CN112170451B - Circuit board metal recovery method - Google Patents
Circuit board metal recovery method Download PDFInfo
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- CN112170451B CN112170451B CN202010990088.1A CN202010990088A CN112170451B CN 112170451 B CN112170451 B CN 112170451B CN 202010990088 A CN202010990088 A CN 202010990088A CN 112170451 B CN112170451 B CN 112170451B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/40—Destroying solid waste or transforming solid waste into something useful or harmless involving thermal treatment, e.g. evaporation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B1/00—Preliminary treatment of ores or scrap
- C22B1/005—Preliminary treatment of scrap
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0026—Pyrometallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G5/00—Incineration of waste; Incinerator constructions; Details, accessories or control therefor
- F23G5/02—Incineration of waste; Incinerator constructions; Details, accessories or control therefor with pretreatment
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G5/00—Incineration of waste; Incinerator constructions; Details, accessories or control therefor
- F23G5/02—Incineration of waste; Incinerator constructions; Details, accessories or control therefor with pretreatment
- F23G5/027—Incineration of waste; Incinerator constructions; Details, accessories or control therefor with pretreatment pyrolising or gasifying stage
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G5/00—Incineration of waste; Incinerator constructions; Details, accessories or control therefor
- F23G5/02—Incineration of waste; Incinerator constructions; Details, accessories or control therefor with pretreatment
- F23G5/033—Incineration of waste; Incinerator constructions; Details, accessories or control therefor with pretreatment comminuting or crushing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G5/00—Incineration of waste; Incinerator constructions; Details, accessories or control therefor
- F23G5/08—Incineration of waste; Incinerator constructions; Details, accessories or control therefor having supplementary heating
- F23G5/14—Incineration of waste; Incinerator constructions; Details, accessories or control therefor having supplementary heating including secondary combustion
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G7/00—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals
- F23G7/003—Incinerators or other apparatus for consuming industrial waste, e.g. chemicals for used articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G2201/00—Pretreatment
- F23G2201/30—Pyrolysing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G2201/00—Pretreatment
- F23G2201/30—Pyrolysing
- F23G2201/302—Treating pyrosolids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G2201/00—Pretreatment
- F23G2201/30—Pyrolysing
- F23G2201/303—Burning pyrogases
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G2201/00—Pretreatment
- F23G2201/60—Separating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G2201/00—Pretreatment
- F23G2201/80—Shredding
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F23—COMBUSTION APPARATUS; COMBUSTION PROCESSES
- F23G—CREMATION FURNACES; CONSUMING WASTE PRODUCTS BY COMBUSTION
- F23G2202/00—Combustion
- F23G2202/10—Combustion in two or more stages
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention relates to a method for recovering metals and reducing residues of a circuit board, belonging to the technical field of metal recovery methods.A closed high-pressure reaction kettle is adopted in the metal recovery method, a binder solvent is added, and the layering of copper foil, glass fibers and a substrate is realized in an oxygen-free environment, so that the difficulty in screening and separating subsequent metals and nonmetals is reduced; the ash slag in the layering is melted, so that the heavy metal can be prevented from dissolving out, and convenience is provided for the subsequent separation of the metal copper. The invention realizes the layering of the copper foil, the glass fiber and the substrate in an oxygen-free environment, and can melt ash slag in the layering to realize the low content of putrescible organic matters.
Description
Technical Field
The invention relates to the technical field of metal recovery methods, in particular to a circuit board metal recovery method.
Background
China is a large producing country and a large consuming country of electric and electronic products. With the continuous development of the times, the updating and upgrading speed of electric and electronic products is faster and faster, and a large number of electric and electronic products enter the elimination peak period. According to the introduction of related data, the annual rate of growth of the world printed circuit board industry is 8.7%, and the annual rate of growth of China is 14.4%. More than 40% of circuit boards are produced in China all over the world, and the Zhujiang Delta and the Changjiang Delta are centralized places of circuit board production enterprises in China. The waste circuit board is a mixture of glass fiber reinforced resin and various metals, and a large amount of leftover materials generated in the production and manufacturing of circuit boards are added, so that if the waste circuit board is not properly treated, a large amount of useful resources are lost, and the environment is seriously damaged. At present, the quantity of waste circuit boards needing to be treated in China every year is more than 50 million tons, the market scale is more than 180 million yuan, and the annual growth rate of the production quantity of the waste circuit boards in the next 5 years reaches 20%.
