JPH06228667A - Method for separating and recovering valuables from printed board - Google Patents

Method for separating and recovering valuables from printed board

Info

Publication number
JPH06228667A
JPH06228667A JP24097293A JP24097293A JPH06228667A JP H06228667 A JPH06228667 A JP H06228667A JP 24097293 A JP24097293 A JP 24097293A JP 24097293 A JP24097293 A JP 24097293A JP H06228667 A JPH06228667 A JP H06228667A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
crushed
copper
separating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24097293A
Other languages
Japanese (ja)
Inventor
Sadahiko Yokoyama
貞彦 横山
Masatoshi Ichi
正年 位地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24097293A priority Critical patent/JPH06228667A/en
Publication of JPH06228667A publication Critical patent/JPH06228667A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03BSEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS
    • B03B9/00General arrangement of separating plant, e.g. flow sheets
    • B03B9/06General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
    • B03B9/061General arrangement of separating plant, e.g. flow sheets specially adapted for refuse the refuse being industrial
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/52Mechanical processing of waste for the recovery of materials, e.g. crushing, shredding, separation or disassembly

Abstract

PURPOSE:To recover valuables from the printed board. CONSTITUTION:A printed board is coarsely crushed and then finely crushed, and the crushed material is separated by gravity into the part having a high content of metallic components such as copper and the part consisting of resin, filler, etc., and recovered. The printed board, parts carrying board and the forming residue generated in the production of the board are efficiently pulverized in this way, and the metals such as copper, resin and filler are efficiently separated and recovered. Consequently, the metals such as copper are effectively utilized as precious metal resources, and the crushed resin and filler are recycled as the filler of the structural material, construction material, insulating material, etc.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電気機器に用いられる
プリント基板、部品を搭載したプリント基板及びこれら
の製造工程で発生する枠材などの成形残を効率よく粉砕
し、これを比重分離することによって、これらの構成成
分の銅などの金属と、樹脂や充填材等の他の成分とを効
率よく分離し、回収する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention efficiently crushes a molding board such as a printed circuit board used in an electric device, a printed circuit board on which components are mounted, and a frame material generated in the manufacturing process of these, and separates by gravity. In this way, the present invention relates to a method for efficiently separating and recovering these constituent metals such as copper and other components such as resins and fillers.

【0002】[0002]

【従来の技術】充填材、樹脂、金属等を主要構成成分と
するプリント基板やこれに電子部品を搭載した基板(以
下部品搭載基板と称す)の再資源化方法としては、焼却
処理し、熱エネルギーを回収する方法が一部で実施され
ている。更に、プリント基板等の複合材料から有価物を
回収する方法としては、これらの複合材料中の樹脂分を
加熱して炭化させた後、分級して、銅などの有価物を分
離回収する方法がある。(特開平2−88725号公
報)
2. Description of the Related Art A printed circuit board containing fillers, resins, metals, etc. as its main constituents and a circuit board on which electronic parts are mounted (hereinafter referred to as "component mounting circuit board") are recycled by incineration. Some methods of energy recovery are implemented. Further, as a method for recovering valuable materials from composite materials such as printed circuit boards, there is a method of heating and carbonizing a resin component in these composite materials, and then classifying and separating and recovering valuable materials such as copper. is there. (JP-A-2-88725)

