mill may be 3 mm or more and 5 mm or less.
また、前記最終粉砕機が衝撃式粉砕機であってもよい。この場合、前記衝撃式粉砕機はハンマーミル又は高速ハンマーミルであってもよい。 The final pulverizer may be an impact pulverizer. In this case, the impact pulverizer may be a hammer mill or a high-speed hammer mill.
本発明に係る部品付プリント基板からの有価金属の回収方法は、上記部品付プリント基板の処理方法によりプリント基板屑を得る工程と、前記プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕する工程と、前記プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、前記粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、前記粉体物から有価金属を回収する工程と、を有することを特徴とする。 A method for recovering valuable metals from a printed circuit board with components according to the present invention includes a step of obtaining printed circuit board waste by the method for processing a printed circuit board with components, and the printed circuit board waste in one or two stages using an impact pulverizer. A step of pulverizing, a step of pulverizing the pulverized product after pulverizing the printed circuit board waste with a final pulverizer to form a powdered product having an average particle size (D50) of 200 μm to 360 μm, and And a step of separating the powdery material containing the valuable metal as a main component by the sorter and the other and collecting the valuable metal from the powdered material.
この場合、前記有価金属は銅滓であってもよい。また、部品付プリント基板からの有価金属の回収方法は、前記風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収する工程を有していてもよい。 In this case, the valuable metal may be copper. In addition, the method for recovering valuable metals from the printed circuit board with components may include a step of recovering, with a bag filter, a powdery material whose main component is a resin component classified by the wind power sorter.
本発明に係る部品付プリント基板の処理方法によれば、部品付プリント基板からのプリント基板屑の回収効率を向上させることができる。また、本発明に係る部品付プリント基板からの有価金属の回収方法によれば、部品付プリント基板からの有価金属の回収効率を向上させることができる。 According to the method for processing a printed circuit board with components according to the present invention, the efficiency of collecting printed circuit board waste from the printed circuit board with components can be improved. Further, according to the method for recovering valuable metals from the printed circuit board with components according to the present invention, the recovery efficiency of valuable metals from the printed circuit board with components can be improved.
図１は、部品付プリント基板の処理工程を表す工程図である。図１で例示するように、出発原料は部品付プリント基板である。 FIG. 1 is a process diagram showing a process of a printed circuit board with components. As illustrated in FIG. 1, the starting material is a printed circuit board with components.
（破砕）
破砕工程では、衝撃式回転破砕機により、部品付プリント基板を破砕する。衝撃式回転破砕機は、例えば、ケーシング中央部で高速回転しているローターの外周に取り付けられたハンマーにより、処理対象物を打撃して破砕する破砕機である。
(Crushing)
In the crushing process, the printed circuit board with components is crushed by an impact rotary crusher. The impact-type rotary crusher is a crusher that hits and crushes a processing object with a hammer attached to the outer periphery of a rotor that rotates at a high speed in the center of the casing.
（磁力選別）
磁力選別では、上記破砕工程で破砕した物を、磁性物と非磁性物とに磁力選別する。これにより、磁性物としてＦｅ濃縮物が得られる。
(Magnetic sorting)
In the magnetic separation, the material crushed in the crushing step is magnetically sorted into a magnetic material and a non-magnetic material. Thereby, Fe concentrate is obtained as a magnetic substance.
（１次篩別）
１次篩別では、上記磁力選別で得られた非磁性物を、例えば、目開き１０ｍｍ〜２０ｍｍ（例えば、２０ｍｍ）の篩で篩別し、篩上物をプリント基板屑として得る。なお、１次篩別の篩上物として得られるプリント基板屑は、サイズが目開き（例えば、２０ｍｍ）よりも大きい、電子部品等が実装されていないプリント基板である。
(Primary sieving)
In the primary sieving, the non-magnetic material obtained by the above magnetic separation is screened, for example, with a sieve having an opening of 10 mm to 20 mm (for example, 20 mm), and the material on the sieve is obtained as printed circuit board waste. In addition, the printed circuit board waste obtained as a sieve product according to the primary sieve is a printed circuit board on which an electronic component or the like is not mounted, whose size is larger than an opening (for example, 20 mm).
