JP6846972B2 - How to process printed circuit boards with parts and how to recover valuable metals from printed circuit boards with parts - Google Patents
How to process printed circuit boards with parts and how to recover valuable metals from printed circuit boards with parts Download PDFInfo
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- JP6846972B2 JP6846972B2 JP2017069180A JP2017069180A JP6846972B2 JP 6846972 B2 JP6846972 B2 JP 6846972B2 JP 2017069180 A JP2017069180 A JP 2017069180A JP 2017069180 A JP2017069180 A JP 2017069180A JP 6846972 B2 JP6846972 B2 JP 6846972B2
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- 238000000034 method Methods 0.000 title claims description 41
- 239000002184 metal Substances 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 title claims description 31
- 150000002739 metals Chemical class 0.000 title claims description 11
- 239000002699 waste material Substances 0.000 claims description 42
- 239000000843 powder Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 14
- 239000000696 magnetic material Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007873 sieving Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 239000002893 slag Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 238000011084 recovery Methods 0.000 claims description 7
- 239000012254 powdered material Substances 0.000 claims 3
- 230000005484 gravity Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Description
本発明は、部品付プリント基板の処理方法及び部品付プリント基板からの有価金属の回収方法に関する。 The present invention relates to a method for processing a printed circuit board with parts and a method for recovering valuable metals from the printed circuit board with parts.
プリント基板、部品を搭載したプリント基板、及びこれらの製造工程で発生する成形残から銅滓などの有価金属を回収する方法が提案されている。 There have been proposed methods for recovering valuable metals such as copper slag from printed circuit boards, printed circuit boards on which components are mounted, and molding residues generated in these manufacturing processes.
例えば、特許文献１には、処理対象物を粗粉砕し、続けて圧縮力やせん断力などの外力を加えて微粉砕し、微粉砕物を金属分などの比重の大きな物質を多く含む部分及び樹脂などの比重の小さな物質を多く含む部分の比重差を使用して分離し、さらに導電体を多く含む部分と、絶縁体を多く含む部分とに静電分離することにより、有価金属を回収する方法が開示されている。 For example, in Patent Document 1, a portion to be treated is roughly pulverized, and then an external force such as a compressive force or a shearing force is applied to pulverize the pulverized material, and the pulverized material contains a large amount of a substance having a large specific gravity such as a metal component. Valuable metals are recovered by separating using the difference in specific gravity of the part containing a large amount of a substance having a small specific gravity such as resin, and then electrostatically separating the part containing a large amount of conductor and the part containing a large amount of insulator. The method is disclosed.
プリント基板から有価金属を回収するためには、まず、電子部品等が実装されていないプリント基板を回収する。電子部品等が実装されていないプリント基板としては、例えば、電子部品を実装する前のプリント基板、電子部品が実装された回路基板の製造工程において、打ち抜きにより発生するプリント基板の成形残、及び切断により発生するプリント基板の切れ端等があげられる。しかしながら、これらの量は、例えばＯＡ機器や家電製品等の解体時に回収される、電子部品が実装されたプリント基板（以後、部品付プリント基板と呼ぶ）の量と比較して少ないため、部品付プリント基板から、電子部品等が実装されていないプリント基板をできるだけ多く回収することが望ましい。 In order to recover valuable metals from a printed circuit board, first, the printed circuit board on which electronic components and the like are not mounted is recovered. Examples of the printed circuit board on which the electronic components are not mounted include, for example, a printed circuit board before mounting the electronic components, a molded circuit board residue generated by punching in the manufacturing process of the circuit board on which the electronic components are mounted, and cutting. Examples include scraps of the printed circuit board generated by the above. However, since these amounts are small compared to the amount of printed circuit boards on which electronic components are mounted (hereinafter referred to as printed circuit boards with components), which are collected at the time of dismantling, for example, OA equipment and home appliances, they are attached with components. It is desirable to collect as much printed circuit board as possible from the printed circuit board on which electronic components and the like are not mounted.
