CN102218439A - Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards - Google Patents
Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards Download PDFInfo
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- CN102218439A CN102218439A CN2011100259027A CN201110025902A CN102218439A CN 102218439 A CN102218439 A CN 102218439A CN 2011100259027 A CN2011100259027 A CN 2011100259027A CN 201110025902 A CN201110025902 A CN 201110025902A CN 102218439 A CN102218439 A CN 102218439A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
Belonging to the technical field of environmental protection, the invention discloses a method for pyrolysis separation of valuable components from substrates of waste printed circuit boards. The method comprises the steps of: cutting substrates of waste printed circuit boards into pieces with a bi-toothed roll shearer; placing the pieces of the waste printed circuit boards in a pyrolysis reactor, sealing the reactor and putting it in a prolyzing furnace, and inputting nitrogen for 5-10min so as to ensure an anoxic atmosphere in the reactor; conducting programmed heating to the pyrolysis reactor to a temperature of 500-600 DEG C, stopping heating after keeping heating for 30-60min, taking out the pyrolysis reactor from the prolyzing furnace when pyrolytic oil is all collected, and leaving the reactor to cool naturally; after the pyrolysis reactor is cooled to room temperature, opening the pyrolysis reactor and taking out the pyrolyzed pieces of waste printed circuit boards, and placing the pieces in a standard sieve equipped with a hitting module; sieving the pieces of waste printed circuit boards in the standard sieve for 1-3min in vibration so as to obtain oversize products and undersize products, thus realizing separation and recycling of metal and nonmetal. The method of invention is characterized by simplicity, strong operationality and no secondary pollution, etc.
Description
Technical field
The invention belongs to environmental protection technical field, be specifically related to the method that a kind of abandoned printed circuit board substrate pyrolysis separates valuable component.
Background technology
(Printed circuitboards PCBs) as the important component part of electric equipment products, is widely used in computer and components and parts, communication apparatus, measurement and fields such as control instrument instrument, household electronic apparatus to printed substrate.In recent years, because the model change of electronics and information industry is quickened, cause a large amount of electron wastes to form, the quantity of waste printed circuit board increases with surprising rapidity year by year.According to estimates, waste printed circuit board shared proportion in electron wastes is about 3%.In addition, in the printed substrate production process, also can produce 1-2% left and right sides waste material and leftover pieces.Usually contain 30% plastics in the printed circuit board (PCB), 30% refractory oxides and greater than 40% metal, almost comprised elements all in the periodic table of elements, the grade of metal is equivalent to tens times of metal content in the common mineral to hundreds of times among the PCB, its potential value height; Because discarded PCB contains a large amount of heavy metals and other poisonous and harmful elements, as Polychlorinated biphenyls, lead, mercury, brominated flame retardant etc., as any stacking, landfill, or the mishandling serious environmental that must cause is polluted harm humans health simultaneously.
The useless existing processing method of PCBs mainly includes: one, open incineration or simple furnace cupola or pyrometallurgy, smelt mode with its acquisition high price component wherein by high-temp combustion, mainly be some precious metals (as: gold, silver, copper etc.), resinous principle wherein then in this process thermal cracking and form be discharged into and in the environment environment had great harm De dioxins materials; Two, hydrometallurgical technology, with strong acid such as the concentrated sulfuric acids, the metal lixiviate is come out among the PCBs that will give up, and adopts the method for electrolysis to extract wherein high value component again, this process is easy to generate a large amount of acid waste waters, and the increase processing cost; Three, the physical separation recovery and treatment method, this technology mainly be utilize metal and nonmetal between differences of physical properties (as density, magnetic, electric conductivity etc.) method that above-mentioned two class materials among the useless PCBs are carried out sorting, as Granted publication number a kind of for the patent of invention of CN1233479C discloses " physics of metal concentrate reclaims technology in the waste printed circuit board ", this method is after waste printed circuit board is removed components and parts, use the double teeth roller cutter that its extruding is become size fritter uniformly with splitting, and then in the impact grinder the useless circuit board of fritter further is broken into certain particle diameter, and make metal and nonmetal being dissociated, classify by particle diameter by the material of multi-deck screen after fragmentation, fine grained is isolated metal and nonmetal through electrostatic separation, and subparticle is then isolated metal and nonmetal by centrifugal separation technology.The common trait that the physics method reclaims the valuable component among the useless PCBs is must will give up the PCBs substrate crushing to very little particle size range, just can reach metal and nonmetallic elementary solution from, and different physical separation technology can only just can reach in certain particle size range than higher separative efficiency, therefore for the useless PCBs broken material after dissociating is efficiently separated, just must adopt multiple physical separation method serial or parallel connection to use, make operation become complicated, energy consumption increases, production cost significantly improves, and has the secondary pollution control problem of dust simultaneously.