（２次篩別）
２次篩別では、１次篩別で得られた篩下物を、目開き５ｍｍ〜１０ｍｍ（例えば、１０ｍｍ）の篩で篩別する。２次篩別の篩上物は、プリント基板と部品との混合品（以後、基板屑・部品混合品と呼ぶ。）であり、篩下物は、部品の濃縮物である。
(Secondary sieving)
In the secondary sieving, the sieving material obtained by the primary sieving is sieved with a sieve having an opening of 5 mm to 10 mm (for example, 10 mm). The sieve top product by secondary sieving is a mixed product of a printed circuit board and components (hereinafter referred to as a substrate scrap / component mixed product), and the sieving product is a concentrate of components.
なお、２次篩別の篩上物（基板屑・部品混合品）を破砕機により部品とプリント基板屑とに分離し、電子部品等が実装されないプリント基板屑を得てもよい。このとき得られるプリント基板屑は、１次篩別で使用する篩の目開きが２０ｍｍであり２次篩別で使用する篩の目開きが１０ｍｍの場合、サイズが１０ｍｍより大きく２０ｍｍ以下のプリント基板であるが、１次篩別で得られたサイズが２０ｍｍよりも大きい、電子部品等が実装されていないプリント基板と一緒に処理してもよい。 In addition, you may obtain the printed-circuit board waste in which an electronic component etc. are not mounted by isolate | separating a sieve top thing (substrate waste-components mixed goods) by secondary crushing into a component and printed-circuit board waste with a crusher. The printed circuit board waste obtained at this time is a printed circuit board having a size larger than 10 mm but not larger than 20 mm when the sieve opening used in the primary sieving is 20 mm and the sieve opening used in the secondary sieving is 10 mm. However, the size obtained by primary sieving may be larger than 20 mm, and may be processed together with a printed circuit board on which electronic components or the like are not mounted.
次に、図１の部品付プリント基板の処理工程により得られたプリント基板屑の処理工程について説明する。図２は、プリント基板屑の処理工程を表す工程図である。図２で例示するように、出発原料はプリント基板屑である。 Next, the process of processing the printed circuit board waste obtained by the process of the printed circuit board with components of FIG. 1 will be described. FIG. 2 is a process diagram illustrating a process of processing printed circuit board waste. As illustrated in FIG. 2, the starting material is printed circuit board waste.
（予備破砕）
予備破砕では、例えば、スクリーン径５０ｍｍの一軸破砕機を用いて、プリント基板屑を１次破砕で使用する衝撃式粉砕機に投入可能なサイズ（例えば、縦及び横の長さが５０ｍｍ以下）にする。なお、予備破砕を行わなくてもよい。例えば、プリント基板屑のうち、そのサイズが既に１次破砕で使用する衝撃式粉砕機に投入可能なサイズとなっているものについては、予備破砕を行わなくてもよい。
(Preliminary crushing)
In preliminary crushing, for example, using a uniaxial crusher with a screen diameter of 50 mm, the size can be put into an impact crusher that uses printed board scraps for primary crushing (for example, the vertical and horizontal lengths are 50 mm or less). To do. Note that preliminary crushing may not be performed. For example, it is not necessary to preliminarily crush printed circuit board waste that has a size that can be put into an impact crusher used for primary crushing.
（１次破砕）
１次破砕では、予備破砕により破砕されたプリント基板屑を、例えば、スクリーン径１３〜１７ｍｍの衝撃式粉砕機を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。また、１次破砕を省略してもよい。
(Primary crushing)
In the primary crushing, the printed circuit board waste crushed by the preliminary crushing is pulverized using, for example, an impact pulverizer having a screen diameter of 13 to 17 mm. The impact pulverizer is preferably a hammer mill. Further, primary crushing may be omitted.