本発明は上記の課題に鑑み、部品付プリント基板からのプリント基板屑の回収効率を向上させる部品付プリント基板の処理方法と、部品付プリント基板からの有価金属の回収効率を向上させる部品付プリント基板からの有価金属の回収方法と、を提供することを目的とする。 In view of the above problems, the present invention has a method for processing a printed circuit board with parts that improves the efficiency of collecting printed circuit board waste from the printed circuit board with parts, and a printing with parts that improves the efficiency of collecting valuable metals from the printed circuit board with parts. It is an object of the present invention to provide a method for recovering a valuable metal from a substrate.
本発明に係る部品付プリント基板の処理方法は、部品付プリント基板を衝撃式回転破砕機により破砕し、目開き１０ｍｍ〜２０ｍｍの篩を通る電子部品と、電子部品が実装されていない目開き１０ｍｍ〜２０ｍｍの篩を通らないプリント基板屑と、を含む破砕物を得る工程と、前記破砕した物を磁性物と非磁性物とに磁力選別する工程と、前記非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別し、篩上物をプリント基板屑として得る工程と、を有することを特徴とする。
The method for processing a printed circuit board with parts according to the present invention is to crush the printed circuit board with parts with an impact type rotary crusher and pass through a sieve with a mesh size of 10 mm to 20 mm, and an electronic component having a mesh size of 10 mm without an electronic component mounted. A step of obtaining a crushed material containing printed circuit board waste that does not pass through a sieve of about 20 mm, a step of magnetically sorting the crushed material into a magnetic material and a non-magnetic material, and opening the non-magnetic material with a mesh size of 10 mm to 20 mm. It is characterized by having a step of sieving with a sieve of the above and obtaining a sieved product as printed circuit board waste.
この場合において、部品付プリント基板の処理方法は、前記非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別して得られる篩下物を、目開き５ｍｍ〜１０ｍｍの篩で篩別する工程と、前記目開き５ｍｍ〜１０ｍｍの篩の篩上物を破砕機により部品と基板とに分離することにより、電子部品が実装されていないプリント基板屑を前記処理対象のプリント基板屑として得る工程と、を有していてもよい。
In this case, the method for processing the printed circuit board with components includes a step of sieving the non-magnetic material with a sieve having a mesh size of 10 mm to 20 mm and sieving the sieved product obtained by sieving with a sieve having a mesh size of 5 mm to 10 mm. There is a step of obtaining printed circuit board waste on which electronic components are not mounted as the printed circuit board waste to be processed by separating the sieve material of a sieve having a mesh size of 5 mm to 10 mm into a component and a substrate by a crusher. You may be doing it.
また、部品付プリント基板の処理方法は、前記処理対象のプリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕する工程と、前記処理対象のプリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、を有していてもよい。
The processing method of the component with the printed circuit board includes the steps of pulverizing a printed circuit board scrap at the processing target by an impact grinder in one step or two steps, the ground product after grinding the printed circuit board scrap of the processed It may have a step of pulverizing with a final pulverizer to form a powder having an average particle size (D50) of 200 μm to 360 μm.
この場合において、前記衝撃式粉砕機はハンマーミルであってもよい。また、前記ハンマーミルのスクリーン径が３ｍｍ以上５ｍｍ以下であってもよい。 In this case, the impact type crusher may be a hammer mill. Further, the screen diameter of the hammer mill may be 3 mm or more and 5 mm or less.
また、前記最終粉砕機が衝撃式粉砕機であってもよい。この場合、前記衝撃式粉砕機はハンマーミル又は高速ハンマーミルであってもよい。 Further, the final crusher may be an impact type crusher. In this case, the impact type crusher may be a hammer mill or a high-speed hammer mill.
