JP6676000B2 - Method for grinding printed circuit board waste and method for recovering valuable metal from printed circuit board waste - Google Patents
Method for grinding printed circuit board waste and method for recovering valuable metal from printed circuit board waste Download PDFInfo
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- JP6676000B2 JP6676000B2 JP2017034288A JP2017034288A JP6676000B2 JP 6676000 B2 JP6676000 B2 JP 6676000B2 JP 2017034288 A JP2017034288 A JP 2017034288A JP 2017034288 A JP2017034288 A JP 2017034288A JP 6676000 B2 JP6676000 B2 JP 6676000B2
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- 239000002699 waste material Substances 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 28
- 239000002184 metal Substances 0.000 title claims description 27
- 229910052751 metal Inorganic materials 0.000 title claims description 27
- 238000000227 grinding Methods 0.000 title description 2
- 238000010298 pulverizing process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000002893 slag Substances 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 8
- 238000011084 recovery Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011090 solid board Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
- Combined Means For Separation Of Solids (AREA)
- Crushing And Pulverization Processes (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Manufacture And Refinement Of Metals (AREA)
Description
本発明は、プリント基板屑の粉砕方法及びプリント基板屑からの有価金属の回収方法に関する。 The present invention relates to a method for pulverizing printed circuit board waste and a method for recovering valuable metal from printed circuit board waste.
プリント基板、部品を搭載したプリント基板及びこれらの製造工程で発生する成形残から銅滓などの有価金属を回収する方法が提案されている。 There has been proposed a method of recovering valuable metals such as copper slag from a printed circuit board, a printed circuit board on which components are mounted, and a molding residue generated in a manufacturing process thereof.
例えば、特許文献１には、処理対象物を粗粉砕し、続けて圧縮力やせん断力などの外力を加えて微粉砕し、微粉砕物を金属分などの比重の大きな物質を多く含む部分及び樹脂などの比重の小さな物質を多く含む部分の比重差を使用して分離し、さらに導電体を多く含む部分と、絶縁体を多く含む部分とに静電分離することにより、有価金属を回収する方法が開示されている。 For example, Patent Literature 1 discloses that a treatment target is roughly pulverized, and then continuously pulverized by applying an external force such as a compressive force or a shearing force, and the finely pulverized material contains a large amount of a substance having a large specific gravity such as a metal component. Valuable metals are collected by separating using the specific gravity difference of a portion containing a large amount of a substance having a low specific gravity such as resin, and then electrostatically separating the portion containing a large amount of conductor and the portion containing a large amount of insulator. A method is disclosed.
特許文献１に記載された技術では、処理対象物を微粉砕するのにローラミルを用いている。ローラミル等のせん断式の破砕機では、有価金属と基板層とを十分に剥離することができず、有価金属の回収効率が低下するおそれがある。 In the technique described in Patent Literature 1, a roller mill is used to finely pulverize an object to be processed. In a shear-type crusher such as a roller mill, the valuable metal and the substrate layer cannot be sufficiently separated, and the recovery efficiency of the valuable metal may be reduced.
本発明は上記の課題に鑑み、プリント基板屑からの有価金属の回収効率を向上させるプリント基板屑の粉砕方法及びプリント基板屑からの有価金属の回収方法を提供すること目的とする。 In view of the above problems, an object of the present invention is to provide a method of pulverizing printed circuit board waste and a method of recovering valuable metal from printed circuit board waste, which improve the efficiency of recovering valuable metal from printed circuit board waste.
本発明に係るプリント基板屑の粉砕方法は、プリント基板屑をハンマーミルにより粉砕する第１工程と、前記第１工程後の粉砕物を、スクリーン径が前記第１工程で使用されるハンマーミルよりも小さいハンマーミルにより粉砕する第２工程と、前記第２工程後の粉砕物を、前記第１工程で用いたハンマーミル及び前記第２工程で用いたハンマーミルの周速よりも周速が速い高速ハンマーミルにより粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする第３工程と、を有することを特徴とする。 The method of pulverizing printed circuit board waste according to the present invention includes a first step of pulverizing printed circuit board waste by a hammer mill, and a step of pulverizing the pulverized product after the first step by using a hammer mill having a screen diameter used in the first step. a second step of pulverizing by even small hammer mill, the crushed product after the second step, the peripheral speed is faster than the peripheral speed of the hammer mill using a hammer mill and the second step used in the first step pulverized by a high-speed hammer mill, average particle size (D50) and having a third step of the powder of 200Myuemu～360myuemu, the.