（２次破砕）
２次破砕では、１次破砕で粉砕したプリント基板屑を、例えば、スクリーン径３〜５ｍｍの衝撃式粉砕機を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。
(Secondary crushing)
In the secondary crushing, the printed circuit board crushed by the primary crushing is pulverized using, for example, an impact pulverizer having a screen diameter of 3 to 5 mm. The impact pulverizer is preferably a hammer mill.
（３次破砕）
３次破砕では、最終粉砕機を用いて、２次破砕により得られた粉砕物を粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする。最終粉砕機は、衝撃粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミルであることがより好ましい。なお、高速ハンマーミルは、周速１００ｍ／ｓ以上のハンマーミルである。この場合、例えばスクリーン径１．５ｍｍ以下、より好ましくは１ｍｍ以下のスクリーン、又は気流分級により平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物を得ることができる。なお、スクリーン径の下限については特には限定されないが、０．３ｍｍ以上、好ましくは０．５ｍｍ以上とすることができる。
(3rd crushing)
In the tertiary crushing, the pulverized product obtained by the secondary crushing is pulverized by using a final pulverizer to obtain a powder product having an average particle diameter (D50) of 200 μm to 360 μm. The final pulverizer is preferably an impact pulverizer, and more preferably a hammer mill or a high-speed hammer mill. The high-speed hammer mill is a hammer mill having a peripheral speed of 100 m / s or more. In this case, for example, a screen having a screen diameter of 1.5 mm or less, more preferably 1 mm or less, or a powder product having an average particle diameter (D50) of 200 μm to 360 μm can be obtained by air classification. The lower limit of the screen diameter is not particularly limited, but can be 0.3 mm or more, preferably 0.5 mm or more.
（分離工程）
分離工程では、粉体物を、風力選別機により銅滓とそれ以外とに分離し、銅滓を回収する。風力選別機は、二種類以上の成分をそれらの比重差に基づいて分離するもので、バリアブルインパクタ、サイクロン、分級ローター付遠心力型風力分級機等が挙げられる。
(Separation process)
In the separation step, the powder material is separated into a copper slag and the other by a wind sorter, and the copper slag is collected. The wind sorter separates two or more types of components based on the difference in specific gravity between them, and examples thereof include a variable impactor, a cyclone, and a centrifugal wind classifier with a classification rotor.
（回収工程）
回収工程では、分離工程において排出された樹脂を含む成分から、バグフィルタなどの集塵装置を用いて樹脂を分離、回収する。このようにして得られた樹脂は、産業廃棄物の焼却炉等で処理又は、粉体バーナ技術を用いて燃料代替とすることができる。
(Recovery process)
In the recovery process, the resin is separated and recovered from the component containing the resin discharged in the separation process using a dust collector such as a bag filter. The resin thus obtained can be treated in an industrial waste incinerator or the like, or can be used as a fuel substitute using powder burner technology.
本実施形態によれば、部品付プリント基板を衝撃式回転破砕機により破砕し、破砕した物を磁性物と非磁性物とに磁力選別し、非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別し、篩上物をプリント基板屑として得ることで、部品付プリント基板からのプリント基板屑の回収効率を向上させることができる。この場合、非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別して得られる篩下物を、目開き５ｍｍ〜１０ｍｍ篩で篩別し、篩上物を破砕機により部品と基板とに分離することにより、プリント基板屑を得ることが好ましい。これにより、部品付プリント基板からのプリント基板屑の回収効率をさらに向上させることができる。 According to this embodiment, the printed circuit board with components is crushed by an impact rotary crusher, the crushed material is magnetically sorted into a magnetic material and a non-magnetic material, and the non-magnetic material is sieved with a sieve having an opening of 10 mm to 20 mm. Separately, by obtaining the sieve top as printed circuit board waste, it is possible to improve the recovery efficiency of the printed circuit board waste from the printed circuit board with components. In this case, sieving material obtained by sieving the non-magnetic material with a sieve having an opening of 10 mm to 20 mm is sieved with a sieve having an opening of 5 mm to 10 mm, and the material on the sieve is separated into a component and a substrate by a crusher. Thus, it is preferable to obtain printed circuit board waste. Thereby, the collection efficiency of printed circuit board waste from the printed circuit board with components can be further improved.