本発明に係る部品付プリント基板からの有価金属の回収方法は、上記部品付プリント基板の処理方法によりプリント基板屑を得る工程と、前記プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕する工程と、前記プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、前記粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、前記粉体物から有価金属を回収する工程と、を有することを特徴とする。 The method for recovering valuable metals from a printed substrate with parts according to the present invention is a step of obtaining printed substrate scraps by the above-mentioned processing method for printed substrates with parts, and a step of obtaining the printed substrate scraps by an impact crusher in one or two steps. A step of crushing, a step of crushing the crushed product after crushing the printed substrate waste with a final crusher to make a powder product having an average particle size (D50) of 200 μm to 360 μm, and a step of converting the powder product into a wind force. It is characterized by having a step of separating a powdery substance containing a valuable metal as a main component from a powdery substance containing a valuable metal as a main component by a sorter and recovering the valuable metal from the powdery substance.
この場合、前記有価金属は銅滓であってもよい。また、部品付プリント基板からの有価金属の回収方法は、前記風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収する工程を有していてもよい。 In this case, the valuable metal may be a copper slag. Further, the method for recovering valuable metals from a printed circuit board with parts may include a step of recovering a powdery substance containing a resin component classified by the wind power sorter as a main component with a bag filter.
本発明に係る部品付プリント基板の処理方法によれば、部品付プリント基板からのプリント基板屑の回収効率を向上させることができる。また、本発明に係る部品付プリント基板からの有価金属の回収方法によれば、部品付プリント基板からの有価金属の回収効率を向上させることができる。 According to the method for processing a printed circuit board with parts according to the present invention, it is possible to improve the efficiency of collecting printed circuit board waste from the printed circuit board with parts. Further, according to the method for recovering valuable metals from a printed circuit board with parts according to the present invention, it is possible to improve the recovery efficiency of valuable metals from a printed circuit board with parts.
図１は、部品付プリント基板の処理工程を表す工程図である。図１で例示するように、出発原料は部品付プリント基板である。 FIG. 1 is a process diagram showing a processing process of a printed circuit board with parts. As illustrated in FIG. 1, the starting material is a printed circuit board with parts.
（破砕）
破砕工程では、衝撃式回転破砕機により、部品付プリント基板を破砕する。衝撃式回転破砕機は、例えば、ケーシング中央部で高速回転しているローターの外周に取り付けられたハンマーにより、処理対象物を打撃して破砕する破砕機である。
(Crushing)
In the crushing step, the printed circuit board with parts is crushed by an impact type rotary crusher. The impact type rotary crusher is, for example, a crusher that hits and crushes an object to be processed by a hammer attached to the outer periphery of a rotor rotating at high speed in the central portion of the casing.
（磁力選別）
磁力選別では、上記破砕工程で破砕した物を、磁性物と非磁性物とに磁力選別する。これにより、磁性物としてＦｅ濃縮物が得られる。
(Magnetic force selection)
In the magnetic force sorting, the material crushed in the above crushing step is magnetically sorted into a magnetic material and a non-magnetic material. As a result, an Fe concentrate can be obtained as a magnetic substance.
（１次篩別）
１次篩別では、上記磁力選別で得られた非磁性物を、例えば、目開き１０ｍｍ〜２０ｍｍ（例えば、２０ｍｍ）の篩で篩別し、篩上物をプリント基板屑として得る。なお、１次篩別の篩上物として得られるプリント基板屑は、サイズが目開き（例えば、２０ｍｍ）よりも大きい、電子部品等が実装されていないプリント基板である。
(By primary sieve)
In the primary sieving, the non-magnetic material obtained by the above magnetic force sorting is sieved by a sieve having a mesh size of, for example, 10 mm to 20 mm (for example, 20 mm), and the sieved product is obtained as printed circuit board waste. The printed circuit board waste obtained as a sieve product for each primary sieve is a printed circuit board having a size larger than the opening (for example, 20 mm) and not equipped with electronic components or the like.