この場合において、前記第１工程で使用される前記ハンマーミルのスクリーン径が１３ｍｍ以上１７ｍｍ以下であってもよい。また、前記第２工程で使用される前記ハンマーミルのスクリーン径が３ｍｍ以上５ｍｍ以下であってもよい。 In this case, the screen diameter of the hammer mill used in the first step may be 13 mm or more and 17 mm or less . The screen diameter of the hammer mill used in the second step may be 3 mm or more and 5 mm or less.
また、前記第３工程で使用される前記高速ハンマーミルのスクリーン径が０．３ｍｍ以上１．５ｍｍ以下であってもよい。 The screen diameter of the high-speed hammer mill used in the third step may be 0.3 mm or more and 1.5 mm or less .
本発明に係るプリント基板屑からの有価金属の回収方法は、プリント基板屑をハンマーミルにより粉砕する第１工程と、前記第１工程後の粉砕物を、スクリーン径が前記第１工程で使用されるハンマーミルよりも小さいハンマーミルにより粉砕する第２工程と、前記第２工程後の粉砕物を、前記第１工程で用いたハンマーミル及び前記第２工程で用いたハンマーミルの周速よりも周速が速い高速ハンマーミルにより粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする第３工程と、前記粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、前記粉体物から有価金属を回収する第４工程と、を有することを特徴とする。 The method for recovering valuable metals from printed circuit board waste according to the present invention includes a first step of pulverizing printed circuit board waste by a hammer mill, and a method in which the crushed material after the first step is used in a screen diameter of the first step. A second step of pulverizing with a hammer mill smaller than a hammer mill that is smaller than the hammer mill used in the first step and the peripheral speed of the hammer mill used in the second step. A third step of pulverizing with a high-speed hammer mill having a high peripheral speed to obtain a powder having an average particle diameter (D50) of 200 μm to 360 μm; And a fourth step of separating valuable materials from the powdery material by separating the powdery material from the other.
この場合、前記有価金属は銅滓であってもよい。また、プリント基板屑からの有価金属の回収方法は、前記風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収する工程を有していてもよい。 In this case, the valuable metal may be copper slag. The method for collecting valuable metals from printed circuit board waste may include a step of collecting, with a bag filter, a powdery substance mainly composed of a resin component classified by the wind separator.
本発明に係るプリント基板屑の粉砕方法及びプリント基板屑からの有価金属の回収方法によれば、プリント基板屑からの有価金属の回収効率を向上させることができる。 According to the method for crushing printed circuit board waste and the method for recovering valuable metal from printed circuit board waste according to the present invention, the efficiency of recovering valuable metal from printed circuit board waste can be improved.
図１は、廃プリント基板の処理工程を表す工程図である。図１で例示するように、出発原料は廃プリント基板である。本実施形態において、廃プリント基板とは、電子部品等が実装されていないプリント基板を意味し、電子部品を実装する前のプリント基板（以後、ベタ基板と称する）、電子部品が実装された回路基板の製造工程において、打ち抜きにより発生するプリント基板の成形残（以後、枠基板と称する）、及び切断により発生するプリント基板の切れ端（以後、長尺基板と称する）を含む。 FIG. 1 is a process diagram illustrating a process of processing a waste printed circuit board. As illustrated in FIG. 1, the starting material is a waste printed circuit board. In the present embodiment, the waste printed board means a printed board on which electronic components and the like are not mounted, a printed board before mounting the electronic components (hereinafter, referred to as a solid board), and a circuit on which the electronic components are mounted. In the manufacturing process of the substrate, it includes a molding residue of the printed circuit board (hereinafter, referred to as a frame substrate) generated by punching and a cut piece of the printed circuit board (hereinafter, referred to as a long substrate) generated by cutting.