また、本実施形態によれば、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にすることで、有価金属と基板層とを十分に剥離することができる。これにより、基板層に付着したままの有価金属の量が低減されるので、有価金属の回収効率を向上させることができる。なお、衝撃式粉砕機はハンマーミルであることが好ましい。この場合、ハンマーミルのスクリーン径が３ｍｍ以上５ｍｍ以下であることが好ましい。また、最終粉砕機は衝撃式粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミル（周速１００ｍ／ｓ以上のハンマーミル）であることがより好ましい。 Further, according to the present embodiment, the printed circuit board waste is pulverized in one or two stages by an impact pulverizer, and the pulverized product after pulverizing the printed circuit board waste is pulverized by the final pulverizer to obtain an average particle diameter (D50 ) Can be sufficiently separated from the valuable metal and the substrate layer. As a result, the amount of valuable metal remaining attached to the substrate layer is reduced, so that the recovery efficiency of valuable metal can be improved. The impact pulverizer is preferably a hammer mill. In this case, the screen diameter of the hammer mill is preferably 3 mm or more and 5 mm or less. The final pulverizer is preferably an impact pulverizer, more preferably a hammer mill or a high-speed hammer mill (a hammer mill having a peripheral speed of 100 m / s or more).
また、本実施形態によれば、上記部品付プリント基板の処理方法によりプリント基板屑を得て、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により平均粒径（Ｄ５０）が２００μｍ〜３６０μｍとなるよう粉砕し、最終粉砕機による粉砕によって得られた粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、有価金属を回収することで、有価金属の回収効率を向上させることができる。なお、有価金属は銅滓であることが好ましい。 Moreover, according to this embodiment, after obtaining printed circuit board waste by the above-described method for processing a printed circuit board with components, the printed circuit board waste is pulverized in one or two stages by an impact pulverizer, and the printed circuit board waste is crushed. The pulverized product was pulverized by a final pulverizer so that the average particle size (D50) was 200 μm to 360 μm, and the powder obtained by pulverization by the final pulverizer was converted into a powder containing valuable metals as main components by an air sorter. The recovery efficiency of valuable metals can be improved by separating valuables and separating them into a state and other parts. In addition, it is preferable that a valuable metal is a copper cocoon.
また、本実施形態によれば、風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収することで、樹脂分を効率よく回収することができる。 In addition, according to the present embodiment, the resin content can be efficiently recovered by recovering the powdery material mainly composed of the resin content classified by the wind power sorter with the bag filter.
以下、本発明の実施例を示すが、本発明は実施例に限定されるものではない。 Examples of the present invention will be described below, but the present invention is not limited to the examples.
（実施例１）
部品付プリント基板を原料とし、図１に示す処理を行ったところ、部品付プリント基板１０６．８ｋｇに対して、１次篩別の篩上物としてプリント基板屑３０．２ｋｇを得た。これは、部品付プリント基板の重量の２８．３％に当たり、図１に示す処理により、部品付プリント基板からのプリント基板屑の回収効率を向上できることが確認できた。また、２次篩別の篩上物として、プリント基板と部品との混合品１９．５ｋｇを得た。これは、部品付プリント基板の重量の１８．３％に当たり、当該混合品を破砕し、プリント基板と部品とに分離することにより、部品付プリント基板からのプリント基板屑の回収効率をさらに向上できることが確認できた。
Example 1
When the process shown in FIG. 1 was performed using the printed circuit board with components as a raw material, 30.2 kg of printed circuit board waste was obtained as a sieved product for each primary sieve with respect to 106.8 kg of the printed circuit board with components. This corresponds to 28.3% of the weight of the printed circuit board with components, and it was confirmed that the efficiency of collecting printed circuit board waste from the printed circuit board with components can be improved by the process shown in FIG. Moreover, 19.5 kg of a mixed product of a printed circuit board and parts was obtained as a sieved product separated from the secondary sieve. This is 18.3% of the weight of the printed circuit board with components. By crushing the mixed product and separating it into a printed circuit board and components, the efficiency of collecting printed circuit board waste from the printed circuit board with components can be further improved. Was confirmed.