【発明が解決しようとする課題】上記のようなプリント
基板や部品搭載基板の焼却処理や炭化処理では、さまざ
まな廃ガスが発生するため、高度な廃ガス処理整備を設
置しなけらばならず、さらにプリント基板や部品搭載基
板に含まれる有価金属成分が酸化されやすくなり、回収
した場合の付加価値が低減することが懸念される。他の
再資源化の方法としてはプリント基板上の銅などをエッ
チングすることも考えられるが、廃水処理や銅の回収に
大規模な設備を要するので実際的ではない。以上のよう
に、プリント基板や部品搭載基板およびこれらの製造工
程での成形残から金属などの有価物を効率よく低コスト
で分離回収する方法は大きな課題であった。
In the incineration process and carbonization process of the printed circuit board and the component mounting board as described above, various waste gases are generated, and therefore an advanced waste gas treatment service must be installed. In addition, the valuable metal component contained in the printed circuit board or the component mounting board is likely to be oxidized, and there is a concern that the added value when recovered is reduced. As another method for recycling, etching copper or the like on a printed circuit board can be considered, but it is not practical because large-scale equipment is required for wastewater treatment and copper recovery. As described above, a method of efficiently separating and recovering valuable materials such as metals from a printed circuit board, a component mounting board, and a molding residue in the manufacturing process thereof at low cost has been a big problem.

【0003】[0003]

【課題を解決するための手段】本発明のプリント基板か
らの有価物の回収方法は、プリント基板、部品を搭載し
たプリント基板およびこれらの製造工程で発生する成形
残からの有価物を分離回収する方法であって、該プリン
ト基板を粗粉砕工程と微粉砕工程で粉砕し、得られた粉
砕物を比重分離工程によって銅などの金属成分を多く含
有する部分と、樹脂や充填材等からなる部分に分離し、
回収することを特徴とする。
A method of recovering a valuable material from a printed circuit board according to the present invention separates and recovers a valuable material from a printed circuit board, a printed circuit board on which components are mounted, and a molding residue generated in the manufacturing process thereof. A method in which the printed board is crushed in a coarse crushing step and a fine crushing step, and the obtained crushed product is a portion containing a large amount of a metal component such as copper in a specific gravity separation step and a portion made of a resin or a filler. Separated into
It is characterized by collecting.

【0004】又、本発明のプリント基板からの有価物の
回収方法は、前記粗粉砕工程中に、投入部の下に回転す
るカッターとチャンバー内壁に設置した固定刃によりせ
ん断力を被破砕物に加え、さらに回転する回転刃とチャ
ンバー内壁に設置した固定刃およびまたは排出部のスク
リーンにより被破砕物にせん断力と衝撃力を加えて粉砕
する機構を持つ粗粉砕機を使用することを特徴とする。
Further, in the method of recovering a valuable material from a printed circuit board of the present invention, during the coarse crushing step, a shearing force is applied to the object to be crushed by a cutter rotating below the charging part and a fixed blade installed on the inner wall of the chamber. In addition, it is characterized by using a coarse crusher having a mechanism for crushing an object to be crushed by applying a shearing force and an impact force with a rotating rotary blade, a fixed blade installed on the inner wall of the chamber, and / or a screen of a discharge part. .

【0005】又、本発明のプリント基板からの有価物の
回収方法は、前記微粉砕工程中に、回転する回転刃の軸
方向に被粉砕物を気流によって移動させ、該回転刃とチ
ャンバー内壁に設置した固定刃とにより衝撃力およびせ
ん断力を被粉砕物に加えて粉砕し、さらに気流によって
所定粒径以下の粉砕物を選択的に取り出すとともに所定
粒径以上の粉砕物を再びチャンバーに戻す機構を持つ微
粉砕機を使用することを特徴とする。
Further, in the method of recovering a valuable material from a printed circuit board of the present invention, during the fine pulverization step, the object to be crushed is moved by an air flow in the axial direction of the rotating rotary blade so that the rotary blade and the inner wall of the chamber are moved. A mechanism that adds impact force and shearing force to the object to be crushed by the fixed blade installed and crushes it further, and then selectively takes out crushed products of a predetermined particle size or less by the air flow and returns the crushed product of a predetermined particle size or more to the chamber again. Characterized by using a fine crusher with.