（予備破砕）
予備破砕では、例えば、スクリーン径５０ｍｍの一軸破砕機を用いて、廃プリント基板を１次破砕で使用する衝撃式粉砕機に投入可能なサイズ（例えば、縦及び横の長さが５０ｍｍ以下）にする。なお、予備破砕を行わなくてもよい。例えば、廃プリント基板のうち、そのサイズが既に１次破砕で使用する衝撃式粉砕機に投入可能なサイズとなっているもの（例えば、長尺基板）については、予備破砕を行わなくてもよい。以後、１次破砕で使用する衝撃式粉砕機に投入可能なサイズとなっている廃プリント基板をプリント基板屑と称する。
(Preliminary crushing)
In the preliminary crushing, for example, using a uniaxial crusher with a screen diameter of 50 mm, the waste printed circuit board is reduced to a size (for example, the vertical and horizontal lengths are 50 mm or less) that can be put into an impact crusher used in the primary crushing. I do. Note that the preliminary crushing need not be performed. For example, among the waste printed circuit boards, those having a size that can be put into an impact-type pulverizer used in the primary crushing (for example, a long board) need not be pre-crushed. . Hereinafter, a waste printed circuit board having a size that can be put into an impact type crusher used in the primary crushing is referred to as printed circuit board waste.
（１次破砕）
１次破砕では、プリント基板屑を、例えば、スクリーン径１３〜１７ｍｍの衝撃式粉砕機を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。また、１次破砕を省略してもよい。
(Primary crushing)
In the primary crushing, printed circuit board waste is crushed using, for example, an impact crusher having a screen diameter of 13 to 17 mm. In addition, it is preferable that an impact-type pulverizer is a hammer mill. Further, primary crushing may be omitted.
（２次破砕）
２次破砕では、１次破砕で粉砕したプリント基板屑を、例えば、スクリーン径３〜５ｍｍの衝撃式粉砕機を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。
(Secondary crushing)
In the secondary crushing, the printed circuit board waste crushed in the primary crushing is crushed using, for example, an impact crusher having a screen diameter of 3 to 5 mm. In addition, it is preferable that an impact-type pulverizer is a hammer mill.
（３次破砕）
３次破砕では、最終粉砕機を用いて、２次破砕により得られた粉砕物を粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする。最終粉砕機は、衝撃粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミルであることがより好ましい。なお、高速ハンマーミルは、周速１００ｍ／ｓ以上のハンマーミルである。この場合、例えばスクリーン径１．５ｍｍ以下、より好ましくは１ｍｍ以下のスクリーン、又は気流分級により平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物を得ることができる。なお、スクリーン径の下限については特には限定されないが、０．３ｍｍ以上、好ましくは０．５ｍｍ以上とすることができる。
(Third crush)
In the third crushing, the crushed material obtained by the second crushing is crushed using a final crusher to obtain a powder having an average particle diameter (D50) of 200 μm to 360 μm. The final mill is preferably an impact mill, more preferably a hammer mill or high speed hammer mill. The high-speed hammer mill is a hammer mill having a peripheral speed of 100 m / s or more. In this case, for example, a screen having a screen diameter of 1.5 mm or less, more preferably 1 mm or less, or a powder having an average particle diameter (D50) of 200 μm to 360 μm can be obtained by air classification. The lower limit of the screen diameter is not particularly limited, but may be 0.3 mm or more, preferably 0.5 mm or more.
（分離工程）
分離工程では、粉体物を、風力選別機により銅滓とそれ以外とに分離し、銅滓を回収する。風力選別機は、二種類以上の成分をそれらの比重差に基づいて分離するもので、バリアブルインパクタ、サイクロン、分級ローター付遠心力型風力分級機等が挙げられる。
(Separation process)
In the separation step, the powdery material is separated into copper slag and the other by a wind separator, and the copper slag is collected. The wind sorter separates two or more types of components based on their specific gravity differences, and examples thereof include a variable impactor, a cyclone, and a centrifugal wind classifier with a classifying rotor.
（回収工程）
回収工程では、分離工程において排出された樹脂を含む成分から、バグフィルタなどの集塵装置を用いて樹脂を分離、回収する。このようにして得られた樹脂は、産業廃棄物の焼却炉等で処理することができる。
(Recovery process)
In the recovery step, the resin is separated and recovered from components containing the resin discharged in the separation step using a dust collector such as a bag filter. The resin thus obtained can be treated in an industrial waste incinerator or the like.