（実施例２〜７）
表１に示した電子部品が実装されていないプリント基板を原料とし、それぞれ示された条件によりプリント基板の粉砕処理を行った。表２に、得られた粉体物の平均粒径（Ｄ５０）を示す。なお、表中、ベタ基板とは、電子部品を実装する前のプリント基板であり、枠基板とは、電子部品が実装された回路基板の製造工程において、打ち抜きにより発生するプリント基板の成形残である。また、長尺基板とは、電子部品が実装された回路基板の製造工程において、切断により発生するプリント基板の切れ端である。比較のため、長尺基板を原料とし、予備破砕を行わず、１次破砕及び２次破砕をせん断式の破砕機で行った。しかしながら、比較例では、２次破砕の終了時点において、目視の状態でも十分な粉砕物を得ることが出来ず、また、有価金属と基板層とが十分に剥離できていなかったため、２次破砕の終了時点で粉砕を中止した。
(Examples 2 to 7)
A printed circuit board on which electronic components shown in Table 1 were not mounted was used as a raw material, and the printed circuit board was pulverized under the conditions indicated. Table 2 shows the average particle diameter (D50) of the obtained powder. In the table, a solid board is a printed board before electronic components are mounted, and a frame board is a printed circuit board molding residue generated by punching in the manufacturing process of a circuit board on which electronic components are mounted. is there. In addition, the long substrate is a piece of a printed circuit board that is generated by cutting in a manufacturing process of a circuit board on which electronic components are mounted. For comparison, a long substrate was used as a raw material, and primary crushing and secondary crushing were performed with a shearing type crusher without preliminary crushing. However, in the comparative example, at the end of the secondary crushing, a sufficient pulverized product could not be obtained even visually, and the valuable metal and the substrate layer were not sufficiently peeled off. Grinding was stopped at the end.
表２に示すように、実施例２〜７において、得られた粉体物の平均粒径（Ｄ５０）は、２００〜３６０μｍとなり、プリント基板屑を粉状に粉砕することができた。また、目視にて、プリント基板屑が良好に粉砕され、かつ、有価金属と基板層とが十分に剥離されていることが確認された。 As shown in Table 2, in Examples 2 to 7, the average particle diameter (D50) of the obtained powder was 200 to 360 μm, and the printed circuit board waste could be pulverized into powder. Moreover, it was confirmed by visual observation that the printed circuit board waste was pulverized well and that the valuable metal and the substrate layer were sufficiently separated.
風力選別機を用いて、上記の粉砕処理により得られた粉体物から銅滓及び樹脂の回収を行った。なお、粉体物に含まれる銅品位、銅量はＩＣＰ法にて測定して評価した。 Using a wind power sorter, copper slag and resin were collected from the powder obtained by the above pulverization treatment. Note that the copper quality and the amount of copper contained in the powder were measured and evaluated by the ICP method.
実施例２から実施例７で得られた合計の粉体物１８４ｋｇには、５０ｋｇのＣｕが含まれていたが、５６ｋｇの銅滓と１２８ｋｇの樹脂に分離された。
回収された樹脂成分の銅品位は５％未満であり、銅滓と樹脂とを有効に分離でき、また、高い回収率で銅滓成分が得られることが明らかとなった。
The total amount of powder 184 kg obtained in Example 2 to Example 7 contained 50 kg of Cu, but was separated into 56 kg of copper soot and 128 kg of resin.
The copper grade of the recovered resin component was less than 5%, and it was revealed that the copper cocoon and the resin can be effectively separated, and that the copper cocoon component can be obtained with a high recovery rate.
以上、本発明の実施例について詳述したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.
