JPH0760227A - Recovery of valuables from printed circuit board - Google Patents

Recovery of valuables from printed circuit board

Info

Publication number
JPH0760227A
JPH0760227A JP5207423A JP20742393A JPH0760227A JP H0760227 A JPH0760227 A JP H0760227A JP 5207423 A JP5207423 A JP 5207423A JP 20742393 A JP20742393 A JP 20742393A JP H0760227 A JPH0760227 A JP H0760227A
Authority
JP
Japan
Prior art keywords
metal
circuit board
printed circuit
copper
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5207423A
Other languages
Japanese (ja)
Inventor
Masatoshi Ichi
正年 位地
Sadahiko Yokoyama
貞彦 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5207423A priority Critical patent/JPH0760227A/en
Publication of JPH0760227A publication Critical patent/JPH0760227A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits

Abstract

PURPOSE:To inexpensively separate and recover valuables such as a metal or the like by grinding a printed circuit board within an average particle size range and separating the ground matter into a metal component such as copper or the like and other components such as a resin, a filler or the like by a specific gravity separator to recover those components. CONSTITUTION:When a printed circuit board containing a glass fiber, a resin and a metal as constituents or the substrate loaded with electronic parts is utilized as resources, the printed circuit board is ground within the average particle size range of 50mum-below 800mum and the ground matter is separated into a metal component such as copper or the like and other components such as a resin, filler or the like to be recovered. That is, the ground matter is separated into a coarse powder containing a large amt. of a hardly ground metal having high specific gravity such as copper and a fine powder containing a large amt. of a component other than a metal such as a resin or filler by classifying operation. The separated metal such as copper is reutilized as metal resources high in value added and the remaining fine ground matter is utilized as the filler of a building material or structural material.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電気機器に用いられる
プリント基板、部品を搭載したプリント基板およびこれ
らの製造工程で発生する枠材などの成形残を所定の粉砕
粒径で粉砕し、これを比重分離することによって、これ
らの構成成分の銅などの金属と、樹脂や充填材とを効率
よく分離し、回収する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention crushes a molding board such as a printed circuit board used for electric equipment, a printed circuit board on which parts are mounted and a frame material generated in the manufacturing process thereof into a predetermined crushed particle size, and The present invention relates to a method of efficiently separating and recovering a metal such as copper, which is a constituent component thereof, from a resin or a filler by performing specific gravity separation of.

【0002】[0002]

【従来の技術】ガラス繊維、樹脂、金属を構成成分とす
るプリント基板やこれに電子部品を搭載した基板(以下
部品搭載基板と称す)の再資源化方法としては。焼却処
理し、熱エネルギーを回収する方法が一部で実施されて
いる。更に、プリント基板等の複合材料からガラス繊維
等の有価物を回収する方法としては、これら複合材料中
の樹脂分を炭化させた後分級を行い、銅などの有価物を
分離回収する方法がある。(特開平2−88725号公
報)
2. Description of the Related Art As a method of recycling a printed circuit board having glass fiber, resin or metal as a constituent component, or a circuit board on which electronic parts are mounted (hereinafter referred to as a component mounting board). Some methods of incineration and recovery of heat energy are implemented. Further, as a method of recovering valuable materials such as glass fibers from a composite material such as a printed circuit board, there is a method of carbonizing a resin component in these composite materials and then classifying them to separate and recover valuable materials such as copper. . (JP-A-2-88725)

【発明が解決しようとする課題】上記のようなプリント
基板や部品搭載基板の焼却処理や炭化処理では、さまざ
まな廃ガスが発生するため、高度な廃ガス処理設備を設
置しなければならず、さらにプリント基板や部品搭載基
板に含まれる有価金属成分が酸化されやすくなり、回収
した場合の付加価値が低減することが懸念される。他の
再資源化の方法としてはプリント基板上の銅などをエッ
チングすることも考えられるが、廃水処理や銅の回収に
大規模な設備を要するので実際的ではない。以上のよう
に、プリント基板や部品搭載基板およびこれらの製造工
程での成形残から金属などの有価物を効率よく低コスト
で分離回収する方法は大きな課題であった。
Since various waste gases are generated in the incineration treatment and carbonization treatment of the printed circuit board and the component mounting board as described above, it is necessary to install an advanced waste gas treatment facility. Furthermore, the valuable metal component contained in the printed circuit board or the component mounting board is likely to be oxidized, and there is a concern that the added value when recovered is reduced. As another method for recycling, etching copper or the like on a printed circuit board can be considered, but it is not practical because large-scale equipment is required for wastewater treatment and copper recovery. As described above, a method of efficiently separating and recovering valuable materials such as metals from a printed circuit board, a component mounting board, and a molding residue in the manufacturing process thereof at low cost has been a big problem.