The waste printed circuit board is used as an important component of electronic waste, on one hand, the waste printed circuit board not only contains various common metals such as copper, gold, silver and the like, but also contains rare and precious metals, and has higher recycling value; on the other hand, the material also contains lead, cadmium, polyvinyl chloride plastic and other heavy metals and harmful substances, and has potential environmental pollution risks. The content of noble metals in the waste circuit board is up to 40%, the most noble metals are copper, and 200-350 kg of copper can be extracted from 1 ton of PCB; in addition, about 300g of gold and 500-2000 g of other noble metals can be extracted from 1 ton of waste circuit boards. The waste circuit board recycling project is a project with high profit space and wide development space in the current renewable resource utilization industry, and the average gross profit rate of the industry is about 17%. Meanwhile, the waste circuit board recycling technology is the most difficult recycling treatment process in the treatment of the waste electrical and electronic products at present. In China, most of small and medium-sized waste circuit board recycling enterprises fall behind in production process, high-value metal substances in waste circuit boards are generally recycled by brutal means such as burning, acid washing and the like, the metal recovery rate is low, and the environmental pollution is serious.
The existing circuit board is pyrolyzed in the recycling process, so that the existing traditional circuit board has more residues after pyrolysis and high content of putrescible organic matters, and can bring great public nuisance to the environment after subsequent landfill; and the pyrolysis oil and the pyrolysis gas generated after pyrolysis are directly combusted, and the sulfur element and the heavy metal substances in the substrate are mainly the environment pollution components which are directly discharged, so that the environment is greatly influenced.
Disclosure of Invention
The invention aims to provide a method for recovering metal of a circuit board, which aims to solve the technical problems that the content of putrescible organic matters is high due to more residues after the traditional circuit board is pyrolyzed and the environment pollution components generated by pyrolysis cannot be effectively purified in the prior art.
The technical scheme of the invention is as follows: a method for recovering metals of a circuit board, wherein the method comprises the steps of:
the method comprises the following steps:
the method comprises the following steps: crushing the circuit board by using a crusher, and screening the crushed circuit board to ensure that the particle diameter of the crushed circuit board is less than 40 mm;
step two: a closed high-pressure reaction kettle is adopted, a binder solvent is added, and the copper foil, the glass fiber and the substrate are layered in an oxygen-free environment, so that the difficulty in screening and separating subsequent metals and nonmetals is reduced;
step three: extracting the circuit board substrate from the layering in the second step, crushing the extracted circuit board substrate, and screening through a 20-30-mesh screen to obtain resin powder;
step four: the ash slag in the second layering step is melted, so that heavy metal can be prevented from dissolving out, and convenience is provided for the subsequent separation of metal copper;
step five: carrying out high-temperature pyrolysis on resin powder obtained after crushing the substrate by adopting a closed reaction kettle;
step six: sorting the solid products separated by the high-temperature pyrolysis in the step five, wherein the solid products can be sorted into metal and nonmetal, and the sorted metal is recycled;
step seven: sorting out pyrolysis residues from the nonmetal in the step six, and recycling the pyrolysis residues as filling materials;
step eight: converting organic matters in the circuit board substrate in the fifth step into pyrolysis oil, pyrolysis gas and fixed carbon;
step nine: condensing the pyrolysis oil and the pyrolysis gas through a condensation reaction kettle, and recovering the pyrolysis oil;
step ten: extracting the non-condensable gas generated by condensation in the step nine, and recovering heat of the non-condensable gas;
step eleven: the generated pyrolysis oil and pyrolysis gas are combusted under a low air ratio, so that sulfur elements and heavy metal substances in the circuit board substrate are fixed in the fixed carbon, and the emission of halogen pollutants is greatly reduced.
Further, the binder solvent is any one of water, alcohol, and ketone.
Further, the pyrolysis temperature of the resin powder in the fifth step is 600 ℃.
Further, the pyrolysis time of the resin powder in the fifth step is 60 min.
Further, the reaction conditions of the step eleven comprise: the reaction temperature is 450-550 ℃, the reaction pressure is 1-4 MPa, and the reaction time is 1-5 hours.
Further, the condensation temperature in the ninth step is 150-180 ℃.
Further, the pressure of the closed reaction kettle in the fifth step is 0.2 MPa to 0.5 MPa.
The invention provides a method for recovering circuit board metal by improvement, compared with the prior art, the method has the following improvements and advantages:
firstly, the copper foil, the glass fiber and the substrate are layered in an oxygen-free environment, the difficulty of screening and separating subsequent metals and nonmetals is reduced, ash slag in the layering can be melted, the putrescible organic matter content is low, the pollution caused by subsequent landfill treatment can be prevented, the discharge density is high, the waste is reduced to a great extent, the ash slag is melted, heavy metals can be prevented from dissolving out, and the convenience is provided for the separation of subsequent metal copper; the technical problem that in the prior art, the putrefactive organic matter content is high due to more residues after pyrolysis of a traditional circuit board is solved.