Claims (10)
前記破砕した物を磁性物と非磁性物とに磁力選別する工程と、
前記非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別し、篩上物をプリント基板屑として得る工程と、
を有することを特徴とする部品付プリント基板の処理方法。 Crushing the printed circuit board with components with an impact rotary crusher;
Magnetically sorting the crushed material into a magnetic material and a non-magnetic material;
Screening the non-magnetic material with a sieve having an opening of 10 mm to 20 mm, and obtaining the material on the sieve as printed circuit board waste;
A method for processing a printed circuit board with components, comprising:
篩上物を破砕機により部品と基板とに分離することにより、プリント基板屑を得る工程と、
を有することを特徴とする請求項１に記載の部品付プリント基板の処理方法。 A step of sieving the non-magnetic material with a sieve having an opening of 10 mm to 20 mm, and a sieve with an opening of 5 mm to 10 mm.
A step of obtaining printed circuit board waste by separating the material on the sieve into a component and a substrate by a crusher;
The processing method of the printed circuit board with components of Claim 1 characterized by the above-mentioned.
前記プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、
を有することを特徴とする請求項１又は２に記載の部品付プリント基板の処理方法。 Crushing the printed circuit board waste in one or two stages with an impact crusher;
Pulverizing the pulverized product after pulverizing the printed circuit board waste with a final pulverizer to obtain a powder product having an average particle size (D50) of 200 μm to 360 μm;
The processing method of the printed circuit board with components of Claim 1 or 2 characterized by the above-mentioned.
前記プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕する工程と、
前記プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、
前記粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、前記粉体物から有価金属を回収する工程と、
を有することを特徴とする部品付プリント基板からの有価金属の回収方法。 A step of obtaining printed circuit board scraps by the method of processing a printed circuit board with components according to claim 1 or 2,
Crushing the printed circuit board waste in one or two stages with an impact crusher;
Pulverizing the pulverized product after pulverizing the printed circuit board waste with a final pulverizer to obtain a powder product having an average particle size (D50) of 200 μm to 360 μm;
Separating the powdered material into a powdery material having a valuable metal as a main component by a wind power sorter and the rest, and recovering the valuable metal from the powder;
A method for recovering valuable metals from a printed circuit board with components, comprising:
It has the process of collect | recovering the powdery material which has the resin component classified by the said wind power sorter as a main component with a bag filter, The valuable metal from the printed circuit board with components of Claim 8 or 9 characterized by the above-mentioned. Collection method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017069180A JP6846972B2 (en) | 2017-03-30 | 2017-03-30 | How to process printed circuit boards with parts and how to recover valuable metals from printed circuit boards with parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017069180A JP6846972B2 (en) | 2017-03-30 | 2017-03-30 | How to process printed circuit boards with parts and how to recover valuable metals from printed circuit boards with parts |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020218148A Division JP2021045755A (en) | 2020-12-28 | 2020-12-28 | Method for processing printed circuit board with components and method for recovering valuable metals from printed circuit boards with components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018167246A true JP2018167246A (en) | 2018-11-01 |
| JP6846972B2 JP6846972B2 (en) | 2021-03-24 |
Family
ID=64017589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017069180A Active JP6846972B2 (en) | 2017-03-30 | 2017-03-30 | How to process printed circuit boards with parts and how to recover valuable metals from printed circuit boards with parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6846972B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020163353A (en) * | 2019-03-29 | 2020-10-08 | Ｊｘ金属株式会社 | Processing method of electronic/electrical apparatus component scrap |
| US20220062962A1 (en) * | 2019-02-28 | 2022-03-03 | Mitsubishi Materials Corporation | Method for treating waste electronic substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07251154A (en) * | 1994-03-14 | 1995-10-03 | Nec Corp | Method for recovering valuables from printed circuit board |
| JP2001009435A (en) * | 1999-06-30 | 2001-01-16 | Hitachi Ltd | Method and device for treating waste |
| JP2002153856A (en) * | 2000-11-20 | 2002-05-28 | Matsushita Electric Ind Co Ltd | Automatic separator for recycling printed board |