【0003】[0003]

【課題を解決するための手段】本発明のプリント基板か
らの有価物の回収方法は、プリント基板および部品を搭
載したプリント基板からの有価物を分離回収する方法で
あって、当プリント基板を平均粒径で50μm以上、8
00μm未満の範囲で粉砕した後、比重分離機によっ
て、銅等の金属成分と、樹脂や充填材などの他の成分と
に分離し回収することを特徴とする。
A method of recovering valuables from a printed circuit board according to the present invention is a method of separating and recovering valuables from a printed circuit board on which a printed circuit board and components are mounted. 50 μm or more in particle size, 8
It is characterized in that after pulverizing in a range of less than 00 μm, it is separated and recovered into a metal component such as copper and other components such as a resin and a filler by a specific gravity separator.

【0004】[0004]

【実施例】本発明では、粉砕の平均粒径が50μm以上
で、800μm未満であり、50μm未満だと金属が他
の成分とともに微粉砕されすぎてしまい、比重分離した
際の金属と他の成分の分離効率が低下し、また800μ
m以上だと金属と他の成分の破壊分離が不十分で同様に
分離効率が低下してしまう。
EXAMPLES In the present invention, the average particle size of pulverization is 50 μm or more and less than 800 μm, and if it is less than 50 μm, the metal is finely pulverized with other components too much, and the metal and other components at the time of specific gravity separation are separated. Separation efficiency is reduced, and
If it is m or more, the destructive separation of the metal and other components is insufficient, and the separation efficiency is similarly reduced.

【0005】本発明で対象とするプリント基板や部品搭
載基板およびこれらの成形残としては通常電気機器に使
用されているものを指す。プリント基板は樹脂成分、充
填材成分および回路などの金属成分からなるものであ
り、充填材としてはガラス繊維、紙 、カーボン繊維等
が挙げられ、樹脂としてはエポキシ樹脂、フェノール樹
脂、ポリイミド樹脂等(硬化剤や各種添加剤を含有す
る)が挙げられ、さらに金属としては銅、アルミ、鉄、
ニッケル、ハンダ(錫と鉛)などが挙げられる。さらに
ここでの部品搭載基板とは上記のプリント基板にICパ
ッケージなどの電子部品が搭載されたものである。成形
残とはプリント基板製造時に枠材や銅張りプレプリグの
不良品、およびこれらの加熱硬化体などを指し、構成成
分が製品のプリント基板と同じのもを指す。
The printed circuit board, the component mounting board, and the molding residue thereof targeted by the present invention are those usually used in electric equipment. The printed circuit board is composed of a resin component, a filler component, and a metal component such as a circuit. Examples of the filler include glass fiber, paper, carbon fiber, etc., and the resin includes epoxy resin, phenol resin, polyimide resin, etc. (Including a curing agent and various additives), as the metal, copper, aluminum, iron,
Examples include nickel and solder (tin and lead). Further, the component mounting board here is an electronic component such as an IC package mounted on the printed board. The molding residue refers to defective products such as a frame material and a copper-clad prepreg during the production of a printed circuit board, and a heat-cured body of these, and those having the same constituent components as the printed circuit board of the product.

【0006】本発明における粉砕機としては切断、せん
断および衝撃の機構を持つものが好ましく、特に、これ
らの機構を持つ粗粉砕機と、せん断と衝撃と機構ととも
に所定の粉砕径以下になるまで粉砕物を気流で循環する
機構を持つ微粉砕機との組み合わせが好ましい。例え
ば、(株)オリエント社製のオリエントミルで粗粉砕し
た後(株)セイシン企業製のインペラーミルで微粉砕す
る組み合わせや、通常のシュレッダーで粗粉砕した後、
上記のインペラーミルで微粉砕する組合わせが挙げられ
る。
As the crusher in the present invention, those having a mechanism of cutting, shearing and impact are preferable, and in particular, a coarse crusher having these mechanisms and crushing together with the mechanism of shearing, impacting and crushing to a predetermined crushing diameter or less. A combination with a fine pulverizer having a mechanism for circulating an object with an air stream is preferable. For example, a combination of coarsely crushed with an Orient Mill manufactured by Orient Co., Ltd. and then finely crushed with an impeller mill manufactured by Seishin Enterprise Co., Ltd., or after roughly crushed with an ordinary shredder,
A combination of finely pulverizing with the above-mentioned impeller mill can be mentioned.