（２次篩別）
２次篩別では、１次篩別で得られた篩下物を、目開き５ｍｍ〜１０ｍｍ（例えば、１０ｍｍ）の篩で篩別する。２次篩別の篩上物は、プリント基板と部品との混合品（以後、基板屑・部品混合品と呼ぶ。）であり、篩下物は、部品の濃縮物である。
(By secondary sieve)
In the secondary sieving, the sieving product obtained by the primary sieving is sieved with a sieve having a mesh size of 5 mm to 10 mm (for example, 10 mm). The sieve product for each secondary sieve is a mixture of a printed circuit board and parts (hereinafter referred to as a substrate waste / parts mixture product), and the sieve product is a concentrate of parts.
なお、２次篩別の篩上物（基板屑・部品混合品）を破砕機により部品とプリント基板屑とに分離し、電子部品等が実装されないプリント基板屑を得てもよい。このとき得られるプリント基板屑は、１次篩別で使用する篩の目開きが２０ｍｍであり２次篩別で使用する篩の目開きが１０ｍｍの場合、サイズが１０ｍｍより大きく２０ｍｍ以下のプリント基板であるが、１次篩別で得られたサイズが２０ｍｍよりも大きい、電子部品等が実装されていないプリント基板と一緒に処理してもよい。 It should be noted that the sieve product (board waste / component mixture) for each secondary sieve may be separated into a component and a printed circuit board waste by a crusher to obtain a printed circuit board waste on which electronic components and the like are not mounted. When the mesh size of the sieve used for the primary sieve is 20 mm and the mesh size of the sieve used for the secondary sieve is 10 mm, the printed circuit board waste obtained at this time has a size larger than 10 mm and 20 mm or less. However, it may be processed together with a printed circuit board on which an electronic component or the like is not mounted and the size obtained by the primary sieve is larger than 20 mm.
次に、図１の部品付プリント基板の処理工程により得られたプリント基板屑の処理工程について説明する。図２は、プリント基板屑の処理工程を表す工程図である。図２で例示するように、出発原料はプリント基板屑である。 Next, the process of processing the printed circuit board waste obtained by the process of processing the printed circuit board with parts of FIG. 1 will be described. FIG. 2 is a process diagram showing a process of processing printed circuit board waste. As illustrated in FIG. 2, the starting material is printed circuit board waste.
（予備破砕）
予備破砕では、例えば、スクリーン径５０ｍｍの一軸破砕機を用いて、プリント基板屑を１次破砕で使用する衝撃式粉砕機に投入可能なサイズ（例えば、縦及び横の長さが５０ｍｍ以下）にする。なお、予備破砕を行わなくてもよい。例えば、プリント基板屑のうち、そのサイズが既に１次破砕で使用する衝撃式粉砕機に投入可能なサイズとなっているものについては、予備破砕を行わなくてもよい。
(Preliminary crushing)
In the preliminary crushing, for example, using a uniaxial crusher with a screen diameter of 50 mm, the size can be put into the impact type crusher used for the primary crushing (for example, the vertical and horizontal lengths are 50 mm or less). To do. It is not necessary to perform preliminary crushing. For example, among the printed circuit board scraps, those whose size is already large enough to be put into the impact type crusher used in the primary crushing need not be pre-crushed.
（１次破砕）
１次破砕では、予備破砕により破砕されたプリント基板屑を、例えば、スクリーン径１３〜１７ｍｍの衝撃式粉砕機を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。また、１次破砕を省略してもよい。
(Primary crushing)
In the primary crushing, the printed circuit board waste crushed by the preliminary crushing is crushed by using, for example, an impact type crusher having a screen diameter of 13 to 17 mm. The impact type crusher is preferably a hammer mill. Further, the primary crushing may be omitted.
（２次破砕）
２次破砕では、１次破砕で粉砕したプリント基板屑を、例えば、スクリーン径３〜５ｍｍの衝撃式粉砕機を用いて粉砕する。なお、衝撃式粉砕機は、ハンマーミルであることが好ましい。
(Secondary crushing)
In the secondary crushing, the printed circuit board waste crushed by the primary crushing is crushed by using, for example, an impact type crusher having a screen diameter of 3 to 5 mm. The impact type crusher is preferably a hammer mill.