| WO2012131906A1 (en) * | 2011-03-29 | 2012-10-04 | 日本磁力選鉱株式会社 | Method for reclaiming valuable metal from waste electronic devices |
-
2017
- 2017-03-30 JP JP2017069180A patent/JP6846972B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07251154A (en) * | 1994-03-14 | 1995-10-03 | Nec Corp | Method for recovering valuables from printed circuit board |
| JP2001009435A (en) * | 1999-06-30 | 2001-01-16 | Hitachi Ltd | Method and device for treating waste |
| JP2002153856A (en) * | 2000-11-20 | 2002-05-28 | Matsushita Electric Ind Co Ltd | Automatic separator for recycling printed board |
| WO2012131906A1 (en) * | 2011-03-29 | 2012-10-04 | 日本磁力選鉱株式会社 | Method for reclaiming valuable metal from waste electronic devices |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220062962A1 (en) * | 2019-02-28 | 2022-03-03 | Mitsubishi Materials Corporation | Method for treating waste electronic substrate |
| JP2020163353A (en) * | 2019-03-29 | 2020-10-08 | Ｊｘ金属株式会社 | Processing method of electronic/electrical apparatus component scrap |
| WO2020203918A1 (en) * | 2019-03-29 | 2020-10-08 | Ｊｘ金属株式会社 | Method for processing electronic/electrical device component scraps |
| CN113631284A (en) * | 2019-03-29 | 2021-11-09 | 捷客斯金属株式会社 | Method for processing electronic/electric equipment component scraps |
| JP7076397B2 (en) | 2019-03-29 | 2022-05-27 | Ｊｘ金属株式会社 | How to dispose of scraps of electronic and electrical equipment parts |
| TWI767196B (en) * | 2019-03-29 | 2022-06-11 | 日商Ｊｘ金屬股份有限公司 | Disposal method of electronic and electrical machine parts scraps |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6846972B2 (en) | 2021-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Zhang et al. | Intelligent liberation and classification of electronic scrap | |
| JP7227287B2 (en) | Method and apparatus for recovering valuable metals from printed circuit board waste | |
| KR101574691B1 (en) | Fluff rdf manufacturing method using combustible waste | |
| JP2016089196A (en) | Valuable metal recovery method and valuable metal recovery system | |
| JP6846972B2 (en) | How to process printed circuit boards with parts and how to recover valuable metals from printed circuit boards with parts | |
| JP2019037944A (en) | Printed circuit board scrap crushing device and printed circuit board scrap crushing method | |
| JP6676000B2 (en) | Method for grinding printed circuit board waste and method for recovering valuable metal from printed circuit board waste | |
| JP2000005702A (en) | Method and device for recovering metal from solid waste | |
| JP2018079459A (en) | Processing method of electronic/electrical equipment component scrap | |
| JPH1057927A (en) | Method for treating compound waste | |
| JP6817127B2 (en) | How to treat shredder dust | |
| EP3325166B1 (en) | System and method for recovering desired materials and producing clean aggregate from incinerator ash | |
| JPH05329841A (en) | Method for recovering valuables from printed circuit board | |
| CN209735768U (en) | Recycling system of waste circuit board | |
| JP2021045755A (en) | Method for processing printed circuit board with components and method for recovering valuable metals from printed circuit boards with components | |
| JPH06228667A (en) | Method for separating and recovering valuables from printed board | |
| CN109675907A (en) | A kind of blast furnace metallurgical solid waste comprehensive management of technology | |
| JPH0760227A (en) | Recovery of valuables from printed circuit board | |
| JP2019025395A (en) | Valuable metal recovery method and recovery system | |
| WO2018198042A1 (en) | Process and device for recovering metal | |
| JP6271392B2 (en) | Method for recovering valuable metals from abrasive scraps | |
| JP6938414B2 (en) | How to dispose of parts waste | |
| JP7307105B2 (en) | Crushing device for printed circuit board waste | |
| JP7406407B2 (en) | Manufacturing method of chromium-reduced cement raw material | |
| JP4907284B2 (en) | Method for processing ferrous waste materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190927 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200630 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200714 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200904 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200929 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201228 |
|
| C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20201228 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20210106 |
|
| C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20210112 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210202 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210302 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6846972 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |