CN100506407C - Combined type processing method for waste printed wiring board - Google Patents
Combined type processing method for waste printed wiring board Download PDFInfo
- Publication number
- CN100506407C CN100506407C CNB2006101131104A CN200610113110A CN100506407C CN 100506407 C CN100506407 C CN 100506407C CN B2006101131104 A CNB2006101131104 A CN B2006101131104A CN 200610113110 A CN200610113110 A CN 200610113110A CN 100506407 C CN100506407 C CN 100506407C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- waste printed
- printed circuit
- carried out
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a combined disposing method of waste printing circuit board in the resource utilizing domain, which comprises the following steps: predisposing waste circuit board through vacuum low-temperature pyrolytic technology at 235-250 deg.c, adopting cutting typed grinder to grind the circuit board, sieving the grinded product, separating the copper in the product from glass fiber, extracting the tail gas through vacuum pump less than 1000Pa, adsorbing through activated charcoal to eliminating pollution.
Description
Technical field
The present invention relates to the waste printed circuit board recovery and utilization technology, particularly a kind of combination high-efficiency is handled the process of waste printed circuit board, belongs to the recycling field.
Background technology
Printed substrate is the important composition parts in the various electric equipment products.Along with the information industry high speed development, produced a large amount of waste printed circuit boards, need handle and recycling.
Containing brominated flame-retardant, each heavy metal species composition etc. in the waste printed circuit board may impact environment and health, but waste printed circuit board also is a valuable resource, wherein contains the recyclable compositions that utilize such as a large amount of metals, plastics.So the recycling of carrying out waste printed circuit board is extremely important.
Mechanical approach is a modal method during current waste printed circuit board is recycled, but current mechanical approach still exists following problem:
(1) disintegrating apparatus requires height, the cutter material serious wear, and current material and facility prepares under the level in China, is the bottleneck factor of restriction to China's waste printed circuit board fragmentation;
(2) for realizing the higher rate of recovery, need waste printed circuit board is crushed to low particle size range, make on the one hand follow-up separating technology complexity to make the energy consumption height on the other hand, the broken time is long, and secondary pollution is serious.
Summary of the invention
The object of the present invention is to provide that a kind of technology is simple, the equipment requirement is low, organic efficiency is high, energy consumption is low and little, the waste printed circuit board combination high-efficiency treatment process method in synthetic temperature stage of especially can avoiding there is dioxin in other pyrolytic techniques once more to ambient influnence.
A kind of combined type processing method for waste printed wiring board that the present invention proposes, it is characterized in that: this method at first adopts the vacuum and low temperature pyrolytic technique that waste printed circuit board is carried out preliminary treatment, adopt shear crusher that the wiring board after handling is carried out fragmentation then, product after the fragmentation is through sorting, copper separates with glass fibre in the sorting product, reach the purpose that waste printed circuit board is recycled, produce tail gas and extract out by vavuum pump and discharge after the charcoal absorption destroy contaminants, described method is carried out successively as follows:
(1) waste printed circuit board is placed in the vacuum pyrolysis device, heating starts vavuum pump simultaneously, keeps vacuum and is lower than 1000Pa;
(2) treat that temperature rises to 235-250 degrees centigrade in the pyrolysis installation, stop heating, the cooling of insulation back;
(3) treat that temperature is cooled to room temperature in the pyrolysis installation after, close vavuum pump, open pyrolysis installation and take out waste printed circuit board;
(4) utilize disintegrating machine that waste printed circuit board after preliminary treatment is carried out fragmentation;
(5) broken afterproduct is carried out sorting.
Use proof, total metal degree of dissociation can reach 100%, and metal recovery rate can reach more than 98%.
The specific embodiment
Below in conjunction with embodiment technical scheme of the present invention is described further:
The present invention at first adopts the vacuum and low temperature pyrolytic technique that waste printed circuit board is carried out preliminary treatment, adopt shear crusher that the wiring board after handling is carried out fragmentation then, product after the fragmentation is through sorting, copper separates with glass fibre in the sorting product, reach the purpose that waste printed circuit board is recycled, produce tail gas and extract out by vavuum pump and after the charcoal absorption destroy contaminants, discharge.
The technical method that the present invention proposes specifically comprises:
1. waste printed circuit board is placed in the vacuum pyrolysis device, starts the pyrolysis installation heating; Start vavuum pump simultaneously, keep vacuum and be lower than 1000Pa;
2. treat that temperature rises to 235-250 degrees centigrade in the pyrolysis installation, stop heating, be incubated cooling after 10 minutes;
3. after treating that temperature is cooled to room temperature in the pyrolysis installation, close vavuum pump, open pyrolysis installation and take out waste printed circuit board.
4. utilize shear crusher to adopt the 2mm screen cloth that waste printed circuit board after preliminary treatment is carried out fragmentation, judge, determine the broken time according to sound.
Broken afterproduct is carried out sorting, and size range of separation can be divided into〉2mm/2mm-0.074mm/<0.074mm Three Estate.
Embodiment 1
1. waste printed circuit board is placed in the vacuum pyrolysis device, starts the pyrolysis installation heating; Start vavuum pump simultaneously, keep vacuum 100Pa;
2. treat that temperature rises to 250 degrees centigrade in the pyrolysis installation, stop heating, be incubated 10 minutes;
3. treat in the pyrolysis installation that temperature is cooled to (after about 4 hours) after the room temperature, close vavuum pump, open pyrolysis installation and take out wiring board;
4. the waste printed circuit board sample carries out fragmentation after utilizing angle cut disintegrating machine to preliminary treatment, adopts the 2mm screen cloth;
5. broken back product is put into electronic vibrating sieving machine and is sieved, and the screening grade is divided into〉2mm/2mm-0.074mm/<0.074mm;
6. result: the metal degree of dissociation can reach 100%, and metal recovery rate can reach more than 98%.Staying on the 2mm screen cloth in the screening product is glass fibre, is copper on the middle-bracket screen cloth, and on the 0.074mm screen cloth is toner.
Embodiment 2 (Comparative Examples)
1. utilize angle cut disintegrating machine that waste printed circuit board sample after the preliminary treatment is not carried out fragmentation, adopt the 2mm screen cloth;
2. broken back product is put into electronic vibrating sieving machine and is sieved, and the screening grade is divided into〉2mm/2mm-0.074mm/<0.074mm;
3. result: total metal degree of dissociation 55.34%, the screening product separates not significantly on each screen cloth, and metal ingredient and glass fibre mix mutually, and metal recovery rate is very low.
Claims (1)
1, a kind of combined type processing method for waste printed wiring board, it is characterized in that: this method at first adopts the vacuum and low temperature pyrolytic technique that waste printed circuit board is carried out preliminary treatment, adopt shear crusher that pretreated waste printed circuit board is carried out fragmentation then, product after the fragmentation is through sorting, copper separates with glass fibre in the sorting product, reach the purpose that waste printed circuit board is recycled, produce tail gas and extract out by vavuum pump and discharge after the charcoal absorption destroy contaminants, described method is carried out successively as follows:
(1) waste printed circuit board is placed in the vacuum pyrolysis device, heating starts vavuum pump simultaneously, keeps vacuum and is lower than 1000Pa;
(2) treat that temperature rises to 235-250 degrees centigrade in the vacuum pyrolysis device, stop heating, the cooling of insulation back;
(3) treat that temperature is cooled to room temperature in the vacuum pyrolysis device after, close vavuum pump, open the vacuum pyrolysis device and take out waste printed circuit board;
(4) utilize shear crusher that waste printed circuit board after preliminary treatment is carried out fragmentation;
(5) broken afterproduct is carried out sorting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101131104A CN100506407C (en) | 2006-09-15 | 2006-09-15 | Combined type processing method for waste printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101131104A CN100506407C (en) | 2006-09-15 | 2006-09-15 | Combined type processing method for waste printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1919483A CN1919483A (en) | 2007-02-28 |
CN100506407C true CN100506407C (en) | 2009-07-01 |
Family
ID=37777401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101131104A Expired - Fee Related CN100506407C (en) | 2006-09-15 | 2006-09-15 | Combined type processing method for waste printed wiring board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100506407C (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101992203B (en) * | 2010-11-02 | 2013-04-03 | 广东工业大学 | Vacuum pyrolysis test device of wasted electronic circuit board |
CN102151689B (en) * | 2010-12-07 | 2014-04-16 | 清华大学 | Laminate composite scrap thermal modification treatment equipment and method |
CN102218439A (en) * | 2011-01-24 | 2011-10-19 | 同济大学 | Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards |
CN103008083A (en) * | 2012-12-17 | 2013-04-03 | 清远市宏保环保科技有限公司 | Dry heating winnowing method for resin glass fiber powder |
CN108728647A (en) * | 2018-05-23 | 2018-11-02 | 中国科学院过程工程研究所 | A kind of recoverying and utilizing method of copper-based oily waste residue |
CN110434159A (en) * | 2019-08-26 | 2019-11-12 | 华南理工大学 | A method of quickly recycling copper foil in waste and old copper-clad plate |
-
2006
- 2006-09-15 CN CNB2006101131104A patent/CN100506407C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1919483A (en) | 2007-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101417284B (en) | Recovery method of waste circuit board value resource | |
CN101423898B (en) | Recovery method of waste circuit board | |
CN101444784B (en) | Method and device for high-efficiency recovery of waste circuit boards in vacuum | |
CN101642765B (en) | Recycling method of discarded circuit board | |
Wang et al. | Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control | |
Hadi et al. | Waste printed circuit board recycling techniques and product utilization | |
Huang et al. | Recycling of waste printed circuit boards: A review of current technologies and treatment status in China | |
CN100506407C (en) | Combined type processing method for waste printed wiring board | |
Li et al. | Recycle technology for recovering resources and products from waste printed circuit boards | |
CN101612628A (en) | The separation of each component material and recovery method in a kind of waste and old printed circuit board | |
CN102218439A (en) | Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards | |
RU2370329C2 (en) | Method of processing multi-component composite and combined materials, and that of using aforesaid separated components | |
CN108031702B (en) | Complete treatment equipment and treatment method for waste circuit board recovery | |
CN102350429A (en) | Method for separation and recovery of metal and nonmetal in waste printed circuit board | |
CN102671916A (en) | Recycling processing technology for waste circuit board | |
CN102441554A (en) | Method for recycling valuable resources of waste glass fiber reinforced plastics and waste circuit boards | |
Liu et al. | Impact of the operating conditions on the derived products and the reaction mechanism in vacuum pyrolysis treatment of the organic material in waste integrated circuits | |
CN100518969C (en) | Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method | |
CN103949461B (en) | A kind of method that uses near-critical water to separate and reclaim the each component material of waste and old circuit board | |
CN102172600A (en) | Comprehensive recovery method using vacuum pyrolysis oil of wastes like waste circuit boards | |
CN101352719A (en) | Recovery technique of waste circuit board | |
CN109092847B (en) | Method for pretreating and recycling nonmetal components of waste circuit board | |
CN102218440B (en) | E-waste disassembling recovery processing method | |
JPH0760227A (en) | Recovery of valuables from printed circuit board | |
Palaniappan et al. | Recycling of Solar Panels |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20170915 |