（３次破砕）
３次破砕では、最終粉砕機を用いて、２次破砕により得られた粉砕物を粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする。最終粉砕機は、衝撃粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミルであることがより好ましい。なお、高速ハンマーミルは、周速１００ｍ／ｓ以上のハンマーミルである。この場合、例えばスクリーン径１．５ｍｍ以下、より好ましくは１ｍｍ以下のスクリーン、又は気流分級により平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物を得ることができる。なお、スクリーン径の下限については特には限定されないが、０．３ｍｍ以上、好ましくは０．５ｍｍ以上とすることができる。
(3rd crushing)
In the tertiary crushing, the pulverized product obtained by the secondary crushing is crushed using a final crusher to obtain a powder having an average particle size (D50) of 200 μm to 360 μm. The final crusher is preferably an impact crusher, more preferably a hammer mill or a high speed hammer mill. The high-speed hammer mill is a hammer mill having a peripheral speed of 100 m / s or more. In this case, for example, a screen having a screen diameter of 1.5 mm or less, more preferably 1 mm or less, or a powder having an average particle size (D50) of 200 μm to 360 μm can be obtained by air flow classification. The lower limit of the screen diameter is not particularly limited, but may be 0.3 mm or more, preferably 0.5 mm or more.
（分離工程）
分離工程では、粉体物を、風力選別機により銅滓とそれ以外とに分離し、銅滓を回収する。風力選別機は、二種類以上の成分をそれらの比重差に基づいて分離するもので、バリアブルインパクタ、サイクロン、分級ローター付遠心力型風力分級機等が挙げられる。
(Separation process)
In the separation step, the powder is separated into copper slag and other parts by a wind power sorter, and the copper slag is recovered. The wind power sorter separates two or more kinds of components based on their specific gravity differences, and examples thereof include a variable impactor, a cyclone, and a centrifugal force type wind power classifier with a classifying rotor.
（回収工程）
回収工程では、分離工程において排出された樹脂を含む成分から、バグフィルタなどの集塵装置を用いて樹脂を分離、回収する。このようにして得られた樹脂は、産業廃棄物の焼却炉等で処理又は、粉体バーナ技術を用いて燃料代替とすることができる。
(Recovery process)
In the recovery step, the resin is separated and recovered from the components containing the resin discharged in the separation step by using a dust collector such as a bag filter. The resin thus obtained can be treated in an industrial waste incinerator or the like, or can be used as a fuel substitute by using powder burner technology.
本実施形態によれば、部品付プリント基板を衝撃式回転破砕機により破砕し、破砕した物を磁性物と非磁性物とに磁力選別し、非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別し、篩上物をプリント基板屑として得ることで、部品付プリント基板からのプリント基板屑の回収効率を向上させることができる。この場合、非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別して得られる篩下物を、目開き５ｍｍ〜１０ｍｍ篩で篩別し、篩上物を破砕機により部品と基板とに分離することにより、プリント基板屑を得ることが好ましい。これにより、部品付プリント基板からのプリント基板屑の回収効率をさらに向上させることができる。 According to this embodiment, a printed circuit board with parts is crushed by an impact type rotary crusher, the crushed material is magnetically sorted into a magnetic material and a non-magnetic material, and the non-magnetic material is sieved with a sieve having a mesh size of 10 mm to 20 mm. Separately, by obtaining the sieved product as the printed circuit board waste, the efficiency of collecting the printed circuit board waste from the printed circuit board with parts can be improved. In this case, the sieved product obtained by sieving the non-magnetic material with a sieve having a mesh size of 10 mm to 20 mm is sieved with a sieve having a mesh size of 5 mm to 10 mm, and the sieved product is separated into a component and a substrate by a crusher. It is preferable to obtain printed circuit board scraps. Thereby, the efficiency of collecting the printed circuit board waste from the printed circuit board with parts can be further improved.