【0007】比重分離機とは粉体を比重別に選別する装
置ではあるが、粉体を分離した後の後処理が容易で実際
的な乾式分級機が好ましく、特に遠心分級機が好まし
い。この分級操作によって、粉砕物は粗粉と微粉に別
れ、粉砕されにくくてかつ比重の重い銅などの金属は粗
粉中に多く含有され、樹脂や充填材などの金属以外の成
分が微粉中に多く含有される。この際の気流の流速や装
置の形状などの分離条件によって回収する粗粉と微粉の
割合は異なり、粗粉の割合が極端に多いと、これに含有
される金属の濃度が減少し、この後の金属の精製に手間
がかかる。また微粉の割合が極端に多いと微粉中に残留
する金属成分が多くなり、この後この微粉を有効利用し
にくくなる。そこで分離する粗粉の全体に対する割合は
20重量%以上70重量%未満が好ましい。このように
して分離できた銅等の金属は、酸化されていないため付
加価値の高い金属資源として再利用でき、残ったガラス
繊維などの充填材と樹脂の微粉砕物は、建材や構造材な
どの充填材として有効に利用できる。
The specific gravity separator is an apparatus for sorting powders by specific gravity, but a dry type classifier is preferable because it is easy to post-process after separating the powders, and a centrifugal classifier is particularly preferable. By this classification operation, the pulverized product is divided into coarse powder and fine powder, and metal such as copper, which is difficult to be pulverized and has a high specific gravity, is contained in the coarse powder, and components other than metal such as resin and filler are contained in the fine powder. Contains a lot. At this time, the ratio of the coarse powder and the fine powder to be recovered differs depending on the separation conditions such as the flow velocity of the air flow and the shape of the device.If the ratio of the coarse powder is extremely large, the concentration of the metal contained in this will decrease. It takes time to refine the metal. Further, if the proportion of the fine powder is extremely large, the amount of metal components remaining in the fine powder increases, and thereafter it becomes difficult to effectively use the fine powder. Therefore, the ratio of the coarse powder to be separated to the whole is preferably 20% by weight or more and less than 70% by weight. Metals such as copper that have been separated in this way can be reused as high-value-added metal resources because they have not been oxidized, and the remaining fillers such as glass fiber and finely pulverized resin can be used as building materials, structural materials, etc. It can be effectively used as a filler.

【0008】以下、本発明による実験データについて説
明する。
The experimental data according to the present invention will be described below.