【0006】[0006]

【実施例】本発明で対象とするプリント基板や部品搭載
基板およびこれらの製造工程での成形残としては通常電
気機器に使用されているものを指す。プリント基板は樹
脂成分、充填材成分および回路などの金属成分からなる
ものであり、樹脂としてはエポキシ樹脂、フェノール樹
脂、ポリイミド樹脂等が挙げられ、充填材としてはガラ
ス繊維、紙、カーボン繊維等が挙げられ、さらに金属と
しては銅、アルミ、鉄、ニッケル、ハンダ(銅と鉛)な
どが挙げられる。さらにここでの部品搭載基板とは上記
のプリント基板にICパッケージなどの電子部品が搭載
されたものである。成形残とはプリント基板製造時の枠
材や銅張りプレプリグの不良品、およびこれらの加熱硬
化体などを指し、構成成分が製品のプリント基板とほぼ
同じものを指す。
EXAMPLES The printed circuit boards and component mounting boards to which the present invention is applied and molding residues in the manufacturing process thereof are those usually used in electrical equipment. The printed circuit board is composed of a resin component, a filler component, and a metal component such as a circuit. Examples of the resin include epoxy resin, phenol resin, and polyimide resin, and examples of the filler include glass fiber, paper, carbon fiber, and the like. Examples of the metal include copper, aluminum, iron, nickel, solder (copper and lead), and the like. Further, the component mounting board here is an electronic component such as an IC package mounted on the printed board. The molding residue refers to a defective frame material or a copper-clad prepreg during the production of a printed circuit board, a heat-cured body of these, and the like, and has substantially the same constituent components as the printed circuit board of the product.

【0007】本発明における粗粉砕工程では、粉砕機と
しては投入部の下に回転するカッターとチャンバー内壁
に設置した固定刃によりせん断力を被粉砕物に加え、さ
らに回転する回転刃、チャンバー内壁に設置した固定刃
およびまたは排出部のスクリーンにより被粉砕物にせん
断力と衝撃力を加えて粉砕する機構を持つ粗粉砕機を使
用する。この例としては(株)オリエントのオリエント
ミルが挙げられる。またこの粉砕機を数台連結し、除々
にスクリーンの目を細かくして各粉砕機への負荷を低減
させ摩耗対策を行うことができる。さらに他の粗粉砕機
との併用も可能であり、例えば通常シュレッダーと呼ば
れる二軸回転せん断機との組合せが挙げられる。
In the coarse crushing step of the present invention, as a crusher, a shearing force is applied to the object to be crushed by a cutter that rotates below the charging section and a fixed blade installed on the inner wall of the chamber. A coarse crusher having a mechanism for crushing an object to be crushed by applying a shearing force and an impact force to the object to be crushed by a fixed blade installed and / or a screen of a discharge part is used. An example of this is the Orient Mill manufactured by Orient Co., Ltd. Further, by connecting several crushers and gradually making the screen finer, it is possible to reduce the load on each crusher and take measures against wear. Further, it can be used in combination with other coarse crushers, and examples thereof include a combination with a twin-screw rotary shearing machine usually called a shredder.

【0008】微粉砕工程中では、回転する回転刃の軸方
向に被粉砕物を気流によって移動させ、該回転刃とチャ
ンバー内壁に設置した固定刃とにより衝撃力およびせん
断力を被粉砕物に加えて粉砕し、さらに気流によって所
定粒径以下の粉砕物を選択的に取り出すとともに所定粒
径以上の粉砕物を再びチャンバーに戻す機構を持つ微粉
砕機を使用する。この例としては、(株)セイシン企業
製のインペラーミルが挙げられる。またこの粉砕機でも
数台連結し、除々に粉砕粒径を細かくして各粉砕機への
負荷を低減させ摩耗対策を行うことができる。さらに他
の微粉砕機との併用も可能である。
In the fine crushing process, the object to be crushed is moved by the air flow in the axial direction of the rotating rotary blade, and an impact force and a shearing force are applied to the object to be crushed by the rotary blade and the fixed blade installed on the inner wall of the chamber. A pulverizer having a mechanism for selectively taking out a pulverized product having a predetermined particle size or less by an air stream and returning the pulverized product having a predetermined particle size or more to the chamber again is used. An example of this is an impeller mill manufactured by Seishin Enterprise Co., Ltd. Also, even with this crusher, several crushers can be connected to gradually reduce the crushed particle size to reduce the load on each crusher and take measures against wear. Further, it can be used in combination with other fine pulverizers.