Existing industrial treatment abandoned printed circuit board technology is used the two-stage fragmentation always, make wiring board be crushed to certain particle diameter once, and reach metal and nonmetallic dissociating, and utilize physical difference between the two to carry out sorting again, comprise gas choosing, magnetic separation, wet concentration, electrostatic separation etc.
Adopt above technical process, complex technical process, energy consumption is bigger, the efficiency of separation is subjected to material, broken degree of dissociation and process conditions to influence bigger, production efficiency is on the low side, the product secondary utilization rate that sub-elects is not high, and easily causes the second environmental pollution problem, is badly in need of it is carried out necessary improvement and redesign.
Summary of the invention
The purpose of this invention is to provide the method that a kind of abandoned printed circuit board pyrolysis separates valuable component, this method is simple to operate, valuable component rate of recovery height, and energy consumption is low, ambient influnence is little, is specially adapted to the broken full recycling of nothing of abandoned printed circuit board substrate valuable component.
Technical scheme of the present invention is as follows:
The invention provides the method that a kind of abandoned printed circuit board pyrolysis separates valuable component, this method may further comprise the steps:
(1) adopt the double teeth roller cutter that the abandoned printed circuit board substrate cut is become fragment;
(2) the abandoned printed circuit board fragment is positioned in the pyrolysis reactor, sealed reactor is put into pyrolysis oven, and logical nitrogen 5-10min guarantees to be in the reactor anaerobic atmosphere;
(3) temperature programming heating pyrolysis reactor keeps 30-60min to 500-600 ℃, stops to heat up, and after waiting to have collected pyrolysis oil, takes out pyrolysis reactor from pyrolysis oven, naturally cooling;
(4) treat the pyrolysis reactor cool to room temperature after, the waste printed circuit board fragment after opening pyrolysis reactor and taking out pyrolysis, and being placed in the standard screen that the bump module is housed;
(5) to the printed substrate fragment vibration screening 1-3min in the standard screen, obtain oversize and screenings, realize that metal separates recovery with nonmetallic.
Described abandoned printed circuit board substrate is meant the abandoned printed circuit board substrate that does not contain electronic component.
Described fragment is meant that the length of side is less than 50mm square or rectangle fragment.
Described bump module is selected from hard material such as bloom that the diameter of axle is 1-3cm or hard rock.
Described oversize is meant the sheet Copper Foil that is retained on the standard screen.
Described screenings is meant by impact block and clashes into peel off granular nonmetal.
Use proof, Copper Foil and inorganic inert material reach 100% separate in the substrate.
The present invention compares with prior art, has following advantage and beneficial effect:
1, the present invention can effectively handle a large amount of waste materials and the leftover pieces that the printed wire production process produces, also can be applicable to remove the waste printed circuit base board of electronic component, it is broken to need not to carry out fine powder, can realize metal and nonmetallic effective the separation by simple external force effect, it is simple to have process, characteristics such as workable, non-secondary pollution have good social benefit, economic benefit and environmental benefit.
2, the inventive method is simple to operate, valuable component rate of recovery height, and energy consumption is low, and ambient influnence is little.
3, the inventive method is that the pyrolytic process process is handled replenishing of abandoned printed circuit board necessity and reinforcement, can realize that pyrolytic process applies to the abandoned printed circuit board metal as a kind of independently method and separates and resource recycling field with nonmetallic.
The specific embodiment
The present invention is further illustrated below in conjunction with embodiment.
The present invention at first shears abandoned printed circuit board, adopt the Non-oxygen pyrolytic technology that block abandoned printed circuit board is carried out preliminary treatment then, solid product after the pyrolysis is through the vibration bump scraping of bump module in the standard screen, realize separating of metal copper foil and inorganic material, reach the purpose of the classification recycling of solid product, the pyrolysis gas that produces is collected liquid product after condensation, uncondensed gas is through alkali lye and drier is eliminated sour gas and moisture is collected or emptying.