本実施形態によれば、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にすることで、有価金属と基板層とを十分に剥離することができる。これにより、基板層に付着したままの有価金属の量が低減されるので、有価金属の回収効率を向上させることができる。なお、衝撃式粉砕機はハンマーミルであることが好ましい。この場合、最終粉砕機前のハンマーミルのスクリーン径が３ｍｍ以上５ｍｍ以下であることが好ましい。また、最終粉砕機は衝撃式粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミル（周速１００ｍ／ｓ以上のハンマーミル）であることがより好ましい。 According to the present embodiment, the printed circuit board waste is pulverized in one or two stages by an impact-type pulverizer, and the pulverized material obtained by pulverizing the printed circuit board debris is pulverized by a final pulverizer to obtain an average particle diameter (D50). By forming a powder having a size of 200 μm to 360 μm, the valuable metal and the substrate layer can be sufficiently separated. Thereby, the amount of valuable metal remaining on the substrate layer is reduced, so that the efficiency of recovering valuable metal can be improved. The impact-type pulverizer is preferably a hammer mill. In this case, it is preferable that the screen diameter of the hammer mill before the final pulverizer is 3 mm or more and 5 mm or less. The final pulverizer is preferably an impact pulverizer, more preferably a hammer mill or a high-speed hammer mill (hammer mill having a peripheral speed of 100 m / s or more).
また、本実施形態によれば、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により平均粒径（Ｄ５０）が２００μｍ〜３６０μｍとなるよう粉砕し、最終粉砕機による粉砕によって得られた粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、有価金属を回収することで、有価金属の回収効率を向上させることができる。なお、有価金属は銅滓であることが好ましい。 Further, according to the present embodiment, the printed circuit board waste is pulverized in one or two stages by an impact type pulverizer, and the pulverized product obtained by pulverizing the printed circuit board debris has an average particle diameter (D50) of 200 μm by a final pulverizer. Crushing to ~ 360 μm, and separating the powdered material obtained by crushing by the final crusher into powdery material containing valuable metal as main component and other by a wind separator, and collecting valuable metal Thus, the recovery efficiency of valuable metals can be improved. Preferably, the valuable metal is copper slag.
また、本実施形態によれば、風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収することで、樹脂分を効率よく回収することができる。 Further, according to the present embodiment, the resin component can be efficiently collected by collecting the powdery material mainly composed of the resin component classified by the wind power sorter with the bag filter.
なお、上記実施形態では、電子部品が実装されていないベタ基板、枠基板、及び長尺基板の処理工程について説明したが、電子部品が実装された基板であっても、破砕機等によって電子部品が取り除かれた基板や基板屑に対して、上記実施形態を適用してもよい。 In the above embodiment, the processing steps of a solid substrate, a frame substrate, and a long substrate on which no electronic components are mounted have been described. The above-described embodiment may be applied to a substrate or a substrate waste from which is removed.
以下、本発明の実施例を示すが、本発明は実施例に限定されるものではない。
（実施例１〜６）
表１に示した廃プリント基板を原料とし、それぞれ示された条件により廃プリント基板の粉砕処理を行った。表２に、得られた粉体物の平均粒径（Ｄ５０）を示す。比較のため、長尺基板を原料とし、予備破砕を行わず、１次破砕及び２次破砕をせん断式の破砕機で行った。しかしながら、比較例では、２次破砕の終了時点において、目視の状態でも十分な粉砕物を得ることが出来ず、また、有価金属と基板層とが十分に剥離できていなかったため、２次破砕の終了時点で粉砕を中止した。
Hereinafter, although an example of the present invention is shown, the present invention is not limited to an example.
(Examples 1 to 6)
The waste printed circuit boards shown in Table 1 were used as raw materials, and the waste printed circuit boards were pulverized under the conditions shown. Table 2 shows the average particle size (D50) of the obtained powder. For comparison, the primary crushing and the secondary crushing were performed by a shear crusher without using a long substrate as a raw material and performing preliminary crushing. However, in the comparative example, at the end of the secondary crushing, a sufficient pulverized product could not be obtained even under visual observation, and the valuable metal and the substrate layer could not be sufficiently separated from each other. Grinding was stopped at the end.