【0009】図1に実験データ1〜8と図2に比較デー
タ1〜7を示す。銅パターン付きガラス繊維強化エポシ
キ樹脂製(ガラスエポシキと略す)のプリント基板(組
成銅;30重量%、ガラス繊維;20重量%、エポキシ
樹脂;50重量%)銅パターン付き紙−フェノール樹脂
製(紙−フェノールと略す)プリント基板(組成は銅;
30重量%、紙;20重量%、フェノール樹脂;50重
量%)および部品搭載基板(上記銅パターン付きガラス
繊維強化エポキシ樹脂製プリント基板)にICパッケー
ジ、コネクタ等の電子部品を搭載したもの(組成は銅;
33重量%、他はエポキシ樹脂、ガラス繊維、シリカ粉
等)を(株)オリエント製オリエントミル(VM50
型)によって4mm以下に微粉砕し、次いで微粉砕機と
して(株)セイシン企業製インペラーミル(IMP−4
00型)により表中の平均粒径になるまで微粉砕する。
これを遠心分級機として(株)セイシン企業製マイクロ
ンクラッシファイヤー(OMC−900型)により表中
の割合で粗粉と微粉に分離する。この分離した粗粉中に
は微粉より銅が濃縮しているのでこれから銅を回収す
る。表中に回収した粉中の銅の含有率を示す。またここ
で銅の回収率としてプリント基板体全の銅の含量に対す
る粗粉中の銅の含量の割合を示す。
FIG. 1 shows experimental data 1 to 8 and FIG. 2 shows comparative data 1 to 7. Printed circuit board made of glass fiber reinforced epoxy resin with copper pattern (abbreviated as glass epoxy) (composition copper; 30% by weight, glass fiber; 20% by weight, epoxy resin; 50% by weight) Copper pattern paper-phenolic resin (paper -Printed circuit board (abbreviated as phenol) (composition is copper;
30% by weight, 20% by weight of paper; 50% by weight of phenol resin) and a component mounting board (the above-mentioned glass-fiber-reinforced epoxy resin printed board with a copper pattern) on which electronic components such as IC packages and connectors are mounted (composition) Is copper;
33% by weight, the other is epoxy resin, glass fiber, silica powder, etc. Orient Mill Orient Mill (VM50
Type) and finely pulverized to 4 mm or less, and then used as a fine pulverizer as an impeller mill (IMP-4 manufactured by Seishin Enterprise Co., Ltd.).
(00 type) until finely pulverized to the average particle size shown in the table.
Using this as a centrifugal classifier, Micron Classifier (OMC-900 type) manufactured by Seishin Enterprise Co., Ltd. is used to separate into coarse powder and fine powder at the ratios shown in the table. Since copper is concentrated in the separated coarse powder rather than fine powder, copper is recovered from this. The content rate of copper in the recovered powder is shown in the table. Further, here, as the copper recovery rate, the ratio of the content of copper in the coarse powder to the content of copper in the entire printed circuit board is shown.

【0010】以上実験データと比較データを比較して明
らかなとうり、本発明の範囲内の平均粒径に粉砕し比重
分離すると、他の範囲のものに比べて粗粉中には銅が濃
縮し、高効率で回収することができ、さらに微粉中の銅
の残存量も少なくなるため、構造材、建材、絶縁材等の
充填材などに有効に再利用できる。
As is clear from the comparison between the experimental data and the comparative data, when crushed to an average particle size within the range of the present invention and separated by specific gravity, copper is more concentrated in the coarse powder than in other ranges. However, since it can be recovered with high efficiency and the amount of copper remaining in the fine powder is reduced, it can be effectively reused as a filler such as a structural material, a building material, and an insulating material.

【0011】[0011]

【発明の効果】本発明によれば、これまで困難だったプ
リント基板、部品搭載基板、およびこれらの製造時に発
生する成形残から効率的に金属と他の成分を分離回収で
き、資源として効果的に有効利用できる。
According to the present invention, the metal and other components can be efficiently separated and recovered from the printed circuit board, the component mounting board, and the molding residue generated at the time of manufacturing these, which has been difficult until now, and is effective as a resource. Can be used effectively.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による実験データFIG. 1 Experimental data according to the present invention

【図2】比較データ[Figure 2] Comparison data

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 プリント基板および部品を搭載したプリ
ント基板からの有価物を分離回収する方法であって、当
プリント基板を平均粒径で50μm以上、800μm未
満の範囲で粉砕した後、比重分離機によって、銅等の金
属成分と、樹脂や充填材などの他の成分とに分離し回収
することを特徴とするプリント基板からの有価物の回収
方法。
1. A method for separating and recovering valuables from a printed circuit board and a printed circuit board on which components are mounted, the specific gravity separator after crushing the printed circuit board in an average particle size of 50 μm or more and less than 800 μm. A method of recovering a valuable material from a printed circuit board, characterized by separating and recovering a metal component such as copper and other components such as a resin and a filler by means of the method.
JP5207423A 1993-08-23 1993-08-23 Recovery of valuables from printed circuit board Pending JPH0760227A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5207423A JPH0760227A (en) 1993-08-23 1993-08-23 Recovery of valuables from printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5207423A JPH0760227A (en) 1993-08-23 1993-08-23 Recovery of valuables from printed circuit board

Publications (1)

Publication Number Publication Date
JPH0760227A true JPH0760227A (en) 1995-03-07

Family

ID=16539514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5207423A Pending JPH0760227A (en) 1993-08-23 1993-08-23 Recovery of valuables from printed circuit board

Country Status (1)