Embodiment 1
(1) the abandoned printed circuit board substrate cut is become 2cm * 2cm fragment;
(2) the abandoned printed circuit board fragment is positioned in the pyrolysis reactor, sealed reactor, logical nitrogen 5min, guaranteeing to react atmosphere is under the condition of anaerobic;
(3) temperature programming heating pyrolysis reactor to 550 ℃ keeps 60min, cools off naturally;
(4) treat the pyrolysis reactor cool to room temperature after, the waste printed circuit board fragment after opening pyrolysis reactor and taking out pyrolysis, and being placed in the standard screen that the about 2cm bloom of the diameter of axle is housed;
(5), obtain the granular nonmetal and sheet Copper Foil of being peeled off by the impact block bump that is retained on the standard screen respectively under the collection screen to the about 1min of printed substrate fragment vibration screening in the standard screen.
The result shows: Copper Foil and inorganic inert material reach 100% separate in the substrate.
Embodiment 2
(1) the abandoned printed circuit board substrate cut is become 3cm * 3cm fragment;
(2) the abandoned printed circuit board fragment is positioned in the pyrolysis reactor, sealed reactor, logical nitrogen 5min, guaranteeing to react atmosphere is under the condition of anaerobic;
(3) temperature programming heating pyrolysis reactor to 600 ℃ keeps 30min, cools off naturally;
When (4) treating the pyrolysis reactor cool to room temperature, remaining waste printed circuit board fragment after opening pyrolysis reactor and taking out pyrolysis, and be placed on and be equipped with in the standard screen that the diameter of axle is about the 2cm hard rock;
(5), obtain the granular nonmetal and sheet Copper Foil of being peeled off by the impact block bump that is retained on the standard screen respectively under the collection screen to the about 2min of printed substrate fragment vibration screening in the standard screen.
The result shows: Copper Foil and inorganic inert material reach 100% separate in the substrate.
The above-mentioned description to embodiment is can understand and apply the invention for ease of those skilled in the art.The person skilled in the art obviously can easily make various modifications to these embodiment, and needn't pass through performing creative labour being applied in the General Principle of this explanation among other embodiment.Therefore, the invention is not restricted to the embodiment here, those skilled in the art are according to announcement of the present invention, and not breaking away from the improvement that category of the present invention makes and revise all should be within protection scope of the present invention.
Claims (6)
1. an abandoned printed circuit board pyrolysis separates the method for valuable component, and it is characterized in that: this method may further comprise the steps,
(1) adopt the double teeth roller cutter that the abandoned printed circuit board substrate cut is become fragment;
(2) the abandoned printed circuit board fragment is positioned in the pyrolysis reactor, sealed reactor is put into pyrolysis oven, and logical nitrogen 5-10min guarantees to be in the reactor anaerobic atmosphere;
(3) temperature programming heating pyrolysis reactor keeps 30-60min to 500-600 ℃, stops to heat up, and after waiting to have collected pyrolysis oil, takes out pyrolysis reactor from pyrolysis oven, naturally cooling;
(4) treat the pyrolysis reactor cool to room temperature after, the waste printed circuit board fragment after opening pyrolysis reactor and taking out pyrolysis, and being placed in the standard screen that the bump module is housed;
(5) to the printed substrate fragment vibration screening 1-3min in the standard screen, obtain oversize and screenings, realize that metal separates recovery with nonmetallic.
2. a kind of abandoned printed circuit board pyrolysis according to claim 1 separates the method for valuable component, and it is characterized in that: described abandoned printed circuit board substrate is meant the abandoned printed circuit board substrate that does not contain electronic component.
3. a kind of abandoned printed circuit board pyrolysis according to claim 1 separates the method for valuable component, and it is characterized in that: described fragment is meant that the length of side is less than 50mm square or rectangle fragment.
4. a kind of abandoned printed circuit board pyrolysis according to claim 1 separates the method for valuable component, it is characterized in that: described bump module is selected from hard material such as bloom that the diameter of axle is 1-3cm or hard rock.