Secondly, the invention can convert organic matters in the substrate of the circuit board into storage energy which mainly comprises pyrolysis oil gas and fixed carbon, the generated pyrolysis oil and pyrolysis gas can be combusted at a low air ratio, and environmental pollution components such as sulfur element and heavy metal substances in the substrate can be fixed in the fixed carbon by optimizing reaction conditions, so that the emission of halogen pollutants is greatly reduced; the technical problem that the environmental pollution components generated by pyrolysis cannot be effectively purified in the prior art is solved.
Thirdly, the invention adopts a closed high-pressure reaction kettle, and adds a binder solvent to realize the layering of the copper foil, the glass fiber and the substrate in an oxygen-free environment, thereby reducing the difficulty of the subsequent screening and separation of metal and nonmetal; the pyrolysis recovery is carried out in an oxygen-free closed system, so that the formation of dioxin and furan substances can be inhibited, and the formation of metal oxides and halides can be reduced by the reduced coke generated by pyrolysis.
Fourthly, the solid products separated by high-temperature pyrolysis are sorted, the solid products can be sorted into metal and nonmetal, and the sorted metal is recycled; sorting out pyrolysis residues from the nonmetal in the step six, and recycling the pyrolysis residues as filling materials; the non-metal component can be used as a filler to be applied to the manufacturing of the composite material, so that the comprehensive utilization of resources is realized.
Drawings
The invention is further explained below with reference to the figures and examples:
FIG. 1 is a flow chart of the metal recovery method of the circuit board of the present invention.
Detailed Description
The present invention will be described in detail with reference to fig. 1, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a metal recovery method of a circuit board by improving, as shown in fig. 1, the metal recovery method of the circuit board, wherein the method comprises the following steps:
the method comprises the following steps: crushing the circuit board by using a crusher, and screening the crushed circuit board to ensure that the particle diameter of the crushed circuit board is less than 40 mm; the crushing can be carried out by adopting a crusher, the screening can be carried out by adopting a vibrating screen with a screen mesh with the diameter of 40mm, and after the crushing is finished, the iron in the crushed materials can be adsorbed by adopting a magnetic separator to finish the extraction of the iron metal.
Step two: a closed high-pressure reaction kettle is adopted, a binder solvent is added, and the copper foil, the glass fiber and the substrate are layered in an oxygen-free environment, so that the difficulty in screening and separating subsequent metals and nonmetals is reduced; a closed high-pressure reaction kettle is adopted, a binder solvent is added, and the copper foil, the glass fiber and the substrate are layered in an oxygen-free environment, so that the difficulty in screening and separating subsequent metals and nonmetals is reduced; the pyrolysis recovery is carried out in an oxygen-free closed system, so that the formation of dioxin and furan substances can be inhibited, and the formation of metal oxides and halides can be reduced by the reduced coke generated by pyrolysis.
Step three: extracting the circuit board substrate from the layering in the second step, crushing the extracted circuit board substrate, and screening through a 20-30-mesh screen to obtain resin powder; after the circuit board is layered, the copper foil can be extracted, so that resources are reasonably utilized. The extracted circuit board substrate is crushed by a first-level crusher, a vibrating screen with the mesh size of 40-50 is selected to work, secondary crushing is performed again, the vibrating screen with the mesh size of 20-30 is arranged below the secondary crushing mechanism, feeding speed is effectively increased by secondary crushing, and the problems of less discharging and large energy consumption in primary screening are solved.
Step four: the ash slag in the second layering step is melted, so that heavy metal can be prevented from dissolving out, and convenience is provided for the subsequent separation of metal copper;
step five: carrying out high-temperature pyrolysis on resin powder obtained after crushing the substrate by adopting a closed reaction kettle;
step six: sorting the solid products separated by the high-temperature pyrolysis in the step five, wherein the solid products can be sorted into metal and nonmetal, and the sorted metal is recycled;
step seven: sorting out pyrolysis residues from the nonmetal in the step six, and recycling the pyrolysis residues as filling materials; the non-metal component can be used as a filler to be applied to the manufacturing of the composite material, so that the comprehensive utilization of resources is realized.
Step eight: converting organic matters in the circuit board substrate in the fifth step into pyrolysis oil, pyrolysis gas and fixed carbon;
step nine: condensing the pyrolysis oil and the pyrolysis gas through a condensation reaction kettle, and recovering the pyrolysis oil;
step ten: extracting the non-condensable gas generated by condensation in the step nine, and recovering heat of the non-condensable gas;
step eleven: the generated pyrolysis oil and pyrolysis gas are combusted under a low air ratio, so that sulfur elements and heavy metal substances in the circuit board substrate are fixed in the fixed carbon, and the emission of halogen pollutants is greatly reduced.
Further, the binder solvent is any one of water, alcohol, and ketone.
Further, the pyrolysis temperature of the resin powder in the fifth step is 600 ℃.
Further, the pyrolysis time of the resin powder in the fifth step is 60 min.