【0009】この様な工程でプリント基板を微粉砕する
と、銅などの金属は微粉砕されにくく、また充填材や樹
脂は微粉砕されやすいという特徴があり、これらを比重
分離することによって、銅等の金属を高含有率で含有す
る粗粉と、これをほとんど含有しない樹脂や充填材など
からなる微粉の部分に分離することができる。この際、
微粉砕化が不十分だと、銅等の金属と樹脂との界面の破
壊分離が不十分となり、比重分離した時に金属と他の成
分の分離率が低下する。また微粉砕化しすぎると銅等の
金属が他の成分とともに微粉砕されていまい、比重分離
した時にやはりこれらの分離率が低下してしまう。そこ
でプリント基板の粉砕物の平均粒径は0.03mm(3
0μm以上)で0.4mm(400μm)未満が好まし
い。
When the printed circuit board is pulverized in such a process, the metal such as copper is hardly pulverized, and the filler and the resin are easily pulverized. It is possible to separate into a coarse powder containing a high content of the above metal and a fine powder containing almost no such metal, such as a resin or a filler. On this occasion,
If the pulverization is insufficient, the fracture separation of the interface between the metal such as copper and the resin will be insufficient, and the separation rate of the metal and other components will be reduced when the specific gravity separation is performed. On the other hand, if the metal is pulverized too much, the metal such as copper will not be pulverized together with other components, and the separation ratio of these components will also decrease when the specific gravity is separated. Therefore, the average particle size of the pulverized material of the printed circuit board is 0.03 mm (3
It is preferably 0 μm or more) and less than 0.4 mm (400 μm).

【0010】本発明における比重分離とは粉体を比重分
離機によって比重別に分離することであるが、粉体を分
離した後の処理が容易で実際的な乾式比重分離が好まし
い。例えば、粒子を気流の旋回や機械的回転によって分
級する遠心分級機、粒子の水平方向の非行距離により分
級する慣性分級機、粒子の落下速度や落下位置の違いに
より分級する重力分級機が挙げられるが、特に気流の旋
回によって分級する型の遠心分級が好ましい。例えば
(株)センシン企業製マイクロンクラシファイアが挙げ
られる。この際の乾式比重分離機の気流の流速や装置の
形状などの分離条件によって、回収する粗粉と微粉の割
合は異なり、粗粉の割合が極端に多いとこれに含有され
る金属の濃度が減少し、この後の金属の精製に手間がか
かる。また微粉の割合が極端に多いと微粉中の残留する
金属成分が多くなり、この微粉を構造材や建材等の充填
材などの用途に有効利用しにくくなる。そこで分離する
粗粉の全体に対する割合は20重量%以上70重量%未
満が好ましい。またこの比重分離の工程の前処理や後処
理として通常の篩を使用した分級操作との組合せも可能
である。
The specific gravity separation in the present invention is to separate the powders by specific gravity by a specific gravity separator, but dry specific gravity separation is preferable since the treatment after the separation of the powders is easy and practical. For example, a centrifugal classifier that classifies particles by swirling or mechanical rotation of an air flow, an inertia classifier that classifies particles by a horizontal non-traveling distance, and a gravity classifier that classifies particles by the difference in their falling speeds and positions. However, centrifugal classification of a type in which classification is performed by swirling an air stream is particularly preferable. For example, Micron Classifier manufactured by Senshin Enterprise Co., Ltd. may be mentioned. Depending on the separation conditions such as the flow velocity of the air flow of the dry gravity separator and the shape of the device at this time, the ratio of the coarse powder and the fine powder to be recovered is different, and if the ratio of the coarse powder is extremely large, the concentration of the metal contained in this will be It is reduced, and it takes time and effort to refine the metal thereafter. Further, if the proportion of fine powder is extremely large, the amount of residual metal components in the fine powder increases, and it becomes difficult to effectively use this fine powder for applications such as fillers such as structural materials and building materials. Therefore, the ratio of the coarse powder to be separated to the whole is preferably 20% by weight or more and less than 70% by weight. It is also possible to combine with a classification operation using an ordinary sieve as a pretreatment or a posttreatment of the specific gravity separation step.