5. a kind of abandoned printed circuit board pyrolysis according to claim 1 separates the method for valuable component, and it is characterized in that: described oversize is meant the sheet Copper Foil that is retained on the standard screen.
6. a kind of abandoned printed circuit board pyrolysis according to claim 1 separates the method for valuable component, it is characterized in that: described screenings is meant by impact block and clashes into peel off granular nonmetal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100259027A CN102218439A (en) | 2011-01-24 | 2011-01-24 | Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards |
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| CN2011100259027A CN102218439A (en) | 2011-01-24 | 2011-01-24 | Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102716896A (en) * | 2012-06-14 | 2012-10-10 | 中国科学院生态环境研究中心 | Method for recycling copper foils and glass fibers in discarded circuit board by means of hydro-thermal treatment |
| CN103924086A (en) * | 2014-04-02 | 2014-07-16 | 上海交通大学 | Method for separating and recovering mixed metal concentrate obtained after electronic waste is crushed and separated |
| CN104451165A (en) * | 2014-12-18 | 2015-03-25 | 郴州市金贵银业股份有限公司 | Method for recovering nonferrous metals and rare-noble metals |
| CN104624605A (en) * | 2014-12-16 | 2015-05-20 | 上海交通大学 | Processing and recycling method for waste aluminum electrolytic capacitor |
| CN105018733A (en) * | 2015-07-09 | 2015-11-04 | 中国科学院金属研究所 | Method for enriching and separating bismuth elements in polymetallic mixed resource of waste printed circuit boards |
| CN105039705A (en) * | 2015-07-09 | 2015-11-11 | 中国科学院金属研究所 | Enrichment and separation method for antimony elements in discarded circuit board multi-metal mixed resource |
| WO2015196688A1 (en) * | 2014-06-23 | 2015-12-30 | 北京建筑材料科学研究总院有限公司 | Method for oriented pyrolysis of combustible waste |
| CN106623340A (en) * | 2015-10-28 | 2017-05-10 | 荆门市格林美新材料有限公司 | A cracking process and device for waste circuit boards |
| US9850433B2 (en) | 2015-12-31 | 2017-12-26 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of E-waste materials |
| CN107828974A (en) * | 2017-10-23 | 2018-03-23 | 广东绿晟环保股份有限公司 | A kind of waste printed circuit board combined treatment process |
| CN109252051A (en) * | 2018-11-28 | 2019-01-22 | 中南大学 | A method of being separated and recovered from Metals of Discarded Printed Circuit Boards |
| US10640711B2 (en) | 2018-06-05 | 2020-05-05 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of treated wood waste sources |
| CN112170451A (en) * | 2020-09-18 | 2021-01-05 | 浙江京城再生资源有限公司 | Circuit board metal recovery and residue reduction treatment method |
| CN113477671A (en) * | 2021-07-09 | 2021-10-08 | 陕西青朗万城环保科技有限公司 | Method for treating waste circuit board based on microwave |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1220876B1 (en) * | 1999-10-07 | 2005-04-20 | Hitachi Chemical Company, Ltd. | Method of treating epoxy resin-cured product |
| CN1899712A (en) * | 2005-07-18 | 2007-01-24 | 中国矿业大学(北京) | Method for recovering waste printed circuit board resource |
| CN1919483A (en) * | 2006-09-15 | 2007-02-28 | 清华大学 | Combined type processing method for waste printed wiring board |
| CN101386015A (en) * | 2008-10-31 | 2009-03-18 | 天津大学 | Metal and non-metal pyrogenation separation method on waste printed plate board |
| CN101444784A (en) * | 2008-12-22 | 2009-06-03 | 中南大学 | Method and device for high-efficiency recovery of waste circuit boards in vacuum |
| CN101767104A (en) * | 2009-12-21 | 2010-07-07 | 大连理工大学 | Pyrolysis based resource reclaiming process of waste circuit board |
-
2011
- 2011-01-24 CN CN2011100259027A patent/CN102218439A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1220876B1 (en) * | 1999-10-07 | 2005-04-20 | Hitachi Chemical Company, Ltd. | Method of treating epoxy resin-cured product |