また、本実施形態によれば、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にすることで、有価金属と基板層とを十分に剥離することができる。これにより、基板層に付着したままの有価金属の量が低減されるので、有価金属の回収効率を向上させることができる。なお、衝撃式粉砕機はハンマーミルであることが好ましい。この場合、ハンマーミルのスクリーン径が３ｍｍ以上５ｍｍ以下であることが好ましい。また、最終粉砕機は衝撃式粉砕機であることが好ましく、ハンマーミル又は高速ハンマーミル（周速１００ｍ／ｓ以上のハンマーミル）であることがより好ましい。 Further, according to the present embodiment, the printed circuit board waste is crushed in one or two steps by an impact type crusher, and the crushed product after crushing the printed circuit board waste is crushed by a final crusher to obtain an average particle size (D50). ) Is made into a powder of 200 μm to 360 μm, so that the valuable metal and the substrate layer can be sufficiently peeled off. As a result, the amount of the valuable metal that remains attached to the substrate layer is reduced, so that the recovery efficiency of the valuable metal can be improved. The impact type crusher is preferably a hammer mill. In this case, the screen diameter of the hammer mill is preferably 3 mm or more and 5 mm or less. Further, the final crusher is preferably an impact type crusher, and more preferably a hammer mill or a high-speed hammer mill (a hammer mill having a peripheral speed of 100 m / s or more).
また、本実施形態によれば、上記部品付プリント基板の処理方法によりプリント基板屑を得て、プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕し、プリント基板屑を粉砕した後の粉砕物を最終粉砕機により平均粒径（Ｄ５０）が２００μｍ〜３６０μｍとなるよう粉砕し、最終粉砕機による粉砕によって得られた粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、有価金属を回収することで、有価金属の回収効率を向上させることができる。なお、有価金属は銅滓であることが好ましい。 Further, according to the present embodiment, the printed circuit board waste is obtained by the above method for processing the printed circuit board with parts, the printed circuit board waste is crushed in one or two steps by an impact type crusher, and the printed circuit board waste is crushed. The crushed product of No. 1 is crushed by a final crusher so that the average particle size (D50) is 200 μm to 360 μm, and the powder obtained by crushing by the final crusher is powder containing a valuable metal as a main component by a wind sorter. By separating the material from the other and recovering the valuable metal, the recovery efficiency of the valuable metal can be improved. The valuable metal is preferably copper slag.
また、本実施形態によれば、風力選別機により分類された樹脂分を主成分とする粉状物をバグフィルタにて回収することで、樹脂分を効率よく回収することができる。 Further, according to the present embodiment, the resin content can be efficiently recovered by recovering the powdery substance containing the resin content as the main component classified by the wind power sorter with a bag filter.
以下、本発明の実施例を示すが、本発明は実施例に限定されるものではない。 Hereinafter, examples of the present invention will be shown, but the present invention is not limited to the examples.
（実施例１）
部品付プリント基板を原料とし、図１に示す処理を行ったところ、部品付プリント基板１０６．８ｋｇに対して、１次篩別の篩上物としてプリント基板屑３０．２ｋｇを得た。これは、部品付プリント基板の重量の２８．３％に当たり、図１に示す処理により、部品付プリント基板からのプリント基板屑の回収効率を向上できることが確認できた。また、２次篩別の篩上物として、プリント基板と部品との混合品１９．５ｋｇを得た。これは、部品付プリント基板の重量の１８．３％に当たり、当該混合品を破砕し、プリント基板と部品とに分離することにより、部品付プリント基板からのプリント基板屑の回収効率をさらに向上できることが確認できた。
(Example 1)
When the process shown in FIG. 1 was performed using a printed circuit board with parts as a raw material, 30.2 kg of printed circuit board waste was obtained as a sieve product for each primary sieve with respect to 106.8 kg of the printed circuit board with parts. This corresponds to 28.3% of the weight of the printed circuit board with parts, and it was confirmed that the efficiency of collecting the printed circuit board waste from the printed circuit board with parts can be improved by the process shown in FIG. Further, 19.5 kg of a mixed product of the printed circuit board and the parts was obtained as a sieve product for each secondary sieve. This corresponds to 18.3% of the weight of the printed circuit board with parts, and by crushing the mixed product and separating it into the printed circuit board and the parts, the efficiency of collecting the printed circuit board waste from the printed circuit board with parts can be further improved. Was confirmed.