【0011】このようにして分離できた銅等の金属は、
酸化されていないため付加価値の高い金属資源として再
利用でき、残ったガラス繊維などの充填材と樹脂の微粉
砕物は、建材や構造材などの充填材として有効に利用で
きる。
Metals such as copper that can be separated in this way are
Since it is not oxidized, it can be reused as a metal resource with high added value, and the remaining filler such as glass fiber and finely pulverized resin can be effectively used as a filler such as building materials and structural materials.

【0012】以下、本発明による実験データについて説
明する。
Experimental data according to the present invention will be described below.

【0013】図1に実験データ1〜8と図2に比較デー
タ1〜7を示す。サンプルとしては銅パターン付きガラ
ス繊維強化エポキシ樹脂製(ガラスエポキシと略す)の
プリント基板(組成は、銅;30重量%、ガラス繊維;
20重量%、エポキシ樹脂;50重量%)、およびこの
基板の銅パターン表面にハンダメッキしたもの、また銅
パターン付き紙−フェノール樹脂製(紙−フェノールと
略す)プリント基板(組成は銅;30重量%、紙;20
重量%、フェノール樹脂;50重量%)、さらに部品搭
載基板(上記銅パターン付きガラスエポキシ基板にIC
パッケージ、コネクタ等の電子部品を搭載したもの(組
成は、銅;33重量%、他はエポキシ樹脂、ガラス繊
維、シリカ等)を用いた。これらのサンプルの粉砕工程
の粉砕機としては、実施例では粗粉砕機として上記オリ
エントミル、オリエントミルを2段組み合わせたもの、
およびシュレッダーとオリエントミルを組み合わせたも
のを用い、微粉砕機としてインペラーミルおよびインペ
ラーミルを2段組み合わせたものを用いた。また比較例
では、粗粉砕機として、回転するハンマーとチャンバー
内の固定刃及び排出部のスクリーンによって衝撃粉砕す
る機構を持つハンマーミル、上記シュレッダーとハンマ
ーミルを組み合わせたもの、および上記オリエントミル
を用い、また微粉砕機としては、上記インペラーミル、
回転する円筒チャンバー内のボールの落下により粉砕す
る機構を持つボールミル、対向する円転円盤のピンない
し溝で粉砕する機構を持つデイスクミル、チャンバー内
のボールの振動で破砕する機構をもつ振動ミルを用い
た。全ての粉砕機はプラスチックス類を1時間当たり標
準100kg粉砕できる能力のあるものである。これら
の粉砕機の粉砕部の材質にはタングステンカーバイドを
用いた。但し、ボールミルと振動ミルではアルミナ製の
ボールとチャンバーを用い、シュレッダーでは通常の鋼
鉄を用いた。
FIG. 1 shows experimental data 1 to 8 and FIG. 2 shows comparative data 1 to 7. As a sample, a printed circuit board made of glass fiber reinforced epoxy resin with a copper pattern (abbreviated as glass epoxy) (composition: copper; 30% by weight, glass fiber;
20% by weight, epoxy resin; 50% by weight), and solder plating on the copper pattern surface of this substrate, and paper with a copper pattern-phenolic resin (paper-abbreviated as phenol) printed circuit board (composition: copper; 30% by weight) %, Paper; 20
% By weight, phenolic resin; 50% by weight, and a component mounting board (the above-mentioned glass epoxy board with a copper pattern and an IC
A package equipped with electronic parts such as a package and a connector (composition: copper; 33% by weight, others: epoxy resin, glass fiber, silica, etc.) was used. As the crusher for the crushing process of these samples, in the Examples, a coarse crusher having a combination of the above-mentioned Orient mill and two-stage Orient mill,
Also, a combination of a shredder and an orient mill was used, and an impeller mill and a two-stage combination of impeller mill were used as a fine pulverizer. Further, in the comparative example, as the coarse crusher, a hammer mill having a mechanism for impact crushing by a rotating hammer, a fixed blade in the chamber and a screen of the discharge part, a combination of the shredder and the hammer mill, and the orient mill are used. As the fine crusher, the above impeller mill,
A ball mill with a mechanism that crushes by dropping balls in a rotating cylindrical chamber, a disk mill that has a mechanism that crushes with opposing pin or groove of a rotating disk, and a vibration mill that has a mechanism that crushes by the vibration of balls in the chamber. Using. All crushers are capable of crushing 100 kg of plastics per hour in a standard manner. Tungsten carbide was used as the material of the crushing section of these crushers. However, the ball mill and vibration mill used alumina balls and chambers, and the shredder used ordinary steel.