表２に示すように、実施例１〜６において、得られた粉体物の平均粒径（Ｄ５０）は、２００〜３６０μｍとなり、プリント基板屑を粉状に粉砕することができた。また、目視にて、プリント基板屑が良好に粉砕され、かつ、有価金属と基板層とが十分に剥離されていることが確認された。 As shown in Table 2, in Examples 1 to 6, the average particle size (D50) of the obtained powdery material was 200 to 360 µm, and the printed circuit board dust could be pulverized into powder. In addition, it was confirmed by visual inspection that the printed circuit board dust was satisfactorily pulverized, and that the valuable metal and the substrate layer were sufficiently separated.
１５０ｋｇ／ｈの処理能力を有する風力選別機であるミクロンセパレータ（ホソカワミクロン製：ＭＳ−１Ｈ）を用いて、上記の粉砕処理により得られた粉体物から銅滓及び樹脂の回収を行った。なお、粉体物に含まれる銅品位、銅量はＩＣＰ法にて測定して評価した。 Using a micron separator (manufactured by Hosokawa Micron: MS-1H), which is a wind separator having a processing capacity of 150 kg / h, copper slag and resin were recovered from the powder obtained by the above pulverization. The copper grade and the amount of copper contained in the powder were measured and evaluated by the ICP method.
実施例１から実施例６で得られた合計の粉体物１８４ｋｇには、５０ｋｇのＣｕが含まれていたが、５６ｋｇの銅滓と１２８ｋｇの樹脂に分離された。
回収された樹脂成分の銅品位は５％未満であり、銅滓と樹脂とを有効に分離でき、また、高い回収率で銅滓成分が得られることが明らかとなった。
Although 184 kg of the total powder obtained in Examples 1 to 6 contained 50 kg of Cu, it was separated into 56 kg of copper slag and 128 kg of resin.
The copper quality of the recovered resin component was less than 5%, which revealed that copper slag and the resin could be effectively separated, and that the copper slag component could be obtained at a high recovery rate.
以上、本発明の実施例について詳述したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited to the specific embodiments, and various modifications and changes may be made within the scope of the present invention described in the appended claims. Changes are possible.
Claims (7)
前記第１工程後の粉砕物を、スクリーン径が前記第１工程で使用されるハンマーミルよりも小さいハンマーミルにより粉砕する第２工程と、
前記第２工程後の粉砕物を、前記第１工程で用いたハンマーミル及び前記第２工程で用いたハンマーミルの周速よりも周速が速い高速ハンマーミルにより粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする第３工程と、
を有することを特徴とするプリント基板屑の粉砕方法。 A first step of pulverizing printed circuit board waste with a hammer mill ;
A second step of pulverizing the pulverized product after the first step with a hammer mill having a screen diameter smaller than the hammer mill used in the first step;
The pulverized product after the second step is pulverized by a hammer mill used in the first step and a high-speed hammer mill having a higher peripheral speed than the peripheral speed of the hammer mill used in the second step. ) and a third step of the powder of 200Myuemu～360myuemu,
A method for pulverizing printed circuit board debris, comprising:
前記第１工程後の粉砕物を、スクリーン径が前記第１工程で使用されるハンマーミルよりも小さいハンマーミルにより粉砕する第２工程と、
前記第２工程後の粉砕物を、前記第１工程で用いたハンマーミル及び前記第２工程で用いたハンマーミルの周速よりも周速が速い高速ハンマーミルにより粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする第３工程と、
前記粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、前記粉体物から有価金属を回収する第４工程と、
を有することを特徴とするプリント基板屑からの有価金属の回収方法。 A first step of pulverizing printed circuit board waste with a hammer mill ;
A second step of pulverizing the pulverized product after the first step with a hammer mill having a screen diameter smaller than the hammer mill used in the first step;
The pulverized product after the second step is pulverized by a hammer mill used in the first step and a high-speed hammer mill having a higher peripheral speed than the peripheral speed of the hammer mill used in the second step. ) and a third step of the powder of 200Myuemu～360myuemu,
A fourth step of separating the powder material into a powder material containing valuable metal as a main component and the other by a wind separator, and recovering the valuable metal from the powder material;
A method for recovering valuable metals from printed circuit board waste, comprising:
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| JPH05329841A (en) * | 1992-06-03 | 1993-12-14 | Nec Corp | Method for recovering valuables from printed circuit board |
| JPH06228667A (en) * | 1992-10-19 | 1994-08-16 | Nec Corp | Method for separating and recovering valuables from printed board |
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