（実施例２〜７）
表１に示した電子部品が実装されていないプリント基板を原料とし、それぞれ示された条件によりプリント基板の粉砕処理を行った。表２に、得られた粉体物の平均粒径（Ｄ５０）を示す。なお、表中、ベタ基板とは、電子部品を実装する前のプリント基板であり、枠基板とは、電子部品が実装された回路基板の製造工程において、打ち抜きにより発生するプリント基板の成形残である。また、長尺基板とは、電子部品が実装された回路基板の製造工程において、切断により発生するプリント基板の切れ端である。比較のため、長尺基板を原料とし、予備破砕を行わず、１次破砕及び２次破砕をせん断式の破砕機で行った。しかしながら、比較例では、２次破砕の終了時点において、目視の状態でも十分な粉砕物を得ることが出来ず、また、有価金属と基板層とが十分に剥離できていなかったため、２次破砕の終了時点で粉砕を中止した。
(Examples 2 to 7)
A printed circuit board on which the electronic components shown in Table 1 were not mounted was used as a raw material, and the printed circuit board was pulverized under the conditions shown in each. Table 2 shows the average particle size (D50) of the obtained powder. In the table, the solid substrate is a printed circuit board before mounting electronic components, and the frame board is a molded circuit board residue generated by punching in the manufacturing process of a circuit board on which electronic components are mounted. is there. The long substrate is a piece of a printed circuit board generated by cutting in the manufacturing process of a circuit board on which electronic components are mounted. For comparison, a long substrate was used as a raw material, and primary crushing and secondary crushing were performed by a shear type crusher without preliminary crushing. However, in the comparative example, at the end of the secondary crushing, a sufficient pulverized product could not be obtained even in a visual state, and the valuable metal and the substrate layer could not be sufficiently separated, so that the secondary crushing was carried out. Crushing was stopped at the end.
表２に示すように、実施例２〜７において、得られた粉体物の平均粒径（Ｄ５０）は、２００〜３６０μｍとなり、プリント基板屑を粉状に粉砕することができた。また、目視にて、プリント基板屑が良好に粉砕され、かつ、有価金属と基板層とが十分に剥離されていることが確認された。 As shown in Table 2, in Examples 2 to 7, the average particle size (D50) of the obtained powder was 200 to 360 μm, and the printed circuit board waste could be pulverized into powder. Further, it was visually confirmed that the printed circuit board waste was satisfactorily crushed and that the valuable metal and the substrate layer were sufficiently peeled off.
風力選別機を用いて、上記の粉砕処理により得られた粉体物から銅滓及び樹脂の回収を行った。なお、粉体物に含まれる銅品位、銅量はＩＣＰ法にて測定して評価した。 Using a wind power sorter, copper slag and resin were recovered from the powder obtained by the above pulverization treatment. The copper grade and the amount of copper contained in the powder were measured and evaluated by the ICP method.
実施例２から実施例７で得られた合計の粉体物１８４ｋｇには、５０ｋｇのＣｕが含まれていたが、５６ｋｇの銅滓と１２８ｋｇの樹脂に分離された。
回収された樹脂成分の銅品位は５％未満であり、銅滓と樹脂とを有効に分離でき、また、高い回収率で銅滓成分が得られることが明らかとなった。
The total powder material obtained in Examples 2 to 7 contained 50 kg of Cu, but was separated into 56 kg of copper slag and 128 kg of resin.