Country Link
JP (1) JPH0760227A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1177836A (en) * 1997-09-11 1999-03-23 Matsushita Electric Ind Co Ltd Porous structural molded object and its production
US6300402B1 (en) 1996-01-04 2001-10-09 Resource Concepts, Inc. Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards
KR100421937B1 (en) * 2001-07-16 2004-03-12 오치정 Method for recovering high-value metals from waste printed circuit boards
JP2004121892A (en) * 2002-09-30 2004-04-22 Sumitomo Wiring Syst Ltd Method for recycling electric connection box
CN100444978C (en) * 2006-01-09 2008-12-24 同济大学 Multi-lateral-line solid fluidization pneumatic transfer separation device and method of printed circuit board
JP2010036112A (en) * 2008-08-05 2010-02-18 Sharp Corp Method for processing light emitting diode (led)-built-in product
JP2017154134A (en) * 2016-02-26 2017-09-07 Jx金属株式会社 Pulverization method of printed circuit board scrap, and recovery method of valuable metal from printed circuit board scrap
JP2019037944A (en) * 2017-08-25 2019-03-14 Jx金属株式会社 Printed circuit board scrap crushing device and printed circuit board scrap crushing method
CN111318556A (en) * 2020-04-15 2020-06-23 珠海安能环境科学研究院有限公司 Method for recycling waste epoxy resin of HW13 and waste printing ink slag powder of HW12

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4897157A (en) * 1972-03-23 1973-12-11
JPS5427272A (en) * 1977-08-01 1979-03-01 Sumitomo Bakelite Co Ltd Method of separating and recovering metals and insulating materials from waste print circuit board with metals attached thereto
JPS55121871A (en) * 1979-03-10 1980-09-19 Toyota Motor Co Ltd Method of separating plastic foaming body and metal
JPS5613050A (en) * 1979-07-12 1981-02-07 Hosokawa Micron Kk Method of separating phenol resin and copper component from print substrate waste material
JPS594485A (en) * 1982-06-29 1984-01-11 Saburo Nishimura Separation of waste composite plastic material
JPS5952695B2 (en) * 1978-02-20 1984-12-21 株式会社細川粉体工学研究所 Method for separating copper components from printed circuit board waste
JPH02218486A (en) * 1989-02-21 1990-08-31 Sanko:Kk Recovery of metal copper from cutting refuse of printed circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4897157A (en) * 1972-03-23 1973-12-11
JPS5427272A (en) * 1977-08-01 1979-03-01 Sumitomo Bakelite Co Ltd Method of separating and recovering metals and insulating materials from waste print circuit board with metals attached thereto
JPS5952695B2 (en) * 1978-02-20 1984-12-21 株式会社細川粉体工学研究所 Method for separating copper components from printed circuit board waste
JPS55121871A (en) * 1979-03-10 1980-09-19 Toyota Motor Co Ltd Method of separating plastic foaming body and metal
JPS5613050A (en) * 1979-07-12 1981-02-07 Hosokawa Micron Kk Method of separating phenol resin and copper component from print substrate waste material
JPS594485A (en) * 1982-06-29 1984-01-11 Saburo Nishimura Separation of waste composite plastic material
JPH02218486A (en) * 1989-02-21 1990-08-31 Sanko:Kk Recovery of metal copper from cutting refuse of printed circuit board

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300402B1 (en) 1996-01-04 2001-10-09 Resource Concepts, Inc. Compositions created by the separation and isolation of the metallic and non-metallic constituent components of printed wiring assemblies and printed wiring boards
JPH1177836A (en) * 1997-09-11 1999-03-23 Matsushita Electric Ind Co Ltd Porous structural molded object and its production
KR100421937B1 (en) * 2001-07-16 2004-03-12 오치정 Method for recovering high-value metals from waste printed circuit boards
JP2004121892A (en) * 2002-09-30 2004-04-22 Sumitomo Wiring Syst Ltd Method for recycling electric connection box
CN100444978C (en) * 2006-01-09 2008-12-24 同济大学 Multi-lateral-line solid fluidization pneumatic transfer separation device and method of printed circuit board
JP2010036112A (en) * 2008-08-05 2010-02-18 Sharp Corp Method for processing light emitting diode (led)-built-in product
JP2017154134A (en) * 2016-02-26 2017-09-07 Jx金属株式会社 Pulverization method of printed circuit board scrap, and recovery method of valuable metal from printed circuit board scrap
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CN111318556A (en) * 2020-04-15 2020-06-23 珠海安能环境科学研究院有限公司 Method for recycling waste epoxy resin of HW13 and waste printing ink slag powder of HW12

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