Further, the reaction conditions of the step eleven comprise: the reaction temperature is 450-550 ℃, the reaction pressure is 1-4 MPa, and the reaction time is 1-5 hours.
Further, the condensation temperature in the ninth step is 150-180 ℃.
Further, the pressure of the closed reaction kettle in the fifth step is 0.2 MPa to 0.5 MPa.
The invention realizes the layering of the copper foil, the glass fiber and the substrate in an oxygen-free environment, reduces the difficulty for screening and separating subsequent metals and nonmetals, can melt the ash slag in the layering to realize low putrescible organic matter content, can prevent the pollution caused by processing subsequent landfills, has high discharge density and reduced waste to a great extent, can prevent heavy metals from dissolving out due to the melting of the ash slag, and provides convenience for the separation of the subsequent metal copper; the invention can also convert organic matters in the substrate of the circuit board into storage energy which mainly comprises pyrolysis oil gas and fixed carbon, the generated pyrolysis oil and pyrolysis gas can be combusted under a low air ratio, and the sulfur element, heavy metal substances and other environmental pollution components in the substrate can be fixed in the fixed carbon by optimizing reaction conditions at the reaction temperature of 450-550 ℃, the reaction pressure of 1-4 MPa and the reaction time of 1-5 hours, so that the emission of halogen pollutants is greatly reduced.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A method for recovering metal from a circuit board, said method comprising the steps of:
the method comprises the following steps: crushing the circuit board by using a crusher, and screening the crushed circuit board to ensure that the particle diameter of the crushed circuit board is less than 40 mm;
step two: a closed high-pressure reaction kettle is adopted, a binder solvent is added, and the copper foil, the glass fiber and the substrate are layered in an oxygen-free environment, so that the difficulty in screening and separating subsequent metals and nonmetals is reduced;
step three: extracting the circuit board substrate from the layering in the second step, crushing the extracted circuit board substrate, and screening through a 20-30-mesh screen to obtain resin powder;
step four: the ash slag in the second layering step is melted, so that heavy metal can be prevented from dissolving out, and convenience is provided for the subsequent separation of metal copper;
step five: carrying out high-temperature pyrolysis on resin powder obtained after crushing the substrate by adopting a closed reaction kettle;
step six: sorting the solid products separated by the high-temperature pyrolysis in the step five, wherein the solid products can be sorted into metal and nonmetal, and the sorted metal is recycled;
step seven: sorting out pyrolysis residues from the nonmetal in the step six, and recycling the pyrolysis residues as filling materials;
step eight: converting organic matters in the circuit board substrate in the fifth step into pyrolysis oil, pyrolysis gas and fixed carbon;
step nine: condensing the pyrolysis oil and the pyrolysis gas through a condensation reaction kettle, and recovering the pyrolysis oil;
step ten: extracting the non-condensable gas generated by condensation in the step nine, and recovering heat of the non-condensable gas;
step eleven: the generated pyrolysis oil and pyrolysis gas are combusted under a low air ratio, so that sulfur elements and heavy metal substances in the circuit board substrate are fixed in the fixed carbon, and the emission of halogen pollutants is greatly reduced.
2. The method for recovering metals of a wiring board according to claim 1, wherein the binder solvent is any one of water, alcohol and ketone.
3. The method for recovering metals of a wiring board according to claim 1, wherein the pyrolysis temperature of the resin powder in the fifth step is 600 ℃.
4. The method for recovering metals of a wiring board according to claim 3, wherein the pyrolysis time of the resin powder in the fifth step is 60 min.
5. The method for recovering metals of a wiring board according to claim 1, wherein the reaction conditions of the step eleven comprise: the reaction temperature is 450-550 ℃, the reaction pressure is 1-4 MPa, and the reaction time is 1-5 hours.
6. The method as claimed in claim 5, wherein the condensation temperature in the ninth step is 150-180 ℃.
7. The method for recovering metals of the circuit board according to claim 5, wherein the pressure of the closed reaction kettle in the fifth step is 0.2 MPa to 0.5 MPa.
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| CN202010990088.1A CN112170451B (en) | 2020-09-18 | 2020-09-18 | Circuit board metal recovery method |
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| CN202010990088.1A CN112170451B (en) | 2020-09-18 | 2020-09-18 | Circuit board metal recovery method |
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| CN112170451B true CN112170451B (en) | 2021-11-12 |
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| CN102218439A (en) * | 2011-01-24 | 2011-10-19 | 同济大学 | Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards |
| CN108413400A (en) * | 2018-02-11 | 2018-08-17 | 中南大学 | A kind of method of alkaline residue and discarded circuit board copyrolysis |
| CN110757682A (en) * | 2019-10-29 | 2020-02-07 | 中国科学院山西煤炭化学研究所 | Method for recycling waste circuit boards in full-component mode through two-step method |
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