It was clarified that the copper grade of the recovered resin component was less than 5%, the copper slag and the resin could be effectively separated, and the copper slag component could be obtained with a high recovery rate.
以上、本発明の実施例について詳述したが、本発明は係る特定の実施例に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 Although the examples of the present invention have been described in detail above, the present invention is not limited to the specific examples, and various modifications and modifications are made within the scope of the gist of the present invention described in the claims. It can be changed.
Claims (12)
前記破砕物を磁性物と非磁性物とに磁力選別する工程と、
前記非磁性物を目開き１０ｍｍ〜２０ｍｍの篩で篩別し、篩上物を処理対象のプリント基板屑として得る工程と、
を有することを特徴とする部品付プリント基板の処理方法。 A printed circuit board with parts is crushed by an impact type rotary crusher , and electronic parts that pass through a sieve with a mesh size of 10 mm to 20 mm and printed circuit board scraps that do not pass through a sieve with a mesh size of 10 mm to 20 mm on which electronic parts are not mounted are separated. The process of obtaining the crushed material including
A step of magnetically sorting the crushed material into a magnetic material and a non-magnetic material,
The non-magnetic was sieved with a sieve having a mesh opening 10mm~20mm and a step of obtaining a sieve quality goods as PCB waste to be processed,
A method for processing a printed circuit board with parts, which comprises.
前記目開き５ｍｍ〜１０ｍｍの篩の篩上物を破砕機により部品と基板とに分離することにより、電子部品が実装されていないプリント基板屑を前記処理対象のプリント基板屑として得る工程と、
を有することを特徴とする請求項１から請求項３のいずれか一項に記載の部品付プリント基板の処理方法。 A step of sieving the non-magnetic material with a sieve having a mesh size of 10 mm to 20 mm and sieving the product obtained by sieving with a sieve having a mesh size of 5 mm to 10 mm.
A step of obtaining printed circuit board waste on which electronic components are not mounted as the printed circuit board waste to be processed by separating the sieve material of the sieve having a mesh size of 5 mm to 10 mm into a component and a substrate by a crusher.
The method for processing a printed circuit board with parts according to any one of claims 1 to 3, wherein the printed circuit board has a component.
前記処理対象のプリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、
を有することを特徴とする請求項１から請求項４のいずれか一項に記載の部品付プリント基板の処理方法。 A step of crushing the printed circuit board waste to be processed in one or two steps with an impact type crusher, and
A step of crushing the crushed product after crushing the printed circuit board waste to be processed by a final crusher to obtain a powder product having an average particle size (D50) of 200 μm to 360 μm.
The method for processing a printed circuit board with parts according to any one of claims 1 to 4, wherein the printed circuit board has a component.
前記プリント基板屑を衝撃式粉砕機により１段階又は２段階で粉砕する工程と、
前記プリント基板屑を粉砕した後の粉砕物を最終粉砕機により粉砕し、平均粒径（Ｄ５０）が２００μｍ〜３６０μｍの粉体物にする工程と、
前記粉体物を、風力選別機により有価金属を主成分とする粉状物とそれ以外とに分離し、前記粉体物から有価金属を回収する工程と、
を有することを特徴とする部品付プリント基板からの有価金属の回収方法。 A step of obtaining printed circuit board waste by the method for processing a printed circuit board with parts according to any one of claims 1 to 4.
A step of crushing the printed circuit board waste in one or two steps with an impact type crusher, and
A step of crushing the crushed product after crushing the printed circuit board waste with a final crusher to obtain a powder product having an average particle size (D50) of 200 μm to 360 μm.
A step of separating the powdered material into a powdery material containing a valuable metal as a main component and a non-powdered material by a wind power sorter and recovering the valuable metal from the powdered material.
A method for recovering valuable metals from a printed circuit board with parts, which comprises.
The valuable value from the printed circuit board with parts according to claim 10 or 11, wherein the powdery substance containing the resin component classified by the wind power sorter as a main component is collected by a bag filter. Metal recovery method.
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