【0014】粗粉砕機の能力は100kgのサンプルを
10mm以下になるまで粉砕するのに要した時間で比較
した。また微粉砕機の能力はこの粗粉砕化したサンプル
を1時間に100kgの条件でできる限り微粉砕した場
合の微粉砕物の平均粒径で比較した。耐摩耗性は100
kgのサンプルを上記の粉砕機の組合せで粗粉砕してか
ら微粉砕した後の微粉中に含有されるタングステンを定
量して比較した。これらの結果を表1、2に示す。
The capabilities of the coarse crushers were compared by the time required to crush a 100 kg sample to less than 10 mm. The capacity of the fine pulverizer was compared by the average particle size of the finely pulverized product when the coarsely pulverized sample was pulverized as much as possible under the condition of 100 kg per hour. Abrasion resistance is 100
Tungsten contained in the fine powder after coarsely pulverizing a sample of kg by the combination of the above-mentioned pulverizers and then finely pulverizing was quantitatively compared. The results are shown in Tables 1 and 2.

【0015】分離工程としては実施例で上記の遠心分級
機、重力分級機、慣性分級機を用い、比較例では遠心分
級機の他、磁界をかけた時の渦電流の発生によって分離
する機構を持つ通常の渦電流分離機と、帯電率の違いを
利用して分離する機構を持つ通常の静電分離機を用い
た。図1、2に分離機で粉砕サンプルを粗粉と微粉に分
離した際の、粗粉/微粉の重量比、及びこの粗粉と微粉
中の銅の含有率を示す。また銅の回収率としてはプリン
ト基板全体の銅の含量に対する粗粉中の銅の含量の割合
を示す。これらを実験データと比較データで比較した。
As the separating step, the centrifugal classifier, the gravity classifier, and the inertia classifier described above are used in the examples. In the comparative example, a mechanism for separating by the generation of eddy current when a magnetic field is applied is used in addition to the centrifugal classifier. We used a normal eddy current separator that we have, and a normal electrostatic separator that has a mechanism to separate by utilizing the difference in charging rate. 1 and 2 show the weight ratio of coarse powder / fine powder and the content ratio of copper in the coarse powder and the fine powder when the crushed sample was separated into coarse powder and fine powder by a separator. As the copper recovery rate, the ratio of the copper content in the coarse powder to the copper content of the entire printed circuit board is shown. These were compared with experimental data and comparative data.