| CN1899712A (en) * | 2005-07-18 | 2007-01-24 | 中国矿业大学(北京) | Method for recovering waste printed circuit board resource |
| CN1919483A (en) * | 2006-09-15 | 2007-02-28 | 清华大学 | Combined type processing method for waste printed wiring board |
| CN101386015A (en) * | 2008-10-31 | 2009-03-18 | 天津大学 | Metal and non-metal pyrogenation separation method on waste printed plate board |
| CN101444784A (en) * | 2008-12-22 | 2009-06-03 | 中南大学 | Method and device for high-efficiency recovery of waste circuit boards in vacuum |
| CN101767104A (en) * | 2009-12-21 | 2010-07-07 | 大连理工大学 | Pyrolysis based resource reclaiming process of waste circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 徐敏，李光明，贺文智，黄春洁: "废弃印刷线路板热解回收研究进展", 《化工进展》, vol. 25, no. 3, 31 March 2006 (2006-03-31), pages 297 - 300 * |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102716896B (en) * | 2012-06-14 | 2015-05-13 | 中国科学院生态环境研究中心 | Method for recycling copper foils and glass fibers in discarded circuit board by means of hydro-thermal treatment |
| CN102716896A (en) * | 2012-06-14 | 2012-10-10 | 中国科学院生态环境研究中心 | Method for recycling copper foils and glass fibers in discarded circuit board by means of hydro-thermal treatment |
| CN103924086A (en) * | 2014-04-02 | 2014-07-16 | 上海交通大学 | Method for separating and recovering mixed metal concentrate obtained after electronic waste is crushed and separated |
| CN103924086B (en) * | 2014-04-02 | 2016-05-18 | 上海交通大学 | The separation and recovery method of the hybrid metal enrich body after electron wastes cracking and sorting |
| WO2015196688A1 (en) * | 2014-06-23 | 2015-12-30 | 北京建筑材料科学研究总院有限公司 | Method for oriented pyrolysis of combustible waste |
| CN104624605A (en) * | 2014-12-16 | 2015-05-20 | 上海交通大学 | Processing and recycling method for waste aluminum electrolytic capacitor |
| CN104451165A (en) * | 2014-12-18 | 2015-03-25 | 郴州市金贵银业股份有限公司 | Method for recovering nonferrous metals and rare-noble metals |
| CN105018733B (en) * | 2015-07-09 | 2017-08-11 | 中国科学院金属研究所 | The enrichment of bismuth element and separation method in many metal mixed resources of waste printed circuit board |
| CN105018733A (en) * | 2015-07-09 | 2015-11-04 | 中国科学院金属研究所 | Method for enriching and separating bismuth elements in polymetallic mixed resource of waste printed circuit boards |
| CN105039705A (en) * | 2015-07-09 | 2015-11-11 | 中国科学院金属研究所 | Enrichment and separation method for antimony elements in discarded circuit board multi-metal mixed resource |
| CN106623340A (en) * | 2015-10-28 | 2017-05-10 | 荆门市格林美新材料有限公司 | A cracking process and device for waste circuit boards |
| US10961461B2 (en) | 2015-12-31 | 2021-03-30 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of e-waste materials |
| US9850433B2 (en) | 2015-12-31 | 2017-12-26 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of E-waste materials |
| US11814585B2 (en) | 2015-12-31 | 2023-11-14 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of e-waste materials |
| US11306255B2 (en) | 2015-12-31 | 2022-04-19 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of e-waste materials |
| CN107828974A (en) * | 2017-10-23 | 2018-03-23 | 广东绿晟环保股份有限公司 | A kind of waste printed circuit board combined treatment process |
| US10640711B2 (en) | 2018-06-05 | 2020-05-05 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of treated wood waste sources |
| CN109252051A (en) * | 2018-11-28 | 2019-01-22 | 中南大学 | A method of being separated and recovered from Metals of Discarded Printed Circuit Boards |
| CN112170451B (en) * | 2020-09-18 | 2021-11-12 | 浙江京城再生资源有限公司 | Circuit board metal recovery method |
| CN112170451A (en) * | 2020-09-18 | 2021-01-05 | 浙江京城再生资源有限公司 | Circuit board metal recovery and residue reduction treatment method |
| CN113477671A (en) * | 2021-07-09 | 2021-10-08 | 陕西青朗万城环保科技有限公司 | Method for treating waste circuit board based on microwave |
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Application publication date: 20111019 |