【0016】以上実験データと比較データを比較して明
らかなとうり、本発明の粗粉砕工程と微粉砕工程でプリ
ント基板を粉砕し比重分離すると、銅が粗粉中に濃縮し
高効率で回収することができ、さらに微粉中の銅の残存
量を極めて少なくできるため、構造材、建材、絶縁材等
の充填材などに有効に再利用できる。
As is clear from the comparison between the experimental data and the comparative data, when the printed circuit board is crushed and the specific gravity is separated in the coarse crushing step and the fine crushing step of the present invention, copper is concentrated in the coarse powder and recovered with high efficiency. In addition, since the amount of copper remaining in the fine powder can be extremely reduced, it can be effectively reused as a filler such as a structural material, a building material, and an insulating material.

【0017】[0017]

【発明の効果】本発明によれば、これまで困難だったプ
リント基板、部品搭載基板、およびこれらの製造時に発
生する成形残から効率的に金属と他の成分を分離回収で
き、資源として効果的に有効利用できる。
According to the present invention, the metal and other components can be efficiently separated and recovered from the printed circuit board, the component mounting board, and the molding residue generated at the time of manufacturing these, which has been difficult until now, and is effective as a resource. Can be used effectively.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による実験データ。FIG. 1 Experimental data according to the present invention.

【図2】比較データ。FIG. 2 Comparative data.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 プリント基板、部品を搭載したプリント
基板及びこれらの製造工程で発生する成形残からの有価
物を分離回収する方法であって、該プリント基板を粗粉
砕工程と微粉砕工程で粉砕し、得られた粉砕物を比重分
離工程によって銅などの金属成分を多く含有する部分
と、樹脂や充填材等からなる部分に分離し、回収するこ
とを特徴とするプリント基板からの有価物の回収方法。
1. A printed circuit board, a printed circuit board on which parts are mounted, and a method for separating and recovering valuable materials from a molding residue generated in the manufacturing process thereof, wherein the printed circuit board is crushed in a coarse crushing step and a fine crushing step. Then, by separating the obtained pulverized product into a portion containing a large amount of metal components such as copper by a specific gravity separation step and a portion composed of resin, filler, etc. Recovery method.
【請求項2】 前記粗粉砕工程中に、投入部の下に回転
するカッターとチャンバー内壁に設置した固定刃により
せん断力を被破砕物に加え、さらに回転する回転刃とチ
ャンバー内壁に設置した固定刃およびまたは排出部のス
クリーンにより被破砕物にせん断力と衝撃力を加えて粉
砕する機構を持つ粗粉砕機を使用することを特徴とする
請求項1記載のプリント基板からの有価物の分離回収方
法。
2. During the coarse crushing step, a shearing force is applied to the object to be crushed by a cutter that rotates below the charging part and a fixed blade that is installed on the inner wall of the chamber, and the rotating blade that rotates further and the fixing that is installed on the inner wall of the chamber. The separation and recovery of valuables from a printed circuit board according to claim 1, characterized in that a coarse crusher having a mechanism for crushing an object to be crushed by a blade and / or a screen of a discharge part by applying a shearing force and an impact force is used. Method.
【請求項3】 前記微粉砕工程中に、回転する回転刃の
軸方向に被粉砕物を気流によって移動させ、該回転刃と
チャンバー内壁に設置した固定刃とにより衝撃力および
せん断力を被粉砕物に加えて粉砕し、さらに気流によっ
て所定粒径以下の粉砕物を選択的に取り出すとともに所
定粒径以上の粉砕物を再びチャンバーに戻す機構を持つ
微粉砕機を使用することを特徴とする請求項1記載のプ
リント基板からの有価物の分離回収方法。
3. An object to be ground is moved by an air flow in the axial direction of a rotating rotary blade during the fine grinding step, and impact force and shearing force are ground by the rotary blade and a fixed blade installed on the inner wall of the chamber. A fine crusher having a mechanism of crushing in addition to the product, selectively extracting a pulverized product having a predetermined particle size or less by an air stream, and returning the pulverized product having a predetermined particle size or more to the chamber again is used. Item 1. A method for separating and recovering valuable materials from a printed circuit board according to Item 1.
JP24097293A 1992-10-19 1993-09-28 Method for separating and recovering valuables from printed board Pending JPH06228667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24097293A JPH06228667A (en) 1992-10-19 1993-09-28 Method for separating and recovering valuables from printed board

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4-279719 1992-10-19
JP27971992 1992-10-19
JP24097293A JPH06228667A (en) 1992-10-19 1993-09-28 Method for separating and recovering valuables from printed board

Publications (1)

Publication Number Publication Date
JPH06228667A true JPH06228667A (en) 1994-08-16

Family

ID=26535012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24097293A Pending JPH06228667A (en) 1992-10-19 1993-09-28 Method for separating and recovering valuables from printed board

Country Status (1)

Country Link
JP (1) JPH06228667A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1157680A (en) * 1997-08-28 1999-03-02 Nkk Corp Method for resource recovery of waste
JPH11320558A (en) * 1998-03-18 1999-11-24 Idemitsu Petrochem Co Ltd Method for crushing thermosetting resin
JP2000192166A (en) * 1998-10-19 2000-07-11 Nippon Magnetic Dressing Co Ltd Method for recovering aluminum from used aluminum formed article
US6336601B1 (en) 1998-12-11 2002-01-08 Matsushita Electric Industrial Co., Ltd. Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment
WO2010055906A1 (en) * 2008-11-17 2010-05-20 独立行政法人物質・材料研究機構 Milled electronic appliance
FR3030317A1 (en) * 2014-12-23 2016-06-24 Brgm PROCESS FOR RECYCLING WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
JP2017154134A (en) * 2016-02-26 2017-09-07 Jx金属株式会社 Pulverization method of printed circuit board scrap, and recovery method of valuable metal from printed circuit board scrap
JP2019037944A (en) * 2017-08-25 2019-03-14 Jx金属株式会社 Printed circuit board scrap crushing device and printed circuit board scrap crushing method
JP2021090963A (en) * 2017-08-25 2021-06-17 Jx金属株式会社 Shredder for printed circuit board scraps

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110919A (en) * 1978-02-20 1979-08-30 Hosokawa Micron Kk Separation of copper component from wasted print board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110919A (en) * 1978-02-20 1979-08-30 Hosokawa Micron Kk Separation of copper component from wasted print board

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1157680A (en) * 1997-08-28 1999-03-02 Nkk Corp Method for resource recovery of waste
JPH11320558A (en) * 1998-03-18 1999-11-24 Idemitsu Petrochem Co Ltd Method for crushing thermosetting resin
JP2000192166A (en) * 1998-10-19 2000-07-11 Nippon Magnetic Dressing Co Ltd Method for recovering aluminum from used aluminum formed article
US6336601B1 (en) 1998-12-11 2002-01-08 Matsushita Electric Industrial Co., Ltd. Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment
US6523764B2 (en) 1998-12-11 2003-02-25 Matsushita Electric Industrial Co., Ltd. Method for separating metallic from waste printed circuit boards, and dry distillation apparatus used for waste treatment
WO2010055906A1 (en) * 2008-11-17 2010-05-20 独立行政法人物質・材料研究機構 Milled electronic appliance
JP2010119906A (en) * 2008-11-17 2010-06-03 National Institute For Materials Science Crushed mass of electronic equipment
FR3030317A1 (en) * 2014-12-23 2016-06-24 Brgm PROCESS FOR RECYCLING WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT
WO2016102849A1 (en) * 2014-12-23 2016-06-30 Brgm Method for recycling waste electrical and electronic equipment
JP2017154134A (en) * 2016-02-26 2017-09-07 Jx金属株式会社 Pulverization method of printed circuit board scrap, and recovery method of valuable metal from printed circuit board scrap
JP2019037944A (en) * 2017-08-25 2019-03-14 Jx金属株式会社 Printed circuit board scrap crushing device and printed circuit board scrap crushing method
JP2021090963A (en) * 2017-08-25 2021-06-17 Jx金属株式会社 Shredder for printed circuit board scraps

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